CN105848836B - 用于在电子装置制造中传输基板的机械手设备、驱动组件和方法 - Google Patents

用于在电子装置制造中传输基板的机械手设备、驱动组件和方法 Download PDF

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Publication number
CN105848836B
CN105848836B CN201480070637.6A CN201480070637A CN105848836B CN 105848836 B CN105848836 B CN 105848836B CN 201480070637 A CN201480070637 A CN 201480070637A CN 105848836 B CN105848836 B CN 105848836B
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CN
China
Prior art keywords
guide
coupled
upper arm
drive
drive pulley
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480070637.6A
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English (en)
Chinese (zh)
Other versions
CN105848836A (zh
Inventor
伊贾·克雷默曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN105848836A publication Critical patent/CN105848836A/zh
Application granted granted Critical
Publication of CN105848836B publication Critical patent/CN105848836B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Program-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20323—Robotic arm including flaccid drive element

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201480070637.6A 2014-01-05 2014-12-26 用于在电子装置制造中传输基板的机械手设备、驱动组件和方法 Expired - Fee Related CN105848836B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461923701P 2014-01-05 2014-01-05
US61/923,701 2014-01-05
PCT/US2014/072438 WO2015103089A1 (en) 2014-01-05 2014-12-26 Robot apparatus, drive assemblies, and methods for transporting substrates in electronic device manufacturing

Publications (2)

Publication Number Publication Date
CN105848836A CN105848836A (zh) 2016-08-10
CN105848836B true CN105848836B (zh) 2018-03-30

Family

ID=53493938

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480070637.6A Expired - Fee Related CN105848836B (zh) 2014-01-05 2014-12-26 用于在电子装置制造中传输基板的机械手设备、驱动组件和方法

Country Status (6)

Country Link
US (1) US9724834B2 (https=)
JP (1) JP6550391B2 (https=)
KR (1) KR102323370B1 (https=)
CN (1) CN105848836B (https=)
TW (1) TWI641458B (https=)
WO (1) WO2015103089A1 (https=)

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JP6053757B2 (ja) * 2012-03-29 2016-12-27 株式会社アルバック 多関節ロボット、搬送装置
US9799544B2 (en) 2015-10-23 2017-10-24 Applied Materials, Inc. Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
TWI724971B (zh) 2016-06-28 2021-04-11 美商應用材料股份有限公司 包括間隔上臂與交錯腕部的雙機器人以及包括該者之系統及方法
EP4699745A3 (en) * 2016-08-30 2026-04-29 Board of Regents of the University of Nebraska Robotic device with compact joint design and an additional degree of freedom
US10453725B2 (en) 2017-09-19 2019-10-22 Applied Materials, Inc. Dual-blade robot including vertically offset horizontally overlapping frog-leg linkages and systems and methods including same
US11574830B2 (en) * 2018-03-16 2023-02-07 Brooks Automation Us, Llc Substrate transport apparatus
US10943805B2 (en) * 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
US11850742B2 (en) 2019-06-07 2023-12-26 Applied Materials, Inc. Dual robot including splayed end effectors and systems and methods including same
TWI797461B (zh) * 2019-07-26 2023-04-01 日商新川股份有限公司 封裝裝置
TWI851868B (zh) * 2020-01-23 2024-08-11 美商布魯克斯自動機械美國公司 基板運送設備
JP7542960B2 (ja) * 2020-02-07 2024-09-02 川崎重工業株式会社 水平多関節ロボット及びそれを備えた基板搬送システム
GR20200100357A (el) 2020-06-23 2022-01-13 Παναγιωτης Βασιλειου Ζαραφωνιτης Μηχανισμος μεταδοσεως ατερμονης περιστροφης μεταξυ ακινητου πλαισιου και περιστρεφομενου φορεα αναξαρτητως της ατερμονης περιστροφης του φορεα
CN112754663B (zh) * 2021-01-06 2025-12-05 深圳康诺思腾科技有限公司 机械臂及具有其的机器人
CN114227663B (zh) * 2021-12-30 2024-10-01 航天科工智能机器人有限责任公司 一种机械臂
USD1089348S1 (en) * 2022-11-11 2025-08-19 Dimitrije Stojanovski Robotic arm assembly
TWI881640B (zh) * 2022-12-28 2025-04-21 日商川崎重工業股份有限公司 基板搬送機器人
JP2025152928A (ja) * 2024-03-28 2025-10-10 セイコーエプソン株式会社 ロボットおよびロボットシステム

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Also Published As

Publication number Publication date
TW201536494A (zh) 2015-10-01
KR102323370B1 (ko) 2021-11-05
TWI641458B (zh) 2018-11-21
US9724834B2 (en) 2017-08-08
WO2015103089A1 (en) 2015-07-09
CN105848836A (zh) 2016-08-10
JP2017503666A (ja) 2017-02-02
US20150190933A1 (en) 2015-07-09
JP6550391B2 (ja) 2019-07-24
KR20160106140A (ko) 2016-09-09

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Granted publication date: 20180330

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CF01 Termination of patent right due to non-payment of annual fee