CN105834542A - Dual-in-line package chip dismounting device - Google Patents
Dual-in-line package chip dismounting device Download PDFInfo
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- CN105834542A CN105834542A CN201510014477.XA CN201510014477A CN105834542A CN 105834542 A CN105834542 A CN 105834542A CN 201510014477 A CN201510014477 A CN 201510014477A CN 105834542 A CN105834542 A CN 105834542A
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- molten tin
- tin bath
- dual
- disengagement
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 109
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 230000033001 locomotion Effects 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 5
- 210000004209 hair Anatomy 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000003750 conditioning effect Effects 0.000 claims 2
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000001413 cellular effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000009347 mechanical transmission Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a dual-in-line package chip dismounting device which can solve the problem that a dual-in-line package chip is difficult to dismount rapidly in a lossless manner during maintenance of a circuit board. The dual-in-line package chip dismounting device includes a circuit board fixing unit (1), a molten tin bath unit (2), a heating temperature-control unit (3), a positioning unit (4), an operation display unit (5) and frames (6, 7, 9, 10). The dual-in-line package chip dismounting device is easy to operate, can rapidly dismount dual-in-line package chips with different pins from the circuit board in a lossless manner.
Description
Technical field
The present invention relates to a kind of device that may be used for dismantling dual-in-line package chip from circuit board.
Background technology
Along with developing rapidly of microelectric technique, in modern weapons equipment, number of applications and the kind of dual-in-line package chip are a lot.
Need when wafer damage to disassemble it from circuit board to carry out testing or replacing maintenance.Dual-in-line package chip is usual
Pin is many, span is big, typically requires and adds the scolding tin of all pins on heat fusing chip simultaneously, there is no suitable work at present during dismounting
Tool device.A kind of method is to use artificial use electric cautery manual teardown, melts the scolding tin on all pins simultaneously and is taken by chip
Go out more difficulty, generally repeatedly by several times part pin is unloaded, easily cause circuit board deformation, solder joint comes off, make
Subsequent maintenance operation becomes the most difficult.Another kind of common method is to use stannum stove, and the heating surface of stannum stove is relatively big, can melt simultaneously
Change all pins of chip and take off, but large-area heating easily causes being heated of chip to be removed and too high causes damage, the most easily
Treat element and the damage of circuit board formation unrepairable tearing chip perimeter open.This process had both needed fixing circuit board to be repaired, also needed
Operation electric cautery, takes off chip to be torn open with extraction tool, and operating process is sufficiently complex, and linking should extremely compact could be dismantled
Success.This process is it is generally required to two people cooperate just can complete.
Summary of the invention
The technical problem to be solved is: provide a kind of easy and simple to handle during circuit board repair, may be used for from electricity
On the plate of road quickly, the device of the dual-in-line package chip of nondestructive demounting difference number of pin.
In order to solve above-mentioned technical problem, a kind of dual-in-line package chip provision for disengagement that the present invention relates to uses following technical side
Case: this device includes circuit board fixed cell, molten tin bath unit, heating temperature control unit, positioning unit, operation display unit and limit
Frame.
Circuit board fixed cell is positioned at the top of described provision for disengagement, and its one end is vertically connected in the front bezel of provision for disengagement, separately
One end is vertically connected on the column type cross bar on rear frame, for fixing circuit board；Molten tin bath unit, heating temperature control unit and fixed
Bit location is positioned at the inside of described provision for disengagement, and molten tin bath unit is arranged on heating temperature control unit top, and heating temperature control unit is by even
Connection device is fixed on positioning unit；Described molten tin bath unit is the pin of dual-in-line package chip to be torn open to carry out local heat
Actuator, has the twice molten tin bath close with chip pin arrangement on molten tin bath unit, fills scolding tin in molten tin bath；Described heating temperature
Control unit realizes the computer heating control to molten tin bath unit by the monitoring temperature of described molten tin bath unit；Described positioning unit can laterally,
Move on longitudinal and vertical three degree of freedom, be responsible for delivering described molten tin bath unit and be directed at the pin of dual-in-line package chip to be torn open,
Completing the location of described molten tin bath unit, the scolding tin melted in making molten tin bath can be fully contacted with dual-in-line package chip pin to be torn open；
Described operation display unit, is positioned on the front panel of described provision for disengagement front bezel bottom, for grasping described provision for disengagement
Make and the display of state；Described heating temperature control unit, positioning unit and the circuit part within operation display unit are by microcontroller
It is controlled and communicates.
During use, circuit board is fixed on circuit board fixed cell, by operation display unit operation positioning unit by molten tin bath list
Unit is directed at the pin of chip to be torn open, and heating temperature control unit starts to heat molten tin bath unit, when molten tin bath temperature reaches the molten of scolding tin
During point temperature, in molten tin bath, the scolding tin of fusing can be fully contacted with chip pin, now can be extracted from circuit board by chip be torn open.
Owing to molten tin bath length, width and the degree of depth on molten tin bath unit matches with the chip pin distribution that need to dismantle, molten tin bath is only to chip pipe
Foot heats, it is ensured that in unloading process, heat is concentrated and made the scolding tin on pin melt simultaneously, reduces circuit board in unloading process simultaneously
Heating surface area.When molten tin bath temperature is higher than the melting temperature of scolding tin, heating temperature control unit stops heating molten tin bath unit, prevents temperature
Spend high damage chip and circuit board.
Want the operating process that facilitating chip is dismantled, it is possible to use dynamo-electric automatic control technology makes molten tin bath be accurately aimed at chip pin to be torn open.
Currently, Electromechanical Control technology is the most ripe, utilizes various control motor, displacement transducer and mechanical transmission mechanism
Control accuracy disclosure satisfy that the demand of molten tin bath position control accuracy.
Owing to have employed technique scheme, the dual-in-line package chip of different pins can from circuit board quickly, easy,
Nondestructively disassemble.
Accompanying drawing explanation
In order to be more fully understood that the present invention, it is further described below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of dual-in-line package chip provision for disengagement；
Fig. 2 is molten tin bath cellular construction schematic diagram top view；
Fig. 3 is the molten tin bath horizontal sectional drawing of cellular construction schematic diagram；
Fig. 4 is the hardware theory of constitution schematic diagram of dual-in-line package chip provision for disengagement.
Detailed description of the invention
Below by embodiment, the present invention is described in further detail.
The structural representation of dual-in-line package chip provision for disengagement (hereinafter referred to as provision for disengagement) is as it is shown in figure 1, include circuit
Plate fixed cell 1, molten tin bath unit 2, heating temperature control unit 3, positioning unit 4, operation display unit 5 and frame 6,7,9,
10。
Wherein, circuit board fixed cell 1 is positioned at the top of provision for disengagement, and its one end is vertically connected on the front bezel 6 of provision for disengagement
On, the other end is vertically connected on on the column type cross bar 8 on the rear frame 7 of front bezel 6 level, fixes single along circuit board
The vertical direction of unit 1 can promote circuit board fixed cell 1.Jun You tri-road, arranged on left and right sides face of circuit board fixed cell 1 and electricity
The groove that road plate thickness matches, the left frame 9 of provision for disengagement simultaneously, left frame 10 corresponding horizontal level on also Jun You tri-road
The groove matched with circuit board thickness, when fixing circuit board, is embedded into left and right side frame wherein by circuit board
In a certain groove, then it is corresponding by walking circuit plate fixed cell 1, the another side of circuit board to be embedded into circuit board fixed cell 1
In the groove of horizontal level, get final product fixing circuit board.So, according to the size of circuit board, can be fixing single by regulation circuit board
The circuit board that unit's 1 fixed dimension is different.The groove of three height of upper, middle and lower is set, can select circuit according to practical situation
Plate is fixed on three different height.
Molten tin bath unit 2 is that the pin of dual-in-line package chip to be torn open carries out the actuator that local is heated, and molten tin bath unit 2 is adopted
Make with the metal material of good heat conductivity.As shown in Figure 2 and Figure 3, it has the twice molten tin bath close with chip pin arrangement
11,11 ', fill scolding tin in molten tin bath 11,11 '.Having two screw holes 12,12 ' in the middle of the top of molten tin bath unit 2, being used for will
Molten tin bath unit 2 is fixed on the top of heating temperature control unit 3.Molten tin bath 11,11 ' length, width and the degree of depth on molten tin bath unit 2
Match with the pin distribution needing chip to be removed, it is ensured that in unloading process, the scolding tin on pin melts simultaneously.
Heating temperature control unit 3, positioning unit 5 and operation circuit part within display unit 6 are controlled by microcontroller 13
With communication, as shown in Figure 4.
Heating temperature control unit 3 by the monitoring temperature of molten tin bath unit 2 being realized the computer heating control to molten tin bath unit 2, by heater,
Temperature sensor and temperature-control circuit composition, heater can use powerful electrothermal tube to constitute, and the internal employing of provision for disengagement is micro-
The temperature of molten tin bath unit 2 that temperature sensor transmission is returned by controller 13 compares with the melting temperature of scolding tin, when molten tin bath unit 2
Temperature less than the melting temperature of scolding tin time, microcontroller 13 controls heater by temperature-control circuit and is energized so that it is temperature liter
Height heats to molten tin bath unit 2；When the temperature of molten tin bath unit 2 is higher than the melting temperature of scolding tin, microcontroller 13 is by temperature control
Circuit processed controls heater power-off, stops heating it.Temperature feedback control process is constantly carried out, and can make described molten tin bath list
The temperature of unit 2 is maintained near the melting temperature of scolding tin, it is ensured that melts soldering tin can make chip disassemble and be unlikely to temperature
Too high damage chip and circuit board.
Positioning unit 4 is responsible for the molten tin bath unit 2 described in delivery to suitable removed position, the weldering melted in making molten tin bath 11,11 '
Stannum can be fully contacted with chip pin.Positioning unit 4 includes located lateral unit 14, longitudinal register unit 15 and vertical location
Unit 16, this makes positioning unit 4 carry molten tin bath unit 2 can motion on three degree of freedom horizontal, longitudinal and vertical.Horizontal
To, longitudinally and vertical each positioning unit 14,15,16 includes an actuator, directional control circuit and position sensing respectively
Device, each actuator of institute is each provided with a motor, a linear guides and a worm drive block, position sensing
Device uses linear movement pick-up.Stepping motor rotating shaft is connected with linear guides, and linear guides can be driven to rotate.Worm drive block is pacified
Being contained on linear guides, linear guides rotates and worm drive block can be driven to move.Molten tin bath unit 2 and heating temperature control unit 3 are installed
On worm drive block, move together with worm drive block.Linear movement pick-up is arranged on worm drive block, measures spiral and passes
The distance length of motion block motion and direction, the signal of telecommunication of its output sends directional control circuit to, forms closed loop location feedback.When
Positioning unit 4 need mobile molten tin bath unit 2 horizontal, longitudinally or vertical in certain direction move a segment distance time, positioning unit
The motor of 4 control respective direction is to being correctly oriented rotation, and motor drives linear guides to rotate, on linear guides
Worm drive block i.e. molten tin bath unit 2 as described in assigned direction drives moves, and linear movement pick-up is measured molten tin bath unit 2 and moved
Distance is also sent to positioning unit 4, positioning unit 4 judge whether molten tin bath unit 2 arrives appointment position.Positioning unit 4 is controlled
Molten tin bath unit 2 described in system moves on three degree of freedom horizontal, longitudinal and vertical, and molten tin bath unit 2 can be made to be accurately aimed at waiting to tear open
Unload the pin of chip, complete the location of molten tin bath unit 2.
Provision for disengagement also includes operating display unit 5, is positioned on the front panel of provision for disengagement front bezel 6 bottom, for dismounting dress
Put and carry out operating and the display of state.The display screen of the band touch function that can use operation and be shown in one, is touched by exploitation
Panel program completes the operation to provision for disengagement and control.For ease of operator's operation and monitoring, can be by before provision for disengagement
Plate is designed to bottom provision for disengagement acutangulate the inclined-plane of (preferably 60 degree), as it is shown in figure 1, embedded by operation display unit 5
In this inclined-plane.
Operation display unit 5 is attached by communication module with microcontroller 12, and operation display 5 is real by microcontroller 12
Now to positioning unit 4 and the control of heating temperature control unit 3, operation display unit 5 receives also by microcontroller 12 and determines simultaneously
The positional information of bit location 4 and the temperature information of heating temperature control unit 3, it is simple to the monitoring of operator.
To when dual-in-line chip is dismantled on circuit board, first circuit board circuit board fixed cell 1 is fixed, then opens
Dynamic detaching equipment, is carried out the control of position, makes molten tin bath unit 2 be directed at core to be torn open by operation display unit 5 to positioning unit 4
After sheet, starting heating function, the scolding tin in molten tin bath unit 2 molten tin bath reaches to be molten into liquid during the melting temperature of scolding tin, liquid
Scolding tin is fully contacted with chip pin, can make the melts soldering tin on pin, departs from circuit board, is extracted by chip from circuit board,
The dismounting of chip to be torn open can be completed.
In order to make chip to be torn open accurately be directed at molten tin bath unit 2, provision for disengagement also can design a reference cell, reference cell can
Installing a laser head, laser head can produce cross hairs.Respectively by the upper left corner and ten in the upper left corner of molten tin bath unit 2 He chip to be torn open
Wordline i.e. completes origin reference location after electricity alignment.
Owing to have employed technique scheme, the dual-in-line package chip of different pins can from circuit board quickly, easy,
Nondestructively disassemble.
The above, be only the better embodiment of the present invention, be not construed as limitation of the scope of the invention.All be familiar with this neck
The personage of field technique, thought according to technological thought, technical method and the technology contents of present disclosure and equivalence change or simplify
Etc. content, all should fall within the scope of protection of the present invention.
Claims (10)
1. a dual-in-line package chip provision for disengagement, including: circuit board fixed cell (1), molten tin bath unit (2), heating
Temperature conditioning unit (3), positioning unit (4), operation display unit (5) and frame (6,7,9,10)；
Circuit board fixed cell (1) is positioned at the top of described provision for disengagement, and its one end is vertically connected on the front bezel (6) of provision for disengagement
On, the other end is vertically connected on the column type cross bar (8) on rear frame (7), for fixing circuit board；
Molten tin bath unit (2), heating temperature control unit (3) and positioning unit (4) are positioned at the inside of described provision for disengagement, molten tin bath list
Unit (2) is arranged on heating temperature control unit (3) top, and heating temperature control unit (3) is fixed on positioning unit (4) by attachment means
On；
Described molten tin bath unit (2) is the pin of dual-in-line package chip to be torn open to carry out the actuator that local is heated, at molten tin bath
Having the twice molten tin bath (11,11 ') close with chip pin arrangement on unit (2), molten tin bath fills scolding tin in (11,11 ')；
Described heating temperature control unit (3) realizes the heating to molten tin bath unit (2) by the monitoring temperature of described molten tin bath unit (2)
Control；
Described positioning unit (4) can move on three degree of freedom horizontal, longitudinal and vertical, is responsible for delivering described molten tin bath unit
(2) it is directed at the pin of dual-in-line package chip to be torn open, completes the location of described molten tin bath unit (2), make molten tin bath (11,11 ')
The scolding tin of interior fusing can be fully contacted with dual-in-line package chip pin to be torn open；
Described operation display unit (5), is positioned on the front panel of described provision for disengagement front bezel (6) bottom, for tearing open described
Handler carries out operating and the display of state；
The circuit part of described heating temperature control unit (3), positioning unit (5) and operation display unit (6) inside is by microcontroller
Device (13) is controlled and communicates.
A kind of dual-in-line package chip provision for disengagement the most according to claim 1, it is characterised in that: circuit board is fixing single
The groove that matches with circuit board thickness of Jun You tri-road, arranged on left and right sides face of unit (1), while described in left frame (9), the right
The groove that on the corresponding horizontal level of frame (10), also Jun You tri-road matches with circuit board thickness.
A kind of dual-in-line package chip provision for disengagement the most according to claim 1, it is characterised in that: described molten tin bath list
Molten tin bath (11,11 ') length, width and the degree of depth in unit (2) is distributed phase with the pin of dual-in-line package chip to be removed
Join.
A kind of dual-in-line package chip provision for disengagement the most according to claim 1, it is characterised in that: described molten tin bath unit
(2) there are two screw holes (12,12 ') in the middle of top, for molten tin bath unit (2) is fixed on heating temperature control unit (3)
Top.
A kind of dual-in-line package chip provision for disengagement the most according to claim 1, it is characterised in that: described heating temperature control
Unit (3) is made up of heater, temperature sensor and temperature-control circuit, and heater can use powerful electrothermal tube to constitute,
The temperature of the molten tin bath unit (2) that temperature sensor transmission is returned by microcontroller (13) compares with the melting temperature of scolding tin, works as stannum
When the temperature of groove unit (2) is less than the melting temperature of scolding tin, microcontroller (13) controls heater by temperature-control circuit and leads to
Electricity so that it is temperature raises and heats to molten tin bath unit (2)；When the temperature of molten tin bath unit (2) is higher than the melting temperature of scolding tin,
Microcontroller (13) controls heater power-off by temperature-control circuit, stops heating it；Temperature feedback control process is continuous
Carry out, the temperature of described molten tin bath unit (2) can be made to be maintained near the melting temperature of scolding tin.
A kind of dual-in-line package chip provision for disengagement the most according to claim 1, it is characterised in that: described positioning unit
(4) located lateral unit (14), longitudinal register unit (15) and vertical positioning unit (16) are included.
A kind of dual-in-line package chip provision for disengagement the most according to claim 6, it is characterised in that: described located lateral
Unit (14), longitudinal register unit (15) and vertical positioning unit (16) include an actuator, direction controlling electricity respectively
Road and position sensor, each actuator of institute is each provided with a motor, a linear guides and worm drive
Block, position sensor uses linear movement pick-up；Stepping motor rotating shaft is connected with linear guides, and linear guides can be driven to rotate；
Worm drive block is arranged on linear guides, and linear guides rotates and worm drive block can be driven to move；Molten tin bath unit (2) and heating
Temperature conditioning unit (3) is arranged on worm drive block, moves together with worm drive block；Linear movement pick-up is arranged on worm drive
On block, measuring distance length and the direction of worm drive block motion, the signal of telecommunication of its output sends directional control circuit to, is formed
Closed loop location feeds back.
A kind of dual-in-line package chip provision for disengagement the most according to claim 1, it is characterised in that: described operation display
Unit (5) uses operation and the display screen of the band touch function being shown in one.
A kind of dual-in-line package chip provision for disengagement the most according to claim 1, it is characterised in that: described provision for disengagement
The inclined-plane acutangulated bottom front panel and provision for disengagement.
A kind of dual-in-line package chip provision for disengagement the most according to claim 1, it is characterised in that: described dismounting dress
Putting and also include reference cell, reference cell can install a laser head, and laser head can produce cross hairs, respectively by molten tin bath unit (2)
The upper left corner and after the upper left corner tearing dual-in-line package chip open is directed at cross hairs centrage, i.e. complete origin reference location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510014477.XA CN105834542B (en) | 2015-01-13 | 2015-01-13 | Biserial in-line package chip dismounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510014477.XA CN105834542B (en) | 2015-01-13 | 2015-01-13 | Biserial in-line package chip dismounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105834542A true CN105834542A (en) | 2016-08-10 |
| CN105834542B CN105834542B (en) | 2019-05-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510014477.XA Active CN105834542B (en) | 2015-01-13 | 2015-01-13 | Biserial in-line package chip dismounting device |
Country Status (1)
| Country | Link |
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| CN (1) | CN105834542B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106825821A (en) * | 2017-01-24 | 2017-06-13 | 安徽锐能科技有限公司 | PCB electronic components remove device |
| CN107876921A (en) * | 2017-11-03 | 2018-04-06 | 西安航天精密机电研究所 | The disassembling fixture and its method for dismounting of a kind of chip pin |
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| US4569473A (en) * | 1983-11-03 | 1986-02-11 | Guiliano John A | Apparatus for and method of desoldering and removing an integrated circuit from a mounting member and for cleaning the same |
| JP2005167142A (en) * | 2003-12-05 | 2005-06-23 | Nec Tohoku Ltd | Soldering apparatus |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
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| CN204686237U (en) * | 2015-01-13 | 2015-10-07 | 中国人民解放军军械工程学院 | The provision for disengagement of a kind of dual-in-line package chip |
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2015
- 2015-01-13 CN CN201510014477.XA patent/CN105834542B/en active Active
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| US3644980A (en) * | 1969-06-25 | 1972-02-29 | Pace Inc | Component removal device |
| US4569473A (en) * | 1983-11-03 | 1986-02-11 | Guiliano John A | Apparatus for and method of desoldering and removing an integrated circuit from a mounting member and for cleaning the same |
| JP2005167142A (en) * | 2003-12-05 | 2005-06-23 | Nec Tohoku Ltd | Soldering apparatus |
| CN2843016Y (en) * | 2005-09-19 | 2006-11-29 | 海尔集团公司 | A kind of circuit board component thermal disassembling equipment |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106825821A (en) * | 2017-01-24 | 2017-06-13 | 安徽锐能科技有限公司 | PCB electronic components remove device |
| CN106825821B (en) * | 2017-01-24 | 2019-07-12 | 安徽锐能科技有限公司 | PCB electronic component removes device |
| CN107876921A (en) * | 2017-11-03 | 2018-04-06 | 西安航天精密机电研究所 | The disassembling fixture and its method for dismounting of a kind of chip pin |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105834542B (en) | 2019-05-07 |
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Address after: 050003 Heping West Road, Shijiazhuang, Hebei Province, No. 97 Applicant after: ARMY ENGINEERING University OF PLA Address before: 050003 Heping West Road, Shijiazhuang, Hebei Province, No. 97 Applicant before: Army Engineering University of PLA |
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| GR01 | Patent grant |