CN107876921A - The disassembling fixture and its method for dismounting of a kind of chip pin - Google Patents

The disassembling fixture and its method for dismounting of a kind of chip pin Download PDF

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Publication number
CN107876921A
CN107876921A CN201711073437.8A CN201711073437A CN107876921A CN 107876921 A CN107876921 A CN 107876921A CN 201711073437 A CN201711073437 A CN 201711073437A CN 107876921 A CN107876921 A CN 107876921A
Authority
CN
China
Prior art keywords
heat
workbench
conducting medium
heating cell
disassembling fixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711073437.8A
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Chinese (zh)
Inventor
谢宗晟
李吉兴
曹宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Aerospace Precision Electromechanical Institute
Original Assignee
Xian Aerospace Precision Electromechanical Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Aerospace Precision Electromechanical Institute filed Critical Xian Aerospace Precision Electromechanical Institute
Priority to CN201711073437.8A priority Critical patent/CN107876921A/en
Publication of CN107876921A publication Critical patent/CN107876921A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention belongs to sealing-off technical field, and in particular to the disassembling fixture and its method for dismounting of a kind of simple in construction, convenient and practical chip pin.The frock includes heat transfer bar, workbench, heating cell body, heat-conducting medium；Heat passes bar one end and is connected with external flatiron, other end installment work platform；Workbench installation heating cell body, the interior filling heat-conducting medium of heating tank body.The scolding tin on chip pin to be removed is melted by the heat-conducting medium in heating tank body, that is, completes sealing-off operation.

Description

The disassembling fixture and its method for dismounting of a kind of chip pin
Technical field
The invention belongs to sealing-off technical field, and in particular to the disassembling fixture and its method for dismounting of a kind of chip pin.
Background technology
IC- integrated circuits (integrated circuit) are a kind of microelectronic devices or part.Using certain work Skill, the elements such as transistor, resistance, electric capacity and the inductance needed for a circuit and wiring are interconnected together, are produced on a fritter Or on several fritter semiconductor wafers or dielectric substrate, be then encapsulated in a shell, turn into the micro- of required circuit function Type structure, IC utilization rate more and more higher, wherein DIP, it is dual inline-pin with the development of electronics industry Package abbreviation, i.e. dual-inline package, it is one of IC cartridge-types encapsulation, the packing forms, which have, is adapted to PCB (printings Circuit board) the features such as installing, be easy to operate of perforating.
In research and production, DIP chips have largely been used, but except to be welded to DIP in debugging and repairing Outside, also often need sealing-off DIP encapsulate IC.DIP chips are generally made up of 4~20 pipe legs, by welding one by one during welding Pin can be completed to operate, and must melt all pipe legs during sealing-off simultaneously and could smoothly pull down, due to chip in itself, pad And the limitation of the heat resistance of printed board so that sealing-off operation is difficult to complete, and heat time length may cause burning for chip, Pad come off and printed board aging, and the heat time it is short then can not by all pipe legs all melt complete sealing-off operations.
The content of the invention
In order to solve the problems, such as in background technology, the invention provides a kind of chip pin simple in construction, convenient and practical Disassembling fixture.
Simultaneously, it was also proposed that a kind of method for dismounting of chip pin.
A kind of disassembling fixture of chip pin, including heat transfer bar, workbench, heating cell body, heat-conducting medium；
Heat passes bar one end and is connected with external heat source, other end installment work platform；
Workbench installation heating cell body, the interior filling heat-conducting medium of heating tank body.
In order to more effectively melt pin, and the size of chip is preferably adapted to, above-mentioned heating cell body is V-shaped；
Material is saved for the ease of processing in actual production, workbench, heating cell body are integrally machined into by copper product Type；
In addition, in order to adapt to shape, size and the processing and manufacturing for being easy to part of different chips to be removed, adapt to different Dismounting requirement, heating cell body processed respectively with workbench, and heat cell body be arranged side by side on workbench it is multiple, Multiple stepped holes are offered on workbench, screwed hole is offered on multiple heating cell bodies；Workbench and multiple heating cell bodies Between be fixedly connected by sunk screw.
In order that the scope of application of the disassembling fixture is wider, stepless extension is realized, the workbench sets promising rectangle, Two end faces in four end faces in a thickness direction set projection, are set on the end face parallel with setting raised end face There is the pit matched somebody with somebody with raised adaptation.
In order that must connect more firmly, the convex outer surface offers external screw thread, offered in the pit with outside The internal thread that screw thread is adapted.
Wherein, heat-conducting medium is scolding tin or heat conductive silica gel.
Based on above-mentioned disassembling fixture, a kind of method for dismounting of chip pin is now provided, comprised the concrete steps that：
1) one end for the bar that conducts heat is connected with external heat source, powered to general flatiron, its work is produced heat, wait to conduct heat After bar transfers heat to workbench and will heat cell body heating, then heat-conducting medium is heated into heating cell body, the heat time Continue 10s,；
2) after heat-conducting medium is heated, the pin of required sealing-off is immersed in heat-conducting medium；
3) after pin heats 1s by heat-conducting medium, the scolding tin on pin is melted by heat-conducting medium, is removed by tweezers or sucker DI P chips complete sealing-off operation.
The beneficial effects of the invention are as follows：
1st, the structure of the invention for using heating cell body, heat transfer bar, workbench and heat-conducting medium to design is simple tears open Frock is unloaded, material benefit is durable, easy to operate, and cost is cheap, and volume is light and handy, is very suitable for being used when reprocessing dismounting for job site.
2nd, heating cell body is designed to V-shaped by the present invention, in order to more effectively melt pin, and preferably adapts to chip Size.
3rd, the present invention is integrally formed using heating cell body, workbench, and it is high to save material, thermal conductivity.
The 4th, raised and pit is set on workbench of the invention, it is possible to achieve the stepless extension of more frocks, when one When thering are multiple chips to need dismounting on circuit board, it is only necessary to which operation simultaneously can be achieved in workbench in parallel or series, improves Operating efficiency.
5th, the multiple heating cell bodies of setting of the invention, and workbench and multiple heating cell bodies are consolidated using sunk screw Fixed connection, convenient each separately machined, heating cell body can be processed according to shape, the size of chip to be removed, can adapt to The chip dismantlement work of different shapes and sizes.
6th, the present invention, because the material is ester shape thing, has certain stickiness using heat conductive silica gel as heat-conducting medium, There is no obvious granular sensation, be easy to construct.
Brief description of the drawings
Fig. 1 is the front view of disassembling fixture of the present invention.
Fig. 2 is the side view of disassembling fixture of the present invention.
Fig. 3 be disassembling fixture of the present invention with multi-tier function when structural front view.
Fig. 4 is Fig. 3 side view.
Fig. 5 is the structural front view that cell body and workbench are heated in structure 2.
Fig. 6 is Fig. 5 A to sectional view.
Reference is as follows：
1- heat transfers bar, 2- workbenches, 3- heating cell body, 4- stepped holes 5- projections, 6- pits, 7- screwed holes.
Embodiment
As depicted in figs. 1 and 2, the invention provides a kind of disassembling fixture of simple in construction, convenient and practical chip pin, Its basic structure is：
Including heat transfer bar 1, workbench 2, heating cell body 3, heat-conducting medium；
Heat passes the one end of bar 1 and is connected with external heat source, other end installment work platform 2；
The installation heating cell body 3 of workbench 2, the interior filling heat-conducting medium of heating cell body 3.
Wherein, in order to preferably melt pin, the heating cell body 3 is V-shaped.
Wherein, heat-conducting medium is scolding tin or heat conductive silica gel, preferably heat conductive silica gel.Heat-conducting silicone grease is most widely used at present A kind of heat-conducting medium, it is using silicone oil as raw material, and adds the fillers such as thickener, by techniques such as heating decompression, grindings A kind of ester shape thing formed afterwards, the material has certain stickiness, without obvious granular sensation.The operating temperature of heat-conducting silicone grease Typically at -50 DEG C~180 DEG C, it has good thermal conductivity, high temperature resistant, ageing-resistant and fire resistance characteristic.
During construction, due to demand, the different present invention give two kinds of structures on the basis of above-mentioned basic structure：
Structure 1：
In order to save material, ensure thermal conductivity, workbench 2, heating cell body 3 are integrally formed by copper product.
As shown in Figure 3 and Figure 4, in order to adapt to multiple frock series connection and/or be used in series, workbench 1 is arranged to rectangle, Two end faces in four end faces in a thickness direction set projection 5, are set on the end face parallel with setting the end face of projection 5 It is equipped with the pit 6 matched somebody with somebody with the adaptation of projection 5.
Structure 2：
As shown in Figure 5 and Figure 6, different chip forms is adapted to for convenience, size (is particularly tearing open for some special-shaped chips Except), heating cell body 3 is processed respectively with workbench 2, and heats cell body 3 and multiple, work has been arranged side by side on workbench 2 Make to offer multiple stepped holes 4 on platform 2, screwed hole 7 is offered on multiple heating cell bodies 3；Workbench 2 and heating cell body 3 Between be fixedly connected by sunk screw, heating cell body 3 shape, size be adapted with chip to be removed, and heat cell body 3 Can be set simultaneously below workbench 2 it is multiple, in order to be dismantled to the chips of multiple different shapes and sizes simultaneously.
Equally, the structure of multi-tier also has embodiment in structure 2, as shown in Figure 3 and Figure 4, in order to adapt to multiple frocks It is used in series, workbench is arranged to rectangle, and two end faces in four end faces in a thickness direction set projection 5, with setting Put to be provided with the parallel end face in end face of projection 5 and adapt to the pit 6 matched somebody with somebody with projection 5, be so achieved that disassembling fixture exists Extension on length and width direction.
Above two structure, when being connected to become an entirety for multiple frocks, connection is more firm, raised 5 outer surfaces External screw thread is offered, the internal thread being adapted with external screw thread is offered in the pit 6.
Introduction more than to tool structure, is now once illustrated the application method of the frock：
1st, heat transfer bar is connected with external heat source (general flatiron).
2nd, 220V civil powers are provided to general flatiron, its work is produced heat, ginseng different according to the flatiron power heat time It is 10 minutes to examine the time required to value is the heating of 30w flatirons.
3rd, after hot rod to be passed transfers heat to workbench and will heat cell body heating, then heat and lead into heating cell body Thermal medium, heat time 10s.
After 4. heat-conducting medium is heated, the DIP pipes leg of required sealing-off is immersed in heat-conducting medium.
After 5. pipe leg heats 1s by heat-conducting medium, the scolding tin on pipe leg is melted, and DIP chips are removed i.e. by tweezers or sucker Complete sealing-off operation.
6. being fulfiled assignment during first time use according to 1~5, such as continuous sealing-off only needs the step of carry out 4~5, is such as spaced sealing-off Then need the step of carry out 2~5.
DIP encapsulation chip sealing-offs rate more than 99% is realized by using the frock, sealing-off post package chip is made because of sealing-off Into fire damage and mechanical damage rate be zero, the pad and printed board where sealing-off DIP without fire damage and mechanical damage, And whole dismounting process dismounting difficulty is small, controllable degree is high, i.e. independently operable after common laborer is trained, frock making Cheap, frock and the flexibility of sealing-off method are high, it is only necessary to which 220V civil powers can complete sealing-off operation.

Claims (10)

  1. A kind of 1. disassembling fixture of chip pin, it is characterised in that：
    Including heat transfer bar, workbench, heating cell body, heat-conducting medium；
    Heat passes bar one end and is connected with external heat source, other end installment work platform；
    Workbench installation heating cell body, the interior filling heat-conducting medium of heating tank body.
  2. 2. the disassembling fixture of chip pin according to claim 1, it is characterised in that：The heating cell body is V-shaped.
  3. 3. the disassembling fixture of chip pin according to claim 1 or 2, it is characterised in that：Workbench, heating cell body lead to Cross copper product and be integrally machined shaping.
  4. 4. the disassembling fixture of chip pin according to claim 3, it is characterised in that：The workbench is arranged to square Shape, two end faces in four end faces in a thickness direction set it is raised, on the end face parallel with setting raised end face It is provided with the pit matched somebody with somebody with raised adaptation.
  5. 5. the disassembling fixture of chip pin according to claim 4, it is characterised in that：Wherein, heat-conducting medium be scolding tin or Heat conductive silica gel.
  6. 6. the disassembling fixture of chip pin according to claim 1, it is characterised in that：The heating cell body has been arranged side by side It is multiple；Multiple stepped holes are offered on the workbench, screwed hole is offered on multiple heating cell bodies；The workbench with It is fixedly connected between multiple heating cell bodies by sunk screw；Shape, size, structure and the chip to be removed of multiple heating cell bodies It is adapted.
  7. 7. the disassembling fixture of chip pin according to claim 6, it is characterised in that：The workbench is arranged to square Shape, two end faces in four end faces in a thickness direction set it is raised, on the end face parallel with setting raised end face It is provided with the pit matched somebody with somebody with raised adaptation.
  8. 8. the disassembling fixture of chip pin according to claim 7, it is characterised in that：The convex outer surface offers outer Screw thread, the internal thread being adapted with external screw thread is offered in the pit.
  9. 9. the disassembling fixture of chip pin according to claim 8, it is characterised in that：Wherein, heat-conducting medium be scolding tin or Heat conductive silica gel.
  10. 10. the method for dismounting of the disassembling fixture of chip pin according to claim 1, it is characterised in that including following step Suddenly：
    1) one end for the bar that conducts heat is connected with external heat source, powered to general flatiron, its work is produced heat, hot rod to be passed will After heat transfer heats to workbench and by heating cell body, then heat-conducting medium is heated into heating cell body, the heat time is lasting 10s,；
    2) after heat-conducting medium is heated, the pin of required sealing-off is immersed in heat-conducting medium；
    3) after pin heats 1s by heat-conducting medium, the scolding tin on pin is melted by heat-conducting medium, and DIP cores are removed by tweezers or sucker Piece completes sealing-off operation.
CN201711073437.8A 2017-11-03 2017-11-03 The disassembling fixture and its method for dismounting of a kind of chip pin Pending CN107876921A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711073437.8A CN107876921A (en) 2017-11-03 2017-11-03 The disassembling fixture and its method for dismounting of a kind of chip pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711073437.8A CN107876921A (en) 2017-11-03 2017-11-03 The disassembling fixture and its method for dismounting of a kind of chip pin

Publications (1)

Publication Number Publication Date
CN107876921A true CN107876921A (en) 2018-04-06

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101363696A (en) * 2008-09-03 2009-02-11 赵耀华 Flat hot pipe for cooling electron device and processing technology thereof
CN201304531Y (en) * 2008-11-17 2009-09-09 汕头大学 General DIP package chip removal tool
CN102418120A (en) * 2011-12-08 2012-04-18 成都先进功率半导体股份有限公司 Method for recovering waste tin from electroplated steel belt
CN203292649U (en) * 2013-06-26 2013-11-20 深圳市添正弘业科技有限公司 Efficient dual in-line package (DIP) chip disassembling tool
CN105834542A (en) * 2015-01-13 2016-08-10 中国人民解放军军械工程学院 Dual-in-line package chip dismounting device
CN206509649U (en) * 2016-09-07 2017-09-22 常州市正阳焊接材料有限公司 A kind of multifunctional gas protects flux-cored wire

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101363696A (en) * 2008-09-03 2009-02-11 赵耀华 Flat hot pipe for cooling electron device and processing technology thereof
CN201304531Y (en) * 2008-11-17 2009-09-09 汕头大学 General DIP package chip removal tool
CN102418120A (en) * 2011-12-08 2012-04-18 成都先进功率半导体股份有限公司 Method for recovering waste tin from electroplated steel belt
CN203292649U (en) * 2013-06-26 2013-11-20 深圳市添正弘业科技有限公司 Efficient dual in-line package (DIP) chip disassembling tool
CN105834542A (en) * 2015-01-13 2016-08-10 中国人民解放军军械工程学院 Dual-in-line package chip dismounting device
CN206509649U (en) * 2016-09-07 2017-09-22 常州市正阳焊接材料有限公司 A kind of multifunctional gas protects flux-cored wire

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Application publication date: 20180406