CN101363696A - Flat hot pipe for cooling electron device and processing technology thereof - Google Patents
Flat hot pipe for cooling electron device and processing technology thereof Download PDFInfo
- Publication number
- CN101363696A CN101363696A CNA2008101193114A CN200810119311A CN101363696A CN 101363696 A CN101363696 A CN 101363696A CN A2008101193114 A CNA2008101193114 A CN A2008101193114A CN 200810119311 A CN200810119311 A CN 200810119311A CN 101363696 A CN101363696 A CN 101363696A
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- heat pipe
- flat
- plate heat
- electronic device
- framework
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- 238000001816 cooling Methods 0.000 title claims abstract description 28
- 238000005516 engineering process Methods 0.000 title claims description 16
- 238000012545 processing Methods 0.000 title claims description 6
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000012546 transfer Methods 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
- 230000003416 augmentation Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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Abstract
The invention provides a flat heat tube used for cooling a high-power electronic device, which comprises a frame of the flat heat tube, wherein, the upper end surface of the frame is provided with a cooling surface. The flat heat tube is characterized in that: an inner fin is arranged in the frame of the flat heat tube, and is positioned between the upper end surface and the lower end surface of the frame; the inner fin separates the inner space of the frame into a plurality of poroid channels; the inside of the frame is a vacuum structure and is filled with liquid working substance; the lower end surface of the flat heat tube is directly connected with a heat emitting surface of the electronic device; a fan is arranged above the upper end surface of the flat heat tube so as to disperse heat into atmosphere by the mode of forced convection. The flat heat tube has the characteristics of super thinness, high efficiency and large heat transfer capacity, and can replace an oscillating heat tube and a common heat tube.
Description
Technical field
The present invention relates to the cooling technology of electronic device, particularly a kind ofly be used for flat-plate heat pipe and the processing technology thereof that the high high-power electronic device of integrated level dispels the heat under the high heat flux condition.
Background technology
Along with developing rapidly and MEMS (MicroElectronic Mechanical System) development of technology of high frequency, high speed and the integrated circuit technique of electronic device, make the caloric value and the heat flow density of unit volume electronic device increase considerably, the constraint that the layout of heat abstractor and design run into is more and more.With the example that is designed to of microelectronic chip, generally reach (60～100) W/cm at present
2, be up to 200W/cm
2More than.Traditional radiating mode such as air-cooled (forced convertion) are because its cooling effectiveness is directly proportional with the speed of fan.When heat flow density reached certain numerical value, this type of cooling seemed unable to do what one wishes.Increasing based on the heat radiation heat flow density that electronic device requires, Chinese patent 99253842.4 has proposed Water Cooling Technology, the advantage of water-cooled is that cooling effect is outstanding, but the structure of water-cooling system is very complicated, according to the cooling requirement, the capacity of water drum is at least more than 20 liters in the system, and itself also has fatal shortcoming-safety problem, in case revealing appears in water-cooling system, will cause computer to damage.Because the mode heat transfer efficiency of phase-change heat-exchange is very high, utilize the phase-change heat-exchange technology that the product that CPU cools off is also occurred, in this type of heat transfer technology, most typically to belong to hot pipe technique, its main heat transfer type is evaporation and condensation, have that heat-transfer capability is big, temperature control capability is strong. the characteristics that heat transfer efficiency is high, but the encapsulation of the extraction of the preparation of the manufacture craft of heat pipe such as capillary wick material, vacuum, working medium and maintenance process are very complicated, and this makes its application be very restricted.General heat pipe and element cooling surface contact area are little, cause equivalent thermal resistance big.And the hot conveying capacity of single heat pipe is limited.Oscillating heat pipe can't be realized the gross area contact, thereby also causes equivalent thermal resistance big, and needs the starting of oscillation temperature difference.
Chinese patent 03137561.8 proposes a kind of novel cooling technology: utilize mini-refrigerator system that computer CPU is cooled off, this technology has can carry out active cooling to CPU and cool off, and has compact conformation, reliability height, characteristics simple to operate.But this kind technology cost height, system complex.
Summary of the invention
At defective and the deficiency that existing high-power electronic device cooling technology exists, the object of the present invention is to provide a kind of flat-plate heat pipe applicable to the high high-power electronic device of the integrated level of cooling high heat flux, and the processing technology of this flat-plate heat pipe.
Technical scheme of the present invention is as follows:
A kind of flat-plate heat pipe that is used for the electronic device cooling, comprise the flat-plate heat pipe framework, the upper surface of described framework is a cooling surface, it is characterized in that: be provided with inner fin in the framework of described flat plate heat tube, described fin is between the upper and lower end face of framework, and described fin is separated into some poroid passages with the inside of frame space, and framework inside is vacuum structure, and being filled with liquid working substance, the flat plate heat tube lower surface partly or entirely directly links to each other with the heating face of electronic device.
Described inner fin for that make by hard material, that have the penetrating hole of plurality of integral in it, have the network structure that the suitable profile of plate frame interior shape is arranged, dull and stereotyped frame forms whole plate heat pipe.
Described fin is a W shape corrugated board chip architecture, and each W-shaped peak paddy position and frame inner wall join, and forms the duct that is arranged alternately.
The cross section in described duct is the non-circular hole cross section.
The cross section in described duct is a triangle.
Each duct path that described fin forms is that an end is convenient to the disposable filling liquid that vacuumizes in the opening of framework inner chamber, the sealing of joining of the other end and frame inner wall, and each duct path is independent heat pipe structure.
Each its two ends of duct path that described fin forms are all open in the framework inner chamber, and each duct path communicates in the framework inner chamber and forms one heat pipe structure arranged side by side.
Described fin and framework connection are all by integral braze-welded being structure as a whole in the soldering oven.
The arranged outside of described framework has can increase the outer fin of area of dissipation with augmentation of heat transfer, and/or in the mode of forced convertion heat is distributed to fan in the atmosphere.
A kind of processing technology of foregoing novel flat heat pipe is characterized in that: each peak valley position of the fin of the corrugated board chip architecture of described flat plate heat tube is connected with frame inner wall, and in soldering oven by the integral braze-welded structure that is processed as one.
Technique effect of the present invention:
The present invention has some fins of arranging duct or conduit in the same way by being provided with in flat framework, in the plate frame after application of vacuum filling liquid working medium, liquid working substance is in duct or conduit that fin forms, naturally form the heat pipe effect, heat pipe can use separately, also the cryosurface of heat pipe partly can be provided with outer fin and fan.Mainly the mode with free convection or forced convertion is passed to heat in the atmosphere.This flat-plate heat pipe has the high efficiency of full platen surface heat absorption on the one hand, the characteristic of the efficient thermotransport of inner heat pipe, make this flat-plate heat pipe have high efficiency, ultra-thin, and wing has good characteristics such as augmentation of heat transfer and stiffened flat plate heat pipe bearing strength in the flat-plate heat pipe, and this flat plate heat tube has structural strength height, non-maintaining advantage.
The framework internal cavity can be separated into some a large amount of open type pore passage structures by inner fin, by filling liquid working medium after the application of vacuum, thereby make each duct in the inner chamber all form heat pipe structure, this heat pipe structure has then possessed the high characteristic of heat pipe-type heat transfer efficiency, eliminated general heat pipe and oscillating heat pipe and the face contact area that is cooled little, the characteristics that equivalent thermal resistance is big have overcome the shortcoming that oscillating heat pipe needs the starting of oscillation temperature difference simultaneously.Have simple in structure, reliable operation, with low cost, non-maintaining, characteristics that radiating efficiency is high.
Adopt built-in fin in the framework, inner fin can play the effect of support reinforcing to framework, can further improve the intensity of frame structure, on the contrary, adopt plate armature of the present invention, can further reduce the sheet metal thickness of frame structure, just reduce the material consumption of framework, reduce the material cost of product.
Characteristics ultra-thin, efficient, that the thermotransport amount is big that flat-plate heat pipe of the present invention has can replace oscillating heat pipe, general heat pipe.
Description of drawings
Shown in Figure 1 is a kind of example structure schematic diagram of flat-plate heat pipe of the present invention;
Shown in Figure 2 is the outer fin structure schematic diagram of flat-plate heat pipe of the present invention;
Shown in Figure 3 is the structural representation of flat-plate heat pipe both ends open of the present invention;
Shown in Figure 4 is the open structural representation of flat-plate heat pipe one end of the present invention.
The specific embodiment
The present invention will be further described below in conjunction with accompanying drawing.
Be illustrated in figure 1 as the structural representation of flat-plate heat pipe of the present invention.
The endotherm section of absorber plate 1 and the heating face of electronic devices and components fit tightly by heat conductive silica gel, and fan 3 is arranged at the top of the outer fin 5 of flat-plate heat pipe, and fan 3 scatters and disappears the heat that the flat-plate heat pipe absorber plate absorbs in atmosphere in the mode of heat convection.
Be provided with inner fin 4 in the plate frame of absorber plate 1, inner fin 4 is between the upper and lower end face of framework, inner fin shown in the figure 4 is for having the plate of W shape ripple struction, the peak valley position of the ripple struction of inner fin 4 joins with the plate inwall of absorber plate 1 respectively, each adjacent peak valley on the inner fin 4 all and between the wooden partition all forms a poroid pipeline, whole inner fin 4 is separated into some poroid pipelines with the inside of frame space, framework inside is vacuum structure, and be filled with liquid working substance, filling is in an end of each poroid passage respectively for working medium, and these poroid passages are with regard to the corresponding heat pipe that becomes.Outer fin 5 also is a W type fin.
The operation principle of present embodiment: absorber plate 1 absorbs the heat that electronic devices and components produce, working medium heat absorption evaporation in the heat pipe, high-temperature vapour dispels the heat to the external world by framework and layout outer fin 5 thereon respectively, outer fin 5 tops are provided with fan 3, under fan 3 forced convertion effects, steam is condensed into liquid and flows back into plate 1, liquid heat absorption evaporation again ..., so go round and begin again, just the heat that absorber plate 1 is absorbed can be passed to the external world continuously, be delivered to extraneous purpose fast thereby reach the heat that electronic devices and components are produced.
A kind of embodiment is: for inner fin 4 formed each pipeline, if having a large amount of through holes on the tube wall that forms each pipeline, then each pipeline is interconnected, and the inner chamber of whole absorber plate 1 forms a total heat pipe structure.
Another kind of embodiment is: inner fin 4 is formed each heat pipe of isolating mutually 6 in absorber plate 1, can seal an end between heat pipe 6 two ends and absorber plate 1 wooden partition and keep other end opening, be heat pipe end 8 sealings, heat pipe end 7 is interconnected, thereby forms separate between each heat pipe (as Fig. 3); Also can adopt each heat pipe two ends 7,8 all open, thereby the two ends of each heat pipe 6 are communicated with mutually, thereby can be used as a total heat pipe structure (as Fig. 4) again between each heat pipe 6.
This inside has the absorber plate 1 of a plurality of fine conduits, absorber plate 1 can utilize REFRIGERATION SYSTEM DRIVEN BY CAPILLARY FORCE to make every effort to promote the steam of evaporator section is moved to condensation segment faster, simultaneously also can impel condensate liquid to turn back to evaporator section faster evaporates once more, circulation successively, clearly, this absorber plate structure has than existing general heat pipe and oscillating heat pipe and has bigger heat transfer efficiency.
The above only is a preferred implementation of the present invention.For a person skilled in the art, can also make a lot of modification and improvement, but these modification and improvement all will fall into protection scope of the present invention according to essence of the present invention.
Claims (10)
1. one kind is used for the flat-plate heat pipe that electronic device cools off, comprise the flat-plate heat pipe framework, the upper surface of described framework is an evaporative cooling face, it is characterized in that: be provided with inner fin in the framework of described flat plate heat tube, described inner fin is between the upper and lower end face of framework, and described inner fin is separated into some poroid passages with the inside of frame space, and framework inside is vacuum structure, and being filled with liquid working substance, the flat plate heat tube lower surface partly or entirely directly links to each other with the heating face of electronic device.
2. a kind of flat-plate heat pipe that is used for the electronic device cooling as claimed in claim 1, it is characterized in that: described inner fin for that make by hard material, that have the penetrating hole of plurality of integral in it, have a network structure that the suitable profile of plate frame interior shape is arranged, dull and stereotyped frame forms whole plate heat pipe with its interior inner fin.
3. a kind of flat-plate heat pipe that is used for the electronic device cooling as claimed in claim 2, it is characterized in that: described inner fin is a W shape corrugated board chip architecture, and each W-shaped peak paddy position and frame inner wall join, and forms the duct that is arranged alternately.
4. a kind of flat-plate heat pipe that is used for the electronic device cooling as claimed in claim 3, it is characterized in that: the cross section in described duct is the non-circular hole cross section.
5. a kind of flat-plate heat pipe that is used for the electronic device cooling as claimed in claim 4, it is characterized in that: the cross section in described duct is a triangle.
6. a kind of flat-plate heat pipe that is used for the electronic device cooling as claimed in claim 3, it is characterized in that: each duct path that described inner fin forms is that an end is convenient to the disposable filling liquid that vacuumizes in the opening of framework inner chamber, the sealing of joining of the other end and frame inner wall, each duct path is independent heat pipe structure.
7. a kind of flat-plate heat pipe that is used for the electronic device cooling as claimed in claim 6, it is characterized in that: each its two ends of duct path that described inner fin forms are all open in the framework inner chamber, and each duct path communicates in the framework inner chamber and forms one heat pipe structure arranged side by side.
8. a kind of flat-plate heat pipe that is used for the electronic device cooling as claimed in claim 7, it is characterized in that: described inner fin and framework connection are all by integral braze-welded being structure as a whole in the soldering oven.
9. a kind of flat-plate heat pipe that is used for the electronic device cooling as claimed in claim 8, it is characterized in that: the arranged outside of described framework has can increase the outer fin of area of dissipation with augmentation of heat transfer, and/or in the mode of forced convertion heat is distributed to fan in the atmosphere.
10. the processing technology of a novel flat heat pipe as claimed in claim 1, it is characterized in that: each peak valley position of the inner fin of the corrugated board chip architecture of described flat plate heat tube is connected with frame inner wall, and in soldering oven by the integral braze-welded structure that is processed as one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101193114A CN101363696B (en) | 2008-09-03 | 2008-09-03 | Flat hot pipe for cooling electron device and processing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101193114A CN101363696B (en) | 2008-09-03 | 2008-09-03 | Flat hot pipe for cooling electron device and processing technology thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101363696A true CN101363696A (en) | 2009-02-11 |
| CN101363696B CN101363696B (en) | 2011-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101193114A Active CN101363696B (en) | 2008-09-03 | 2008-09-03 | Flat hot pipe for cooling electron device and processing technology thereof |
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| Country | Link |
|---|---|
| CN (1) | CN101363696B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101846471A (en) * | 2010-05-15 | 2010-09-29 | 中山伟强科技有限公司 | Soaking plate |
| CN102121802A (en) * | 2011-03-25 | 2011-07-13 | 长沙理工大学 | Plate-type pulsating heat pipe with double-side grooves |
| CN104755860A (en) * | 2012-09-03 | 2015-07-01 | Abb技术有限公司 | Power electronics cooling |
| CN105258542A (en) * | 2015-11-25 | 2016-01-20 | 赵炜 | Ladder-shaped inner finned heat pipe |
| CN105960147A (en) * | 2016-06-13 | 2016-09-21 | 东南大学 | Spiral fractal based integrated micro flat plate heat pipe |
| CN107876921A (en) * | 2017-11-03 | 2018-04-06 | 西安航天精密机电研究所 | The disassembling fixture and its method for dismounting of a kind of chip pin |
| WO2018177443A1 (en) * | 2017-03-28 | 2018-10-04 | 杭州三花家电热管理系统有限公司 | Heat conduction assembly, heat conduction device, and preparation method for heat conduction assembly |
| CN110198611A (en) * | 2018-02-27 | 2019-09-03 | 泽鸿(广州)电子科技有限公司 | Radiator |
| CN115412649A (en) * | 2022-08-16 | 2022-11-29 | 常州大学 | Heat pipe type cooling system for fax machine |
-
2008
- 2008-09-03 CN CN2008101193114A patent/CN101363696B/en active Active
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101846471A (en) * | 2010-05-15 | 2010-09-29 | 中山伟强科技有限公司 | Soaking plate |
| CN102121802A (en) * | 2011-03-25 | 2011-07-13 | 长沙理工大学 | Plate-type pulsating heat pipe with double-side grooves |
| CN104755860A (en) * | 2012-09-03 | 2015-07-01 | Abb技术有限公司 | Power electronics cooling |
| CN104755860B (en) * | 2012-09-03 | 2017-02-22 | Abb 技术有限公司 | Power electronics cooling |
| CN105258542A (en) * | 2015-11-25 | 2016-01-20 | 赵炜 | Ladder-shaped inner finned heat pipe |
| CN105258542B (en) * | 2015-11-25 | 2017-04-12 | 赵炜 | Ladder-shaped inner finned heat pipe |
| CN105960147A (en) * | 2016-06-13 | 2016-09-21 | 东南大学 | Spiral fractal based integrated micro flat plate heat pipe |
| CN105960147B (en) * | 2016-06-13 | 2018-09-14 | 东南大学 | Divide the integrated microminiature flat-plate heat pipe of shape based on spiral |
| WO2018177443A1 (en) * | 2017-03-28 | 2018-10-04 | 杭州三花家电热管理系统有限公司 | Heat conduction assembly, heat conduction device, and preparation method for heat conduction assembly |
| CN107876921A (en) * | 2017-11-03 | 2018-04-06 | 西安航天精密机电研究所 | The disassembling fixture and its method for dismounting of a kind of chip pin |
| CN110198611A (en) * | 2018-02-27 | 2019-09-03 | 泽鸿(广州)电子科技有限公司 | Radiator |
| CN115412649A (en) * | 2022-08-16 | 2022-11-29 | 常州大学 | Heat pipe type cooling system for fax machine |
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| Publication number | Publication date |
|---|---|
| CN101363696B (en) | 2011-07-20 |
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