CN105834542B - A kind of dual-in-line package chip provision for disengagement - Google Patents
A kind of dual-in-line package chip provision for disengagement Download PDFInfo
- Publication number
- CN105834542B CN105834542B CN201510014477.XA CN201510014477A CN105834542B CN 105834542 B CN105834542 B CN 105834542B CN 201510014477 A CN201510014477 A CN 201510014477A CN 105834542 B CN105834542 B CN 105834542B
- Authority
- CN
- China
- Prior art keywords
- unit
- molten tin
- tin bath
- dual
- provision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention relates to a kind of dual-in-line package chip provision for disengagement, solve the problems, such as that dual-in-line package chip is quick during circuit board repair, nondestructive demounting is difficult.The device includes circuit board fixed cell (1), molten tin bath unit (2), heating temperature control unit (3), positioning unit (4), operation display unit (5) and frame (6,7,9,10).The device is easy to operate, can from circuit board quickly, the dual-in-line package chip of nondestructive demounting difference pin.
Description
Technical field
The present invention relates to a kind of devices that can be used for dismantling dual-in-line package chip from circuit board.
Background technique
With the rapid development of microelectric technique, the number of applications and kind of dual-in-line package chip in modern weapons equipment
There are many class.It needs to disassemble it from circuit board to be tested or be replaced maintenance when wafer damage.Dual-in-line envelope
The usual pin of cartridge chip is more, span is big, and when disassembly usually requires the scolding tin for heating all pins on fusing chip simultaneously, at present still
Without suitable tool device.A kind of method is while to melt the weldering on all pins using manually using electric iron manual teardown
Chip is simultaneously taken out more difficulty by tin, to be usually repeated as many times, by several times be unloaded part pin, circuit board is be easy to cause to deform,
Solder joint falls off, and subsequent maintenance operation is made to become very difficult.Another common method be using tin furnace, the heating surface of tin furnace compared with
Greatly, all pins of chip can be melted simultaneously and removed, but the heating of large area be easy to cause being heated for chip to be removed
Height damages, and also easily treats the element for tearing chip perimeter open and circuit board forms the damage of unrepairable.This process both needs solid
Fixed circuit board to be repaired also needs operation electric iron, is removed chip to be torn open with extraction tool, and operating process is sufficiently complex, linking
Answer extremely compact could dismantle successfully.This process generally requires two people cooperation and could complete.
Summary of the invention
The technical problems to be solved by the present invention are: providing one kind easy to operate, Ke Yiyong during circuit board repair
In the device of dual-in-line package chip quick, nondestructive demounting difference number of pin from circuit board.
In order to solve the above-mentioned technical problem, a kind of dual-in-line package chip provision for disengagement of the present invention is using as follows
Technical solution: the device includes circuit board fixed cell, molten tin bath unit, heating temperature control unit, positioning unit, operation display unit
And frame.
Circuit board fixed cell is located at the top of the provision for disengagement, and one end is vertically connected on the front bezel of provision for disengagement
On, the other end is vertically connected on the cylindrical type cross bar on rear frame, is used for fixing circuit board；Molten tin bath unit, heating temperature control list
Member and positioning unit are located at the inside of the provision for disengagement, and molten tin bath unit is mounted on heating temperature control unit top, heat temperature control list
Member is fixed on positioning unit by attachment device；The molten tin bath unit be will dual-in-line package chip be torn open pin carry out
The executing agency of local heating has on molten tin bath unit and arranges similar twice molten tin bath with chip pin, fills scolding tin in molten tin bath；
The heating temperature control unit realizes the computer heating control to molten tin bath unit by the monitoring temperature of the molten tin bath unit；The positioning is single
Member can move on lateral, longitudinal and vertical three degree of freedom, be responsible for the delivery molten tin bath unit and be directed at dual-in-line to be torn open
The pin for encapsulating chip, completes the positioning of the molten tin bath unit, enables the scolding tin melted in molten tin bath and dual-in-line package to be torn open
Chip pin comes into full contact with；The operation display unit, on the front panel of provision for disengagement front frame bottom, for pair
The provision for disengagement carries out operation and the display of state；Inside the heating temperature control unit, positioning unit and operation display unit
Circuit part controlled and communicated by microcontroller.
In use, circuit board is fixed on circuit board fixed cell, operating positioning unit by operation display unit will
Molten tin bath unit is directed at the pin of chip to be torn open, and heating temperature control unit starts to heat molten tin bath unit, when molten tin bath temperature reaches
When the melting temperature of scolding tin, the scolding tin melted in molten tin bath can come into full contact with chip pin, at this time can will chip be torn open from circuit
It is extracted on plate.Since molten tin bath length, width and the depth on molten tin bath unit match with the chip pin distribution that need to be dismantled, molten tin bath
Only chip pin is heated, guarantees that heat concentration makes the scolding tin on pin while melting in disassembly process, while reducing and dismantling
The heating surface area of circuit board in journey.When molten tin bath temperature is higher than the melting temperature of scolding tin, heating temperature control unit stops to molten tin bath list
Member heating, prevents the excessively high damage chip of temperature and circuit board.
The operating process for wanting facilitating chip to dismantle, can use electromechanical automatic control technology makes molten tin bath be accurately aimed at core to be torn open
Piece pin.Currently, Electromechanical Control technology is more mature, utilizes various control stepper motors, displacement sensor and mechanical biography
The control precision of motivation structure can satisfy the demand of molten tin bath position control accuracy.
By adopting the above-described technical solution, the dual-in-line package chip of different pins can from circuit board quickly,
Simplicity nondestructively disassembles.
Detailed description of the invention
For a better understanding of the present invention, it is further described with reference to the accompanying drawing.
Fig. 1 is the structural schematic diagram of dual-in-line package chip provision for disengagement；
Fig. 2 is molten tin bath cellular construction schematic diagram top view；
Fig. 3 is molten tin bath cellular construction schematic diagram transverse direction sectional drawing；
Fig. 4 is the hardware theory of constitution schematic diagram of dual-in-line package chip provision for disengagement.
Specific embodiment
Below by embodiment, the present invention is described in further detail.
The structural schematic diagram of dual-in-line package chip provision for disengagement (hereinafter referred to as provision for disengagement) is as shown in Figure 1, include
Circuit board fixed cell 1, molten tin bath unit 2, heating temperature control unit 3, positioning unit 4, operation display unit 5 and frame 6,7,9,
10。
Wherein, circuit board fixed cell 1 is located at the top of provision for disengagement, and one end is vertically connected on the front of provision for disengagement
On frame 6, the other end is vertically connected on the cylindrical type cross bar 8 on the rear frame 7 horizontal with front bezel 6, is fixed along circuit board
The vertical direction of unit 1 can push circuit board fixed cell 1.The arranged on left and right sides face Jun You tri- and electricity of circuit board fixed cell 1
The groove that road plate thickness matches, while also Jun You tri- on the left frame 9 of provision for disengagement, the correspondence horizontal position of left frame 10
The groove to match with circuit plate thickness, in fixing circuit board, by circuit board. while being embedded into left and right side frame wherein
A certain groove in, then by walking circuit plate fixed cell 1 another side of circuit board to be embedded into circuit board fixed cell 1 right
It answers in the groove of horizontal position, it can fixing circuit board.In this way, can be fixed by adjusting circuit board according to the size of circuit board
The different circuit board of 1 fixed dimension of unit.The groove of three height of upper, middle and lower is set, and can select according to the actual situation will be electric
Road plate is fixed in three different height.
Molten tin bath unit 2 be will dual-in-line package chip be torn open pin carry out local heating executing agency, molten tin bath list
Member 2 is made of the metal material of good heat conductivity.As shown in Figure 2 and Figure 3, have thereon and the similar twice of chip pin arrangement
Molten tin bath 11,11 ', molten tin bath 11,11 ' is interior to fill scolding tin.There are two screw hole 12,12 ' among the top of molten tin bath unit 2, being used for will
Molten tin bath unit 2 is fixed on the top of heating temperature control unit 3.Molten tin bath 11,11 ' length, width and depth and need on molten tin bath unit 2
The pin distribution of chip to be removed matches, and guarantees that the scolding tin in disassembly process on pin melts simultaneously.
Circuit part inside heating temperature control unit 3, positioning unit 4 and operation display unit 5 is carried out by microcontroller 13
It controls and communicates, as shown in Figure 4.
Heating temperature control unit 3 realizes the computer heating control to molten tin bath unit 2 by the monitoring temperature to molten tin bath unit 2, by adding
Hot device, temperature sensor and temperature-control circuit composition, heater can be used powerful electrothermal tube and constitute, inside provision for disengagement
Using microcontroller 13 to temperature sensor send back come molten tin bath unit 2 temperature compared with the melting temperature of scolding tin, work as tin
When the temperature of slot unit 2 is lower than the melting temperature of scolding tin, microcontroller 13 controls heater by temperature-control circuit and is powered, and makes
Its temperature is increased to be heated to molten tin bath unit 2；When the temperature of molten tin bath unit 2 is higher than the melting temperature of scolding tin, microcontroller 13 is logical
Excess temperature control circuit controls heater power-off, and stopping heats it.Temperature feedback control process constantly carries out, and can make described
The temperature of molten tin bath unit 2 be maintained near the melting temperature of scolding tin, guarantee melts soldering tin can make chip disassemble and
It is unlikely to the excessively high damage chip of temperature and circuit board.
The responsible delivery of the positioning unit 4 molten tin bath unit 2 arrives suitable removed position, makes fusing in molten tin bath 11,11 '
Scolding tin can come into full contact with chip pin.Positioning unit 4 includes located lateral unit 14, longitudinal register unit 15 and vertical positioning
Unit 16, this moves the carrying molten tin bath unit 2 of positioning unit 4 on lateral, longitudinal and vertical three degree of freedom.It is horizontal
An executing agency, directional control circuit and position sensing are respectively included to, longitudinal and vertical each positioning unit 14,15,16
Device is each provided with a stepper motor, a linear guides and a worm drive block in each executing agency, institute, position sensing
Device uses linear movement pick-up.Stepping motor rotating shaft is connect with linear guides, linear guides can be driven to rotate.Worm drive block peace
On linear guides, linear guides rotation can drive worm drive block mobile.Molten tin bath unit 2 and heating temperature control unit 3 are installed
On worm drive block, moved together with worm drive block.Linear movement pick-up is mounted on worm drive block, and measurement spiral passes
The distance length of motion block movement and direction, the electric signal of output send directional control circuit to, form closed loop location feedback.When
When positioning unit 4 needs mobile molten tin bath unit 2 some direction in lateral, longitudinal or vertical to move a distance, positioning unit 4
The stepper motor for controlling respective direction drives linear guides to rotate to rotation, stepper motor is correctly oriented, on linear guides
Worm drive block presses assigned direction and the molten tin bath unit 2 is driven to move, and linear movement pick-up measures the movement of molten tin bath unit 2
Distance is simultaneously transmitted to positioning unit 4, judges whether molten tin bath unit 2 reaches designated position by positioning unit 4.Positioning unit 4 controls
The molten tin bath unit 2 moves on lateral, longitudinal and vertical three degree of freedom, molten tin bath unit 2 can be made to be accurately aimed to be removed
The pin of chip completes the positioning of molten tin bath unit 2.
Provision for disengagement further include operation display unit 5, on the front panel of 6 lower part of provision for disengagement front bezel, for pair
Provision for disengagement carries out operation and the display of state.Operation can be used and be shown in the integrated display screen with touch function, pass through
Touch panel program is developed to complete the operation and control to provision for disengagement.To operate and monitoring convenient for operator, can will tear open
Handler front panel design is at the inclined-plane with provision for disengagement bottom (preferably 60 degree) at an acute angle, as shown in Figure 1, operation display is single
Member 5 is embedded into the inclined-plane.
Operation display unit 5 is attached with microcontroller 13 by communication module, and operation display unit 5 passes through microcontroller
Device 13 realizes the control to positioning unit 4 and heating temperature control unit 3, while operating display unit 5 also by microcontroller 13
The location information of positioning unit 4 and the temperature information of heating temperature control unit 3 are received, convenient for the monitoring of operator.
To when dual-in-line chip is dismantled on circuit board, circuit board is consolidated with circuit board fixed cell 1 first
It is fixed, then start detaching equipment, carries out the control of position to positioning unit 4 by operation display unit 5, keep molten tin bath unit 2 right
Standard starts heating function after tearing chip open, and the scolding tin in 2 molten tin bath of molten tin bath unit is molten into liquid when reaching the melting temperature of scolding tin
State, scolding tin and the chip pin of liquid come into full contact with, and can make the melts soldering tin on pin, are detached from circuit board, by chip from electricity
It is extracted on the plate of road, the disassembly of chip to be torn open can be completed.
In order to precisely align chip to be torn open with molten tin bath unit 2, a reference cell, benchmark list can be also designed in provision for disengagement
The mountable laser head of member, laser head can produce cross hairs.Respectively by the upper left corner in the upper left corner of molten tin bath unit 2 and chip to be torn open
With after cross hairs midpoint alignment i.e. complete origin reference location.
By adopting the above-described technical solution, the dual-in-line package chip of different pins can from circuit board quickly,
Simplicity nondestructively disassembles.
The above is only better embodiment of the invention, is not construed as limitation of the scope of the invention.It is all to be familiar with
The personage of this field technology, think according to the technical idea of present disclosure, technical method and technology contents and equivalence changes
Or the contents such as simplified, it should all fall within the scope of protection of the present invention.
Claims (6)
1. a kind of dual-in-line package chip provision for disengagement, comprising: circuit board fixed cell (1), molten tin bath unit (2), heating temperature
Control unit (3), positioning unit (4), operation display unit (5) and frame (6,7,9,10)；It is characterized by:
Circuit board fixed cell (1) is located at the top of the provision for disengagement, and one end is vertically connected on the front bezel of provision for disengagement
(6) on, the other end is vertically connected on the cylindrical type cross bar (8) on rear frame (7), is used for fixing circuit board；
Molten tin bath unit (2), heating temperature control unit (3) and positioning unit (4) are located at the inside of the provision for disengagement, molten tin bath unit
(2) it is mounted on heating temperature control unit (3) top, heating temperature control unit (3) is fixed on positioning unit (4) by attachment device；
The molten tin bath unit (2) be will dual-in-line package chip be torn open pin carry out local heating executing agency, in tin
Have on slot unit (2) and arrange similar twice molten tin bath (11,11 ') with chip pin, fills scolding tin in molten tin bath (11,11 ')；
The heating temperature control unit (3) is made of heater, temperature sensor and temperature-control circuit；The heating temperature control unit
(3) computer heating control to molten tin bath unit (2) is realized by the monitoring temperature of the molten tin bath unit (2)；
The positioning unit (4) includes located lateral unit (14), longitudinal register unit (15) and vertical positioning unit (16)；Institute
Stating positioning unit (4) can move on lateral, longitudinal and vertical three degree of freedom, and it is right to be responsible for the delivery molten tin bath unit (2)
The pin of standard dual-in-line package chip to be torn open completes the positioning of the molten tin bath unit (2), makes fusing in molten tin bath (11,11 ')
Scolding tin can come into full contact with dual-in-line package chip pin to be torn open；
The operation display unit (5) is located on the front panel of provision for disengagement front bezel (6) lower part, for tearing open to described
Handler carries out operation and the display of state；
The circuit part of the heating temperature control unit (3), positioning unit (4) and operation display unit (5) inside is by microcontroller
(13) it is controlled and is communicated；
The groove that the arranged on left and right sides face Jun You tri- and circuit plate thickness of circuit board fixed cell (1) match, while left frame
(9), the groove that also Jun You tri- and circuit plate thickness match on the correspondence horizontal position of left frame (10)；
The located lateral unit (14), longitudinal register unit (15) and vertical positioning unit (16) respectively include an execution machine
Structure, directional control circuit and position sensor, be each provided in each executing agency a stepper motor, a linear guides and
One worm drive block, position sensor use linear movement pick-up；Stepping motor rotating shaft is connect with linear guides, can be with moving-wire
Property guide rail rotation；Worm drive block is mounted on linear guides, and linear guides rotation can drive worm drive block mobile；Molten tin bath list
First (2) and heating temperature control unit (3) are mounted on worm drive block, are moved together with worm drive block；Linear movement pick-up peace
On worm drive block, the distance length and direction, the electric signal of output of measurement worm drive block movement send direction to
Control circuit forms closed loop location feedback.
2. a kind of dual-in-line package chip provision for disengagement according to claim 1, it is characterised in that: the molten tin bath list
The pin distribution of molten tin bath (11,11 ') length, width and depth and dual-in-line package chip to be removed on first (2) matches.
3. a kind of dual-in-line package chip provision for disengagement according to claim 1, it is characterised in that: the molten tin bath unit
(2) there are two screw hole (12,12 ') among top, for molten tin bath unit (2) to be fixed on heating temperature control unit (3)
Portion.
4. a kind of dual-in-line package chip provision for disengagement according to claim 1, it is characterised in that: the operation display
Unit (5) is using operation and is shown in the integrated display screen with touch function.
5. a kind of dual-in-line package chip provision for disengagement according to claim 1, it is characterised in that: the provision for disengagement
Front panel and provision for disengagement bottom inclined-plane at an acute angle.
6. a kind of dual-in-line package chip provision for disengagement according to claim 1, it is characterised in that: the provision for disengagement
It further include reference cell, the mountable laser head of reference cell, laser head can produce cross hairs, respectively by molten tin bath unit (2)
Origin reference location is completed after being aligned with cross hairs center line in the upper left corner and the upper left corner wait tear dual-in-line package chip open.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510014477.XA CN105834542B (en) | 2015-01-13 | 2015-01-13 | A kind of dual-in-line package chip provision for disengagement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510014477.XA CN105834542B (en) | 2015-01-13 | 2015-01-13 | A kind of dual-in-line package chip provision for disengagement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105834542A CN105834542A (en) | 2016-08-10 |
| CN105834542B true CN105834542B (en) | 2019-05-07 |
Family
ID=57178042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510014477.XA Active CN105834542B (en) | 2015-01-13 | 2015-01-13 | A kind of dual-in-line package chip provision for disengagement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105834542B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106825821B (en) * | 2017-01-24 | 2019-07-12 | 安徽锐能科技有限公司 | PCB electronic component removes device |
| CN107876921A (en) * | 2017-11-03 | 2018-04-06 | 西安航天精密机电研究所 | The disassembling fixture and its method for dismounting of a kind of chip pin |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3644980A (en) * | 1969-06-25 | 1972-02-29 | Pace Inc | Component removal device |
| US4569473A (en) * | 1983-11-03 | 1986-02-11 | Guiliano John A | Apparatus for and method of desoldering and removing an integrated circuit from a mounting member and for cleaning the same |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
| CN2843016Y (en) * | 2005-09-19 | 2006-11-29 | 海尔集团公司 | A kind of circuit board component thermal disassembling equipment |
| CN101311868A (en) * | 2007-05-25 | 2008-11-26 | 佛山市顺德区汉达精密电子科技有限公司 | Tip-off thermostatic control device and its control method |
| CN101362239A (en) * | 2008-09-18 | 2009-02-11 | 中国人民解放军后勤工程学院 | Automatic disassembling device of circuit board device |
| CN204686237U (en) * | 2015-01-13 | 2015-10-07 | 中国人民解放军军械工程学院 | The provision for disengagement of a kind of dual-in-line package chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005167142A (en) * | 2003-12-05 | 2005-06-23 | Nec Tohoku Ltd | Soldering apparatus |
-
2015
- 2015-01-13 CN CN201510014477.XA patent/CN105834542B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3644980A (en) * | 1969-06-25 | 1972-02-29 | Pace Inc | Component removal device |
| US4569473A (en) * | 1983-11-03 | 1986-02-11 | Guiliano John A | Apparatus for and method of desoldering and removing an integrated circuit from a mounting member and for cleaning the same |
| CN2843016Y (en) * | 2005-09-19 | 2006-11-29 | 海尔集团公司 | A kind of circuit board component thermal disassembling equipment |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
| CN101311868A (en) * | 2007-05-25 | 2008-11-26 | 佛山市顺德区汉达精密电子科技有限公司 | Tip-off thermostatic control device and its control method |
| CN101362239A (en) * | 2008-09-18 | 2009-02-11 | 中国人民解放军后勤工程学院 | Automatic disassembling device of circuit board device |
| CN204686237U (en) * | 2015-01-13 | 2015-10-07 | 中国人民解放军军械工程学院 | The provision for disengagement of a kind of dual-in-line package chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105834542A (en) | 2016-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110524225B (en) | Quick clamping device of ring gear processing | |
| CN105834542B (en) | A kind of dual-in-line package chip provision for disengagement | |
| CN201332546Y (en) | FPC flat cable welding machine | |
| CN102095628A (en) | Sample digestion processing device | |
| CN101987387B (en) | Fully automatic novel electronic component soldering machine | |
| CN201708093U (en) | Relay automatic tin feeding and wetting device | |
| CN103612381A (en) | Multifunctional hot-melting column machine | |
| KR100516185B1 (en) | Fusion splicer | |
| CN204686237U (en) | The provision for disengagement of a kind of dual-in-line package chip | |
| KR200408328Y1 (en) | Multi-focussing glass lense pressing and making device | |
| KR101175070B1 (en) | Jig for adjusting film pitch and apparatus for joining film having the same and method for adjusting film pitch using the same | |
| KR100546738B1 (en) | Multi-focussing lense processing device | |
| CN108819265A (en) | Screw nut hot melting installs equipment and screw nut hot melting installation method | |
| CN206326868U (en) | Hot melting fixture | |
| CN104029383B (en) | A kind of instrument board door-plate full automatic rotary type bonding machine | |
| CN105004637A (en) | Cement setting time tester | |
| CN204994693U (en) | Brush scalds and bores all -in -one | |
| CN211991522U (en) | Welding device with CCD detection function | |
| KR200449154Y1 (en) | film's binding device | |
| CN110434524A (en) | A kind of electronic component welder | |
| JP2010034341A (en) | Chip mounting device | |
| CN208305838U (en) | A kind of fixed device of rivet hot | |
| CN110421857A (en) | A kind of multistation fuse machine | |
| CN109278275A (en) | Three-dimensional silk-screen label molding machine | |
| CN215320859U (en) | Automatic pressure maintaining device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 050003 Heping West Road, Shijiazhuang, Hebei Province, No. 97 Applicant after: PLA Military Engineering University Address before: 050003 Heping West Road, Shijiazhuang, Hebei Province, No. 97 Applicant before: Ordnance Engineering College of the Chinese People's Liberation Army |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |