CN105828590A - Terminal equipment - Google Patents
Terminal equipment Download PDFInfo
- Publication number
- CN105828590A CN105828590A CN201610308438.5A CN201610308438A CN105828590A CN 105828590 A CN105828590 A CN 105828590A CN 201610308438 A CN201610308438 A CN 201610308438A CN 105828590 A CN105828590 A CN 105828590A
- Authority
- CN
- China
- Prior art keywords
- fpc
- mainboard
- fingerprint recognition
- recognition module
- terminal unit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The embodiment of the invention discloses terminal equipment, and relates to the electronic equipment field. The terminal equipment can consider the thickness of a whole machine at a fingerprint identification module and does not influence the board utilization rate of a main board. The terminal equipment includes a fingerprint identification module, a flexible printed circuitboard FPC and a main board, wherein the fingerprint identification module is pasted on one surface of the FPC; the other surface of the FPC is pasted on a reinforced sheet layer; the reinforced sheet layer is fixed on the main board, and is used for reinforcement of the FPC; and the reinforced sheet layer is also used for shielding a device on the main board. The embodiment of the terminal equipment is used for assembling of terminal equipment.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of terminal unit.
Background technology
Along with the ultrathin of electronic equipment, as PCB (PrintedCircuitBoard, the printed circuit board) plate of electronic equipment mainboard towards integrated and extra smallization development, generally require when needing integrated new function and again develop new PCB layout designs.As when designing fingerprint identification function, need to consider to take less device area and thickness.
In prior art, one of common practice is to be pasted onto on the back cover of electronic equipment by glue by fingerprint recognition module；Another kind of way is directly to be fixed on mainboard by the device arrangement mode of Butut again；But no matter use which kind of mode all to influence whether original device such as microprocessor on mainboard, the devices such as video card, when wherein using first kind of way, owing to being fixed on back cover when fingerprint recognition module assembles, regardless of whether be affixed to the where of back cover, all can device original with on mainboard overlapping, the especially original device of part considers when electromagnetic shielding affects, it is required to individually design radome in device periphery, and when fingerprint recognition module is pasted on the back cover of the device position that correspondence has radome, the thickness of each structure above above-mentioned device is overlapped mutually, it is unfavorable for that the thickness of electronic equipment reduces, when using the second way, firstly the need of again taking original device and fingerprint recognition module into account design layout, the circuit of fingerprint recognition module can take certain area on mainboard, it is unfavorable for mainboard miniaturization.
Summary of the invention
Embodiments of the invention provide a kind of terminal unit, it is possible to do not affect the plate face utilization rate of mainboard while taking into account complete machine thickness at fingerprint recognition module.
For reaching above-mentioned purpose, embodiments of the invention adopt the following technical scheme that
First aspect, a kind of terminal unit, including: fingerprint recognition module, FPC, mainboard；
Described fingerprint recognition module paster is in the one side of FPC；The another side of described FPC is pasted on reinforcement lamella；Described reinforcement lamella is fixed on described mainboard, and described reinforcement lamella is for the reinforcement of described FPC, and described reinforcement lamella is additionally operable to shield the device on described mainboard.
The terminal unit that embodiments of the invention provide, including: fingerprint recognition module, FPC, mainboard；Wherein, fingerprint recognition module paster is in the one side of FPC；The another side of FPC is pasted on reinforcement lamella；Reinforcement lamella is fixed on mainboard, and reinforcement lamella is for the reinforcement of described FPC, and reinforcement lamella is additionally operable to shield the device on mainboard.Owing to FPC is flexible base board, therefore reinforcement is needed when paster fingerprint recognition module, the reinforcement to FPC is realized by being pasted on reinforcement lamella by the another side of FPC in this programme, additionally due to be usually present the device needing to carry out electromagnetic shielding on terminal unit, therefore this programme uses reinforcement lamella that the device needing electromagnetic shielding carries out electromagnetic shielding simultaneously, thus eliminate and be individually for this kind of element manufacturing radome；In addition, owing to fingerprint recognition module paster is fixed on mainboard on FPC and by reinforcement lamella, and reinforcement lamella is as the radome of device below, therefore fingerprint recognition module is spatially overlapping with the device of reinforcement lamella shielding on mainboard, i.e. on mainboard, fingerprint recognition module need not be made by layout-design mode, therefore without the layout-design arrangement areas for layout fingerprint recognition module again on mainboard, avoid the Butut area occupied designing fingerprint recognition module on mainboard, the most do not affect terminal unit mainboard plate face utilization rate；Device on this external mainboard and the overlapping region of fingerprint recognition module, reinforcement lamella had both served the strengthening action to FPC, serve again the electromagnetic shielding action to the device on terminal unit mainboard, electro-magnetic shielding cover can be saved in the most at least overlapping region of the device on mainboard and fingerprint recognition module, thus avoids impact electro-magnetic shielding cover being fabricated separately on terminal unit thickness.To sum up, the terminal unit that embodiments of the invention provide does not affects the plate face utilization rate of mainboard while can taking into account complete machine thickness at fingerprint recognition module.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
The assembling structural representation of fingerprint recognition module on a kind of terminal unit that Fig. 1 provides for embodiments of the invention；
The assembling structural blast figure of fingerprint recognition module on a kind of terminal unit that Fig. 2 provides for embodiments of the invention；
The assembling process schematic one of fingerprint recognition module on a kind of terminal unit that Fig. 3 provides for embodiments of the invention；
The assembling process schematic two of fingerprint recognition module on a kind of terminal unit that Fig. 4 provides for embodiments of the invention；
The structural representation of a kind of mounting clip that Fig. 5 provides for embodiments of the invention.
Reference:
Terminal unit-10；
Fingerprint recognition module-11；
Fingerprint recognition IC-111；
Additional device-112；
Immunity substrate FPC-12；
Reinforcement lamella-13；
Connector male head-14；
Strengthening course-15；
Mainboard-20；
Mounting clip-21.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
Embodiments of the invention are applied to terminal unit, this terminal unit can be the equipment that mobile phone, computer, intelligent television etc. comprise fingerprint recognition module, this programme is for the assembling of fingerprint recognition module, concrete principle is, fingerprint recognition module paster is arranged on FPC (FlexiblePrintedCircuitboard, immunity substrate or the printed circuit board (PCB) that detours) one side, the another side of FPC pass through reinforcement lamella reinforcement, reinforcement lamella is additionally operable to the device on shield terminal equipment mainboard in addition.Owing to reinforcement lamella had both served the strengthening action to FPC, serve again the electromagnetic shielding action to the device on terminal unit mainboard, electro-magnetic shielding cover can be saved in the most at least overlapping region of the device on mainboard and fingerprint recognition module, thus avoid impact electro-magnetic shielding cover being fabricated separately on terminal unit thickness, additionally without the layout-design arrangement areas for being individually for fingerprint recognition module on mainboard such that it is able to do not affect the plate face utilization rate of mainboard while taking into account complete machine thickness at fingerprint recognition module.
Concrete scheme is implemented as follows, reference Fig. 1, shown in 2, it is provided that terminal unit 10, including fingerprint recognition module 11, immunity substrate FPC12, mainboard 20；
Fingerprint recognition module 11 paster is in the one side of FPC12；The another side of FPC12 is pasted on reinforcement lamella 13；Reinforcement lamella 13 is fixed on mainboard 20, and reinforcement lamella 13 is for the reinforcement of FPC12, and reinforcement lamella 13 is additionally operable to shield the device on mainboard 20.
In the scheme that above-described embodiment provides, owing to FPC is flexible base board, therefore reinforcement is needed when paster fingerprint recognition module, the reinforcement to FPC is realized by being pasted on reinforcement lamella by the another side of FPC in this programme, additionally due to be usually present the device needing to carry out electromagnetic shielding on terminal unit, therefore this programme uses reinforcement lamella that the device needing electromagnetic shielding carries out electromagnetic shielding simultaneously, thus eliminate and be individually for this kind of element manufacturing radome；In addition, owing to fingerprint recognition module paster is fixed on mainboard on FPC and by reinforcement lamella, and reinforcement lamella is as the radome of device below, therefore fingerprint recognition module is spatially overlapping with the device of reinforcement lamella shielding on mainboard, i.e. on mainboard, fingerprint recognition module need not be made by layout-design mode, therefore without the layout-design arrangement areas for layout fingerprint recognition module again on mainboard, avoid the Butut area occupied designing fingerprint recognition module on mainboard, the most do not affect terminal unit mainboard plate face utilization rate；Device on this external mainboard and the overlapping region of fingerprint recognition module, reinforcement lamella had both served the strengthening action to FPC, serve again the electromagnetic shielding action to the device on terminal unit mainboard, electro-magnetic shielding cover can be saved in the most at least overlapping region of the device on mainboard and fingerprint recognition module, thus avoids impact electro-magnetic shielding cover being fabricated separately on terminal unit thickness.To sum up, the terminal unit that embodiments of the invention provide does not affects the plate face utilization rate of mainboard while can taking into account complete machine thickness at fingerprint recognition module.
Concrete shape the application of reinforcement lamella is not specifically limited, shape as shown in Figure 2, and its concrete shape is as the criterion with the device shape on its mainboard covered.For realizing the shielding completely of device on mainboard 20, with reference to shown in Fig. 2, reinforcement lamella 13 includes the groove of FPC12 opening dorsad, and groove is for accommodating the device on mainboard 20.Reinforcement lamella 13 i.e. can be made as the shape of the radome of prior art.Exemplary, fingerprint recognition module 11 includes fingerprint recognition IC111 and additional device 112, and additional device 112 can carry out preliminary treatment to the signal that fingerprint recognition IC111 gathers, and can also be not provided with additional device 112 in certain program.Below it is only a kind of example, or additional device 112 can also be the device with other functions.
Additionally, fingerprint recognition module 11 paster is formed and the electrical connection of conducting wire on FPC in the one side of FPC12, and then the signal of identification can be derived by fingerprint recognition module by FPC；Wherein the signal in order to be identified by fingerprint recognition module 11 exports the processor to mainboard, and FPC12 is also additionally provided with connector male head 14 in fingerprint recognition module 11 side.Connector male head 14 fastens with the female of adapter on mainboard and realizes being connected, thus realize the signal that identified by fingerprint recognition module 11 by FPC output to mainboard, then by device in adapter transmission to mainboard (exemplary such as signal processor, signal amplifier part, signal filter part etc.).Wherein, owing to male needs to install to FPC, and FPC is flexible material, being therefore additionally provided with strengthening course 15 on the FPC12 of reinforcement lamella 13 side on the position of corresponding connector male head 14, connector male head 14 is connected with fingerprint recognition module 11 by the conducting wire on FPC12.So fastening realization by connector male head 14 with the female of adapter on mainboard to be connected, wherein adapter can be BTB adapter.With reference to Fig. 3, shown in 4, when mounted, first BTB adapter is fastened, wherein by after the female para-position in the male of BTB adapter and mainboard, both can be fastened by applying pressure at strengthening course 15, strengthening course 15 can be avoided directly FPC being applied pressure and causes FPC to deform upon or rupture.After BTB adapter fastens, need FPC bending 180 degree, to be fastened on mainboard 20 by reinforcement lamella, thus realize the electromagnetic shielding action to the device below reinforcement lamella.Certainly reinforcement steel disc can use arbitrary connected mode to arrange and on mainboard, such as welding manner, bonding way etc..In order to realize the device exactitude position of reinforcement lamella 13 and lower section, and realize fingerprint recognition module and can firmly be installed on mainboard 20, reinforcement lamella is fixed on mainboard by the mounting clip 21 (as shown in Fig. 3,4,5) on mainboard, and wherein mounting clip 21 is buried underground on the motherboard 120 along the shape at reinforcement lamella edge.Compared to welding manner and bonding way, due in welding or bonding front reinforcement lamella is relative with the position of mainboard does not fixes, during welding reinforcement lamella may with the pad generation slide displacement on mainboard thus cause positioning accurate, and then the damage to underlying device can be caused or cause device to contact with reinforcement lamella and to produce electromagnetic shielding bad；And in the application, owing to mounting clip directly can be embedded in appointment position by mounting clip pre-buried on mainboard according to design, when reinforcement lamella is installed, fixed by mounting clip after being directly fastened on above the device of mainboard, any slide displacement will not be produced, thus improve and the installation accuracy of reinforcement lamella.
With reference to Fig. 3, shown in 4, by FPC bending 180 degree after during assembling, BTB adapter fastens, reinforcement lamella can be pressed on the connectors, thus prevents the male of adapter and female from disengaging；But generally there is certain thickness in adapter and FPC, when making standard disunity, corresponding BTB (Board-to-board, plate is to plate) position of connector male head, gap is there may be between strengthening course 15 on reinforcement lamella and BTB connector male head, and this gap is likely to result in BTB connector male head and female generation relative displacement, when male is likely to result in BTB connector male head 14 when the sliding of female direction exceedes the contact length of male and female and comes off to departing from；In addition male is during the female that slips away, the contact area of its each pin can be gradually reduced, contact area when between pin is sufficiently small to such an extent as to may produce virtual connection phenomenon when contact impedance and line transmission impedance mismatch, i.e. causes contact resistance super-high-current density excessive because contact area is too small on the male pin with female and the conductor joint heating phenomenon that formed.For avoiding BTB connector male head 14 virtual connection that may result in or the generation that comes off, strengthening course 15 being provided with cushion (not shown), wherein cushion is elastomeric material, and thickness is more than or equal to the thickness in above-mentioned gap.Wherein cushion is filled in the gap between the strengthening course 15 on reinforcement lamella and BTB connector male head, so that adapter is compacted by reinforcement lamella, it is to avoid male is to departing from the sliding of female direction.This exemplary cushion can be foam.
In such scheme, reinforcement lamella mainly has two effects, the supporting role of first couple of FPC, the electromagnetic shielding action of the device on second pair of mainboard；Wherein, as long as possessing suitable rigidity for first effect reinforcement lamella, it is possible to ensure to produce the deformation causing damaging during FPC pressurized.For second effect, for realizing the good electromagnetic shielding action of device on mainboard, usual reinforcement lamella is the level such as zero potential.Here reinforcement lamella 13 realizes electrical connection by conducting resinl is bonding with the public pressure wire on FPC, exemplary offer one implementation: Copper treatment can be revealed in the position that need not laying signal wire on FPC, the position that FPC reveals copper is pasted with reinforcement lamella by conducting resinl, the position wherein revealing copper on FPC is in above-mentioned public pressure wire, generally this public pressure wire is ground wire, reinforcement lamella forms ground connection conductive path by mounting clip with mainboard, mainboard provides ground voltage for this ground connection conductive path, with realize reinforcement lamella as zero potential etc. level, and then realize the ESD (Electro-Staticdischarge of device on mainboard, Electro-static Driven Comb) protection.Additionally, fingerprint recognition module needs to be turned on mainboard by FPC, it is achieved grounding function.Therefore, FPC is pasted onto on reinforcement lamella by conducting resinl, and reinforcement lamella forms ground connection conductive path by mounting clip with mainboard, and mainboard provides ground voltage by this ground connection conductive path for fingerprint recognition module.For realizing electromagnetic shielding action and the ground connection of fingerprint recognition module of reinforcement lamella, reinforcement lamella 13 can be metal material, thus is grounded the transmission of voltage, and exemplary reinforcement lamella 13 can use steel disc to make.
The above; being only the detailed description of the invention of the present invention, but protection scope of the present invention is not limited thereto, any those familiar with the art is in the technical scope that the invention discloses; change can be readily occurred in or replace, all should contain within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with described scope of the claims.
Claims (8)
1. a terminal unit, it is characterised in that including: fingerprint recognition module, immunity substrate FPC, mainboard；
Described fingerprint recognition module paster is in the one side of FPC；The another side of described FPC is pasted on reinforcement lamella；Described reinforcement lamella is fixed on described mainboard, and described reinforcement lamella is for the reinforcement of described FPC, and described reinforcement lamella is additionally operable to shield the device on described mainboard.
Terminal unit the most according to claim 1, it is characterised in that described reinforcement lamella realizes electrical connection by conducting resinl is bonding with the public pressure wire on described FPC.
Terminal unit the most according to claim 1, it is characterised in that described assembling structure also includes that the mounting clip being arranged on described mainboard, described mounting clip are used for fixing described reinforcement lamella.
Terminal unit the most according to claim 1, it is characterised in that described reinforcement lamella includes the groove of the most described FPC opening, described groove is for accommodating the device on described mainboard.
Terminal unit the most according to claim 1, it is characterized in that, also it is additionally provided with connector male head in described fingerprint recognition module side on described FPC, being additionally provided with strengthening course on the position of corresponding described connector male head on the FPC of described reinforcement lamella side, described connector male head is connected with described fingerprint recognition module by the conducting wire on described FPC.
Terminal unit the most according to claim 5, it is characterised in that be provided with cushion on described strengthening course.
Terminal unit the most according to claim 6, it is characterised in that described cushion is foam.
8. according to the terminal unit described in any one of claim 1-7, it is characterised in that described reinforcement lamella is metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610308438.5A CN105828590A (en) | 2016-05-10 | 2016-05-10 | Terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610308438.5A CN105828590A (en) | 2016-05-10 | 2016-05-10 | Terminal equipment |
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|---|---|
| CN105828590A true CN105828590A (en) | 2016-08-03 |
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| CN201610308438.5A Pending CN105828590A (en) | 2016-05-10 | 2016-05-10 | Terminal equipment |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106161903A (en) * | 2016-08-25 | 2016-11-23 | 歌尔股份有限公司 | Circuit board and photographic head module for photographic head module |
| CN106385472A (en) * | 2016-09-07 | 2017-02-08 | 青岛海信移动通信技术股份有限公司 | Terminal device |
| CN107657247A (en) * | 2017-10-20 | 2018-02-02 | 西安易朴通讯技术有限公司 | A kind of fingerprint recognition module and corresponding terminal |
| CN107732415A (en) * | 2017-11-28 | 2018-02-23 | 广东欧珀移动通信有限公司 | The metallic support component and terminal device of antenna radiation performance can be improved |
| CN108040421A (en) * | 2017-12-29 | 2018-05-15 | 广东欧珀移动通信有限公司 | A kind of flexible PCB and preparation method thereof, electronic equipment |
| WO2018103473A1 (en) * | 2016-12-07 | 2018-06-14 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Device assembly applied to mobile terminal and mobile terminal |
| WO2018190494A1 (en) * | 2017-04-14 | 2018-10-18 | 주식회사 리딩유아이 | Fingerprint sensor module and fingerprint recognition apparatus having same |
| CN112684866A (en) * | 2021-01-06 | 2021-04-20 | 素泰智能科技(上海)有限公司 | Hardware and structure for improving protection performance of expansion port |
| CN113890907A (en) * | 2020-07-01 | 2022-01-04 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
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| CN107732415A (en) * | 2017-11-28 | 2018-02-23 | 广东欧珀移动通信有限公司 | The metallic support component and terminal device of antenna radiation performance can be improved |
| CN108040421A (en) * | 2017-12-29 | 2018-05-15 | 广东欧珀移动通信有限公司 | A kind of flexible PCB and preparation method thereof, electronic equipment |
| CN113890907A (en) * | 2020-07-01 | 2022-01-04 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
| CN113890907B (en) * | 2020-07-01 | 2024-03-01 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
| CN112684866B (en) * | 2021-01-06 | 2023-05-12 | 素泰智能科技(上海)有限公司 | Hardware and structure for improving protection performance of expansion port |
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Application publication date: 20160803 |
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