CN113890907A

CN113890907A - Camera assembly and electronic equipment

Info

Publication number: CN113890907A
Application number: CN202010627303.1A
Authority: CN
Inventors: 范桃桃; 唐义梅
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-07-01
Filing date: 2020-07-01
Publication date: 2022-01-04
Anticipated expiration: 2040-07-01
Also published as: CN113890907B

Abstract

The application discloses a camera assembly and electronic equipment, wherein the camera assembly comprises a main board and a camera module, the main board comprises a board body and a shielding cover, and the shielding cover is arranged on an electronic device of the board body; the camera module is arranged on one side of the shielding cover, which is far away from the plate body, and is coupled with the plate body, and the projection of the camera module on the plate body is at least partially overlapped with the projection of the shielding cover on the plate body. The electronic equipment comprises a shell, a display screen and the camera assembly, wherein the shell is connected with the display screen, a containing cavity is formed between the shell and the display screen, and part of the camera assembly is contained in the containing cavity. In this way, this application can guarantee just can practice thrift camera subassembly's holistic three-dimensional size between two parties of camera module.

Description

Camera assembly and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a camera module and electronic equipment.

Background

With the updating of electronic devices, people have higher requirements on the electronic devices, for example, for a camera, a traditional electronic device is provided with a front camera and a rear camera, but at present, the electronic device is developed towards a plurality of cameras, and the thickness of the electronic device is required to be thinner.

The camera generally can directly be connected with the mainboard, so set up, the region that contacts with the camera on the mainboard can't set up electronic component again, also the camera occupies the usable space that the mainboard is more, and the mainboard needs the bigger could satisfy the requirement of doing, consequently just can make the holistic size of electronic equipment bigger than normal, and thickness is thick than normal, influences user experience.

Disclosure of Invention

The main technical problem who solves of this application provides a mainboard and electronic equipment, can improve the usable floor area of mainboard under the prerequisite that does not increase the mainboard volume.

In order to solve the technical problem, the application adopts a technical scheme that: there is provided a camera assembly comprising: the mainboard comprises a board body and a shielding case, wherein the shielding case is covered on the electronic device of the board body;

the camera module is arranged on one side of the shielding cover far away from the plate body and is coupled with the plate body,

the projection of the camera module on the plate body is at least partially overlapped with the projection of the shielding case on the plate body.

In order to solve the above technical problem, another technical solution adopted by the present application is: an electronic device is provided, the electronic device including:

the camera assembly comprises a shell, a display screen and the camera assembly, wherein the shell is connected with the display screen, a containing cavity is formed between the shell and the display screen, and part of the camera assembly is contained in the containing cavity.

The beneficial effect of this application is: be different from prior art's condition, this application camera module is located the shield cover and is kept away from one side of plate body and overlap with plate body looks coupling and the projection of camera module on the plate body and the projection of shield cover on the plate body at least part, also the camera module sets up with the plate body interval, separates with the shield cover between camera module and the plate body, can normally set up electronic device on can guaranteeing the plate body to the use of shield cover, can not reduce the usable floor area of plate body because of setting up of camera module.

Drawings

FIG. 1 is a schematic diagram of an embodiment of an electronic device of the present application;

FIG. 2 is a schematic block diagram of one embodiment of a camera assembly of the present application;

FIG. 3 is a schematic block diagram of another embodiment of a camera head assembly according to the present application;

FIG. 4 is a top view of the camera assembly shown in FIG. 2;

FIG. 5 is a cross-sectional view at A-A of the camera assembly shown in FIG. 4;

FIG. 6 is an enlarged schematic view of the structure shown in FIG. 5 at X;

FIG. 7 is an exploded view of the camera assembly of FIG. 2;

FIG. 8 is an exploded view of the FPC adapter plate and the camera bracket of the camera assembly shown in FIG. 2;

FIG. 9 is a schematic view of a first mount in the camera assembly of FIG. 2;

FIG. 10 is a schematic diagram of the construction of a second mount in the camera assembly shown in FIG. 2;

FIG. 11 is a schematic view of the FPC interposer in the camera assembly shown in FIG. 2;

fig. 12 is a schematic structural component diagram of an embodiment of an electronic device according to the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of an embodiment of an electronic device 90 of the present application, and fig. 2 is a schematic structural diagram of an embodiment of a camera assembly 9310 of the present application. The electronic device 90 comprises a housing 9110, a display screen 9210 and a camera assembly 9310, wherein the housing 9110 is connected with the display screen 9210, a containing cavity is formed between the housing 9110 and the display screen 9210, and the camera assembly 9310 is partially contained in the containing cavity. It should be noted that "electronic device 90" (or simply "terminal") as used herein includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection (e.g., via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network) and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device 90 equipped with a cellular communication module. The mobile phone is illustrated here as an example, but the electronic device 90 is not limited to the mobile phone.

The housing 9110 is matched with the display screen 9210 and forms an accommodating cavity inside, and the camera assembly 9310 partially protrudes out of the accommodating cavity. Further, the display screen 9210 according to an embodiment of the present application may be an OLED (Organic Light-Emitting Diode) screen. For example, the display screen 9210 may include a first substrate, a transparent anode layer, an organic layer, a conductive layer, an emission layer, a cathode layer, and a second substrate, which are sequentially stacked. The first and second substrates are primarily supportive to support the entire display 9210; the transparent anode layer is used for increasing electron holes when current flows; the organic layer is composed of organic molecules or organic polymers; the conductive layer is made of conductive organic polymer molecules, such as polyaniline, for transporting electron holes from the anode layer; the emissive layer is also made up of organic polymer molecules, such as polyfluorene, for transporting electrons from the cathode, where the light emission process takes place; the cathode layer is used to inject electrons when current passes through it.

Referring to fig. 4, 5 and 6, fig. 4 is a top view of the camera assembly 9310 shown in fig. 2, fig. 5 is a cross-sectional view at a-a of the camera assembly 9310 shown in fig. 4, fig. 6 is an enlarged schematic structural view at X shown in fig. 5, and fig. 7 is an exploded schematic structural view of the camera assembly 9310 shown in fig. 2. In an embodiment of the present application, the camera assembly 9310 includes: mainboard 10 and camera module 20, mainboard 10 include plate body 110 and shield cover 120, and shield cover 120 covers and establishes on the electron device of plate body 110, is equipped with the cavity in the shield cover 120, and shield cover 120 covers and establishes on plate body 110 promptly, and the placing of the electron device on plate body 110 can not receive the influence. The camera module 20 is disposed on a side of the shielding cover 120 away from the board body 110 and coupled to the board body 110, and a projection of the camera module 20 on the board body 110 and a projection of the shielding cover 120 on the board body 110 at least partially overlap. Set up shield cover 120 on plate body 110, and camera module 20 is further connected with shield cover 120, also plate body 110 and the interval setting of camera module 20, compare in the scheme that traditional camera module 20 is directly connected with plate body 110, this application makes camera module 20 and plate body 110 interval setting, and then camera module 20's setting can not occupy plate body 110's usable space, plate body 110's availability ratio has been improved, because the projection of camera module 20 on plate body 110 overlaps with the projection of shield cover 120 on plate body 110 at least part, so along plate body 110 to camera module 20's direction, shield cover 120 piles up with camera module 20 in proper order, and then can save plate body 110 to the ascending pile up space of camera module 20 side, make camera assembly 9310's overall dimension littleer, be favorable to camera assembly 9310's miniaturization setting. It should be noted that the terms "comprises" and "comprising," and any variations thereof, in the embodiments of the present application, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other components or elements inherent to such process, method, article, or apparatus.

In an embodiment of the present application, the camera module 20 includes a first camera module 210 and a second camera module 220, the first camera module 210 and the second camera module 220 are arranged side by side at an interval, and the first camera module 210 and the second camera module 220 are connected by an fpc (FreePascal compiler) adapter board. In other embodiments, the number of the camera modules 20 may also be 1, 3, 4, etc., for example, please refer to fig. 3, and fig. 3 is a schematic structural diagram of another embodiment of the camera assembly 9310 of the present application. Wherein, the number of the camera modules 20 is 1, the camera modules 20 are coupled to the first connector 40, and the first connector 40 is further coupled to the board body 110, so that the camera modules 20 are connected to the board body 110. In other embodiments, the arrangement of the camera module 20 may be set according to the actual arrangement. The FPC adapters 30 are connected to the plurality of corresponding camera modules 20, respectively. The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature.

One end of the FPC adapter board 30 is connected to the first connector 40, and the other end of the first connector 40 is connected to the board body 110, that is, the first camera module 210 and the second camera module 220 are connected to the board body 110 through the connection between the FPC adapter board 30 and the first connector 40.

In an embodiment of the present invention, the first camera module 210 is coupled to the FPC adapter 30 through the second connector 50, and the second camera module 220 is coupled to the FPC adapter 30 through the third connector 60. That is, the first camera module 210 and the second camera module 220 are coupled to the FPC through the second connector 50 and the third connector 60, and the FPC adapter board 30 is coupled to the board body 110 through the first connector 40, so as to indirectly couple the first camera module 210 and the second camera module 220 to the board body 110. In an embodiment of the present application, the first connector 40, the second connector 50, and the third connector 60 are BTB connectors, and when the camera module 20 is provided in plurality, the number of the connectors always corresponds to the number of the camera modules 20, that is, the number of the connectors is always greater than the number of the camera modules 20 by one.

Referring to fig. 7, a first connection board 2110 is disposed between the first camera module 210 and the second connector 50, and the first connection board 2110 is coupled to the first camera module 210 and the second connector 50 respectively; a second connecting plate 2210 is disposed between the second camera module 220 and the third connector 60, the second connecting plate 2210 is coupled to the second camera module 220 and the third connector 60 respectively, so as to connect the first camera module 210 and the second camera module 220 to the FPC adapter 30 respectively, it can be understood that the first connecting plate 2110 and the second connecting plate 2210 may be FPC connecting plates respectively.

Referring to fig. 7, 9 and 10, fig. 9 is a schematic structural view of a first bracket 710 in the camera head assembly 9310 shown in fig. 2, and fig. 10 is a schematic structural view of a second bracket 720 in the camera head assembly 9310 shown in fig. 2. In an embodiment of the present application, the camera holder 70 includes a first holder 710 and a second holder 720, the first holder 710 is disposed on a side close to the FPC adapter board 30, and the second holder 720 is disposed on a side close to the shielding cover 120; wherein, the projection of the camera module 20 on the shielding case 120 overlaps with the projection of the second holder 720 on the shielding case 120. Since the projection of the camera module 20 on the shielding case 120 overlaps the projection of the second bracket 720 on the shielding case 120, the camera module 20 cannot be directly connected to the board body 110, and further, it is required that the connector is indirectly connected to the board body 110, in an embodiment of the present application, as described above, the first camera module 210 and the second camera module 210 are connected to the FPC adapter board 30 through the second connector 50 and the third connector 60, and the second connector 50 and the third connector 60 are connected to the FPC adapter board 30, and further, the FPC adapter board 30 is coupled to the board body 110 through the first connector 40, so that the first camera module 210 and the second camera module 220 are connected to the board body 110.

Referring to fig. 5 and fig. 6, the first bracket 710 and the second bracket 720 are integrally formed by injection molding, and in an embodiment of the present application, the first bracket 710 is made of plastic, and the second bracket 720 is made of hardware. Be equipped with first fastener 7210, second fastener 7230 and third fastener 7250 on second support 720, when first support 710 was moulded plastics with second support 720, first fastener 7210, second fastener 7230 and third fastener 7250 are inlayed and are located in second support 720 to prevent that first support 710 from breaking away from with second support 720, improved the intensity after first support 710 and the holistic connection of second support 720. The camera module 20 is connected to the camera holder 70, so that the gap between the camera module 20 and the shield can 120 is minimized in order to minimize the dimension of the board body 110 in the direction of the camera module 20. Due to the limitation of the size of the camera module 20 installed on the first support 710, the available gap left between the support located at the position of the camera module 20 and the shielding case 120 is less than 0.2mm, specifically, refer to the distance Q shown in fig. 6, when the distance Q indicates that the camera module 20 is installed, the camera module 20 is matched with the camera support 70 on one hand, the gap reserved between the camera modules 20 on the camera support 70 can be 0.2mm, the second support 720 in the application is a hardware, the hardware can be within 0.2mm in thickness, but if the second support 720 is made of plastic, the thickness formed when the second support is injection-molded with the first support 710 is 0.35mm-0.4 mm. Also cooperate when camera module 20 and first support 710 after, camera module 20 bottom is less than 0.2mm apart from the distance of shield cover 120, and then if mould plastics this 0.2 mm's material with the plastic material when moulding plastics, the thickness after the plastic is moulded plastics is greater than 0.35mm at least, and then is equivalent to having increased camera module 20 top apart from the distance of shield cover 120. By such an arrangement, the extending length of the first camera module 20 in the direction from the board body 110 to the shielding case 120 is longer, and the thickness of the first camera module 20 and the first bracket 710 in the direction from the board body 110 to the shielding case 120 is thicker. In an embodiment of the present application, the second bracket 720 is a hardware, and the thickness of the hardware injection molding can be 0.15mm, within 0.2mm, so the installation requirement is satisfied, and because the second bracket 720 and the first bracket 710 are integrally injection molded, the overall size of the first bracket 710 for installing the camera module 20 is further reduced, and the lengths of the first bracket 710 and the camera module 20 in the direction from the plate body 110 to the shielding case 120 are also reduced. Meanwhile, the second bracket 720 is made of hardware, so that the strength of the camera bracket 70 can be improved.

Referring to fig. 8 and 9, fig. 8 is an exploded schematic view of the FPC adapter board 30 and the camera bracket 70 in the camera assembly 9310 shown in fig. 2. The camera support 70 is provided with a first avoidance position 730 and a second avoidance position 740, the second connector 50 is located at the first avoidance position 730, and the third connector 60 is located at the second avoidance position 740; the projections of the first avoiding position 730 and the second avoiding position 740 on the board body 110 are overlapped with the projection of the shielding cover 120 on the board body 110. The camera support 70 is provided with a first avoidance portion 730 and a second avoidance portion 740 for saving the use space of the second connector 50 and the third connector 60 and further reducing the overall size of the camera assembly 9310. That is, the second connector 50 and the third connector 60 cannot be directly connected to the board body 110, and the first connector 40 is required to be indirectly connected to the FPC adapter board 30 and the board body 110. In an embodiment of the present invention, a projection of the first connector 40 on the board body 110 does not overlap a projection of the shield cover 120 on the board body 110, so that the first connector 40 can be directly coupled with the board body 110.

Referring to fig. 9 and 11, fig. 11 is a schematic structural view of the FPC adapter board 30 in the camera head assembly 9310 shown in fig. 2. The FPC adapter board 30 and the camera holder 70 are positioned by at least one positioning post 80. In an embodiment of the present invention, the number of the positioning pillars 80 is 4, and the positioning pillars are a first positioning pillar 810, a second positioning pillar 820, a third positioning pillar 830, and a fourth positioning pillar 840, respectively. The FPC adapter plate 30 is inserted between the first camera module 210 and the second camera module 220, and is respectively disposed to protrude from two sides of the first camera module 210 and the second camera module 220, wherein one of the protruding sides of the first positioning column 810 is disposed near the first camera module 210, the second positioning column 820 is disposed at a spacing region between the first camera module 210 and the second camera module 220, and is disposed near the second camera module 220, and the third positioning column 830 and the fourth positioning column 840 are disposed at the other protruding side and are respectively disposed relative to the positions of the first camera module 210 and the second camera module 220. In an embodiment of the present invention, the positioning column 80 is connected to the camera holder 70, and the FPC adapter board 30 is provided with a first positioning hole 320 adapted to the first positioning column 810, a second positioning hole 330 adapted to the second positioning column 820, a third positioning hole 340 adapted to the third positioning column 830, and a fourth positioning hole 350 adapted to the fourth positioning column 840. In other embodiments, the number of the positioning pillars 80 is 2, 5, 6, etc., which is not limited herein.

The FPC adapter board 30 is connected to the camera support 70 through the first connection layer 310, and the camera support 70 is connected to the second connection layer 750 through the second connection layer 750, in an embodiment of the present application, the first connection layer 310 and the second connection layer 750 are adhesive layers, respectively. When being connected through the gum between FPC keysets 30 and the camera support 70, the setting of reference column 80 can prevent that FPC keysets 30 position from taking place the skew, and then improves the stability of FPC installation, also when installing FPC keysets 30, can make a plurality of reference columns 80 cooperate with the locating hole that corresponds earlier and then spacing.

Further, please refer to fig. 12, fig. 12 is a schematic structural component diagram of an embodiment of an electronic device 90 according to the present application. The electronic device 90 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc., and the mobile phone is taken as an example in the embodiment. The electronic device 90 may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display screen 9210 in the above-described embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; the power supply 990 is used to supply power to the entire electronic device 90.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device 90, and further comprises a camera assembly 9310. With respect to the related art features of the camera head assembly 9310, reference is made to the above description of the embodiments of the camera head assembly 9310 and detailed description thereof is omitted here.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A camera head assembly, comprising:

the mainboard comprises a board body and a shielding case, wherein the shielding case is covered on the electronic device of the board body;

2. The camera assembly according to claim 1, further comprising an FPC adapter board, wherein the camera module comprises a first camera module and a second camera module, the first camera module and the second camera module are arranged side by side at an interval, and the FPC adapter board is connected to the first camera module and the second camera module respectively.

3. The camera assembly according to claim 2, further comprising a first connector, a second connector and a third connector, wherein one end of the first connector is connected with the FPC adapter board, and the other end of the first connector is connected with the board body;

the second connector is respectively coupled with the first camera module and the FPC adapter plate, and the third connector is respectively coupled with the second camera module and the FPC adapter plate.

4. The camera assembly of claim 3, further comprising a camera bracket for supporting the camera module and coupled to the shield.

5. The camera assembly of claim 4, wherein the camera bracket comprises a first bracket and a second bracket, the first bracket is disposed on a side close to the FPC adapter board, and the second bracket is disposed on a side close to the shielding case; wherein the content of the first and second substances,

the projection of the camera module on the shielding case is overlapped with the projection of the second support on the shielding case.

6. The camera assembly of claim 5, wherein the first bracket and the second bracket are integrally injection molded, the first bracket is made of plastic, and the second bracket is made of hardware.

7. The camera assembly according to claim 5, wherein a first avoidance position and a second avoidance position are provided on the camera support, the second connector is located at the first avoidance position, and the third connector is located at the second avoidance position; wherein the content of the first and second substances,

the first avoidance position and the second avoidance position are arranged on the plate body in a mode that the projection of the shielding cover on the plate body is overlapped.

8. The camera assembly of claim 5, further comprising at least one positioning post for connecting the FPC interposer to the camera mount.

9. The camera assembly according to claim 5, further comprising a first connection layer and a second connection layer, wherein the FPC interposer is connected with the camera bracket through the first connection layer;

the camera support is connected with the shielding case through the second connecting layer.

10. An electronic device, comprising a housing, a display screen, a circuit board, and the camera assembly of any one of claims 1-9, wherein the housing is connected to the display screen, and a receiving cavity is disposed between the housing and the display screen for receiving the camera assembly, and the circuit board is disposed in the receiving cavity and coupled to the camera assembly.