CN113890907B - Camera assembly and electronic equipment - Google Patents
Camera assembly and electronic equipment Download PDFInfo
- Publication number
- CN113890907B CN113890907B CN202010627303.1A CN202010627303A CN113890907B CN 113890907 B CN113890907 B CN 113890907B CN 202010627303 A CN202010627303 A CN 202010627303A CN 113890907 B CN113890907 B CN 113890907B
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- camera
- camera module
- bracket
- plate body
- connector
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- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- 230000001413 cellular effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000010267 cellular communication Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application discloses a camera subassembly and electronic equipment, the camera subassembly includes mainboard and camera module, the mainboard includes plate body and shield cover, the shield cover covers and locates on the electron device of plate body; the camera module is arranged on one side, far away from the plate body, of the shielding cover and is coupled with the plate body, and the projection of the camera module on the plate body is at least partially overlapped with the projection of the shielding cover on the plate body. The electronic equipment comprises a shell, a display screen and the camera component, wherein the shell is connected with the display screen, a containing cavity is formed between the shell and the display screen, and part of the camera component is contained in the containing cavity. Through the mode, the camera module can be guaranteed to be centered, and the overall three-dimensional size of the camera module can be saved.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a camera module and electronic equipment.
Background
With the updating of electronic devices, people have higher requirements on the electronic devices, for example, for cameras, a front camera and a rear camera are arranged on a traditional electronic device, but at present, the electronic devices are increasingly developed towards a plurality of cameras, and the thickness of the electronic devices is required to be thinner.
The camera can be directly connected with the mainboard generally, so set up, the regional unable electronic component that sets up that contacts with the camera on the mainboard any longer, the camera occupies the more usable space of mainboard promptly, and the mainboard needs bigger just can satisfy the requirement of doing, consequently just can make holistic size of electronic equipment bigger, thickness is thick partially, influences user experience.
Disclosure of Invention
The technical problem that this application mainly solves is to provide a mainboard and electronic equipment, can improve the usable floor area of mainboard under the prerequisite that does not increase the mainboard volume.
In order to solve the technical problems, one technical scheme adopted by the application is as follows: there is provided a camera assembly comprising: the mainboard comprises a board body and a shielding cover, wherein the shielding cover is arranged on an electronic device of the board body;
the camera module is arranged on one side of the shielding cover away from the plate body and is coupled with the plate body,
the projection of the camera module on the plate body is at least partially overlapped with the projection of the shielding cover on the plate body.
In order to solve the technical problems, another technical scheme adopted by the application is as follows: there is provided an electronic apparatus including:
the camera module comprises a shell, a display screen and the camera module, wherein the shell is connected with the display screen, a containing cavity is formed between the shell and the display screen, and the camera module is partially contained in the containing cavity.
The beneficial effects of this application are: in the condition of prior art, this application camera module locates the shield cover and keeps away from one side of plate body and couple with the plate body and the projection of camera module on the plate body overlaps with the projection of shield cover on the plate body at least partially, also camera module and plate body interval set up promptly, separates with the shield cover between camera module and the plate body, and the use of shield cover can guarantee to normally set up electronic device on the plate body, can not reduce the usable floor area of plate body because of the setting of camera module.
Drawings
FIG. 1 is a schematic diagram of an embodiment of an electronic device of the present application;
FIG. 2 is a schematic diagram of an embodiment of a camera assembly of the present application;
FIG. 3 is a schematic structural view of another embodiment of a camera assembly of the present application;
FIG. 4 is a top view of the camera head assembly shown in FIG. 2;
FIG. 5 is a cross-sectional view at A-A of the camera head assembly shown in FIG. 4;
FIG. 6 is an enlarged schematic view of the structure at X shown in FIG. 5;
FIG. 7 is an exploded view of the camera head assembly of FIG. 2;
FIG. 8 is an exploded view of the FPC adapter plate and camera mount of the camera assembly of FIG. 2;
FIG. 9 is a schematic view of a first bracket in the camera head assembly of FIG. 2;
FIG. 10 is a schematic view of a second mount in the camera head assembly of FIG. 2;
fig. 11 is a schematic structural view of the FPC adapter in the camera assembly shown in fig. 2;
fig. 12 is a schematic structural composition diagram of an embodiment of the electronic device of the present application.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of an embodiment of an electronic device 90 of the present application, and fig. 2 is a schematic structural diagram of an embodiment of a camera assembly 9310 of the present application. The electronic device 90 includes a housing 9110, a display screen 9210, and a camera component 9310, where the housing 9110 is connected to the display screen 9210, and a receiving cavity is disposed between the housing 9110 and the display screen 9210, and a portion of the camera component 9310 is received in the receiving cavity. It is noted that "electronic device 90" (or simply "terminal") as used herein includes, but is not limited to, a device configured to receive/transmit communication signals via a wireline connection, such as via a public-switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface, such as for example, a cellular network, a Wireless Local Area Network (WLAN), a digital television network, such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal. A communication terminal configured to communicate through a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellites or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; a PDA that can include a radiotelephone, pager, internet/intranet access, web browser, organizer, calendar, and/or a Global Positioning System (GPS) receiver; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. The handset is an electronic device 90 configured with a cellular communication module. The mobile phone is illustrated here as an example, but the electronic device 90 is not limited to the mobile phone.
The housing 9110 is mated with the display 9210 and forms a receiving cavity therein, and the camera assembly 9310 is partially protruding from the receiving cavity. Further, the display 9210 in an embodiment of the present application may be an OLED (Organic Light-Emitting Diode) screen. For example, the display 9210 may include a first base layer, a transparent anode layer, an organic layer, a conductive layer, an emission layer, a cathode layer, and a second base layer, which are sequentially stacked. The first base layer and the second base layer mainly play a supporting role for supporting the entire display 9210; the transparent anode layer is used for increasing electron holes when current flows through the transparent anode layer; the organic layer is composed of organic molecules or organic polymers; the conductive layer is composed of conductive organic polymer molecules, such as polyaniline, for transporting electron holes from the anode layer; the emissive layer is also composed of organic polymer molecules, such as polyfluorene, for transporting electrons from the cathode, at which layer the light-emitting process takes place; the cathode layer is used for injecting electrons when current passes through.
Referring to fig. 4, 5 and 6, fig. 4 is a top view of the camera assembly 9310 shown in fig. 2, fig. 5 is a cross-sectional view of the camera assembly 9310 shown in fig. 4 at A-A, fig. 6 is an enlarged schematic view of the camera assembly 9310 shown in fig. 5 at X, and fig. 7 is an exploded schematic view of the camera assembly 9310 shown in fig. 2. In one embodiment of the present application, camera assembly 9310 comprises: the main board 10 and the camera module 20, the main board 10 comprises a board body 110 and a shielding cover 120, the shielding cover 120 is covered on the electronic device of the board body 110, a cavity is arranged in the shielding cover 120, namely, the shielding cover 120 is covered on the board body 110, and the placement of the electronic device on the board body 110 is not affected. The camera module 20 is disposed on a side of the shielding case 120 away from the board 110 and coupled to the board 110, and a projection of the camera module 20 on the board 110 at least partially overlaps a projection of the shielding case 120 on the board 110. Set up shield cover 120 on plate body 110, and camera module 20 is further connected with shield cover 120, also the plate body 110 sets up with camera module 20 interval promptly, compare in traditional camera module 20 and the scheme that plate body 110 is directly connected, this application makes camera module 20 and plate body 110 interval set up, and then camera module 20's setting can not occupy plate body 110's usable space, the availability of plate body 110 has been improved, because the projection of camera module 20 on plate body 110 overlaps with the projection of shield cover 120 on plate body 110 at least part, so along the direction of plate body 110 to camera module 20, shield cover 120 stacks gradually with camera module 20, and then can save plate body 110 to the epaxial stack space of camera module 20, make camera module 9310's overall dimension smaller, be favorable to the miniaturized setting of camera module 9310. It should be noted that the terms "comprising" and "having," and any variations thereof, in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other elements not listed or inherent to such process, method, article, or apparatus.
In an embodiment of the present application, the camera module 20 includes a first camera module 210 and a second camera module 220, and the first camera module 210 and the second camera module 220 are arranged at intervals side by side, and the first camera module 210 and the second camera module 220 are connected through a FPC (FreePascal Compiler) adapter plate. In other embodiments, the number of camera modules 20 may be 1, 3, 4, etc., for example, refer to fig. 3, and fig. 3 is a schematic structural diagram of another embodiment of a camera module 9310 of the present application. The number of the camera modules 20 is 1, and the camera modules 20 are coupled to the first connector 40, and the first connector 40 is further coupled to the board 110, so that the camera modules 20 are connected to the board 110. In other embodiments, the arrangement of the camera modules 20 may be set according to the actual arrangement situation. The FPC adapter plates 30 are connected to the corresponding plurality of camera modules 20, respectively. The terms "first," "second," "third," and the like in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature.
One end of the FPC interposer 30 is connected to the first connector 40, and the other end of the first connector 40 is connected to the board 110, that is, the first camera module 210 and the second camera module 220 are connected to the first connector 40 and then to the board 110 through the connection of the FPC interposer 30.
In an embodiment of the present application, the first camera module 210 is coupled to the FPC interposer 30 through the second connector 50, and the second camera module 220 is coupled to the FPC interposer 30 through the third connector 60. That is, the first camera module 210 and the second camera module 220 are coupled to the FPC through the second connector 50 and the third connector 60, and the FPC interposer 30 is coupled to the board body 110 through the first connector 40, so as to indirectly couple the first camera module 210 and the second camera module 220 to the board body 110. In an embodiment of the present application, the first connector 40, the second connector 50 and the third connector 60 are BTB connectors, and when the camera module 20 is provided with a plurality of connectors, the number of connectors always corresponds to the number of the camera modules 20, that is, the number of connectors is always more than one camera module 20.
With continued reference to fig. 7, a first connection board 2110 is disposed between the first camera module 210 and the second connector 50, and the first connection board 2110 is coupled to the first camera module 210 and the second connector 50 respectively; a second connection board 2210 is disposed between the second camera module 220 and the third connector 60, and the second connection board 2210 is respectively coupled with the second camera module 220 and the third connector 60, so as to realize that the first camera module 210 and the second camera module 220 are respectively connected with the FPC interposer 30, it can be appreciated that the first connection board 2110 and the second connection board 2210 can also be FPC connection boards, respectively.
Referring to fig. 7, 9 and 10, fig. 9 is a schematic structural diagram of a first bracket 710 in the camera module 9310 shown in fig. 2, and fig. 10 is a schematic structural diagram of a second bracket 720 in the camera module 9310 shown in fig. 2. In an embodiment of the present application, the camera bracket 70 includes a first bracket 710 and a second bracket 720, the first bracket 710 is disposed on a side close to the FPC adapter 30, and the second bracket 720 is disposed on a side close to the shielding case 120; wherein, the projection of the camera module 20 on the shielding case 120 overlaps with the projection of the second bracket 720 on the shielding case 120. Because the projection of the camera module 20 on the shielding case 120 overlaps the projection of the second bracket 720 on the shielding case 120, the camera module 20 cannot be directly connected to the board 110, and thus the connector needs to be indirectly connected to the board 110, in this embodiment, as described above, the first camera module 210 and the second camera are connected to the second connector 50 and the third connector 60, and the second connector 50 and the third connector 60 are connected to the FPC adapter 30, and thus the FPC adapter 30 is coupled to the board 110 through the first connector 40, so that the first camera module 210 and the second camera module 220 are connected to the board 110.
With continued reference to fig. 5 and 6, the first bracket 710 and the second bracket 720 are integrally injection molded, and in one embodiment of the present application, the first bracket 710 is made of plastic, and the second bracket 720 is made of hardware. The second bracket 720 is provided with a first fastening piece 7210, a second fastening piece 7230 and a third fastening piece 7250, and when the first bracket 710 and the second bracket 720 are injection molded, the first fastening piece 7210, the second fastening piece 7230 and the third fastening piece 7250 are embedded in the second bracket 720 so as to prevent the first bracket 710 from being separated from the second bracket 720, and the strength of the first bracket 710 and the second bracket 720 after being integrally connected is improved. The camera module 20 is connected to the camera bracket 70, so that the gap between the camera module 20 and the shield case 120 is minimized in order to minimize the dimension of the plate 110 in the direction of the camera module 20. Because the first bracket 710 is limited by the size of the camera module 20, the usable gap between the bracket at the position of the camera module 20 and the shielding cover 120 is less than 0.2mm, and the distance Q can be specifically referred to as distance Q shown in fig. 6, where the distance Q refers to the distance Q between the bracket and the camera module 20 when the camera module 20 is installed, the camera module 20 is to be matched with the camera bracket 70 on the one hand, the gap between the camera modules 20 and the camera bracket 70 can be 0.2mm, the second bracket 720 in the application is a hardware, and the hardware can be within 0.2mm, but if the second bracket 720 is made of plastic material, the thickness formed when the second bracket 720 is injection-molded with the first bracket 710 is 0.35mm-0.4mm. That is, after the camera module 20 is matched with the first bracket 710, the distance between the bottom of the camera module 20 and the shielding cover 120 is less than 0.2mm, and if the injection molding material of 0.2mm is injection molded with plastic material, the thickness of the injection molded plastic material is at least greater than 0.35mm, which is equivalent to increasing the distance between the top of the camera module 20 and the shielding cover 120. By this arrangement, the extension length of the first camera module 20 along the direction from the plate 110 to the shield 120 is longer, so that the thickness of the camera module 20 along the direction from the plate 110 to the shield 120 is thicker after the installation of the first bracket 710 is completed. In an embodiment of the present application, the second bracket 720 is a hardware, and the thickness of the hardware injection molding can be 0.15mm and is within 0.2mm, so that the installation requirement is met, because the second bracket 720 and the first bracket 710 are integrally injection molded, the overall size of the first bracket 710 for installing the camera module 20 is further reduced, that is, the lengths of the first bracket 710 and the camera module 20 in the direction from the plate 110 to the shielding cover 120 are reduced. Meanwhile, the second bracket 720 is hardware, so that the strength of the camera bracket 70 can be improved.
Referring to fig. 8 and 9, fig. 8 is an exploded view of the FPC adapter 30 and the camera bracket 70 in the camera module 9310 shown in fig. 2. The camera bracket 70 is provided with a first avoidance position 730 and a second avoidance position 740, the second connector 50 is positioned at the first avoidance position 730, and the third connector 60 is positioned at the second avoidance position 740; the projection of the first avoidance bit 730 and the second avoidance bit 740 on the board 110 are overlapped with the projection of the shielding case 120 on the board 110. The first avoidance bit 730 and the second avoidance bit 740 are provided on the camera support 70 to save the usage space of the second connector 50 and the third connector 60, so as to reduce the overall size of the camera component 9310, and in an embodiment of the present application, the projection of the first avoidance bit 730 and the second avoidance bit 740 on the board 110 overlaps the projection of the shielding case 120 on the board 110. That is, the second connector 50 and the third connector 60 cannot be directly connected to the board 110, and the first connector 40 needs to be disposed to indirectly connect the FPC interposer 30 to the board 110. In an embodiment of the present application, the projection of the first connector 40 on the board 110 and the projection of the shielding case 120 on the board 110 do not overlap, so that the first connector 40 can be directly coupled to the board 110.
Referring to fig. 9 and 11, fig. 11 is a schematic structural diagram of the FPC adapter 30 in the camera module 9310 shown in fig. 2. The FPC adapter 30 and the camera mount 70 are positioned by at least one positioning post 80. In one embodiment of the present application, the number of positioning posts 80 is 4, and the positioning posts are respectively a first positioning post 810, a second positioning post 820, a third positioning post 830 and a fourth positioning post 840. The FPC adapter plate 30 is arranged between the first camera module 210 and the second camera module 220 in a penetrating manner, and protrudes out of two sides of the first camera module 210 and the second camera module 220 respectively, wherein one protruding side of the first positioning column 810 is arranged close to the first camera module 210, the second positioning column 820 is located in a spacing area between the first camera module 210 and the second camera module 220 and is arranged close to the second camera module 220, and the third positioning column 830 and the fourth positioning column 840 are located on the other protruding side and are arranged relative to positions of the first camera module 210 and the second camera module 220 respectively. In an embodiment of the present application, the positioning post 80 is connected to the camera support 70, and the FPC adapter board 30 is provided with a first positioning hole 320 adapted to the first positioning post 810, a second positioning hole 330 adapted to the second positioning post 820, a third positioning hole 340 adapted to the third positioning post 830, and a fourth positioning hole 350 adapted to the fourth positioning post 840. In other embodiments, the number of positioning posts 80 is 2, 5, 6, etc., without limitation.
The FPC interposer 30 is connected to the camera support 70 through the first connection layer 310, and the camera support 70 is connected to the second connection layer 750 through the second connection layer 750, where in an embodiment of the present application, the first connection layer 310 and the second connection layer 750 are adhesive layers respectively. When the FPC adapter plate 30 is connected with the camera support 70 through back glue, the positioning columns 80 can prevent the position of the FPC adapter plate 30 from shifting, so that the stability of FPC installation is improved, namely, when the FPC adapter plate 30 is installed, the positioning columns 80 can be matched with corresponding positioning holes to limit.
Further, referring to fig. 12, fig. 12 is a schematic structural diagram of an embodiment of an electronic device 90 according to the present application. The electronic device 90 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc., and this embodiment illustrates a mobile phone as an example. The structure of the electronic device 90 may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., a display 9210 in the above embodiments), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, a power source 990, and the like. Wherein, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to supply power to the entire electronic device 90.
Specifically, RF circuitry 910 is used to send and receive signals; memory 920 is used to store data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting a user proximity signal, a distance signal, etc.; a speaker 961 and a microphone 962 are coupled to the processor 980 by an audio circuit 960 for receiving and transmitting audio signals; the wifi module 970 is configured to receive and transmit wifi signals, and the processor 980 is configured to process data information of the electronic device 90, and further includes a camera component 9310. For relevant technical features of the camera assembly 9310, please refer to the above description of the embodiments of the camera assembly 9310, and detailed descriptions thereof will be omitted.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (7)
1. A camera assembly, comprising:
the mainboard comprises a board body and a shielding cover, wherein the shielding cover is arranged on an electronic device of the board body;
the camera module is arranged on one side of the shielding cover away from the plate body and is coupled with the plate body,
the projection of the camera module on the plate body is at least partially overlapped with the projection of the shielding cover on the plate body;
the FPC adapter plate comprises a first camera module and a second camera module, the first camera module and the second camera module are arranged at intervals side by side, and the FPC adapter plate is respectively connected with the first camera module and the second camera module;
the camera bracket is used for supporting the camera module and is connected with the shielding cover; the camera bracket comprises a first bracket and a second bracket, the first bracket is arranged on one side close to the FPC adapter plate, and the second bracket is arranged on one side close to the shielding cover; the projection of the camera module on the shielding cover is overlapped with the projection of the second bracket on the shielding cover.
2. The camera assembly of claim 1, further comprising a first connector, a second connector, and a third connector, wherein one end of the first connector is connected to the FPC adapter plate, and the other end is connected to the plate body;
the second connector is respectively coupled with the first camera module and the FPC adapter plate, and the third connector is respectively coupled with the second camera module and the FPC adapter plate.
3. The camera assembly of claim 1, wherein the first bracket and the second bracket are integrally injection molded, and the first bracket is made of plastic and the second bracket is a hardware.
4. The camera assembly of claim 2, wherein the camera bracket is provided with a first avoidance bit and a second avoidance bit, the second connector is positioned at the first avoidance bit, and the third connector is positioned at the second avoidance bit; wherein,
the projection of the first avoidance position and the second avoidance position on the plate body is overlapped with the projection of the shielding cover on the plate body.
5. The camera assembly of claim 1, further comprising at least one positioning post for connecting the FPC adapter plate and the camera bracket.
6. The camera assembly of claim 1, further comprising a first connection layer and a second connection layer, wherein the FPC adapter is connected to the camera bracket through the first connection layer;
the camera support is connected with the shielding cover through the second connecting layer.
7. An electronic device, comprising a housing, a display screen, a circuit board, and the camera assembly of any one of claims 1-6, wherein the housing is connected to the display screen, a receiving cavity is provided between the housing and the display screen for placing the camera assembly, and the circuit board is disposed in the receiving cavity and coupled to the camera assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010627303.1A CN113890907B (en) | 2020-07-01 | 2020-07-01 | Camera assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010627303.1A CN113890907B (en) | 2020-07-01 | 2020-07-01 | Camera assembly and electronic equipment |
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| Publication Number | Publication Date |
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| CN113890907A CN113890907A (en) | 2022-01-04 |
| CN113890907B true CN113890907B (en) | 2024-03-01 |
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| CN202010627303.1A Active CN113890907B (en) | 2020-07-01 | 2020-07-01 | Camera assembly and electronic equipment |
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| CN206237735U (en) * | 2016-08-12 | 2017-06-09 | 上海与德通讯技术有限公司 | Radome, mainboard structure and mobile terminal |
| CN107105573A (en) * | 2017-05-24 | 2017-08-29 | 广东欧珀移动通信有限公司 | Electronic component support, electronic component module and mobile terminal |
| CN107528946A (en) * | 2017-09-26 | 2017-12-29 | 广东欧珀移动通信有限公司 | Camera module and mobile terminal |
| CN107948348A (en) * | 2017-10-25 | 2018-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and its circuit board assemblies, shielding case |
| CN110099197A (en) * | 2018-01-29 | 2019-08-06 | 广东欧珀移动通信有限公司 | CCD camera assembly and electronic equipment |
| CN208112675U (en) * | 2018-01-31 | 2018-11-16 | 广东欧珀移动通信有限公司 | A kind of camera fixation kit and electronic device |
| CN209056699U (en) * | 2018-08-29 | 2019-07-02 | Oppo（重庆）智能科技有限公司 | A kind of circuit board assemblies and the electronic device with the circuit board assemblies |
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| CN113890907A (en) | 2022-01-04 |
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