CN215991342U

CN215991342U - Circuit board for infrared image module

Info

Publication number: CN215991342U
Application number: CN202122224171.0U
Authority: CN
Inventors: 汤永长
Original assignee: Suzhou Xinjingteng Photoelectric Technology Co ltd
Current assignee: Suzhou Xinjingteng Photoelectric Technology Co ltd
Priority date: 2021-09-14
Filing date: 2021-09-14
Publication date: 2022-03-08
Anticipated expiration: 2031-09-14

Abstract

The utility model discloses a circuit board for an infrared image module, which comprises an FPC (flexible printed circuit) substrate, wherein the FPC substrate comprises a fixing part, a control part and a connecting part which are sequentially connected, one side of the fixing part, one side of the control part and one side of the connecting part are flush, the other side of the fixing part, the control part and the other side of the connecting part form a stepped structure with gradually increased width, an arc chamfer is formed at the connecting part of the control part and the connecting part, a copper foil in the FPC substrate is of an arc structure which is arranged at the arc chamfer at the same angle with the arc chamfer, a marking assembly is arranged on the front surface of a bonding area of the control part, and an image chip which is in communication connection with the FPC substrate is arranged in the marking assembly. The FPC substrate of the circuit board and the associated auxiliary components are optimized and integrated, the production efficiency of the circuit board and the stability of the circuit board are improved, and particularly, stress is dispersed at the turning position of the FPC substrate and is not easy to damage.

Description

Circuit board for infrared image module

Technical Field

The utility model relates to the technical field of image products, in particular to a circuit board for an infrared image module.

Background

The infrared image touch module has the advantages of simple structure, high response speed, high precision, no interference of touch force, current and voltage and the like, and is widely applied to the field of large-size infrared image devices such as interactive electronic whiteboards, projection televisions, advertisement all-in-one machines and the like. However, the cost of the infrared image touch module is not superior to that of common capacitive and LED infrared touch products. The main reason is that the infrared image touch module has a structure different from a common image module used in a mobile phone, a computer and a monitoring camera structure, and the production efficiency and the through rate are low. How to optimize and integrate the main board and the associated auxiliary components of the circuit board, so as to improve the stability of the whole circuit board, which is a problem to be solved.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above disadvantages, an object of the present invention is to provide a circuit board for an infrared imaging module, which optimally integrates an FPC board of the circuit board with associated auxiliary components, thereby improving the production efficiency of the circuit board and the stability of the circuit board, and particularly, the circuit board is not easily damaged due to stress dispersion at the turning position of the FPC board.

In order to achieve the above purposes, the utility model adopts the technical scheme that: a circuit board for infrared image module, its characterized in that: including the FPC base plate, the FPC base plate is including fixed part, control part and the connecting portion that connect gradually, one side of fixed part, control part and connecting portion flushes, and the opposite side becomes the ladder structure that the width increases progressively, the junction of control part and connecting portion forms the circular arc chamfer, copper foil in the FPC base plate is the circular arc structure with the same angle setting of circular arc chamfer in circular arc chamfer, the bonding district of control part openly is provided with the mark subassembly, be provided with the image chip with FPC base plate communication connection in the mark subassembly.

The utility model has the beneficial effects that: the circuit is usually placed on a carrier for processing, a connection part of the control part and the connecting part which are easy to bear force adopts an arc chamfering structure, and the inner copper foil adopts the same arc structure at the arc chamfering position. When the circuit board is taken from the carrier, the stress is dispersed by the arc chamfers, the tearing of the connecting part is avoided, and the stability of the circuit board is greatly improved. On the other hand, the segmented FPC substrate structure combines the manufacturing process packaging technology to optimally integrate the FPC substrate and the corresponding part and the associated auxiliary components, so that the production efficiency and the product stability can be improved.

Further, the image chip is rectangular, the marking components are two L-shaped marking points arranged along the diagonal line of the image chip, and the inner sides of the L-shaped marking points are tangent to the side edges of the image chip. The marking assembly is drawn on the front side of the bonding area in advance, and is designed into two L-shaped marking points according to the structure of the image chip, so that the image chip is accurately installed between the two L-shaped marking points and is connected with the FPC substrate, the connection accuracy of the image chip and the FPC substrate is greatly improved, the process is simplified, and the efficiency is improved.

Further, the arc chamfer is an inward concave fillet, so that the stability is improved when the FPC substrate is taken and placed, and the tearing of the FPC substrate is avoided.

Further, in order to facilitate connection of the circuit board and an external circuit, a bus bar connector in communication connection with the FPC substrate is further disposed at an end portion of the connecting portion, which is away from the control portion, and the bus bar connector is disposed at a front surface or a back surface of the connecting portion, and may adopt one of an up-drawer mode, a down-drawer mode and a down-flip mode. The front surface of the control part is also bonded with a third reinforcing plate to improve the stability.

Furthermore, the end part of the third reinforcing plate is flush with one end, away from the control part, of the connecting part, and the other end of the third reinforcing plate extends upwards and completely covers the arc chamfer, so that the strength of the arc chamfer is improved, and the FPC substrate is prevented from being broken.

Further, one end, covering the arc chamfer, of the third reinforcing plate is provided with a chamfer structure matched with the arc chamfer.

Further, a first reinforcing plate is bonded to the back surface of the bonding region of the control portion, and the material of the first reinforcing plate is SUS 304.

Further, an infrared LED is arranged at the end part, far away from the control part, of the fixing part, the infrared LED is arranged on the back face of the fixing part, and a second reinforcing plate corresponding to the position of the infrared LED is bonded on the front face of the fixing part. One end of the second reinforcing plate is flush with the end part, far away from the control part, of the fixing part, a gap is reserved between the other end of the second reinforcing plate and the control part, and the fixing part can be bent along the other end of the second reinforcing plate. The fixing part is further provided with fixing holes located on two sides of the infrared LED, the whole circuit board can be connected with an external lens mount through the fixing holes, and the lens mount is provided with a positioning column matched with the fixing holes.

Further, the thickness of the first reinforcing plate is 0.10-0.30 mm.

Drawings

FIG. 1 is a front view of an embodiment of the present invention;

FIG. 2 is a side view of an embodiment of the present invention;

FIG. 3 is a perspective view of an embodiment of the present invention;

FIG. 4 is a rear view of an embodiment of the present invention;

fig. 5 is a schematic view of a carrier according to an embodiment of the present invention.

In the figure:

1. an FPC substrate; 1a, a fixed part; 1b, a control unit; 1c, a connecting part; 2. chamfering with an arc; 3. a marking component; 4. an image chip; 5. a flat cable connector; 6. a third reinforcing plate; 7. a first reinforcing plate; 8. an infrared LED; 9. a second reinforcing plate; 10. a fixing hole; 11. and a carrier plate.

Detailed Description

The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the utility model easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the utility model.

Examples

Referring to fig. 1-4, the circuit board for an infrared imaging module according to the present invention includes an FPC substrate 1, and the FPC substrate 1 includes a fixing portion 1a, a control portion 1b, and a connecting portion 1c, which are connected in sequence. One sides of the fixing part 1a, the control part 1b and the connecting part 1c are flush, and the other sides are in a stepped structure with gradually increased width. The connection part of the control part 1b and the connection part 1c forms an arc chamfer 2, and the copper foil in the FPC substrate 1 is of an arc structure arranged at the arc chamfer 2 at the same angle with the arc chamfer 2. The arc chamfers 2 are concave fillets, so that when the FPC substrate 1 is taken and placed, the stability is improved by the concave fillets, and tearing of the FPC substrate 1 is avoided. The circuit board is usually placed and is processed on the carrier, and current FPC base plate 1 often adopts the right angle wiring, and the operation process product is got from the carrier when putting to turn to the concentrated position of department stress and is easily torn, and the copper foil is especially fragile, will break in gently dragging. The connection part of the control part 1b and the connection part 1c which are easy to bear force adopts a circular arc chamfer 2 structure, and the inner copper foil adopts the same circular arc structure at the circular arc chamfer 2. When the circuit board is taken from the carrier, the arc chamfers 2 disperse stress, the tearing of the joints is avoided, and the stability of the circuit board is greatly improved.

The segmented FPC substrate 1 structure combines the manufacturing process packaging technology to optimally integrate the FPC substrate 1 and the corresponding part and the associated auxiliary components, so that the production efficiency and the product stability can be improved.

The front face of the bonding area of the control part 1b is provided with a marking assembly 3, and an image chip 4 which is in communication connection with the FPC substrate 1 is arranged in the marking assembly 3. The image chip 4 is rectangular, the marking component 3 is two L-shaped marking points arranged along the diagonal of the image chip 4, and the inner sides of the L-shaped marking points are tangent to the side edges of the image chip 4. The marking assembly 3 is drawn on the front side of the bonding area in advance, and the marking assembly 3 is designed into two L-shaped marking points according to the structure of the image chip 4, so that the image chip 4 is accurately installed between the two L-shaped marking points and connected with the FPC substrate 1, the connection accuracy of the image chip 4 and the FPC substrate 1 is greatly improved, the process is simplified, and the efficiency is improved.

In order to facilitate the connection of the circuit board with an external circuit, a bus bar connector 5 in communication connection with the FPC board 1 is further provided at an end of the connecting portion 1c remote from the control portion 1b, the bus bar connector 5 is provided at a back surface of the FPC board, and the bus bar connector 5 may adopt one of an up drawer mode, a down drawer mode and a down flip mode.

The front surface of the control part 1b is also bonded with a third reinforcing plate 6 to improve stability. The end of the third reinforcing plate 6 is flush with the end of the connecting part 1c away from the control part 1b, and the other end extends upwards and completely covers the arc chamfer 2, so that the strength of the arc chamfer 2 is improved, and the FPC substrate 1 is prevented from being broken. One end of the third reinforcing plate 6 covering the arc chamfer 2 is provided with a chamfer structure matched with the arc chamfer 2.

A first reinforcing plate 7 is bonded to the back surface of the bonding region of the control portion 1b, and the material of the first reinforcing plate 7 is SUS 304. The thickness of the first reinforcing plate 7 is 0.10 to 0.30 mm.

The end of the fixing part 1a far away from the control part 1b is provided with an infrared LED8, an infrared LED8 is arranged on the back surface of the fixing part 1a, and the front surface of the fixing part 1a is also bonded with a second reinforcing plate 9 corresponding to the position of the infrared LED 8. One end of the second reinforcing plate 9 is flush with the end part of the fixing part 1a far away from the control part 1b, a gap is reserved between the other end of the second reinforcing plate and the control part 1b, and the fixing part 1a can be bent along the other end of the second reinforcing plate 9. Still be provided with on fixed part 1a and be located infrared LED8 both sides fixed orifices 10, through fixed orifices 10, whole circuit board can be connected with outside lens mount, is provided with the reference column that matches with fixed orifices 10 on the lens mount.

Referring to fig. 5, when the circuit board is packaged, at least one FPC substrate 1 is placed on the carrier 11, a placing groove for the FPC substrate 1 to be embedded is formed on the carrier 11, and after the FPC substrate 1 is fixed to the carrier 11, the image chip 4, the infrared LED8 and the bus connector 5 are packaged with the FPC substrate 1.

The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims

1. A circuit board for infrared image module, its characterized in that: including the FPC base plate, the FPC base plate is including fixed part, control part and the connecting portion that connect gradually, one side of fixed part, control part and connecting portion flushes, and the opposite side becomes the ladder structure that the width increases progressively, the junction of control part and connecting portion forms the circular arc chamfer, copper foil in the FPC base plate is the circular arc structure with the same angle setting of circular arc chamfer in circular arc chamfer, the bonding district of control part openly is provided with the mark subassembly, be provided with the image chip with FPC base plate communication connection in the mark subassembly.

2. The circuit board for an infrared imaging module set according to claim 1, wherein: the image chip is rectangular, the marking components are two L-shaped marking points arranged along the diagonal line of the image chip, and the inner sides of the L-shaped marking points are tangent to the side edges of the image chip.

3. The circuit board for an infrared imaging module set according to claim 1, wherein: the arc chamfer is an inward concave fillet.

4. The circuit board for an infrared imaging module set according to claim 1, wherein: the end part of the connecting part far away from the control part is also provided with a bus bar connector in communication connection with the FPC substrate, and the back surface of the bus bar connector is also bonded with a third reinforcing plate.

5. The circuit board for an infrared imaging module set according to claim 4, wherein: the end part of the third reinforcing plate is flush with one end, far away from the control part, of the connecting part, and the other end of the third reinforcing plate extends upwards and completely covers the arc chamfer.

6. The circuit board for an infrared imaging module set according to claim 5, wherein: and one end of the third reinforcing plate, which covers the arc chamfer, is provided with a chamfer structure matched with the arc chamfer.

7. The circuit board for an infrared imaging module set according to claim 1, wherein: the back of the bonding area of the control part is bonded with a first reinforcing plate, and the material of the first reinforcing plate is SUS 304.

8. The circuit board for an infrared imaging module set according to claim 1, wherein: the fixing part is characterized in that an infrared LED is arranged at the end part of the fixing part far away from the control part, the infrared LED is arranged on the back surface of the fixing part, a second reinforcing plate corresponding to the infrared LED in position is further bonded on the front surface of the fixing part, and fixing holes located on two sides of the infrared LED are further formed in the fixing part.

9. The circuit board for an infrared imaging module set forth in claim 7, wherein: the thickness of the first reinforcing plate is 0.10-0.30 mm.