CN105820315A - Thermosetting light-reflective resin composition, method for preparing the same, optical semiconductor element-mounted reflector, and optical semiconductor device - Google Patents
Thermosetting light-reflective resin composition, method for preparing the same, optical semiconductor element-mounted reflector, and optical semiconductor device Download PDFInfo
- Publication number
- CN105820315A CN105820315A CN201610091323.5A CN201610091323A CN105820315A CN 105820315 A CN105820315 A CN 105820315A CN 201610091323 A CN201610091323 A CN 201610091323A CN 105820315 A CN105820315 A CN 105820315A
- Authority
- CN
- China
- Prior art keywords
- luminous reflectance
- resin combination
- optical semiconductor
- heat curing
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/053—Polyhydroxylic alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
Disclosed are a thermosetting light-reflective resin composition, a method for preparing the same, an optical semiconductor element-mounted reflector, and an optical semiconductor device. More specifically, disclosed are a thermosetting light-reflective resin composition which includes a polyhydric polyol having two or more hydroxyl groups and thus exhibits superior discoloration resistance and entails little deterioration in reflectance, a method for preparing the same, an optical semiconductor element-mounted reflector produced therefrom and an optical semiconductor device including the same.
Description
This application claims the priority of the korean patent application 10-2011-0047065 submitted on May 18th, 2011；The application is the divisional application of Chinese patent application No.201280024015.0 of filing date on May 15th, 2012, invention entitled " heat curing-type luminous reflectance resin combination and preparation method thereof, the optical semiconductor lift-launch reflecting plate utilizing it to prepare and the optical semiconductor device including it ".
Technical field
The optical semiconductor lift-launch reflecting plate the present invention relates to a kind of heat curing-type luminous reflectance resin combination and preparation method thereof, utilizing described compositions to prepare and the optical semiconductor device including described optical semiconductor lift-launch reflecting plate.More specifically, the present invention relates to a kind of heat curing-type luminous reflectance resin combination and preparation method thereof, utilize optical semiconductor lift-launch reflecting plate prepared by described compositions and the optical semiconductor device including described optical semiconductor lift-launch reflecting plate, wherein said heat curing-type luminous reflectance resin combination comprises and has the polyhydric alcohol of more than 2 hydroxyls as curing accelerator, there is the anti-discoloration of excellence, thus without xanthochromia or variable color, and less reduce luminous reflectance.
Background technology
LED (lightemittingdiode) is element mounted on reflecting plate, and carries out the light-emitting device sealed with epoxy resin etc..Such LED is less, relatively light, be the most easily loaded in various device, and shake or ON/OFF (on/off) repeatedly owing to resisting, therefore there is the life-span long, bright-colored and obvious and there is identity, advantage that energy consumption is low.In this type of LED, ultraviolet ray emitting element and the ultraviolet produced by described ultraviolet ray emitting element send the White LED of the fluorophor of white light, as at the background light of LCDs, the headlight of automobile or the light sources of instrument board, illuminating device etc. such as mobile phone, computer, TVs, enjoy attracting attention of people.
The LED reflection plate used on this kind of device, it usually needs the light that light-emitting component can be sent or ultraviolet high-efficiency reflective, good luminous reflectance.In order to prevent luminous reflectance low, should avoid reflecting plate itself that xanthochromia or variable color will not occur.Further, owing to LED reflection plate is exposed in high temperature for a long time, therefore its needs the most also should have higher luminous reflectance.
Existing LED reflection plate is first to form metal winding displacement from metal forming by the known method such as punching press or etching, makes with comprising the thermoplastic resin molded of Chinese white after then carrying out the metals such as nickel plating/silver on metal winding displacement (lead frame).But, owing to consumer is for the demand of high brightness, the rated power of nearest LED is higher.The high temperature now produced and ultraviolet make the variable colors such as reflecting plate generation xanthochromia, become and cause luminous reflectance to reduce and the main cause of luminance-reduction.The existing luminous reflectance reflecting plate manufactured with thermoplastic resin finished product, it is limited for the most at high temperature maintaining luminous reflectance.
Summary of the invention
Solve the technical problem that
It is an object of the invention to, it is provided that one does not occur xanthochromia or variable color, the heat curing-type luminous reflectance resin combination that anti-discoloration is outstanding.
Another object of the present invention is to, it is provided that after heat treatment, luminous reflectance does not reduces one, and can the heat curing-type luminous reflectance resin combination of transfer molding.
It is a further object of the present invention to provide the preparation method of a kind of heat curing-type luminous reflectance resin combination.
It is a further object of the present invention to provide a kind of optical semiconductor lift-launch reflecting plate, comprising: the reflecting plate constituted with described heat curing-type luminous reflectance resin combination.
It is a further object of the present invention to provide a kind of optical semiconductor device, comprising: described mounting semiconductor element reflecting plate.
Technical scheme
Heat curing-type luminous reflectance resin combination according to an aspect of the present invention, it comprises the polyhydric alcohol with more than 2 hydroxyls and can reach about more than 70% as curing accelerator, described the compositions sustainment rate of the luminous reflectance represented by following formula 1 of the test piece prepared.
<formula 1>
Luminous reflectance × 100 of the sustainment rate (%) of luminous reflectance=before the luminous reflectance/heat treatment after 180 DEG C of heat treatments about 168 hours
In one concrete example, described compositions, after transfer molding, solidifies about 3 hours at 150 DEG C, then the sustainment rate of the luminous reflectance after 180 DEG C of heat treatments 168 hours can reach about more than 70%.
In one concrete example, described compositions is when transfer molding, and Spiral flow length (SpiralFlowLength (S/F)) is about 15-45 inch.
In one concrete example, described compositions is when transfer molding, and gelling time (gelationtime (G/T)) is about the 30-70 second.
In one concrete example, described compositions comprises the steps that described curing accelerator, epoxy resin, firming agent, inorganic filler and Chinese white.
In one concrete example, described curing accelerator can have the structure of following chemical formula 3.
<chemical formula 3>
OH-(CH2)m-[CR1-OH]n-(CH2)p-OH
(in described formula, R1It is hydrogen or the line style of carbon number 1-30 or branched alkyl；N is the integer of 0-20；M and p independence is the integer of 0-10.But, except n, m and p are all the situation of 0)
In one concrete example, described curing accelerator can not include aromatic group.
In one concrete example, described curing accelerator is relative to the epoxy resin of 100 weight portions, it may include about 3-49 weight portion.
In one concrete example, described epoxy resin may not include aromatic group.
In one concrete example, described firming agent may not include aromatic group.
In one concrete example, described compositions may also include that the more than one material selected in the group being made up of releasing agent and additive.
In one concrete example, described inorganic filler comprises the steps that inorganic filler and the mixture of mean diameter (D50) the about inorganic filler of 10-35 μm of not enough about 10 μm of mean diameter (D50).
In one concrete example, described in described compositions, the ratio of Chinese white and inorganic filler is about 1:0.1 to 1:4 weight ratio.
The preparation method of heat curing-type luminous reflectance resin combination according to a further aspect of the invention, including: by epoxy resin and firming agent melting mixing；And in described mixture, add and comprise the curing accelerator of polyhydric alcohol, inorganic filler and the Chinese white with more than about 2 hydroxyls with the step of melting mixing.
In one concrete example, described melting mixing step can be at a temperature of about 30-50 DEG C, carries out about 30 to 180 minutes.
Optical semiconductor lift-launch reflecting plate according to another aspect of the invention, it may include described heat curing-type luminous reflectance resin combination.
Optical semiconductor device according to another aspect of the invention, it may include described optical semiconductor lift-launch reflecting plate.
Beneficial effect
The present invention provides a kind of anti-discoloration with excellence, thus without occurring to turn yellow or the heat curing-type luminous reflectance resin combination of variable color.It addition, the present invention provides a kind of when being exposed to for a long time under high temperature, the heat curing-type luminous reflectance resin combination of the reflective reduction penetrating rate also will not occur.
Accompanying drawing explanation
Fig. 1 is the sample compositions of embodiment 1-3 and the compositions of comparative example 4 prepared, after 180 DEG C of heat treatments about 168 hours, under 430nm wavelength, with the change of the luminous reflectance that ageing time (agingtime) changes, wherein the compositions of embodiment 4 contains the curing accelerator with aromatic group.
Fig. 2 is the sample compositions of embodiment of the present invention 1-3 and the compositions of comparative example 5-7 prepared, after 180 DEG C of heat treatments about 168 hours, under 430nm wavelength, with the change of the luminous reflectance of ageing time change, wherein the compositions of comparative example 5-7 contains the thermoplastic resin of use in the past.
Detailed description of the invention
The sustainment rate of the luminous reflectance of the resin combination of heat curing-type luminous reflectance according to an aspect of the present invention can reach about more than 70%.In this specification, " sustainment rate of luminous reflectance " of indication refers to the test piece prepared by described resin combination, and the luminous reflectance after 180 DEG C of heat treatments about 168 hours, relative to the ratio of the luminous reflectance before heat treatment.The sustainment rate of luminous reflectance can represent according to following formula 1.
<formula 1>
Luminous reflectance × 100 of the sustainment rate (%) of luminous reflectance=before the luminous reflectance/heat treatment after 180 DEG C of heat treatments about 168 hours
Generally, luminous reflectance resin combination when the test piece prepared is carried out heat treatment, its color can from white yellowing, its because of luminous reflectance reduce caused by.Luminous reflectance reduces the least, and its anti-discoloration is the highest.The i.e. sustainment rate of luminous reflectance is the highest, and anti-discoloration is the highest.
The sustainment rate of the luminous reflectance of described compositions can reach about more than 70%, it is preferable that can reach about 72-85%.
Although the sustainment rate of described luminous reflectance is not particularly limited, but transfer molding machine can be utilized, by compositions molding 240 seconds at a temperature of 150 DEG C, after mould takes off, then carry out the rear solidification of 3 hours the temperature of 150 DEG C, thus prepare test piece.Afterwards, the luminous reflectance before detection heat treatment, and at a temperature of 180 DEG C, carry out detection luminous reflectance after the heat treatment of 168 hours, and draw through calculating further.In the present invention, described luminous reflectance is on the basis of the value of detection under 430nm wavelength.
In one concrete example, described heat curing-type luminous reflectance resin combination is when transfer molding, and its Spiral flow length is about 15-45 inch.Preferably, may be about 24-45 inch.
In one concrete example, the resin combination of described heat curing-type luminous reflectance is when transfer molding, and its gelling time (gelationtime (G/T)) may be about the 30-70 second, it is preferable that may be about the 57-68 second.
The resin combination of the present invention comprises the steps that epoxy resin, firming agent, curing accelerator, inorganic filler and Chinese white.
In the present invention, epoxy resin can use conventional epoxy resin molding material.Specifically have: the phenolic resin of Pyrogentisinic Acid's class and aldehydes carries out epoxidised resin, including phenol novolak type epoxy, Study On O-cresol Epoxy Resin etc.；Diglycidyl ether, including bisphenol-A, Bisphenol F, bisphenol S and hydrocarbon for bis-phenol etc.；The glycidyl amine type epoxy resin obtained by the reaction of the polyamine such as MDA, isocyanuric acid and epoxy chloropropionate alcohol；The linear aliphatic epoxy resins that alkene key is obtained with peracid molding such as high acetic acid；And cycloaliphatic epoxy resin etc..Epoxy resin can also mix two or more use.
Epoxy resin is the resin that epoxide equivalent is about 50-500g/eq.Preferably, the epoxy resin of about 80-450g/eq can be used.
Preferably, can use and do not include the epoxy resin of aromatic group.Including aromatic group, and when being applied to the reflecting plate of light-emitting component, xanthochromia can be produced because of the high temperature of light-emitting component, cause to use as reflecting plate.Such as, epoxy resin can use the linear aliphatic epoxy resins peracid molding such as the high acetic acid of alkene key obtained；And cycloaliphatic epoxy resin etc..
Such as, in epoxy resin, it is possible to use the triglycidyl isocyanurate resin of the following chemical formula 1 of the transparency and anti-discoloration excellence or the epoxy resin of following chemical formula 2.
<chemical formula 1>
<chemical formula 2>
The integer of 0-20 (the above-mentioned n be)
Especially, owing to the epoxy resin of described formula 2 is to comprise the most more than one hydroxyl in epoxy molecule structure, the most relatively it is suitable for being prepared as the B-stage (Bstage) of thermosetting resin, it will not occur gelation because reacting with the partial esterification of firming agent, and can again be melted after heating.
Firming agent for using in the present invention is not particularly limited, as long as all can be able to use with the compound that described epoxy resin reacts.Firming agent can use anhydride curing agent, isocyanuric acid firming agent, phenol firming agent etc..Firming agent can mix two or more use.
Anhydride curing agent can use phthalic anhydride, maleic anhydride, trimellitic anhydride, PMA, hexahydrophthalic anhydride, tetrabydrophthalic anhydride, methylnadic anhydride, carbic anhydride, glutaric anhydride, dimethylated pentanedioic acid acid anhydride, diethyl glutarate acid anhydride, succinic anhydrides, methylhexahydrophthalic anhydride and methyl tetrahydrophthalic anhydride etc..
Isocyanuric acid firming agent includes: 1,3,5-tri-(1-carboxymethyl) isocyanuric acid ester, 1,3,5-tri-(2-carboxymethyl) isocyanates, 1,3, double (2-carboxymethyl) isocyanuric acid esters of 5-tri-(3-carboxymethyl) isocyanuric acid ester, 1,3-etc..
Phenol firming agent can use the compound that the aphthols of the phenol such as phenol, cresol, resorcinol, catechol, bisphenol-A, Bisphenol F, phenylphenol, amino phenols and/or alpha-Naphthol, betanaphthol, dihydroxy naphthalene etc. and formaldehyde, benzaldehyde, salicylic aldehyde etc. have aldehyde radical, polymerization or cocondensation under conditions of acidic catalyst and the novolac type phenolic resin that obtains；By phenol and/or aphthols and dimethoxy xylol or the phenol-aralkyl resin of double (methoxyl group) biphenyl synthesis；Biphenyl type phenol-aralkyl-type phenol resin such as aralkyl resin, naphtol-aralkyl resins；The dicyclopentadiene-type phenolic resins such as the dicyclopentadiene-type phenol novolacs that synthesized by phenols and/or aphthols and the copolymerization of bicyclopentadiene, dicyclopentadiene-type naphthol novolac resin；Tritan. type phenolic resin；Modified terpene phenolic resin；Modified xylol and/or meta-xylene phenolic resin；Modified cyanurotriamide phenolic resin；Or modification cyclopentadiene phenol resin.
Preferably, can use and do not include the firming agent of aromatic group.
Including aromatic group, and when being applied to the reflecting plate of light emitting diode, produce xanthochromia due to the high temperature of light emitting diode so that cannot use as reflecting plate.Such as, the group can being made up of anhydride curing agent and isocyanuric acid firming agent selects at least one, as firming agent.Preferably, anhydride curing agent can be used.
Anhydride curing agent is preferred with the colourless or flaxen firming agent of use.
Firming agent is relative to the described epoxy resin of 100 weight portions, it may include about 50-250 weight portion.In the range of described, can have high-temperature stability and the electric property of excellence, hot modification temperature height, the effect of good mechanical property.Preferably, it may include about 50-200 weight portion, more preferably, it may include about 50-170 weight portion.
For the firming agent of epoxy resin, especially with the proportioning of anhydride curing agent, for the epoxide group in the epoxy resin of 1 equivalent it is best to use the active group that can react with epoxide group of about 0.5-1.5 equivalent, such as anhydride group.In the range of described, the moisture-proof of the solidification rate of composition epoxy resin, the glass transition temperature of solidfied material and solidfied material all will not reduce.Preferably, about 0.7-1.2 equivalent can be used.
In addition to the firming agent for described epoxy resin, it is possible to used along with alcohol by the firming agent of described anhydride curing agent partial esterification or carboxylic acid curing agents.
The most spendable curing accelerator can react with described epoxy resin and firming agent, thus plays the effect promoting cross-linking reaction.Curing accelerator can use the polyhydric alcohol with more than about 2 hydroxyls.Preferably, curing accelerator can have the hydroxyl of more than about 3.
Not having special restriction for curing accelerator, it can have the structure of following chemical formula 3.
<chemical formula 3>
OH-(CH2)m-[CR1-OH]n-(CH2)p-OH
(in above-mentioned formula, R1It is hydrogen or the line style of carbon number 1-30 or the alkyl of ramiform；N is the integer of 0-20；M and p independence is the integer of 0-10.But, except n, m and p are all the situation of 0)
Preferably, R1 is hydrogen or the line style of carbon number 1-10 or the alkyl of ramiform；N is the integer of 0-3.
The curing accelerator of the present invention can use hydroxyl equivalent to be about more than 30；Preferably about 30-200；More preferably, about 30-150 curing accelerator.
The curing accelerator of the present invention may not include aromatic group.As included aromatic group, then when preparing reflecting plate, it may occur that variable color.
The curing accelerator of the present invention, relative to the described epoxy resin of 100 weight portions, it may include about 3-49 weight portion.In the range of described, owing to epoxy resin and firming agent do not crosslink, the state that compositions is uncured can be prevented.Preferably, it may include about 5-45 weight portion.
To inorganic filler, there is no particular limitation.Such as, can use in the group being made up of silicon dioxide, aluminium hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, brium carbonate and select at least one above inorganic filler.Consider from mouldability and the anti-flammability of resin combination, the electrodeless filler of at least one that select more than is preferably used from silicon dioxide, aluminium hydroxide and magnesium hydroxide.
The mean diameter (D50) of inorganic filler is about below 35 μm, it is preferable that may be about 1-22 μm.Inorganic filler also can mix the mutually different inorganic filler of mean diameter of more than two kinds and use.Such as, the inorganic filler that mean diameter (D50) can be about below 10 μm, the inorganic filler of preferably about 1-9.99 μm and mean diameter (D50) about 10-35 μm is used in mixed way.When being about the inorganic filler of 10-35 μm including mean diameter (D50), when transfer molding, can have the effect reducing the overlap (flash) produced between mould.If but time too much, easily the inlet in blocking note chamber, causes not sufficiently filled situation.Now, it may include the inorganic filler of about 10 μm that mean diameter (D50) is not enough: the weight ratio of the inorganic filler that mean diameter (D50) is about 10-35 μm is about the inorganic filler of 1:0.1 to about 1:20.
Relative in total 100 weight portions of heat curing-type luminous reflectance resin combination, inorganic filler can use about 1-90 weight portion.Preferably, about 5-70 weight portion, it is highly preferred that about 40-45 weight portion.
Chinese white is not particularly limited, titanium oxide, aluminium oxide, magnesium oxide, stibium oxide, zirconium oxide and inorganic hollow particle can be used.
The mean diameter (D50) of Chinese white is about 0.1 to 50 μm.In the range of described, owing to particle does not condenses, therefore, its good dispersion, and the reflective character of solidfied material will not be deteriorated.
Chinese white can be used in mixed way the Chinese white of more than two kinds that mean diameter is different.
Relative to total 100 weight portions of the resin combination of heat curing-type luminous reflectance, Chinese white can use about 5-50 weight portion, preferably from about 10-40 weight portion, more preferably from about 15-35 weight portion.
For Chinese white and inorganic filler, Chinese white: the weight ratio of inorganic filler is about the weight ratio of 1:0.1 to 1:4.In the range of described, the reflective character of solidfied material will not be deteriorated, and flat board (tablet) molding being advantageously used in transfer molding method, when injecting solute in mould, finished surface can be reduced the generation of the foam of luminous reflectance occurs to hinder, also can reduce the resin burr overflowed between mould, do not produce the pollution of the metal winding displacement (lead frame) caused by resin burr, when optical semiconductor is equipped on metal winding displacement, there is good weld job and the effect of metal wire connection operation.Preferably, it may include the weight ratio of about 1:0.2 to 1:3.
In another concrete example, the compositions of the present invention may also include more than one the material selected in the group being made up of releasing agent and additive.
Releasing agent is had no particular limits, can be by aliphatic carboxylic acid, aliphatic carboxylic acid esters, aliphatic polyether, Non-oxidized polyolefin and have in the group that the oxidized form polyolefin of carboxyl forms and select at least one used above.Preferably, the releasing agent that colourless or flaxen coloring is shallower is used.
Aliphatic carboxylic acid, can use the unitary organic acid that carbon number is 10-50 such as lauric acid, myristic acid, Palmic acid, stearic acid and montanic acid.
Aliphatic carboxylic acid esters, can use polyalkylene ether (polyakyleneether) compound of the carbon number 3-500 with following chemical formula 4 structure.
<chemical formula 4>
(above-mentioned q1 is 1-20, and R is hydrogen, methyl, the organic group of carbon number 2-10)
Oxidized form or the polyolefin of Non-oxidized, can use the low-molecular-weight polyolefin that number-average molecular weight is about 500-10000g/mol.
For the epoxy resin of 100 weight portions, releasing agent can use about 0.01-8 weight portion.In the range of described, the cohesiveness for reflecting plate will not degenerate.Preferably, about 1-7 weight portion is used.
Heat-resisting or the cold tolerance of additive is outstanding, and maintains the elasticity of product within the scope of about-50 DEG C to 250 DEG C of extensive temperature.The structure of the line style dimethicone comprising crosslinking can be used as additive.
Such as, additive can use the fine silicone powder comprising the construction unit that following formula 5 represents.Or additive can use the mixing silicone powder after the silicones coating of the fine silicone powder following formula 6 following formula 5 represented.
<chemical formula 5>
<chemical formula 6>
(RSiO3/2)n
(wherein, R is methyl, phenyl, vinyl or hydrogen.N is the integer of 2 to 10000)
The mean diameter (D50) of described silicone powder may be about 0.8-40 μm.
Relative to total 100 weight portions of heat curing-type luminous reflectance resin combination, additive can include about 0.01-10 weight portion.In the range of described, article shaped can absorb impact, and has raising wearability and the effect of release property.Preferably, it may include about 0.1-7 weight portion.
Thermocurable luminous reflectance resin combination according to the present invention is in addition to epoxy resin, firming agent, curing accelerator, inorganic filler, Chinese white, releasing agent and additive, it is also possible to include other various additives.Such as, consider from the surface tackiness improved between resin and inorganic filler and Chinese white, coupling agent can be used as required.Coupling agent is had no particular limits, silane coupler, titanate coupling agent can be used.Epoxy silane class, amino silicone alkanes, cationic silane class, vinyl silanes class, silicon Acrylote alkanes, hydrosulphonyl silane class etc. can be used as silane coupler.Coupling agent is it is also contemplated that amount of surface coverage to inorganic filler, thus makes suitable adjustment.Coupling agent is preferably below about 5 weight % of resin combination.In addition to coupling agent, may also include the additive such as antioxidant, ion trap agent.
According to another aspect of the invention, it is provided that the preparation method of a kind of heat curing-type luminous reflectance resin combination.Described method can be the mixing of described epoxy resin, firming agent, curing accelerator, inorganic filler and Chinese white to be prepared, but has no particular limits hybrid mode or condition etc..General preparation method can be used, i.e. use the devices such as mixing roll, compressor, kneader, roll, extruder by mixing for various compositions, the mixing thing obtained is prepared by cooling and the method for pulverizing.Compounding process is had no particular limits, melting mixing can be carried out, and temperature and time during melting mixing can be adjusted according to the kind of various use compositions or proportional quantity.
As a concrete example, although the built-up sequence for each composition does not limit, but in order to make the mixture being mixed with epoxy resin, firming agent, releasing agent and additive to be melted, predetermined temperature (e.g., from about 100-150 DEG C) can be maintained, thus obtain aqueous molten mixture.The molten mixture obtained is cooled to 30-60 DEG C.Put into other raw material such as curing accelerator and various solid state powder additive, Chinese white and the inorganic fillers not melted, carry out melting mixing process.Under conditions of mixture is maintained about 30-50 DEG C by melting mixing process, it is preferably kept under the temperature conditions of about 35-45 DEG C, and with about 50-300rpm, mixing about 30-180 minute.If during melting mixing deficiency of time 30 minutes, the dispersibility that can make mixture is low；And during more than 180 minutes, due to the reaction heat produced during composition react, it is difficult to control reaction, and the most likely produce gel.Although the built-up sequence of each composition is not limited, it is desirable that first by after epoxy resin, firming agent, releasing agent and various additive premixing, then add curing accelerator, Chinese white, inorganic filler and the solid additives not melted.
According to another aspect of the invention, it is provided that a kind of optical semiconductor lift-launch reflecting plate.Described optical semiconductor lift-launch reflecting plate can be made up of the heat curing-type luminous reflectance resin combination of the present invention.Specifically, optical semiconductor carries reflecting plate and has at least more than one a recess, and at least inner side at described recess includes the reflecting plate being made up of the resin combination of the heat curing-type luminous reflectance of the present invention.
According to another aspect of the invention, it is provided that the preparation method of a kind of optical semiconductor lift-launch reflecting plate.Described method includes: be made up of the step that described optical semiconductor carries the inner side of reflecting plate described heat curing-type luminous reflectance resin combination.Specifically, resin combination or its flat-plate molded body of heat curing-type luminous reflectance can be prepared by transfer molding.For preparing optical semiconductor lift-launch reflecting plate, first metal winding displacement can be formed from metal forming by the known method such as punching press or etching.Plating nickel silver is implemented at this metal winding displacement (lead frame).Then this metal winding displacement is configured in mould, from the resin inlet of mould by the solute of the heat curing-type luminous reflectance resin combination (the most flat-plate molded body) of the present invention.Afterwards, the resin combination that will inject, with mold temperature about 145-190 DEG C, briquetting pressure about 10-80Kgf/cm2, separate from mould after the about 100-240 second solidifies, with solidification temperature about 120-180 DEG C, carry out the heat cure of about 1-5 hour.
And, on the metal winding displacement (lead frame) removing optical semiconductor device, such as after the operation of the Organic Pollutions such as resin burr, for reaching to improve the reflectance of photosemiconductor and the long-time purpose maintained, to as optical semiconductor carry region recess precalculated position again implement plate nickel silver, the illuminator that wherein said recess is made up of the solidfied material of heat curing-type luminous reflectance resin combination around.
According to another aspect of the invention, it is provided that include the optical semiconductor device of described optical semiconductor lift-launch reflecting plate.Described optical semiconductor device comprises the steps that described optical semiconductor lift-launch reflecting plate；It is equipped on the optical semiconductor of the recess bottom surface of optical semiconductor lift-launch reflecting plate；And be formed in recess, the transparent sealing resin layer containing fluorophor for covering optical semiconductor.LED can be used as described semiconductor element.
Detailed description of the invention
Hereinafter, by the preferred embodiments of the present invention, composition and the effect of the present invention be will be described in greater detail.But, it is only used as the preferred exemplary of the present invention, it is impossible to limit the present invention with any reason with this.
It is not recorded in this content, is that those skilled in the art can weigh through sufficient technology and obtain, therefore repeats no more.
Details are as follows for the concrete composition used in following embodiment and comparative example.
(1) epoxy resin employs TEPIC-S (nissan chemical).
(2) firming agent employs MH-700G (new Japan physical chemistry).
(3-1) curing accelerator employs PEP550 (4 yuan of alcohol) (BASF AG).
(3-2) curing accelerator employs TPP-PB (preserving the phosphor catalyst of photoinitiator chemical).
(4) inorganic filler employs SiO2(mean diameter (D50) 1 μm: the mixture of the weight portion of the 1:1 of mean diameter (D50) 22 μm).
(5) Chinese white employs TiO2(mean diameter 0.17 μm).
(6) releasing agent employs PED-522 (Clariant chemical industry).
(7) additive employs KBM-403 (epoxy silane) (SHIN-ETSU HANTOTAI's chemical industry).
(8) thermoplastic resin 1 employs PA-9TTA-112 (Kuraray company)；Thermoplastic resin 2 employs PA-9TTA-113 (Kuraray company)；Thermoplastic resin 3 employs PA-9TTA-124 (Kuraray company).
Embodiment 1-3
By add with the content described in table 1 below, the mixture of epoxy resin, firming agent, releasing agent and additive is heated to 120 DEG C and carries out melting mixing.The temperature of the mixture obtained is cooled to 40 DEG C.Chinese white, curing accelerator and inorganic filler is added with the content that table 1 below is recorded.The temperature making the mixture of acquisition maintains 35 DEG C, mixes about 180 minutes with 100rpm.In the mixture loading dish that will obtain, in the baking box of 70 DEG C after maturation about 3 hours, utilize transfer molding machine to carry out under the conditions of 150 DEG C about 240 seconds, thus prepare each test piece.
Comparative example 1-4
In addition to changing the composition of content in table 1 below, all prepare compositions with the method that above-described embodiment is identical, and prepare sample.
Table 1
Comparative example 5
It is applicable to the polyamide-type thermoplastic resin 1 with high-fire resistance of this area of 0.5 watt of level LED light reflection reflecting plate, in 300 DEG C of moulds, utilizes the method for injection molding to prepare test piece.
Comparative example 6-7
Comparative example 6-7 is in addition to using thermoplastic resin 2-3 respectively and substituting the thermoplastic resin 1 of above-mentioned comparative example 5, uses identical method to be prepared for test piece.
Experimental example: physical property evaluation
For the test piece of preparation in described embodiment and comparative example, evaluating following physical property, its result is as described in Table 2.
<test method for physical property>
(1) Spiral flow length (S/F (Spiralflowlength)) (inch): utilize EMMI Standard Module, for the compositions of preparation in described embodiment and comparative example, detect mobility during transfer molding under conditions of mold temperature is 150 DEG C.It addition, during 70 DEG C of maturations, have detected the S/F according to the maturation time.
(2) gelling time (G/T, gelationtime) (second): by the compositions of preparation in appropriate described embodiment and comparative example, be placed on the hot plate of 150 DEG C and react, detect from starting to the time that gelation occurs.It addition, during 70 DEG C of maturations, have detected the G/T according to the maturation time.
(3) high temperature hardness (shore a hardness, Shore-A): for the compositions of preparation in described embodiment and comparative example, utilize transfer molding machine, the mold temperature of 150 DEG C, make the test piece of 50mm × 50mm × 3mm (length × width x thickness) after 240 seconds, the mould of 150 DEG C detects hardness.
(4) luminous reflectance (Reflectance, R) (%): by the test piece of 50mm × 50mm × 1mm (length × width x thickness), transfer molding about 240 seconds under the conditions of 150 DEG C, and under the conditions of 150 DEG C, solidify about 3 hours.V-670 spectrogrph (JASCO company) is utilized to measure the initial light reflectance under 430nm.Then, heat treatment about 168 hours under the conditions of 180 DEG C, and under 430nm, measure luminous reflectance again.Fig. 1 shows the compositions for embodiment 1-3 and the compositions of comparative example 4, and under the conditions of 180 DEG C, heat treatment is after about 168 hours, with the luminous reflectance of ageing time change under 430nm.Fig. 2 shows test piece prepared by the compositions of the compositions for embodiment 1-3 and comparative example 5-7, and under the conditions of 180 DEG C, heat treatment is after about 168 hours, with the luminous reflectance of ageing time change under 430nm.
(5) anti-discoloration (sustainment rate of luminous reflectance) (%): utilize the luminous reflectance of described detection and following formula, calculates anti-discoloration (sustainment rate of luminous reflectance).
Luminous reflectance × 100 of the sustainment rate (%) of luminous reflectance=before the luminous reflectance/heat treatment after 180 DEG C of heat treatments about 168 hours
(6) evaluation is peeled off: after the contact site dipping water-base ink of the cup-shaped products formed of 3mm × 2.5mm × 2mm (length × width x thickness), confirm the infiltration either with or without the ink caused by capillarity.Represent with zero during ink bleed, do not permeate time represent with Χ.
Table 2
As shown in table 2, being not added with the comparative example 1 of curing accelerator of the present invention, more difficult in the maturation temperature of 70 DEG C react, even if the most also existing with its uncured state, being therefore difficult to preparation semi-cured state (B-Stage).Epoxy resin relative to 100 weight portions, the addition of curing accelerator is the compositions of the comparative example 2 of 2 weight portions, different from the comparative example 1 not including curing accelerator, although at a temperature of 70 DEG C, to there occurs reaction, but S/F be more than 103 inches, G/T be 100 seconds, although being prepared as semi-cured state, but after transfer molding, because high temperature hardness is 10, occur in that the phenomenon with die adhesion, it is difficult to the test piece being prepared as evaluating physical property, causes to detect luminous reflectance and peeling off evaluation.When epoxy resin at 100 weight portions includes the curing accelerator of 50 weight portions, although there occurs reaction in identical maturation temperature, but there is not the sufficient cross-linking reaction of compositions, therefore the high temperature hardness after transfer molding is as little as 12, it is similarly difficult to be prepared as semi-cured state, causes to detect luminous reflectance and peeling off evaluation.On the contrary, in embodiment 1,2 and 3, reacting at a temperature of 70 DEG C of maturations, it is possible to be prepared as semi-cured state, the high temperature hardness after transfer molding reaches more than 50, does not has any problem for preparation test piece.Initial luminous reflectance is the highest in embodiment 1,2 and 3, has reached more than 90%, and measures the luminous reflectance after 180 DEG C of heat treatments about 168 hours, it is judged that the result of anti-discoloration shows, embodiment 1,2 and 3 is illustrated as more than 70%.Use in the comparative example 4 of the phosphorus curing accelerator comprising aromatic group, at a temperature of the maturation of 70 DEG C, there occurs sufficiently reaction, and be prepared as semi-cured state after 30 minutes.During transfer molding, owing to its high temperature hardness is higher, test piece preparation does not has hell and high water, and peeling does not occurs yet.But for anti-discoloration, although the initial light reflectance detected is higher, but the luminous reflectance after high-temperature heat treatment is substantially less than the present invention.This be due to high-temperature heat treatment after, there is the discoloration such as xanthochromia, be therefore unable to maintain that initial luminous reflectance, cause anti-discoloration unsatisfactory.And, as shown in the result of comparative example 5-7 and Fig. 2, by can be used for luminous reflectance reflecting plate in the art, test piece prepared by the thermoplastic resin of the polyamide-based series with high-fire resistance, after Overheating Treatment, the most also there is dramatic decrease in its luminous reflectance, it may thus be appreciated that its anti-discoloration is unsatisfactory.
It addition, for the compositions of preparation in described embodiment and comparative example, measure S/F and G/T with the change of maturation time under the conditions of 70 DEG C, and result be as shown in Table 3 and Table 4.
Table 3
Table 4
As shown above, the compositions of the present invention can be prepared as having suitable S/F value and the semi-cured state of G/T value；On the contrary, the compositions of comparative example 1-3 occurs uncured, or prepares semi-cured state the most at last and also do not possess suitable S/F value and G/T value.Comparative example 4 is after 0.5 hour, within the time faster, is prepared as semi-cured state, and it has suitable S/F value and G/T value, and afterwards, owing to it does not has mobility, and have been carried out gelation, therefore cause detecting its G/T value.
Industrial applicibility
The present invention provides one to have excellent anti-discoloration, thus without occurring to turn yellow or the heat curing-type luminous reflectance resin combination of variable color.It addition, the present invention provides a kind of long-time exposure at high temperature, also will not make the reflective heat curing-type luminous reflectance resin combination penetrating rate reduction.
It is above embodiments of the invention and accompanying drawing are illustrated, but the present invention is not limited to described embodiment and accompanying drawing, multiple different form can be prepared as.There is the technical staff of Conventional wisdom in the technical field of the invention, in the case of not changing the essential feature of technological thought of the present invention, it is possible to implement other concrete form multiple.Therefore, embodiment is interpreted as illustrating invention entirety rather than restriction to this as mentioned.
Claims (16)
1. a heat curing-type luminous reflectance resin combination, it comprises and has the polyhydric alcohol of more than 3 hydroxyls as curing accelerator, described compositions comprises described curing accelerator, epoxy resin, firming agent, inorganic filler and Chinese white, described epoxy resin relative to 100 weight portions, curing accelerator comprises 5-45 weight portion, described compositions the sustainment rate of the test piece the prepared luminous reflectance for representing with following formula 1 is more than 70%；
<formula 1>
Luminous reflectance × 100 of the sustainment rate (%) of luminous reflectance=before the luminous reflectance/heat treatment after 180 DEG C of heat treatments 168 hours,
Described curing accelerator has a structure of following chemical formula 3:
<chemical formula 3>
OH-(CH2)m-[CR1-OH]n-(CH2)p-OH
In above-mentioned formula, R1It is hydrogen or the line style of carbon number 1-30 or the alkyl of ramiform；N is the integer of 0-20；M and p is the integer of independent 0-10, but, except n, m and p are all the situation of 0.
Heat curing-type luminous reflectance resin combination the most according to claim 1, it is characterised in that described compositions, after transfer molding, solidifies 3 hours at 150 DEG C, then the sustainment rate of the luminous reflectance after 180 DEG C of heat treatments 168 hours is more than 70%.
Heat curing-type luminous reflectance resin combination the most according to claim 1, it is characterised in that described compositions is when transfer molding, and Spiral flow length (S/F) is 15-45 inch.
Heat curing-type luminous reflectance resin combination the most according to claim 1, it is characterised in that described compositions is when transfer molding, and gelling time (G/T) is the 30-70 second.
Heat curing-type luminous reflectance resin combination the most according to claim 1, it is characterised in that the hydroxyl equivalent of described curing accelerator is more than 30.
Heat curing-type luminous reflectance resin combination the most according to claim 1, it is characterised in that described curing accelerator does not comprise aromatic functional groups.
Heat curing-type luminous reflectance resin combination the most according to claim 1, it is characterised in that described epoxy resin does not include aromatic functional groups.
Heat curing-type luminous reflectance resin combination the most according to claim 1, it is characterised in that described firming agent does not comprise aromatic functional groups.
Heat curing-type luminous reflectance resin combination the most according to claim 1, it is characterised in that in described compositions, the ratio of Chinese white and inorganic filler is 1:0.1 to 1:4 weight ratio.
Heat curing-type luminous reflectance resin combination the most according to claim 1, it is characterized in that, described inorganic filler comprises the inorganic filler of below mean diameter (D50) 10 μm and the mixture of inorganic filler that mean diameter (D50) is 10-35 μm.
11. heat curing-type luminous reflectance resin combinations according to claim 1, it is characterised in that described compositions may also include in the group being made up of releasing agent and additive select more than one.
12. heat curing-type luminous reflectance resin combinations according to claim 11, it is characterised in that described additive has the structure of the line style dimethicone of crosslinking.
The preparation method of 13. 1 kinds of heat curing-type luminous reflectance resin combinations, comprising: by epoxy resin and firming agent melting mixing；And in described mixture, add and comprise the curing accelerator of the polyhydric alcohol with more than 3 hydroxyls, inorganic filler and the Chinese white step with melting mixing, relative to the described epoxy resin of 100 weight portions, curing accelerator comprises 5-45 weight portion,
Described curing accelerator has a structure of following chemical formula 3:
<chemical formula 3>
OH-(CH2)m-[CR1-OH]n-(CH2)p-OH
In above-mentioned formula, R1It is hydrogen or the line style of carbon number 1-30 or the alkyl of ramiform；N is the integer of 0-20；M and p is the integer of independent 0-10, but, except n, m and p are all the situation of 0.
The preparation method of 14. heat curing-type luminous reflectance resin combinations according to claim 13, it is characterised in that described melting mixing step is at a temperature of 30-50 DEG C, carries out 30 to 180 minutes.
15. 1 kinds of optical semiconductor lift-launch reflecting plates, it includes according to the thermohardening type luminous reflectance resin combination of any one in claim 1-12.
16. 1 kinds of optical semiconductor devices, it includes the optical semiconductor lift-launch reflecting plate described in claim 15.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110047065A KR101092015B1 (en) | 2011-05-03 | 2011-05-18 | Thermosetting resin composition for light reflection, process for producing the same, substrate made therefrom for photosemiconductor element mounting, and photosemiconductor device |
| KR10-2011-0047065 | 2011-05-18 | ||
| CN201280024015.0A CN103562290A (en) | 2011-05-18 | 2012-05-15 | Thermosetting resin composition for light reflection, preparation method thereof, reflecting plate for loading photonic semiconductor prepared therefrom, and photonic semiconductor device containing same |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280024015.0A Division CN103562290A (en) | 2011-05-18 | 2012-05-15 | Thermosetting resin composition for light reflection, preparation method thereof, reflecting plate for loading photonic semiconductor prepared therefrom, and photonic semiconductor device containing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105820315A true CN105820315A (en) | 2016-08-03 |
Family
ID=47178418
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610091323.5A Pending CN105820315A (en) | 2011-05-18 | 2012-05-15 | Thermosetting light-reflective resin composition, method for preparing the same, optical semiconductor element-mounted reflector, and optical semiconductor device |
| CN201280024015.0A Pending CN103562290A (en) | 2011-05-18 | 2012-05-15 | Thermosetting resin composition for light reflection, preparation method thereof, reflecting plate for loading photonic semiconductor prepared therefrom, and photonic semiconductor device containing same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280024015.0A Pending CN103562290A (en) | 2011-05-18 | 2012-05-15 | Thermosetting resin composition for light reflection, preparation method thereof, reflecting plate for loading photonic semiconductor prepared therefrom, and photonic semiconductor device containing same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2014517110A (en) |
| CN (2) | CN105820315A (en) |
| WO (1) | WO2012157938A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6220133B2 (en) * | 2013-02-26 | 2017-10-25 | 京セラ株式会社 | Optical semiconductor case molding resin composition and optical semiconductor case |
| KR101980728B1 (en) | 2015-07-14 | 2019-05-21 | 주식회사 엘지화학 | Conductive structure body, method for manufacturing thereof, touch panel comprising thereof and display device comprising thereof |
| CN116178890A (en) * | 2022-11-30 | 2023-05-30 | 深圳伊帕思新材料科技有限公司 | Thermosetting resin composition, prepreg for PCB and copper-clad plate for PCB |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101461070A (en) * | 2006-06-02 | 2009-06-17 | 日立化成工业株式会社 | Package for mounting optical semiconductor element and optical semiconductor device employing the same |
| WO2010026716A1 (en) * | 2008-09-03 | 2010-03-11 | 日亜化学工業株式会社 | Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW257779B (en) * | 1992-12-09 | 1995-09-21 | Shell Internat Res Schappej Bv | |
| JP5176144B2 (en) * | 2007-08-22 | 2013-04-03 | 日立化成株式会社 | Thermosetting light reflecting resin composition, substrate for mounting optical semiconductor using the same, method for manufacturing the same, and optical semiconductor device |
| JP5540487B2 (en) * | 2007-09-25 | 2014-07-02 | 日立化成株式会社 | Thermosetting light reflecting resin composition, optical semiconductor element mounting substrate using the same, method for producing the same, and optical semiconductor device |
-
2012
- 2012-05-15 CN CN201610091323.5A patent/CN105820315A/en active Pending
- 2012-05-15 CN CN201280024015.0A patent/CN103562290A/en active Pending
- 2012-05-15 WO PCT/KR2012/003792 patent/WO2012157938A2/en active Application Filing
- 2012-05-15 JP JP2014511293A patent/JP2014517110A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101461070A (en) * | 2006-06-02 | 2009-06-17 | 日立化成工业株式会社 | Package for mounting optical semiconductor element and optical semiconductor device employing the same |
| WO2010026716A1 (en) * | 2008-09-03 | 2010-03-11 | 日亜化学工業株式会社 | Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014517110A (en) | 2014-07-17 |
| CN103562290A (en) | 2014-02-05 |
| WO2012157938A2 (en) | 2012-11-22 |
| WO2012157938A3 (en) | 2013-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI488900B (en) | Thermosetting light reflective resin composition, optical semiconductor mounting substrate using the resin composition, and optical semiconductor device | |
| TWI466339B (en) | Light emitting device | |
| JP5176144B2 (en) | Thermosetting light reflecting resin composition, substrate for mounting optical semiconductor using the same, method for manufacturing the same, and optical semiconductor device | |
| TW201329129A (en) | Composition for transfer molding | |
| JP5672318B2 (en) | Manufacturing method of optical semiconductor device | |
| JP2010242095A (en) | Thermosetting molding material | |
| JP5359349B2 (en) | Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element, method for manufacturing the same, and optical semiconductor device | |
| JP2011230050A (en) | Screen for resin material-grinding machine, and method for grinding resin material | |
| JP5942445B2 (en) | Thermosetting resin composition for light reflection, optical semiconductor element mounting substrate using the same, manufacturing method thereof, and optical semiconductor device | |
| KR101092015B1 (en) | Thermosetting resin composition for light reflection, process for producing the same, substrate made therefrom for photosemiconductor element mounting, and photosemiconductor device | |
| JP5624091B2 (en) | Method for manufacturing photocoupler device | |
| JP2010254919A (en) | Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element using the same and manufacturing method thereof, and optical semiconductor device | |
| CN105820315A (en) | Thermosetting light-reflective resin composition, method for preparing the same, optical semiconductor element-mounted reflector, and optical semiconductor device | |
| JP2017103470A (en) | Board for mounting optical semiconductor element and manufacturing method therefor, and optical semiconductor device | |
| JP2009246334A (en) | Thermosetting resin composition for light reflection, substrate for loading photosemiconductor device and manufacturing method therefor, and photosemiconductor device | |
| JP2010189553A (en) | Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element, manufacturing method thereof, and optical semiconductor apparatus | |
| JP5936804B2 (en) | Thermosetting resin composition, substrate for mounting optical semiconductor element, manufacturing method thereof, and optical semiconductor device | |
| JP3795491B2 (en) | Resin composition for optical semiconductor encapsulation and optical semiconductor device | |
| JP5644831B2 (en) | Reflector manufacturing method and LED device | |
| JP2012162729A (en) | Thermosetting resin composition for optical reflection, substrate for mounting optical semiconductor element using the same and production method therefor, and optical semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160803 |