CN105810622A - 一种柔性传动装置及其传动控制方法 - Google Patents
一种柔性传动装置及其传动控制方法 Download PDFInfo
- Publication number
- CN105810622A CN105810622A CN201610298764.2A CN201610298764A CN105810622A CN 105810622 A CN105810622 A CN 105810622A CN 201610298764 A CN201610298764 A CN 201610298764A CN 105810622 A CN105810622 A CN 105810622A
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- Prior art keywords
- coil paper
- antivibrator
- motors
- single motor
- power transmission
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- Granted
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims description 11
- 238000007639 printing Methods 0.000 claims description 20
- 230000009471 action Effects 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 13
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 230000006872 improvement Effects 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Automation & Control Theory (AREA)
- Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
- Advancing Webs (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610298764.2A CN105810622B (zh) | 2016-05-06 | 2016-05-06 | 一种柔性传动装置及其传动控制方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610298764.2A CN105810622B (zh) | 2016-05-06 | 2016-05-06 | 一种柔性传动装置及其传动控制方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105810622A true CN105810622A (zh) | 2016-07-27 |
CN105810622B CN105810622B (zh) | 2019-03-08 |
Family
ID=56456557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610298764.2A Active CN105810622B (zh) | 2016-05-06 | 2016-05-06 | 一种柔性传动装置及其传动控制方法 |
Country Status (1)
Country | Link |
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CN (1) | CN105810622B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107680927A (zh) * | 2017-10-23 | 2018-02-09 | 苏州迈为科技股份有限公司 | 一种卷纸传片装置及控制方法 |
CN110962442A (zh) * | 2019-12-29 | 2020-04-07 | 苏州辰锦智能科技有限公司 | 卷纸式硅片传输装置、硅片传输方法、转盘及丝网印刷机 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201222489Y (zh) * | 2008-05-20 | 2009-04-15 | 东莞市镶阳电子厂 | 邦定机旋转轴驱动装置 |
CN201436203U (zh) * | 2009-06-10 | 2010-04-07 | 青岛美光机械有限公司 | 具有制动功能的模切机输纸系统 |
CN101863159A (zh) * | 2009-04-15 | 2010-10-20 | 昆山乐美文具有限公司 | 热转印机卷膜系统 |
CN201873332U (zh) * | 2010-10-14 | 2011-06-22 | 吴江迈为技术有限公司 | 一种太阳能电池片的传送装置 |
CN205645779U (zh) * | 2016-05-06 | 2016-10-12 | 东莞市科隆威自动化设备有限公司 | 一种柔性传动装置 |
-
2016
- 2016-05-06 CN CN201610298764.2A patent/CN105810622B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201222489Y (zh) * | 2008-05-20 | 2009-04-15 | 东莞市镶阳电子厂 | 邦定机旋转轴驱动装置 |
CN101863159A (zh) * | 2009-04-15 | 2010-10-20 | 昆山乐美文具有限公司 | 热转印机卷膜系统 |
CN201436203U (zh) * | 2009-06-10 | 2010-04-07 | 青岛美光机械有限公司 | 具有制动功能的模切机输纸系统 |
CN201873332U (zh) * | 2010-10-14 | 2011-06-22 | 吴江迈为技术有限公司 | 一种太阳能电池片的传送装置 |
CN205645779U (zh) * | 2016-05-06 | 2016-10-12 | 东莞市科隆威自动化设备有限公司 | 一种柔性传动装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107680927A (zh) * | 2017-10-23 | 2018-02-09 | 苏州迈为科技股份有限公司 | 一种卷纸传片装置及控制方法 |
CN110962442A (zh) * | 2019-12-29 | 2020-04-07 | 苏州辰锦智能科技有限公司 | 卷纸式硅片传输装置、硅片传输方法、转盘及丝网印刷机 |
CN110962442B (zh) * | 2019-12-29 | 2024-01-23 | 连城凯克斯科技有限公司 | 卷纸式硅片传输装置、硅片传输方法、转盘及丝网印刷机 |
Also Published As
Publication number | Publication date |
---|---|
CN105810622B (zh) | 2019-03-08 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Flexible transmission device and transmission control method thereof Effective date of registration: 20190507 Granted publication date: 20190308 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: Dongguan Folungwin Automatic Equipment Co., Ltd. Registration number: 2019440000170 |
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Address after: 523000 Building 2, 11 Jinfu West Road, Tangchun, Liaobu Town, Dongguan City, Guangdong Province Patentee after: Guangdong kelongwei Intelligent Equipment Co.,Ltd. Address before: Shi Bu Cun Shi Da Lu, Liaobu Town, Dongguan City, Guangdong Province Patentee before: FOLUNGWIN AUTOMATIC EQUIPMENT Co.,Ltd. |
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Date of cancellation: 20210526 Granted publication date: 20190308 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: FOLUNGWIN AUTOMATIC EQUIPMENT Co.,Ltd. Registration number: 2019440000170 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |