CN105799340B - Light irradiation device - Google Patents
Light irradiation device Download PDFInfo
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- CN105799340B CN105799340B CN201610134223.6A CN201610134223A CN105799340B CN 105799340 B CN105799340 B CN 105799340B CN 201610134223 A CN201610134223 A CN 201610134223A CN 105799340 B CN105799340 B CN 105799340B
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- light
- pedestal
- irradiation device
- emitting diode
- diode led
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 102
- 238000001816 cooling Methods 0.000 claims abstract description 94
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 230000017525 heat dissipation Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000976 ink Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 210000004209 hair Anatomy 0.000 description 4
- 206010037660 Pyrexia Diseases 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000511976 Hoya Species 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
- B41J11/00214—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Ink Jet (AREA)
- Coating Apparatus (AREA)
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
Abstract
The present invention provides a kind of frivolous and light weight light irradiation device, has：Substrate；Multiple Light-emitting diode LED light sources, are arranged by appointed interval on a surface of a substrate；Radiating component, it from the back side of substrate by extending out to assigned direction and to heat is diffused caused by Light-emitting diode LED light source pedestal, and it is located at the one side of pedestal and groups of fins with the multiple fins for being arranged on prescribed direction on pedestal and cooling fin at offering through hole；Light-emitting diode LED driving circuit drives the multiple Light-emitting diode LED light sources being mounted on the base；Shell, while it stores radiating component and Light-emitting diode LED driving circuit, it is formed with the air-flow flowing space, the air-flow flowing space includes surrounding the wind-tunnel of multiple fins, it is connected to the air passage formed with through hole on cooling fin by through hole on pedestal, and surrounds the space of Light-emitting diode LED driving circuit；Cooling fan is directed outside air into wind-tunnel, air passage and space.
Description
It is 2015 that the application, which is the applying date that applicant HOYA Guande KK submits to State Intellectual Property Office,
On April 3, in, application No. is the divisional applications of the application for a patent for invention of 201510157968.X, entitled light irradiation device.
Technical field
The present invention relates to it is a kind of its have Light-emitting diode LED (Light Emitting Diode) as light source,
And irradiate the light irradiation device of linear light, more particularly to a kind of heat dissipation structure having the heat for distributing Light-emitting diode LED generation
The light irradiation device of part.
Background technology
In the past, the printing equipment printed using cured ultraviolet ink is carried out by ultraviolet light widely people
Know.This printing equipment is that ink is sprayed on medium from the nozzle of nozzle, is then irradiated to the specking being formed on medium purple
Outer light.By ultraviolet light, specking cures and is fixed on medium, so can also have very for the medium for being not easy to absorb liquid
Good printing effect.This printing equipment, for example, on the books in patent document 1.
Recorded printing equipment, has in patent document 1：Convey the supply unit of printed medium；In conveying direction
On be arranged in order, and spray 6 nozzles of dark green, carmetta, yellow, black, the colored inks such as orange, green respectively；Match
Set that the transporting direction downstream side between each nozzle, so that each nozzle is sprayed on the dotted ink on printed medium temporary fixing (pegging)
6 temporary fixing use irradiation portion；Dotted ink is fully cured and is fixed on being fully cured on printed medium and uses irradiation portion.
Printing equipment as recorded in Patent Document 1, by by dotted ink it is temporary fixing, consolidating for the two stages is fully cured
Change, it is suppressed that the diffusion interpenetrated with specking between colored ink.
In patent document 1 it is recorded it is temporary fixing use irradiation portion, be disposed on the top of printed medium, and be situated between in printing
Irradiating ultraviolet light in matter, i.e., so-called UV curing apparatus, linear ultraviolet light is irradiated in the width direction of printed medium.
In order to correspond to lightweight and the densification of printing equipment itself, made using Light-emitting diode LED in temporary fixing use in irradiation portion
For light source, it is arranged multiple Light-emitting diode LED along the width direction of printed medium.
Prior art patent document
Patent document 1：Japanese invention patent 2013-252720 bulletins.
Invention content
The technical problem to be solved in the present invention：
As recorded in Patent Document 1 is temporary fixing such with irradiation portion, is used using Light-emitting diode LED as light source
When, it has following problem and generates：Have in input electricity it is a greater part of can all be changed into heat, so Light-emitting diode LED sheet
The heat of body sent out can reduce luminous efficiency and service life.In addition, this problem, such as temporary fixing to use irradiation portion, if it is carrying
In the case of multiple Light-emitting diode LED devices, due to the Light-emitting diode LED quantity increase as heat source, it will cause
More serious problem.Therefore, the cooling knot such as cooling fin as in the light irradiation device of light source, generally can all used using LED
Structure (radiating component) come inhibit Light-emitting diode LED generate heat structure.
It is effective using radiating components such as cooling fins to inhibit the fever of Light-emitting diode LED.But in order to
More effectively Light-emitting diode LED is made to radiate, need the surface area for expanding radiating component as possible, and once expand radiating component, just
There is a problem of that device is integrally excessive.Especially as temporary fixing with irradiation portion in patent document 1, configuration is in each nozzle
Between light irradiation device if using large-scale radiating component, just having to expand the distance between each nozzle, cause therefrom
Printing equipment itself it is re-quantization and enlarged, will be as more serious problem.
In addition, in the light irradiation device that Light-emitting diode LED is used as light source, when for Light-emitting diode LED
When the driving circuit of offer electric current necessitates, the driving circuit also has the semiconductor portions such as triode or Integrated circuit IC
Part also will appear the problem that must be effectively cooled down by fever.
The present invention exactly in view of the foregoing, to provide a kind of effective cooling Light-emitting diode LED and cooling simultaneously send out
For the purpose of frivolous and light weight the light irradiation device of optical diode LED drive circuit.
The technical solution adopted by the present invention is：
In order to achieve the above object, light irradiation device of the invention be one kind on shadow surface, upwardly extended in the 1st side,
And on 2nd direction orthogonal thereto with the 1st direction, the light irradiation device of the linear light with specified line width is irradiated, is had：Base
Plate, it is substantially parallel with the 1st direction and the 2nd direction；Multiple Light-emitting diode LED (Light Emitting Diode) light sources,
It is arranged in each appointed interval along the 1st direction on a surface of a substrate, orthogonal thereto with the 1st direction and the 2nd direction
The 3rd direction on project light；Radiating component, by extending out to assigned direction from the back side of substrate and to Light-emitting diode LED light
The pedestal for the plate that heat caused by source is diffused and the vertical one side for being built up in pedestal and with being arranged on designated parties
To multiple fins groups of fins at offering through hole on the pedestal and cooling fin；Light-emitting diode LED driving electricity
Road is mounted on the another side of pedestal, drives multiple Light-emitting diode LED light sources；Shell, store the radiating component and
While the Light-emitting diode LED driving circuit, and it is formed with the air-flow flowing space, the air-flow flowing space includes described in encirclement
The wind-tunnel of multiple fins is connected to the air passage formed, and packet with the through hole on cooling fin by the through hole on the pedestal
Enclose the space of the Light-emitting diode LED driving circuit；Cooling fan is directed outside air into the wind-tunnel, the air passage
And in the space, and generate in the wind-tunnel, the air passage and space the air-flow of the assigned direction.
It is that pedestal and cooling fin only extend the structure of assigned direction, therefore can realize the light of light and thin type according to this configuration,
Irradiation unit.Because generating air-flow in wind-tunnel, air passage and space by cooling fan, so not only configuring in wind-tunnel
Radiating component is cooled, configures the Light-emitting diode LED driving circuit in space and is also cooled simultaneously.
Moreover it is preferred that through hole in the position close to base substrate along the 1st multiple formation in direction.
In addition, may be configured as：Pedestal and another side in it is at least arbitrary while, opposite assigned direction tilts,
Cross-sectional area perpendicular to the cross section of pedestal assigned direction is reduced with separate along assigned direction from substrate.
In addition, the light irradiation device can be constituted as follows：The one side of pedestal relative to assigned direction tilt, fin with
The reduction of pedestal cross-sectional area, correspondingly becomes larger along assigned direction.According to this configuration, formed respective seat one side inclination and
The larger fin of surface area, therefore radiating efficiency also becomes higher.In addition, in this case, being distributed by pedestal and cooling fin
Heat dissipation capacity, by along assigned direction it is approximately fixed in a manner of and constituted.
In addition, the light irradiation device can be constituted as follows：The another side of pedestal is to be parallel to the 1st direction and designated parties
To plane, it is approximately fixed in a specified direction from the plane to the distance of fin front end.
In addition, the light irradiation device can be constituted as follows：The another side of pedestal is tilted relative to assigned direction, pedestal
The plane for being parallel to the 1st direction and assigned direction on one side, from the plane to the distance of fin front end, in a specified direction greatly
It causes to fix.
Moreover it is preferred that fin is divided into multiple and is formed in a specified direction.
Moreover it is preferred that assigned direction be with the 3rd side in the opposite direction.
Moreover it is preferred that the thermal conductivity of pedestal is higher than the thermal conductivity of cooling fin.In addition, in this case, it is preferable that
Pedestal is made of copper, and cooling fin is made of aluminum.According to this structure, be formed as heat dissipation effect height, and the cooling fin of light weight.
It is sandwiched between pedestal and cooling fin further, it is also possible to have, the heat of pedestal is conducted to the height of cooling fin
Heat-conducting plate.
Moreover it is preferred that each Light-emitting diode LED light source has multiple Light-emitting diode LED elements.
Moreover it is preferred that light is the light for including the wavelength for acting on ultraviolet curable resin.
Advantageous effect of the invention：
As described above, according to the present invention, a kind of effective cooling Light-emitting diode LED of realization and Light-emitting diode LED are driven
While dynamic circuit, frivolous and light weight light irradiation device.
Description of the drawings
Fig. 1 is the outside drawing of the light irradiation device involved by embodiments of the present invention.
Fig. 2 is the figure for the internal structure for illustrating the light irradiation device involved by embodiments of the present invention.
Fig. 3 is the figure for the understructure for illustrating the light irradiation device involved by embodiments of the present invention.
Fig. 4 is the figure for the heat radiating fin structure for illustrating the light irradiation device involved by embodiments of the present invention.
Fig. 5 is the figure of the structure for the radiating component for illustrating the light irradiation device involved by embodiments of the present invention.
Fig. 6 is generated in the radiating component and shell for illustrate the light irradiation device involved by embodiments of the present invention
The ideograph of relationship between air-flow.
Fig. 7 is the pass between the radiating component and heat dissipation capacity for illustrating the light irradiation device involved by embodiments of the present invention
The ideograph of system.
Fig. 8 is the figure for the variation for illustrating the light irradiation device involved by embodiments of the present invention.
In figure：
1 light irradiation device
100 shells
102 air inlets
105 window portions
110 exhaust fans
200 light source units
205 substrates
210 Light-emitting diode LED elements
215 Light-emitting diode LED driving circuits
300 control base boards
400 radiating components
410 pedestals
430 cooling fins
Above 414a
Below 414b
434a bearing surfaces
434b fin forming faces
Specific implementation mode
In the following, being described in further detail to embodiments of the present invention in conjunction with attached drawing.Also, it is identical or corresponding in figure
The identical sign flag in position, illustrate to be not repeated.
Fig. 1 is the outside drawing of the light irradiation device 1 involved by embodiments of the present invention, and Fig. 1 (a) is the implementation of the present invention
The plan view of light irradiation device 1 involved by mode.In addition, Fig. 1 (b) is the right hand view of the light irradiation device 1 of Fig. 1 (a), figure
1 (c) is the ground plan of the light irradiation device 1 of Fig. 1 (a), and Fig. 1 (d) is the front elevation of the light irradiation device 1 of Fig. 1 (a).This implementation
The light irradiation device 1 of mode is that one kind is loaded on printing equipment, keeps ultraviolet curable ink or ultraviolet curable resin solid
The light supply apparatus of change is configured in the top of object to be illuminated, and object relatively to be illuminated projects linear ultraviolet light.Also, in this theory
In bright book, as shown in the coordinate of Fig. 1, aftermentioned Light-emitting diode LED (Light Emitting Diode) element 210 is projected into purple
The direction of outer light is defined as X-direction, the orientation of Light-emitting diode LED element 210 is defined as Y direction, and will
Orthogonal thereto direction is defined as Z-direction and illustrates with X-direction and Y direction.
Fig. 2 is the figure for the internal structure for illustrating the light irradiation device 1 involved by embodiments of the present invention.Fig. 2 (a) is to bow
Depending on plane perspective view when light irradiation device 1.In addition, Fig. 2 (b) is side perspective when watching light irradiation device 1 from right side
Figure.In addition, Fig. 2 (c) is front perspective view when being viewed from the front light irradiation device 1.
As depicted in figs. 1 and 2, the light irradiation device 1 of present embodiment has：200 He of light source unit is stored in inside
The shell 100 (shell) of the ultra-thin box-shaped of radiating component 400 etc.；The glass system of ultraviolet light is projected before shell 100
Window portion 105；It is located at the back side of shell 100,3 exhaust fans 110 of the air in shell 100 are discharged.In addition, in shell 100
Bottom surface, the air inlet 102 of sucking extraneous air is formed in shell 100.
The light irradiation device 1 of present embodiment, has inside shell 100：4 light source units 200, control base boards
300, radiating component 400 etc..
Shown in such as Fig. 2 (a) and (c), 4 light source units 200 are close to arrange and be accommodated in shell 100 along Y direction.
Each light source unit 200 has：It is parallel to the rectangular substrate 205 of Y direction and Z-direction；4 hairs with the same characteristics
Optical diode LED element 210；Drive the Light-emitting diode LED driving circuit 215 of 4 Light-emitting diode LED elements 210.
4 Light-emitting diode LED elements 210 in the state that optical axis is aligned in the X-axis direction, in the Y-axis direction every
It is in an in-line configuration on the surface of substrate 205 to open appointed interval, and is electrically connected with substrate 205.Substrate 205 is formed as, pass through by
It is placed in the cable (not shown) of Light-emitting diode LED driving circuit 215 on 414a above aftermentioned pedestal 410, connects each hair
Optical diode LED element 210 supplies the driving current for coming from Light-emitting diode LED driving circuit 215 by substrate 205.One
Denier supplies driving current to each Light-emitting diode LED element 210, then projects driving current from each Light-emitting diode LED element 210
The ultraviolet light of corresponding light quantity projects the linear ultraviolet light for being parallel to Y direction from each light source unit 200.Also, for this
Each Light-emitting diode LED element 210 of embodiment can the roughly the same ultraviolet light of quantity of light emission, to being supplied to each light-emitting diodes
The driving current of pipe LED element 210 is adjusted, the linear ultraviolet light projected from each light source unit 200, in the Y-axis direction
With substantially uniform light quantity distribution.Also, as described above, 4 light source units 200 of present embodiment, because along Y direction
It is close to arrange, so from the ultraviolet light that each light source unit 200 projects, with the ultraviolet light from the adjacent injection of light source unit 200 in Y
It overlaps in axis direction, on the whole (that is, from 4 light source units 200), extends in the Y-axis direction, have in the Z-axis direction specified
The linear ultraviolet light of line width is projected by window portion 105.Also, each Light-emitting diode LED element 210 of present embodiment, has
There are multiple (such as 4) that there is the Light-emitting diode LED chip (not shown) of generally square light-emitting surface, receives to carry out self-luminous
The driving current of diode (LED) driving circuit 215 projects the ultraviolet light of wavelength 365nm.
While control base board 300 is a kind of Light-emitting diode LED driving circuit 215 controlling each light source unit 200,
Control the whole circuit board of light irradiation device 1.Control base board 300 is that user is defeated by user interface (not shown) reception
Enter signal, realize ON/OFF control and the brightness control of each light source unit 200, and failure letter is output to the outside by user interface
Breath.
Radiating component 400 is a kind of component that the heat distributed to 4 light source units 200 radiates.This embodiment party
The radiating component 400 of formula is close to the back side of the substrate 205 of each light source unit 200 and is configured, by conducting each Light-emitting diode LED
The pedestal 410 for the heat that element 210 is distributed and it is close to pedestal 410 to configure and radiate to the heat of pedestal 410
Cooling fin 430 constitutes (Fig. 2 (b)).
Fig. 3 is the figure for the structure for illustrating pedestal 410, and Fig. 3 (a) is the plan view of pedestal 410.In addition, Fig. 3 (b) is to use Fig. 3
(a) sectional view that line A-A is cut off.In addition, Fig. 3 (c) is the front elevation of pedestal 410.
Fig. 4 is the figure for the structure for illustrating cooling fin 430, and Fig. 4 (a) is the plan view of cooling fin 430.In addition, Fig. 4 (b) is
The sectional view cut off with the line B-B of Fig. 4 (a).Fig. 4 (c) is the front elevation of cooling fin 430.In addition, Fig. 4 (d) is cooling fin
430 ground plan, Fig. 4 (e) are the back views of cooling fin 430.
Fig. 5 is the figure for illustrating to be combined the structure of the radiating component 400 constituted by pedestal 410 and cooling fin 430.Fig. 5 (a) is
The plan view of radiating component 400.In addition, Fig. 5 (b) is the sectional view cut off with the line C-C of Fig. 5 (a), Fig. 5 (c) is heat dissipation
The front elevation of component 400.In addition, Fig. 5 (d) is the ground plan of radiating component 400, Fig. 5 (e) is the back view of radiating component 400.
Pedestal 410 is a kind of by copper (thermal conductivity：4.01 (W/cmK), proportion：8.96(g/cm3)) processing is formed
Component afterwards, as shown in figure 3, it has the substrate support 412 for the substrate 205 for placing each light source 200, from substrate support
412 extend to the heat-conduction part 414 of X-direction negative side.Substrate support 412, in the square for being parallel to Y direction and Z-direction
The shape of shape plate, the substrate 205 of each light source unit 200, which is tightly attached on positive 412a, to be placed and fixes (Fig. 3 (c), Fig. 2 (b)).
Therefore, heat caused by each Light-emitting diode LED element 210, is reached by substrate 205 on pedestal 410, and reach heat transfer
Portion 414.
As shown in Fig. 3 (b), heat-conduction part 414 has：The tapered plate-like shape in cross section, and be parallel to X-direction and
The upper surface of Y direction 414a and relative to 414a above (that is, relative to X-direction) by specified angle tilt after below
414b.That is, the heat-conduction part 414 of present embodiment is configured to：The substrate support 412 of substrate 205 is placed apart from X-axis
Direction is remoter, and plate thickness is just got thinner (that is, the distance between 414a and following 414b above) (that is, being parallel to Y direction and Z
The cross-sectional area of the cross section of axis direction tapers into).As described above, in the present embodiment, due to overstriking heat-conduction part
414 base end part side (substrate-side), therefore heat conveying capacity is improved, and then effectively produced each Light-emitting diode LED element 210
Raw heat is delivered to the front end of heat-conduction part 414.Although also, from the angle of heat conveying capacity it is also contemplated that by heat-conduction part
414 whole overstrikings, but because in heat-conduction part 414 (that is, pedestal 410), the heavier copper of proportion being used, in present embodiment
In, volume is reduced by using conical by its shape, to reduce the increase of weight.Further, it is also possible to by by heat-conduction part 414
Tapered form is made, space is formed between heat-conduction part 414 and shell 100, in order to increase aftermentioned radiating fin 440
The mode of size is constituted.
In the upper surface of heat-conduction part 414 414a, it is formed with the fixed Light-emitting diode LED for supporting each light source unit 200 and drives
Multiple protrusion 414c of dynamic circuit 215.It is penetrated through to following 414b's in addition, being formed with from the upper surface of heat-conduction part 414 414a
Multiple through hole 414d.Through hole 414d is inserted into the spiral shell of the screw (not shown) for firm banking 410 and cooling fin 430
Wire hole.In addition, in heat-conduction part 414, it is formed with from the upper surface of heat-conduction part 414 414a and penetrates through to multiple through holes of 414b
414e.In detail as described later, through hole 414e is formed with air passage, will be sucked into from outside below heat-conduction part 414
The air of the sides 414b is sent to the sides 414a above.In addition, from 414b below heat-conduction part 414, protrudes and cooling fin 430 is carried out
The positioning pin 415 of positioning.
Cooling fin 430 is a kind of by aluminium (thermal conductivity：2.37 (W/cmK), proportion：2.70(g/cm3)) be formed plus
Component after work.As shown in Figures 4 and 5, have：The fitting portion 432 of the substrate support 412 of embedded pedestal 410, from embedding
Conjunction portion 432 extends out to rear (X-direction negative side), the interconnecting piece 434 being connected with pedestal 410.Such as Fig. 4 (b) and (c) institute
Show, fitting portion 432 have be parallel to Y direction and Z-direction rectangular plate-like plate-like portion 432a, from plate-like portion 432a just
Face protrudes from X-direction positive side and extends to a pair of of protruding portion 432b of Y direction, and its cross section is in U-shaped.In addition, plate
Shape portion 432a is formed with when being watched from X-direction the opening 432c of shape in the form of a substantially rectangular.Opening 432c is combination 410 He of pedestal
When cooling fin 430, for pedestal 410 heat-conduction part 414 by opening.
Interconnecting piece 434, the shape of rectangular plate have and pedestal after combination pedestal 410 and cooling fin 430
Bearing surface 434a opposite 414b and the forming face 434b of multiple radiating fins 440 is formd below 410.Such as Fig. 4 (b)
Shown, the interconnecting piece 434 of present embodiment is tilted in angle identical with 414b below pedestal 410 relative to X-direction,
After pedestal 410 is combined with cooling fin 430, it is close to below pedestal 410 in a manner of 414b by the bearing surface 434a of interconnecting piece 434
It constitutes.Therefore, when pedestal 410 is combined with cooling fin 430, the heat of pedestal 410 can reach on cooling fin 430.
Radiating fin 440, by from the fin forming face 434b of interconnecting piece 434 to Z-direction it is outstanding in a manner of vertically set up,
And the heat for reaching cooling fin 430 is dissipated in air.Also, in detail as described later, in the present embodiment, pass through exhaust fan
110 by extraneous air suction casing 100, and the air-flow by generating X-direction makes the air being inhaled into radiating fin 440
Surface flow, radiating fin 440 are extended in the mode extended in X-direction.In addition, such as Fig. 4 (b), (d) and (e) shown, this reality
The radiating fin 440 for applying mode is divided into multiple (4) and is formed in the X-axis direction.In addition, the protrusion of radiating fin 440
It measures (size of radiating fin 440), becomes larger according to separate along X-direction from fitting portion 432, to improve cooling effect.
Shown in such as Fig. 4 (a) and (c), on the bearing surface 434a of interconnecting piece 434, it is formed with the positioning pin for cooling fin 430
The embeded slot 435 of 415 insertions.In addition, on interconnecting piece 434, it is formed with multiple spiral shells of firm banking 410 and cooling fin 430
Wire hole 434c.In addition, on interconnecting piece 434, be formed with penetrated through from the bearing surface 434a of interconnecting piece 434 it is more to forming face 434b
A through hole 434d.Also, after pedestal 410 is combined with cooling fin 430, through hole 414d and the cooling fin 430 of pedestal 410
Screw hole 434c connections, the through hole 414e of pedestal 410 are connected to (Fig. 5 (a), (b)) with the through hole 434d of cooling fin 430.
When being assembled to the radiating component 400 being composed of pedestal 410 and cooling fin 430, in cooling fin 430
The heat-conduction part 414 of opening 432c inserted bases 410, and pedestal 410 is pressed into X-direction negative side relative to cooling fin 430,
The substrate support 412 (Fig. 5) of embedded pedestal 410 on the fitting portion 432 of cooling fin 430.Also, positioning pin 415 is embedded in embedding
It closes in slot 435 and pedestal 410 and cooling fin 430 is positioned, so that 414b and cooling fin 430 support below pedestal 410
Junction 434a is close to.In addition, in this state, being tightened in screw hole 434c by through hole 414d.Pedestal 410 as a result,
It is completely fixed with cooling fin 430, radiating component 400 is completed.
As described above, in the present embodiment, the plate thickness of heat-conduction part 414, from the substrate support for placing substrate 205
412 the leave X-direction the remote then thinner, and heat caused by Light-emitting diode LED element 210 is delivered to X-direction negative side
While, by making larger space on X-direction negative side, and form larger radiating fin 440 as possible in the space,
Form the radiating component 400 with high efficiency and heat radiation effect.In addition, the copper pedestal 410 and thermal conductivity high by combining thermal conductivity
The aluminum thermal fin 430 that rate is slightly weaker than copper but proportion is lighter than copper constitutes radiating component 400, therefore radiating component 400 is than whole
It is light when being made of copper, and than it is integrally made of aluminum when radiating efficiency it is high.In addition, as described above, present embodiment
Radiating component 400, along X-direction, rearward (that is, X-direction negative side) extends, the structure by not prominent Y direction and Z-direction
At.Therefore, the size of the Y direction and Z-direction of light irradiation device 1 can control minimum.
Secondly, the cooling effect of the radiating component 400 of present embodiment is illustrated.Fig. 6 be to radiating component 400 with
The ideograph that the relationship of generated air-flow illustrates in shell 100.In addition, Fig. 7 be to radiating component 400 and heat dissipation capacity it
Between the ideograph that illustrates of relationship.
Shown in Fig. 6, the light irradiation device 1 of present embodiment has 3 exhaust fans 110 at the back side of shell 100.In addition,
The bottom surface of shell 100 is formed with the air inlet 102 of sucking extraneous air in shell 100.Therefore, exhaust fan 110 1 rotates,
Extraneous air is sucked from air inlet 102, the air in shell 100 is discharged from exhaust fan 110.Therefore, in shell 100, Fig. 6
In, air-flow that generation is indicated with solid arrow.That is, the air in shell 100 is sucked into from air inlet 102, in quilt
It is flowed along X-direction in the space (that is, space equipped with radiating fin 440) that cooling fin 430 and shell 100 surround.Therefore, by
Each Light-emitting diode LED element 210 generates, and the heat for reaching by substrate 205 and pedestal 410 cooling fin 430 (in Fig. 6, is used
Dotted arrow indicates), it is dissipated in air by radiating fin 440.In this way, in the present embodiment, with shell 100 and heat dissipation
Piece 430 constitutes a kind of wind-tunnel, and by limiting the space of air-flow flowing, cooling is effectively performed.
In addition, in the present embodiment, the through hole 414e of pedestal 410 is connected to the through hole 434d of cooling fin 430, shape
At have for be inhaled into air in shell 100 by air passage.Therefore, the air being inhaled into shell 100, by passing through
Through-hole 434d and through hole 414e, also by the space of the sides the upper surface of heat-conduction part 414 414a.Therefore, according to the present embodiment
Structure, configuring LED drive circuit 215 and control base board 300 in the sides the upper surface of heat-conduction part 414 414a can also carry out
It is cooling.
In addition, as shown in fig. 7, the heat-conduction part 414 of the radiating component 400 of present embodiment, with from placing substrate
For 205 substrate support 412 far from X-direction, plate thickness (that is, the distance between 414a and following 414b above) meeting is thinning (i.e.
The cross-sectional area of the cross section vertical with X-direction tapers into) mode constitute.Also, become by heat-conduction part 414
It is thin and in the space that obtains, the radiating fin 440 become larger along X-direction is formed with, with from the upper surface of pedestal 410 414a
Distance to the front end of radiating fin 440 is constituted in mode approximately fixed in the X-axis direction.
Here, the thermal resistance as considered pedestal 410, by the heat of pedestal 410 (that is, all Light-emitting diode LED elements
Heat caused by 210) Q1 (W), each light source unit 200 substrate 205 temperature (that is, temperature of substrate support 412) and
The temperature difference Δ T (DEG C) of cooling fin 430, the thermal resistance R (DEG C/W) of pedestal 410, pedestal 410 length (that is, heat-conduction part 414
Length) L (m), pedestal 410 cross-sectional area (that is, cross-sectional area of heat-conduction part 414) A (m2), the thermal conductivity of pedestal 410
The relationship of rate λ (W/m DEG C) can be indicated by following formula (1) and formula (2).
Q1 (W)=Δ T (DEG C)/R (DEG C/W) (1)
R (DEG C/W)=L (m)/(A (m2)×λ(W/m℃) (2)
As described above, heat caused by Light-emitting diode LED element 210, passes from the substrate support 412 of pedestal 410
To heat-conduction part 414, further spread to the front end side of heat-conduction part 414 (X-direction negative side), because passing through cooling fin
430 radiating fin 440 is rejected heat to from the air that air inlet 102 is inhaled into, thus by pedestal 410 heat Q1 by
Nearly 412 side of substrate support is maximum, is gradually decreased with far from X-direction negative side.Therefore, in the present embodiment, such as
Shown in Fig. 7, it is uniformly dispersed (that is, gradually with separate X-direction negative side along X-direction by the heat Q1 of pedestal 410
Thermal resistance R becomes larger), the cross-sectional area perpendicular to the cross section of the X-direction of heat-conduction part 414 tapers into (that is, heat-conduction part
414 base end part side (substrate-side) is thicker).That is, making below pedestal 410 414b with respect to X-direction by specified angle
It tilts.Also, the sides 414b ensure the adequate space needed for radiating fin 440 below pedestal 410 as a result,.
Specifically, as shown in fig. 7, the heat-conduction part 414 of present embodiment, has the length of about 80mm in X-direction
Degree, it is assumed that heat Q1 caused by all Light-emitting diode LED elements 210 is 200 (W), in order to make the X of heat-conduction part 414
The heat dissipation capacity of axis direction each position respectively impartial (25 (W)), will be each when cut-out heat-conduction part 414 per 10mm along X-direction
The ratio of the cross-sectional area of cross section, from be set as 1.00 successively close to the side of substrate support 412,0.85,0.72,
0.61、0.52、0.44、0.38、0.32。
Secondly, such as consider the heat dissipation capacity of cooling fin 430, the heat flow Q2 (W) of cooling fin 430, the coefficient of overall heat transmission of cooling fin 430
α(W/m2DEG C), the surface area B (m of cooling fin 4302), the temperature of the temperature of cooling fin 430 and the air being inhaled into from air inlet 102
The relationship between difference Δ T (DEG C) is spent, can be indicated by following formula (3).
Q2 (W)=α (W/m2℃)×B(m2)×ΔT(℃) (3)
As shown in fig. 6, in the present embodiment, being configured to：In base end side (the Light-emitting diode LED element of cooling fin 430
210 sides) below be formed with air inlet 102, by be inhaled into the air in shell 100 from air inlet 102 cool down heat dissipation
The radiating fin 440 of piece 430.Here, the air in shell 100 is sucked into from air inlet 102, by cooling fin 430 and shell
It is flowed along X-direction in the space (that is, space equipped with radiating fin 440) that body 100 is surrounded, therefore cooling radiating fin
440 air themperature, it is low in the base end side (210 side of Light-emitting diode LED element) of cooling fin 430, in the front end of cooling fin 430
Side is got higher.That is, the Δ T (DEG C) in formula (3), becomes in the base end side (210 side of Light-emitting diode LED element) of cooling fin 430
Greatly, become smaller in the front end side of cooling fin 430.Therefore, in the present embodiment, due to the surface area B (m of cooling fin 4302) dissipating
The base end side (210 side of Light-emitting diode LED element) of backing 430 becomes smaller, becomes larger in the front end side of cooling fin 430, therefore is formed
For the heat flow Q2 of cooling fin 430 structures impartial in X-direction each position.That is, with radiating fin 440 along X-direction
The mode become larger is constituted.
In this way, in the present embodiment, being configured to：414b inclines relative to X-direction by specified angle below pedestal 410
Tiltedly, radiating fin 440 becomes larger along X-direction, also, is formed as the heat Q1 by pedestal 410 as a result, along X-axis
Direction is evenly dispersed, and the heat flow Q2 of cooling fin 430 is along the evenly dispersed structure of X-direction.
It is above the explanation for combining present embodiment to be made, but the present invention is not limited to above-mentioned composition, in the present invention
Technical thought range in can carry out various modifications.For example, the light irradiation device 1 of present embodiment, although irradiation is purple
The device of outer light, but on the device of irradiation light (such as the visible lights such as white light, infrared light) for irradiating other wavelength regions
It is equally applicable the present invention.
In addition, each Light-emitting diode LED element 210 of present embodiment, although having：Equipped with generally square hair
Multiple Light-emitting diode LED chips of smooth surface, but it is not limited to the structure, for example, Light-emitting diode LED element 20 shines
Diode LED chips can also have the light-emitting surface other than square, in addition, Light-emitting diode LED element 20 or tool
The element of standby 1 or more Light-emitting diode LED chip.
In addition, in the present embodiment, the bearing surface 434a with 414b below pedestal 410 and cooling fin 430 is direct
It is close to face to be illustrated, for example, it is also possible to set between 414b and the bearing surface 434a of cooling fin 430 below pedestal 410
High-termal conductivity graphite flake, or coating silicone grease, further improve the close property of the two.
In addition, in the present embodiment, pedestal 410 and cooling fin 430, to be said as individual component
It is bright, but pedestal 410 can also be integrally formed with cooling fin 430.In addition, in this case, it can also be under pedestal 410
On the 414b of face, the radiating fin 440 made of copper or aluminium is directly formed.
In addition, the radiating component 400 of present embodiment, rear (that is, X-direction negative side) is extended along X-direction, so as not to
It protruding Y direction and Z-direction and constitutes, still, be not limited to such structure, radiating component 400 extends direction,
It can be arbitrary assigned direction (for example, Y direction or Z-direction).Also, in this case, although cooling fin 430
Also assigned direction is extended, but shell 100 can also be set, to form wind-tunnel (that is, covering using shell 100 and cooling fin 430
Cover cooling fin 430).
In addition, in the present embodiment, although by the heat Q1 of pedestal 410 and the edges heat flow Q2 of cooling fin 430
The evenly dispersed structure of X-direction, but if 414b is tilted relative to X-direction below pedestal 410, and radiating fin
440 become larger along X-direction, then can form the radiating component 400 with high efficiency and heat radiation effect, therefore be not not limited to the knot
Structure.In addition, the heat-conduction part 414 of present embodiment, the cross-sectional area of each cross section when often cutting off 10mm along X-direction
Ratio, from close to the side of substrate support 412 sequentially with 1.00,0.85,0.72,0.61,0.52,0.44,0.38,0.32 structure
At, but it is not limited to the structure.
In addition, in the present embodiment, due to the surface area B (m of cooling fin 4302) in the base end side (hair of cooling fin 430
210 side of optical diode LED element) become smaller, become larger (that is, since radiating fin 440 is along X-axis side in the front end side of cooling fin 430
To becoming larger), therefore in X-direction, everybody is set to impartial composition to the heat flow Q2 of cooling fin 430, but it is not limited to the knot
Structure.It, can also be from dissipating for example, in the case that the heat Q1 (W) caused by all Light-emitting diode LED elements 210 is smaller
The base end side of backing 430 forms the radiating fin 440 of identical size by front end side.In addition, in this case, in pedestal 410
Below the sides 414b without expanding space needed for radiating fin 440, therefore also It is not necessary to keep 414b below bottom plate 410 opposite
X-direction tilts.Thus, for example, as shown in figure 8, can also be configured to, 414b below pedestal 410 is substituted for pedestal 410
The upper surface of 414a, make the sides the upper surface of pedestal 410 414a with respect to X-direction tilt, from 414b below pedestal 410 to radiating fin
Distance until 440 front end becomes approximately fixed in the X-axis direction.In addition, from the point of view of heat conveying capacity, heat transfer
The base end part side (substrate-side) in portion 414 can be slightly thicker than front end side, for example, it is also possible to be the upper surface of pedestal 410 414a under
Both face 414b are with respect to the inclined structure of X-direction.
In addition, embodiment of disclosure, is made that illustration, it should be appreciated that the present invention is not limited only in all respects
The embodiment.The scope of the present invention is not limited to above description, be intended to comprising according to shown in claims, with
The intention of Claims scope equalization and all deformations included within the scope of its.
Claims (20)
1. a kind of light irradiation device upwardly extends on shadow surface in the 1st side, and 2nd side orthogonal thereto with the 1st direction
Upwards, irradiation has the linear light of specified line width；
It is characterized in that,
It has：
Substrate, it is parallel with the 1st direction and the 2nd direction；
Multiple Light-emitting diode LED light sources are arranged along the 1st direction in each finger on the surface of the substrate
In fixed interval, light is projected on 3rd direction orthogonal thereto with the 1st direction and the 2nd direction；
Radiating component, by extending out to assigned direction from the back side of the substrate and being produced to the Light-emitting diode LED light source
The pedestal for the plate that raw heat is diffused and vertically it is located at the one side of the pedestal and with being arranged on the designated parties
To multiple fins groups of fins at offering through hole on the pedestal and cooling fin；
Light-emitting diode LED driving circuit is mounted on the another side of the pedestal, drives the multiple Light-emitting diode LED
Light source；
Shell while storing the radiating component and the Light-emitting diode LED driving circuit, and is formed with air-flow stream
Dynamic space, the air-flow flowing space includes surrounding the wind-tunnel of the multiple fin, by the through hole and cooling fin on the pedestal
Through hole be connected to the air passage to be formed, and surround the space of the Light-emitting diode LED driving circuit；
Cooling fan directs outside air into the wind-tunnel, the air passage and surrounds the Light-emitting diode LED driving electricity
In the space on road, and produced in the space of the wind-tunnel, the air passage and the encirclement Light-emitting diode LED driving circuit
The air-flow of the raw assigned direction.
2. light irradiation device according to claim 1, which is characterized in that
The through hole is formed multiple in the position of the substrate close to the pedestal along the 1st direction.
3. light irradiation device according to claim 1 or 2, which is characterized in that
The one side and at least one side in another side of the pedestal, the relatively described assigned direction tilt,
Cross-sectional area perpendicular to the cross section of the assigned direction of the pedestal is specified with from the substrate along described
Direction is separate and reduces.
4. light irradiation device according to claim 3, which is characterized in that
The one side of the pedestal is tilted relative to the assigned direction,
The fin as the cross-sectional area of the cross section of the pedestal is reduced, and becomes larger along the assigned direction.
5. light irradiation device according to claim 4, which is characterized in that
The heat dissipation capacity to be shed by the pedestal and the cooling fin, is fixed along the assigned direction.
6. light irradiation device according to claim 4, which is characterized in that
The another side of the pedestal, to be parallel to the plane in the 1st direction and the assigned direction, from the plane to the fin
The distance of piece front end is fixed on the assigned direction.
7. light irradiation device according to claim 5, which is characterized in that
The another side of the pedestal, to be parallel to the plane in the 1st direction and the assigned direction, from the plane to the fin
The distance of piece front end is fixed on the assigned direction.
8. light irradiation device according to claim 3, which is characterized in that
The another side of the pedestal is tilted relative to the assigned direction,
The one side of the pedestal, to be parallel to the plane in the 1st direction and the assigned direction, from the plane to the fin
The distance of front end is fixed on the assigned direction.
9. light irradiation device according to claim 1 or 2, which is characterized in that
The fin is divided on the assigned direction multiple and is formed.
10. light irradiation device according to claim 3, which is characterized in that
The fin is divided on the assigned direction multiple and is formed.
11. light irradiation device according to claim 4, which is characterized in that
The fin is divided on the assigned direction multiple and is formed.
12. light irradiation device according to claim 5, which is characterized in that
The fin is divided on the assigned direction multiple and is formed.
13. light irradiation device according to claim 6, which is characterized in that
The fin is divided on the assigned direction multiple and is formed.
14. light irradiation device according to claim 7, which is characterized in that
The fin is divided on the assigned direction multiple and is formed.
15. light irradiation device according to claim 1 or 2, which is characterized in that
The assigned direction, for the 3rd side in the opposite direction.
16. the light irradiation device according to any one of claims 1 or 2, which is characterized in that
The thermal conductivity of the pedestal, the thermal conductivity than the cooling fin are high.
17. light irradiation device according to claim 10, which is characterized in that
The pedestal is made of copper, and the cooling fin is made of aluminum.
18. light irradiation device according to claim 1 or 2, which is characterized in that
It has been also equipped with high heat conduction plate, has been clipped between the pedestal and the cooling fin, the heat of the pedestal has been conducted to institute
It states on cooling fin.
19. light irradiation device according to claim 1 or 2, which is characterized in that
Each Light-emitting diode LED light source has multiple Light-emitting diode LED elements.
20. the light irradiation device according to any one of claims 1 or 2, which is characterized in that
The light is the light for including the wavelength for acting on ultraviolet curable resin.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2014-077872 | 2014-04-04 | ||
| JP2014077872 | 2014-04-04 | ||
| CN201510157968.XA CN104972742B (en) | 2014-04-04 | 2015-04-03 | Light irradiation device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510157968.XA Division CN104972742B (en) | 2014-04-04 | 2015-04-03 | Light irradiation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105799340A CN105799340A (en) | 2016-07-27 |
| CN105799340B true CN105799340B (en) | 2018-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610134223.6A Expired - Fee Related CN105799340B (en) | 2014-04-04 | 2015-04-03 | Light irradiation device |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6069382B2 (en) |
| KR (2) | KR101959550B1 (en) |
| CN (1) | CN105799340B (en) |
| TW (2) | TWI664372B (en) |
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|---|---|---|---|---|
| JP6651765B2 (en) * | 2015-09-24 | 2020-02-19 | 東芝ライテック株式会社 | UV irradiation module and UV irradiation device |
| JP6294898B2 (en) * | 2016-01-15 | 2018-03-14 | Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 | Light irradiation device |
| JP6852494B2 (en) * | 2017-03-22 | 2021-03-31 | コニカミノルタ株式会社 | Optical writing device and image forming device |
| JP7300899B2 (en) * | 2019-06-13 | 2023-06-30 | Hoya株式会社 | Light source device |
| CN114929484A (en) * | 2019-10-11 | 2022-08-19 | Hoya株式会社 | Light irradiation device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041055U (en) * | 1983-08-29 | 1985-03-23 | 三菱電機株式会社 | Heat sink for semiconductor devices |
| JP2502633Y2 (en) * | 1990-05-24 | 1996-06-26 | 株式会社東芝 | Information display panel with cooling function |
| JPH0795771A (en) * | 1993-09-20 | 1995-04-07 | Sansha Electric Mfg Co Ltd | Cooling structure of power unit |
| JP2001319998A (en) * | 2000-05-09 | 2001-11-16 | Matsushita Electric Ind Co Ltd | Heat sink and its manufacturing method and cooling device using heat sink |
| JP2007052950A (en) * | 2005-08-16 | 2007-03-01 | Sony Corp | Light emitting diode lighting system and image display device |
| JP2009081091A (en) * | 2007-09-27 | 2009-04-16 | Toyoda Gosei Co Ltd | Light source device |
| CN201246718Y (en) * | 2008-07-22 | 2009-05-27 | 大和灯具工业股份有限公司 | LED illuminating apparatus |
| JP5298781B2 (en) * | 2008-11-05 | 2013-09-25 | 岩崎電気株式会社 | LED irradiation device |
| CN101839421B (en) * | 2009-03-17 | 2012-07-18 | 和谐光电科技（泉州）有限公司 | Sealed outdoor lighting lamp with LED light source module |
| EP2447070A4 (en) * | 2009-06-26 | 2012-11-21 | Nk Works Co Ltd | Ultraviolet irradiation device and printing device |
| TWI383117B (en) * | 2009-12-03 | 2013-01-21 | Asda Technology Co Ltd | Sealed outdoors led lighting lamp |
| JP2011228602A (en) * | 2010-04-23 | 2011-11-10 | Toray Ind Inc | Led light-emitting device and manufacturing method thereof |
| JP5496763B2 (en) * | 2010-04-26 | 2014-05-21 | 日本モレックス株式会社 | Lighting device and lighting equipment with heat dissipation mechanism |
| JP2012028097A (en) * | 2010-07-21 | 2012-02-09 | Nk Works Kk | Led light irradiation device and printing device |
| TWM404339U (en) * | 2010-12-17 | 2011-05-21 | Hergy Lighting Technology Corp | LED illumination lamp |
| CN201944610U (en) * | 2010-12-24 | 2011-08-24 | 合钜光电股份有限公司 | LED lighting lamp |
| CN102501600B (en) * | 2011-10-28 | 2014-12-03 | 深圳市润天智数字设备股份有限公司 | Ink curing system |
| JP5962326B2 (en) * | 2012-08-14 | 2016-08-03 | 富士電機株式会社 | Forced air cooling heat sink |
| CN203052318U (en) * | 2013-01-18 | 2013-07-10 | 本科照明有限公司 | Light emitting diode (LED) lamp good in heat dissipating effect |
| JP5733363B2 (en) | 2013-09-25 | 2015-06-10 | セイコーエプソン株式会社 | Printing device |
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2015
- 2015-02-10 JP JP2015024448A patent/JP6069382B2/en active Active
- 2015-04-02 TW TW104111043A patent/TWI664372B/en not_active IP Right Cessation
- 2015-04-02 TW TW105112055A patent/TWI598534B/en not_active IP Right Cessation
- 2015-04-03 CN CN201610134223.6A patent/CN105799340B/en not_active Expired - Fee Related
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- 2015-07-04 JP JP2015134837A patent/JP6006379B2/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105799340A (en) | 2016-07-27 |
| JP6069382B2 (en) | 2017-02-01 |
| JP2015199362A (en) | 2015-11-12 |
| KR20160031482A (en) | 2016-03-22 |
| JP6006379B2 (en) | 2016-10-12 |
| TWI598534B (en) | 2017-09-11 |
| KR20150115672A (en) | 2015-10-14 |
| KR101959550B1 (en) | 2019-07-04 |
| KR101793969B1 (en) | 2017-11-06 |
| JP2015201427A (en) | 2015-11-12 |
| TWI664372B (en) | 2019-07-01 |
| TW201542959A (en) | 2015-11-16 |
| TW201623864A (en) | 2016-07-01 |
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