TW201623864A - Light illuminating apparatus - Google Patents

Abstract

Provided is a light irradiation apparatus which is thin and lightweight. The light irradiation apparatus for irradiating line-shaped light comprises: a substrate; a plurality of LED light sources arranged on a surface of the substrate at predetermined intervals; a heat radiation member including a base plate extending from a back surface of the substrate in a predetermined direction and formed in a plate shape to diffuse heat generated by the LED light sources, and a heat sink installed uprightly on one side of the base plate in one direction and provided with a plurality of pins extending in a predetermined direction; an LED drive circuit positioned on the other side of the base plate, and driving the LED light sources; a housing forming a first wind channel enclosing a plurality of pins and a second wind channel enclosing the LED drive circuit; and a cooling fan which guides external air to the first and second wind channels, and generates an air flow within the first and second wind channels in a predetermined direction. The base plate has a through hole penetrating from one side to the other side, and air flowing through the second wind channel is supplied through the through hole.

Description

Light irradiation device

The present invention relates to a light-irradiating device including a light-emitting diode (LED) as a light source and illuminating linear light, and more particularly to a light-irradiating device including a heat radiating member that radiates heat generated by an LED.

Conventionally, a printing apparatus that performs printing using ultraviolet ink that is cured by ultraviolet light irradiation is widely known. This printing apparatus ejects ink from a nozzle of a head to a medium, and then irradiates ultraviolet rays to a spot formed on the medium. By ultraviolet light irradiation, the spray spot is solidified and fixed on the medium, so that it can have a good printing effect on a medium that does not easily absorb liquid. Such a printing apparatus is described, for example, in Patent Document 1.

The printing apparatus described in Patent Document 1 includes a transport unit that transports a print medium, and sequentially arranges cyan, magenta, yellow, and black in the transport direction. Six nozzles of color inks such as orange and green; arranged on the downstream side of the transport direction between the nozzles, and temporarily solidified (pinned) the dot inks sprayed on the print medium by the nozzles. The irradiation unit for temporary curing; and the irradiation unit for complete curing in which the dot ink is completely cured and fixed on the printing medium. The printing apparatus described in Patent Document 1 suppresses the mutual penetration between the color inks and the spread of the dots by curing the dot ink in the two stages of temporary curing and complete curing.

The temporary curing irradiation unit described in Patent Document 1 is disposed above the printing medium and irradiates ultraviolet light on the printing medium, that is, a so-called ultraviolet light irradiation device that illuminates the linear ultraviolet light in the width direction of the printing medium. . In order to reduce the weight and compactness of the printing apparatus itself, an LED is used as a light source in the temporary curing irradiation unit, and a plurality of LEDs are arranged side by side in the width direction of the printing medium.

Patent Document Patent Document 1: Japanese Patent Publication No. 2013-252720

When the LED is used as a light source as in the irradiation unit for temporary curing described in Patent Document 1, there is a problem in that a large part of the amount of electric power input is converted into heat, and the heat emitted from the LED itself is lowered. Efficiency and longevity. Further, such a problem, such as a temporary curing irradiation unit, in the case where a plurality of LED devices are mounted, an increase in the number of LEDs as a heat source causes a more serious problem. Therefore, in a light irradiation device using an LED as a light source, a structure in which a cooling structure (heat dissipation member) such as a heat sink is used to suppress heat generation of the LED is generally used.

In order to suppress the heat generation of the LED, it is effective to use a heat dissipating member such as a heat sink. However, in order to more effectively dissipate the heat of the LED, it is necessary to enlarge the surface area of the heat radiating member as much as possible, and once the heat radiating member is enlarged, there is a problem that the entire device is excessively large. In particular, as in the temporary curing irradiation unit of Patent Document 1, if a large-sized heat dissipating member is used for the light irradiation device disposed between the respective heads, it is necessary to enlarge the distance between the respective heads, thereby causing the printing apparatus itself. Weighting and large-scale will become more serious problems.

Further, in a light irradiation device used as a light source of a light-emitting diode LED, when a drive circuit for supplying a current to a light-emitting diode LED is necessary, the drive circuit is also provided with a semiconductor such as a triode or an integrated circuit IC. Parts also have the problem of having to be effectively cooled due to heat.

The present invention has been made in view of the above circumstances to provide a light-weight and lightweight light-irradiating device while effectively cooling an LED light source and an LED driving circuit.

In order to achieve the above object, the light irradiation device of the present invention is a light having a specific line width and a linear shape extending in a first direction and extending in a second direction orthogonal to the first direction on the irradiation surface. The light irradiation device includes: a substrate substantially parallel to the first direction and the second direction; and a plurality of LED (Light Emitting Diode) light sources, each of the LED light sources being spaced apart from the first direction by a specific interval on the surface of the substrate Arranging, emitting light in a third direction orthogonal to the first direction and the second direction; the heat dissipating member is a plate-shaped base extending from a back surface of the substrate in a specific direction and diffusing heat generated by the LED light source And a heat sink composed of a plurality of fins erected on one side of the base and extending in a specific direction; an LED driving circuit mounted on the other side of the base to drive the plurality of LED light sources; the casing, the heat dissipating member and the housing The LED driving circuit simultaneously forms a first wind tunnel surrounding the plurality of fins and a second wind tunnel surrounding the LED driving circuit; and a cooling fan that introduces outside air into the first wind tunnel A second tunnel, an air flow in a specific direction within the first tunnel and second tunnel. The base has a through hole penetrating from the other surface to the other surface, and the air flowing through the second wind hole is provided through the through hole.

According to this configuration, since the base and the fin are configured to extend only in a specific direction, a light-weight light irradiation device can be realized. Since the airflow is generated in the first wind tunnel and the second wind tunnel by the cooling fan, not only the heat radiating member disposed in the first wind tunnel is cooled, but also the LED driving circuit disposed in the second wind tunnel is simultaneously cooled.

Further, the through holes are formed in plural in the first direction at a position close to the base substrate.

Further, at least one of one side and the other side of the base is inclined with respect to a predetermined direction, and a cross-sectional area of a cross section in a specific direction of the vertical base is configured to be reduced as being distant from the substrate in a specific direction.

Further, the light irradiation device may be configured such that one side of the base is inclined with respect to a specific direction, and the fins are correspondingly enlarged in a specific direction as the cross-sectional area of the base is reduced. According to this configuration, the fins having a large surface area are formed by the inclination of one side of the corresponding base, and thus the heat dissipation efficiency is also made higher. Further, in this case, the amount of heat radiated by the base and the fins is substantially fixed in a specific direction.

Further, the light irradiation device may be configured such that the other surface of the base is a plane parallel to the first direction and the specific direction, and the distance from the plane to the tip end of the fin is substantially fixed in a specific direction.

In addition, the light irradiation device may be configured such that the other side of the base is inclined with respect to a specific direction, one side of the base is parallel to the plane of the first direction and the specific direction, and the distance from the plane to the front end of the fin is in a specific direction. It is roughly fixed.

Further, preferably, the fins are formed into a plurality of pieces in a specific direction.

Further, preferably, the specific direction is a direction opposite to the third direction.

Further, preferably, the thermal conductivity of the base is higher than the thermal conductivity of the heat sink. Further, in this case, preferably, the base is made of copper, and the heat sink is made of aluminum. According to this configuration, a heat sink having a high heat dissipation effect and a light weight is formed.

In addition, a high heat conductive plate sandwiched between the base and the heat sink to conduct heat of the base to the heat sink may be provided.

Further, preferably, each of the LED light sources has a plurality of LED elements.

Further, preferably, the light is light containing a wavelength acting on the ultraviolet curable resin.

As described above, according to the present invention, a light-thin, lightweight light-irradiating device while effectively cooling an LED light source and an LED driving circuit is realized.

Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. In addition, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

1(a) to 1(d) are schematic views showing the appearance of a light irradiation device 1 according to an embodiment of the present invention, and Fig. 1(a) is a plan view showing a light irradiation device 1 according to an embodiment of the present invention. 1(b) is a right side view of the light irradiation device 1 of Fig. 1(a), and Fig. 1(c) is a bottom view of the light irradiation device 1 of Fig. 1(a), 1st (d) The figure is a front view of the light irradiation device 1 of Fig. 1(a). The light irradiation device 1 of the present embodiment is a light source device that is mounted on a printing device or the like to cure an ultraviolet curable ink or an ultraviolet curable resin, and is disposed above the object to be irradiated, and emits linear ultraviolet light with respect to the object to be irradiated. In the present specification, as shown by the coordinates of the first (a) to (d) diagrams, the direction in which the LED (Light Emitting Diode) element 210 emits ultraviolet light is defined as the X-axis direction, and the arrangement of the LED elements 210 is performed. The direction is defined as the Y-axis direction, and the direction orthogonal to the X-axis direction and the Y-axis direction is defined as the Z-axis direction.

As shown in the first (a) to (d), the light irradiation device 1 of the present embodiment includes an ultra-thin box-shaped casing 100 (housing) that houses the light source unit 200 and the heat radiating member 400 therein; A window portion 105 made of glass that emits ultraviolet light on the front surface of the casing 100; three exhaust fans 110 that are provided on the back surface of the casing 100 to discharge air in the casing 100. Further, on the bottom surface of the casing 100, an air inlet 102 for taking in outside air is formed in the casing 100.

2(a) to 2(c) are views for explaining the internal structure of the light irradiation device 1 according to the embodiment of the present invention. The second (a) is a plan perspective view when the light irradiation device 1 is viewed in plan. Further, the second (b) is a right side perspective view when the light irradiation device 1 is viewed from the right side. Further, the second (c) is a front perspective view when the light irradiation device 1 is viewed from the front.

As shown in the second (a) to (c), the light irradiation device 1 of the present embodiment includes four light source units 200, a control substrate 300, a heat radiating member 400, and the like inside the casing 100.

As shown in the second (a) and (c), the four light source units 200 are closely arranged in the Y-axis direction and housed in the casing 100. Each of the light source units 200 includes a rectangular substrate 205 that is parallel to the Y-axis direction and the Z-axis direction, four LED elements 210 having the same characteristics, and an LED drive circuit 215 that drives the four LED elements 210.

The four LED elements 210 are arranged in a line on the surface of the substrate 205 at a predetermined interval in the Y-axis direction in a state where the optical axes are aligned in the X-axis direction, and are electrically connected to the substrate 205. The substrate 205 is connected to an LED driving circuit 215 which is placed on the upper surface 414a of the base 410 to be described later via a cable (not shown), and each LED element 210 supplies a driving current from the LED driving circuit 215 through the substrate 205. When a drive current is supplied to each of the LED elements 210, ultraviolet light of a light amount corresponding to the drive current is emitted from each of the LED elements 210, and linear ultraviolet light parallel to the Y-axis direction is emitted from each of the light source units 200. Further, in order to emit ultraviolet light having substantially the same amount of light for each of the LED elements 210 of the present embodiment, the driving current supplied to each of the LED elements 210 is adjusted, and the linear ultraviolet light emitted from each of the light source units 200 is in the Y-axis direction. It has a substantially uniform light quantity distribution. Further, as described above, since the four light source units 200 of the present embodiment are closely arranged in the Y-axis direction, the ultraviolet light emitted from each of the light source units 200 and the ultraviolet light emitted from the adjacent light source unit 200 are The Y-axis directions coincide with each other (i.e., from the four light source units 200) extending in the Y-axis direction, and linear ultraviolet light having a specific line width in the Z-axis direction is emitted through the window portion 105. Further, each of the LED elements 210 of the present embodiment includes a plurality of (for example, four) LED chips (not shown) having a substantially square light-emitting surface, and each of the LED elements 210 receives a drive current from the LED drive circuit 215. Ultraviolet light having a wavelength of 365 nm is emitted.

The control board 300 is a circuit board that controls the entire LED unit 215 while controlling the LED driving circuit 215 of each of the light source units 200. The control substrate 300 receives input signals from the user through a user interface (not shown) to realize ON/OFF control and brightness control of each light source unit 200, and outputs fault information to the outside through the user interface.

The heat radiating member 400 is a member that dissipates heat radiated from the four light source units 200. The heat dissipating member 400 of the present embodiment is disposed in close contact with the back surface of the substrate 205 of each of the light source units 200, and the base 410 that conducts heat radiated from each of the LED elements 210 and the base 410 are placed in close contact with each other and heat of the base 410 is disposed. The heat radiating fin 430 is configured (Fig. 2(b)).

3(a) to 3(c) are diagrams illustrating the structure of the base 410, and Fig. 3(a) is a plan view of the base 410. Further, Fig. 3(b) is a cross-sectional view taken along line A-A of Fig. 3(a). Further, the third (c) is a front view of the base 410.

4(a) to 4(e) are views for explaining the structure of the heat sink 430, and Fig. 4(a) is a plan view of the heat sink 430. Further, Fig. 4(b) is a cross-sectional view taken along line B-B of Fig. 4(a). Figure 4(c) is a front view of the heat sink 430. Further, the fourth (d) is a bottom view of the heat sink 430, and the fourth (e) is a rear view of the heat sink 430.

The fifth (a) to (e) drawings are views for explaining the configuration of the heat dissipation member 400 composed of the combination of the base 410 and the fins 430. FIG. 5( a ) is a plan view of the heat dissipation member 400 . Further, Fig. 5(b) is a cross-sectional view taken along line C-C of Fig. 5(a), and Fig. 5(c) is a front view of the heat dissipating member 400. Further, the fifth (d) is a bottom view of the heat dissipating member 400, and the fifth (e) is a rear view of the heat dissipating member 400.

The base 410 is a member obtained by molding copper (thermal conductivity: 4.01 (W/cm·K), specific gravity: 8.96 (g/cm 3 )), as shown in the third (a) to (c), The substrate support portion 412 having the substrate 205 on which the light sources 200 are placed is provided, and the heat conduction portion 414 extending from the substrate support portion 412 toward the X-axis negative direction side. The substrate supporting portion 412 has a rectangular plate shape parallel to the Y-axis direction and the Z-axis direction, and the substrate 205 of each light source unit 200 is placed and fixed on the front surface 412a (Fig. 3(c), 2(b) )))). Therefore, the heat generated by each of the LED elements 210 is transmitted to the base 410 through the substrate 205 and transmitted to the heat conduction portion 414.

As shown in FIG. 3(b), the heat conducting portion 414 has a plate-like shape having a tapered cross section and an upper surface 414a parallel to the X-axis direction and the Y-axis direction, and an upper surface 414a (ie, relative to the X). The axial direction is the lower surface 414b which is inclined at a specific angle. That is, the heat conduction portion 414 of the present embodiment is such that the distance from the substrate support portion 412 of the substrate 205 to the substrate support portion 412 in the X-axis direction is greater than the distance between the upper surface 414a and the lower surface 414b. The thinner the surface (i.e., the cross-sectional area of the cross section parallel to the Y-axis direction and the Z-axis direction becomes smaller). As described above, in the present embodiment, since the base end side (substrate side) of the heat transfer portion 414 is thickened, the amount of heat transfer is increased, and the heat generated by each of the LED elements 210 is efficiently transmitted to the heat transfer portion 414. front end. Further, although the entire heat conduction portion 411 is also considered to be thick from the viewpoint of the amount of heat transfer, copper is used in the heat transfer portion 414 (that is, the base 410), and in the present embodiment, the cone is used. Shapes to reduce volume, thereby reducing weight gain. Further, by forming the heat conducting portion 414 into a tapered shape, a space is formed between the heat conducting portion 414 and the casing 100 so that the size of the heat radiating fin 440 described later can be increased.

A plurality of protrusions 414c that securely support the LED drive circuits 215 of the respective light source units 200 are formed on the upper surface 414a of the heat conduction portion 414. Further, a plurality of through holes 414d penetrating from the upper surface 414a of the heat conduction portion 414 to the lower surface 414b are formed. The through hole 414d is a screw hole into which a screw (not shown) for fixing the base 410 and the heat sink 430 is inserted. Further, in the heat conduction portion 414, a plurality of through holes 414e penetrating from the upper surface 414a of the heat conduction portion 414 to the lower surface 414b are formed. As will be described later in detail, the through hole 414e is formed with an air passage that feeds air from the outside to the lower surface 414b side of the heat conduction portion 414 to the upper surface 414a side. Further, a positioning pin 415 for positioning the heat sink 430 is protruded from the lower surface 414b of the heat conduction portion 414.

The heat sink 430 is a member obtained by molding aluminum (thermal conductivity: 2.37 (W/cm·K), specific gravity: 2.70 (g/cm 3 )). As shown in FIGS. 4( a ) to 4 ( e ) and 5 ( a ) to ( e ), the heat sink 430 includes a fitting portion 432 that is fitted into the substrate supporting portion 412 of the chassis 410 and extends from the fitting portion 432 . A connecting portion 434 that is connected to the base 410 to the rear (the X-axis negative direction side). As shown in FIGS. 4(b) and 4(c), the fitting portion 432 has a rectangular plate-like plate-like portion 432a parallel to the Y-axis direction and the Z-axis direction, and protrudes from the front surface of the plate-shaped portion 432a to the X-axis. The pair of protrusions 432b on the side of the value direction and extending to the Y-axis direction, and having a U-shaped cross section. Further, the plate-like portion 432a is formed with an opening 432c having a substantially rectangular shape when viewed in the X-axis direction. The opening 432c is an opening through which the heat conducting portion 414 of the base 410 passes when the base 410 and the heat sink 430 are combined.

The connecting portion 434 has a rectangular plate shape, and after combining the base 410 and the heat sink 430, has an abutting surface 434a corresponding to the lower surface 414b of the base 410, and fins forming a plurality of heat radiating fins 440 A face 434b is formed. As shown in FIG. 4(b), the connecting portion 434 of the present embodiment is inclined with respect to the X-axis direction at the same angle as the lower surface 414b of the base 410. When the base 410 is combined with the heat sink 430, the connecting portion 434 is used. The abutting surface 434a is configured to abut against the lower surface 414b of the base 410. Therefore, when the base 410 is combined with the heat sink 430, the heat of the base 410 is transmitted to the heat sink 430.

The heat radiating fins 440 are erected so as to protrude from the fin forming surface 434b of the connecting portion 434 in the Z-axis direction, and dissipate heat transferred to the heat sink 430 to the air. Further, as will be described later in detail, in the present embodiment, the outside air is sucked into the casing 100 by the exhaust fan 110, and the air sucked in the X-axis direction causes the sucked air to flow on the surface of the heat radiating fin 440, and the heat radiating fin The sheet 440 is disposed to extend in the X-axis direction. Further, as shown in the fourth (b), (d), and (e), the heat dissipation fins 440 of the present embodiment are formed by being divided into a plurality of (four) in the X-axis direction. Further, the amount of protrusion of the heat radiation fins 440 (the size of the heat radiation fins 440) is increased away from the fitting portion 432 in the X-axis direction, thereby improving the cooling effect.

As shown in the fourth (a) and (c), a fitting groove 435 into which the positioning pin 415 of the fin 430 is fitted is formed in the abutting surface 434a of the connecting portion 434. Further, on the connecting portion 434, a plurality of screw holes 434c for fixing the base 410 and the fins 430 are formed. Further, a plurality of through holes 434d penetrating from the abutting surface 434a of the connecting portion 434 to the fin forming surface 434b are formed in the connecting portion 434. Further, when the base 410 is combined with the heat sink 430, the through hole 414d of the base 410 communicates with the screw hole 434c of the heat sink 430, and the through hole 414e of the base 410 communicates with the through hole 434d of the heat sink 430 (Fig. 5(a) , Figure 5(b)).

When the heat dissipating member 400 composed of the base 410 and the heat sink 430 is assembled, the heat conducting portion 414 of the base 410 is inserted into the opening 432c of the heat sink 430, and the base 410 is pressed into the X-axis negative value with respect to the heat sink 430. On the direction side, the substrate supporting portion 412 of the chassis 410 is fitted into the fitting portion 432 of the heat sink 430 (Fig. 5(a) to (e)). Further, the positioning pin 415 is fitted into the fitting groove 435, and the base 410 and the heat sink 430 are positioned such that the lower surface 414b of the base 410 abuts against the abutting surface 434a of the heat sink 430. Further, in this state, the screw is screwed into the screw hole 434c through the through hole 414d. Thereby, the base 410 is completely fixed to the heat sink 430, and the heat radiating member 400 is assembled.

As described above, in the present embodiment, the thickness of the heat conduction portion 414 is thinner as it goes away from the substrate support portion 412 of the substrate 205 in the X-axis direction, and the heat generated by the LED element 210 is transferred to the X-axis negative. At the same time as the value direction side, a large space is formed on the negative side of the X-axis, and a large heat dissipation fin 440 is formed as much as possible in the space to form the heat dissipation member 400 having an efficient heat dissipation effect. Further, by combining a copper base 410 having a high thermal conductivity and an aluminum heat sink 430 having a thermal conductivity slightly weaker than copper but having a lighter specific gravity than copper, the heat dissipating member 400 is formed, so that the heat dissipating member 400 is made of copper as a whole. It is lighter and more efficient than heat when it is made entirely of aluminum. Further, as described above, the heat radiating member 400 of the present embodiment extends rearward in the X-axis direction (that is, on the X-axis negative direction side), and does not protrude in the Y-axis direction and the Z-axis direction. Therefore, the size of the light irradiation device 1 in the Y-axis direction and the Z-axis direction can be controlled to a minimum.

Next, the cooling action of the heat radiating member 400 of the present embodiment will be described. Fig. 6 is a schematic view for explaining the relationship between the heat radiating member 400 and the airflow generated in the casing 100. In addition, FIG. 7 is a schematic view for explaining the relationship between the heat radiating member 400 and the amount of heat radiation.

As shown in Fig. 6, the light irradiation device 1 of the present embodiment includes three exhaust fans 110 on the back surface of the casing 100. Further, on the bottom surface of the casing 100, an intake port 102 for taking in outside air is formed in the casing 100. Therefore, as soon as the exhaust fan 110 rotates, the air in the casing 100 is discharged from the exhaust fan 110, and the outside air is taken in from the intake port 102. Therefore, in the casing 100, in Fig. 6, an air flow indicated by solid arrows is generated. That is, the air sucked into the casing 100 from the intake port 102 flows in the X-axis direction in the space surrounded by the fins 430 and the casing 100 (that is, the space in which the fins 440 are provided). Therefore, the heat generated by each of the LED elements 210 and transmitted to the heat sink 430 through the substrate 205 and the base 410 (indicated by a broken line arrow in FIG. 6) is dispersed into the air by the heat radiating fins 440. Thus, in the present embodiment, the casing 100 and the fins 430 constitute a wind tunnel (in the present embodiment, the first wind tunnel), and the cooling is effectively performed by defining a space in which the airflow flows.

Further, in the present embodiment, the through hole 414e of the base 410 communicates with the through hole 434d of the fin 430, and an air passage through which the air sucked into the casing 100 passes is formed. Therefore, the air sucked into the casing 100 passes through the through hole 434d and the through hole 414e, and also passes through the space on the upper surface 414a side of the heat conduction portion 414 (in the present embodiment, it is different from the first wind tunnel described above, The space is the second wind tunnel). Therefore, according to the configuration of the present embodiment, the LED drive circuit 215 and the control substrate 300 disposed on the upper surface 414a side of the heat conduction portion 414 can be cooled.

Further, as shown in FIG. 7, the heat conduction portion 414 of the heat dissipation member 400 of the present embodiment is separated from the substrate support portion 412 from the substrate 205 in the X-axis direction, that is, the upper surface 414a and the lower surface The distance between 414b is thinned (that is, the cross-sectional area of the cross section perpendicular to the X-axis direction is gradually reduced). Further, in the space obtained by thinning the heat conducting portion 414, the heat radiating fins 440 which are gradually enlarged in the X-axis direction are formed so that the distance from the upper surface 414a of the base 410 to the front end of the heat radiating fin 440 is at It is configured to be substantially fixed in the X-axis direction.

Here, considering the thermal resistance of the base 410, the heat passing through the base 410 (ie, the heat generated by all the LED elements 210) Q1 (W), the temperature of the substrate 205 of each light source unit 200 (ie, the substrate support portion 412) Temperature ΔT (°C) of the heat sink 430, thermal resistance R (°C/W) of the base 410, length of the base 410 (ie, length of the heat conducting portion 414) L(m), cross section of the base 410 The relationship between the area (i.e., the cross-sectional area of the heat conduction portion 414) A (m ² ) and the thermal conductivity λ (W/m ° C) of the base 410 can be expressed by the following formulas (1) and (2). Q1(W)=ΔT(°C)/R(°C/W) ・・・(1) R(°C/W)=L(m)/(A(m ² )×λ(W/m°C))・・(2)

As described above, the heat generated by the LED element 210 is transmitted from the substrate supporting portion 412 of the chassis 410 to the heat conducting portion 414, and further diffused toward the front end side (the X-axis negative direction side) of the heat conducting portion 414 due to the heat sink. The heat radiating fins 440 of the heat sink 430 are dissipated into the air taken in from the air inlet 102, so the heat Q1 passing through the base 410 is the largest on the side close to the substrate supporting portion 412, and gradually decreases as it goes away from the negative side in the X-axis direction. Therefore, in the present embodiment, as shown in FIG. 7, the heat amount Q1 passing through the base 410 is uniformly dispersed along the X-axis direction (that is, as the thermal resistance R becomes larger as it goes away from the X-axis negative direction side), The cross-sectional area of the cross section perpendicular to the X-axis direction of the heat conduction portion 414 gradually becomes smaller (that is, the base end side (substrate side) of the heat conduction portion 414 becomes thicker). That is, the lower surface 414b of the base 410 is inclined at a specific angle with respect to the X-axis direction. And, thereby, a sufficient space required for the heat dissipation fins 440 is secured on the lower surface 414b side of the base 410.

Specifically, as shown in FIG. 7, the heat conduction portion 414 of the present embodiment has a length of about 80 mm in the X-axis direction, and it is assumed that the heat amount Q1 generated by all the LED elements 210 is 200 (W), in order to make the heat conduction portion. The heat of each position in the X-axis direction of 414 is equal (25 (W)), and the cross-sectional area ratio of each cross section when the heat conducting portion 414 is cut every 10 mm in the X-axis direction is started from the side close to the substrate supporting portion 412. It is set to 1.00, 0.85, 0.72, 0.61, 0.52, 0.44, 0.38, and 0.32 in order.

Next, considering the heat dissipation amount of the heat sink 430, the heat flow rate Q2 (W) of the heat sink 430, the heat transfer rate α (W/m ² ° C) of the heat sink 430, the surface area B (m ² ) of the heat sink 430, and heat dissipation. The relationship between the temperature of the sheet 430 and the temperature difference ΔT (° C.) of the air taken in from the intake port 102 can be expressed by the following formula (3). Q2(W)=α(W/m ² °C)×B(m ² )×ΔT(°C) ・・・(3)

As shown in FIG. 6, in the present embodiment, the intake port 102 is formed below the base end side (on the side of the LED element 210) of the heat sink 430, and is sucked into the casing 100 from the intake port 102. The air inside cools the heat sink fins 440 of the heat sink 430. Here, the air sucked into the casing 100 from the intake port 102 flows in the X-axis direction in the space surrounded by the heat sink 430 and the casing 100 (that is, the space in which the heat radiating fins 440 are provided). Therefore, the air temperature for cooling the heat radiating fins 440 is lower on the base end side (on the side of the LED element 210) of the heat sink 430, and becomes higher on the front end side of the heat sink 430. In other words, ΔT (° C.) in the formula (3) is large on the base end side (on the side of the LED element 210) of the heat sink 430, and becomes smaller on the front end side of the heat sink 430. Therefore, in the present embodiment, the surface area B (m ² ) of the heat sink 430 is small on the base end side (the side of the LED element 210) of the heat sink 430 and becomes large on the front end side of the heat sink 430, so that heat is formed. The heat flow rate Q2 of the sheet 430 is uniform in each position in the X-axis direction. In other words, the heat dissipation fins 440 are gradually increased in the X-axis direction.

As described above, in the present embodiment, the lower surface 414b of the chassis 410 is inclined at a specific angle with respect to the X-axis direction, and the heat dissipation fins 440 gradually become larger along the X-axis direction, and are thereby formed to pass through the base 410. The heat Q1 is uniformly dispersed along the X-axis direction, and the heat flow rate Q2 of the fins 430 is uniformly dispersed along the X-axis direction.

The above description has been made in connection with the present embodiment, but the present invention is not limited to the above configuration, and various modifications can be made within the scope of the technical idea of the present invention. For example, although the light irradiation device 1 of the present embodiment is a device that irradiates ultraviolet light, the present invention is also applicable to an apparatus that irradiates irradiation light of another wavelength region (for example, visible light such as white light or infrared light).

Further, each of the LED elements 210 of the present embodiment includes a plurality of LED chips having a substantially square light-emitting surface. However, the LED chips 210 are not limited to this configuration. For example, the LED chips of the LED elements 20 may have a square shape. Further, the LED element 20 may be an element including one or more LED chips.

Further, in the present embodiment, the lower surface 414b of the base 410 and the contact surface 434a of the heat sink 430 are directly adhered to each other. For example, the lower surface 414b of the base 410 may be in contact with the heat sink 430. A highly thermally conductive graphite sheet is provided between the faces 434a, or a resin is coated to further improve the adhesion between the two.

Further, in the present embodiment, the base 410 and the heat sink 430 have been described as separate members, but the base 410 and the heat sink 430 may be integrally formed. Further, in this case, the heat dissipation fins 440 made of copper or aluminum may be directly formed on the lower surface 414b of the base 410.

Further, the heat dissipation member 400 of the present embodiment is configured to extend rearward in the X-axis direction (that is, on the X-axis negative direction side) and does not protrude in the Y-axis direction and the Z-axis direction. However, the heat dissipation member 400 is not limited to such a configuration and is radiated. The extending direction of the member 400 may be any specific direction (for example, the Y-axis direction or the Z-axis direction). Further, in this case, although the fins 430 are also extended in a specific direction, the casing 100 may be provided to form a wind tunnel between the casing 100 and the fins 430 (that is, to cover the fins 430).

Further, in the present embodiment, the heat amount Q1 passing through the chassis 410 and the heat flow rate Q2 of the heat sink 430 are uniformly dispersed along the X-axis direction, but if the lower surface 414b of the chassis 410 is inclined with respect to the X-axis direction, When the heat dissipation fins 440 become larger in the X-axis direction, the heat dissipation member 400 having an efficient heat dissipation effect can be formed, and thus it is not limited to this configuration. Further, in the heat conduction portion 414 of the present embodiment, the ratio of the cross-sectional areas of the respective cross-sections taken along the X-axis direction every 10 mm is 1.00, 0.85, 0.72, 0.61, and 0.52 from the side closer to the substrate support portion 412. It is composed of 0.44, 0.38, and 0.32, but is not limited to this structure.

Further, in the present embodiment, since the surface area B (m ² ) of the heat sink 430 is small on the base end side (the LED element 210 side) of the heat sink 430, it becomes large on the front end side of the heat sink 430 (that is, due to heat dissipation) Since the fins 440 gradually become larger along the X-axis direction, the heat flux Q2 of the fins 430 is equally formed at positions in the X-axis direction, but is not limited to this configuration. For example, in a case where the heat amount Q1 (W) generated by all the LED elements 210 is small, the heat dissipation fins 440 of the same size may be formed from the base end side to the front end side of the heat sink 430. Further, in this case, it is not necessary to enlarge the space required for the heat radiating fins 440 on the lower surface 414b side of the base 410, and therefore it is not necessary to incline the lower surface 414b of the bottom plate 410 with respect to the X-axis direction. Therefore, for example, as shown in FIG. 8, the lower surface 414b of the base 410 may be replaced with the upper surface 414a of the base 410 such that the upper surface 414a side of the base 410 is inclined with respect to the X-axis direction from the base 410. The distance from the lower surface 414b to the front end of the heat dissipation fin 440 is substantially constant in the X-axis direction. Further, from the viewpoint of the amount of heat transfer, the base end side (substrate side) of the heat conduction portion 414 may be slightly thicker than the front end portion side, and for example, the upper surface 414a and the lower surface 414b of the base 410 may be opposite to the X axis. A structure with a slanted direction.

In addition, the embodiments disclosed herein are exemplified in various aspects, but it should be understood that the invention is not limited to the embodiments described. The scope of the present invention is not intended to be limited to the foregoing description, and is intended to be inclusive of the scope of the claims

1‧‧‧Lighting device
100‧‧‧shell
102‧‧‧air inlet
105‧‧‧ Window Department
110‧‧‧Exhaust fan
200‧‧‧Light source unit
205‧‧‧Substrate
210‧‧‧LED components
215‧‧‧LED drive circuit
300‧‧‧Control substrate
400‧‧‧heating components
410‧‧‧Base
412‧‧‧Substrate support
412a‧‧‧ positive
414‧‧‧Heat conduction department
414a‧‧‧ upper surface
414b‧‧‧ lower surface
414c‧‧‧Protruding
414d‧‧‧through hole
414e‧‧‧through hole
415‧‧‧Locating pin
430‧‧ ‧ heat sink
432‧‧‧Mate
432a‧‧‧plate
432b‧‧‧Protruding
432c‧‧‧ openings
434‧‧‧Connecting Department
434a‧‧‧Abutment
434b‧‧‧Fin forming surface
434c‧‧‧ screw holes
434d‧‧‧through hole
435‧‧‧ fitting slot
440‧‧‧heat fins

[Fig. 1 (a) to (d)] Fig. 1 is a plan view, a right side view, a bottom view, and a front view, respectively, of an appearance of a light irradiation device according to an embodiment of the present invention. [Fig. 2(a) to (c)] Fig. 2 is a plan perspective view, a right side perspective view, and a front perspective view, respectively, showing an internal structure of a light irradiation device according to an embodiment of the present invention. [Fig. 3 (a) to (c)] Fig. 3 is a plan view showing a base structure of a light irradiation device according to an embodiment of the present invention, and a cross-sectional view and a front view taken along line A-A of Fig. 3(a). [Fig. 4 (a) to (e)] Fig. 4 is a plan view showing a heat sink structure of a light irradiation device according to an embodiment of the present invention, and a cross-sectional view, a front view, a bottom view, and a rear view taken along line BB of Fig. 4(a); . [Fig. 5(a) to (e)] FIG. 5 is a plan view showing a configuration of a heat dissipating member of the light irradiation device according to the embodiment of the present invention, and a cross-sectional view, a front view, a bottom view, and a rear view taken along line CC of FIG. 5(a). view. [Fig. 6] Fig. 6 is a schematic view showing the relationship between the heat radiating member of the light irradiation device and the airflow generated in the casing according to the embodiment of the present invention. [Fig. 7] Fig. 7 is a schematic view showing the relationship between the heat radiating member and the amount of heat radiation of the light irradiation device according to the embodiment of the present invention. Fig. 8 is a cross-sectional view showing a light irradiation device according to another embodiment of the present invention.

100‧‧‧shell

110‧‧‧Exhaust fan

102‧‧‧air inlet

210‧‧‧LED components

215‧‧‧LED drive circuit

300‧‧‧Control substrate

410‧‧‧Base

412‧‧‧Substrate support

414‧‧‧Heat conduction department

414a‧‧‧ upper surface

414b‧‧‧ lower surface

430‧‧ ‧ heat sink

434‧‧‧Connecting Department

434a‧‧‧Abutment

440‧‧‧heat fins

Claims (14)

A light irradiation device that illuminates a light having a specific line width and a linear shape in a second direction extending in a first direction and orthogonal to the first direction on the illumination surface, the light The illumination device includes: a substrate substantially parallel to the first direction and the second direction; a plurality of LED light sources, each of the LED light sources being spaced apart from the first direction by a specific interval on a surface of the substrate Aligning the light, emitting the light in a third direction orthogonal to the first direction and the second direction; a heat dissipating member comprising extending from a back surface of the substrate toward a specific direction and the LED light source a plate-shaped base on which the generated heat is diffused, and a heat sink erected on one side of the base and having a plurality of fins extending in the specific direction; an LED driving circuit mounted on the The other side of the base drives the plurality of LED light sources; a casing housing the heat dissipating member and the LED driving circuit, and forming a first wind tunnel surrounding the plurality of fins and surrounding the LED driving circuit of a second wind tunnel; and at least one cooling fan that introduces outside air into the first wind tunnel and the second wind tunnel, and generates the airflow in the specific direction in the first wind tunnel and the second wind tunnel; The base has at least one through hole penetrating from the one surface to the other surface, and air flowing through the second wind tunnel is provided through the through hole. The light irradiation device of claim 1, wherein the through hole is formed in a plurality of positions along the first direction at a position close to the substrate of the base. The light irradiation device of claim 1 or 2, wherein at least one of one side and the other side of the base is inclined with respect to the specified direction and perpendicular to a cross section of the specified direction of the base A cross-sectional area decreases as the substrate moves away from the specified direction. The light irradiation device of claim 3, wherein one side of the base is inclined with respect to the specific direction, and the fins are along the specific direction as the cross-sectional area of the base is reduced Become bigger. The light-irradiating device of claim 4, wherein the amount of heat dissipated by the base and the heat sink is substantially fixed in the specific direction. The light irradiation device of claim 4 or 5, wherein the other side of the base is a plane parallel to the first direction and the specific direction, a distance from the plane to a front end of the fin, It is substantially fixed in the particular direction. The light irradiation device of claim 3, wherein the other side of the base is inclined with respect to the specific direction, and one side of the base is a plane parallel to the first direction and the specific direction, The distance from the plane to the front end of the fin is substantially fixed in the particular direction. The light irradiation device according to any one of claims 1 to 7, wherein the fin is divided into a plurality in the specific direction. The light irradiation device according to any one of claims 1 to 8, wherein the specific direction is a direction opposite to the third direction. The light-irradiating device according to any one of claims 1 to 9, wherein the thermal conductivity of the base is higher than the thermal conductivity of the heat sink. The light irradiation device of claim 10, wherein the base is made of copper, and the heat sink is made of aluminum. The light-irradiating device according to any one of claims 1 to 11, further comprising a high heat conducting plate interposed between the base and the heat sink to conduct heat of the base to the heat dissipation Chip. The light irradiation device according to any one of claims 1 to 12, wherein each of the LED light sources has a plurality of LED elements. The light irradiation device according to any one of claims 1 to 13, wherein the light contains light of a wavelength acting on the ultraviolet curable resin.