CN105790583A - Coupling inductor based SiC metal-oxide-semiconductor field effect transistor (MOSFET) parallel current sharing control method - Google Patents

Coupling inductor based SiC metal-oxide-semiconductor field effect transistor (MOSFET) parallel current sharing control method Download PDF

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CN105790583A
CN105790583A CN201610139323.8A CN201610139323A CN105790583A CN 105790583 A CN105790583 A CN 105790583A CN 201610139323 A CN201610139323 A CN 201610139323A CN 105790583 A CN105790583 A CN 105790583A
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current
inductance
coil
parallel
sicmosfet
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CN105790583B (en
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曾正
邵伟华
胡博容
廖兴林
李辉
冉立
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Zhixin Semiconductor Co ltd
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Chongqing University
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/02Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H02M3/1584Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/14Arrangements for reducing ripples from dc input or output
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/0048Circuits or arrangements for reducing losses
    • H02M1/0054Transistor switching losses
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Abstract

The invention provides a coupling inductor based SiC metal-oxide-semiconductor field effect transistor (MOSFET) parallel current sharing control method. An induction coil is connected in series to each branch of SiC MOSFETs in parallel, and the induction coil of each branch is coupled to a common magnetic core. By the method, unbalanced current containing dynamic unbalanced current and static unbalanced current can be suppressed, so that the current equilibrium of each branch of the SiC MOSFETs in parallel is ensured; and moreover, the difference between on loss and off loss of a SiC MOSFET device is effectively reduced, the unbalanced stress is effectively prevented, each SiC MOSFET device is effectively protected, the service lifetime is prolonged, and the electrical performance and the durability of the parallel device are improved.

Description

SiC MOSFET current sharing control method based on coupling inductance
Technical field
The present invention relates to a kind of current balance method of SiCMOSFET in parallel, particularly relate to a kind of SiCMOSFET current sharing control method based on coupling inductance.
Background technology
SiCMOSFET and sic filed effect transistors, owing to the performance of its excellence uses more and more extensive;Owing to SiCMOSFET is subject to the restriction of manufacturing process and yield rate, the through-current capability of single SiCMOSFET is limited, in commercial Application, generally require that multiple discrete device is used in parallel or multi-chip parallel-connection structure power model is to reach Industry Control purpose, owing to the parameter between each device exists dispersibility, the loop parasitic parameter of different components can't be accomplished completely the same, current-unbalance problem will be produced during many SiCMOSFET parallel connection, dynamic current in and switching process unbalanced including: the quiescent current after conducting is unbalanced, unbalanced electric current makes device produce not reciprocity loss, switching speed, voltage and current stress, it is particularly susceptible on the weakest device, forms higher mistake blow stress, thus jeopardizing the safety of device.
It is, therefore, desirable to provide a kind of new method, it is possible to ensure the current balance on each branch road of SiCMOSFET in parallel; the phenomenon being prevented effectively from unbalanced stress weighing apparatus occurs; each SiCMOSFET device is effectively protected, increases the service life, promote electric property and the ruggedness of devices in parallel.
Summary of the invention
In view of this; it is an object of the invention to provide a kind of SiCMOSFET current balance method in parallel based on coupling inductance; ensure that the current balance on each branch road of SiCMOSFET in parallel; the phenomenon being prevented effectively from unbalanced stress weighing apparatus occurs; each SiCMOSFET device is effectively protected; increase the service life, promote electric property and the ruggedness of devices in parallel.
A kind of SiCMOSFET current balance method in parallel based on coupling inductance provided by the invention, an inductance coil of all connecting on each branch road of SiCMOSFET in parallel, and the inductance coil of each branch road are coupled on a public magnetic core.
Further, the equal turn numbers of the inductance coil of each branch road.
Further, according to the coupling inductance electric current according to the balanced each branch road of following method:
According to Ampere circuital theorem:Wherein, n is coil turn, and i is the electric current flowing through coil, and H is magnetic field intensity, and R is the radius of coil;When two coil turns are equal, differential mode inductance LdiffWith the induction electromotive force u produced by differential-mode currentdiffMeet:
ΔΦ=Δ BS is different mode flux, and S is the cross-sectional area of magnetic core, and Δ B is magnetic field intensity, it may be assumed that
Δ B=μrμ0(H1-H2) (11),
Wherein, μ0For air permeability, μrFor the relative permeability of magnetic core, H1And H2Respectively by electric current id1And id2The magnetic field intensity produced, therefore, by (11) Shi Ke get:
Δ B = nμ r μ 0 i d 1 - i d 2 2 π R - - - ( 12 ) ;
Induction electromotive force u can be obtained by (10) and (12) formuladiffFor:
u d i f f = L d i f f dΔi d d t = μ r μ 0 n 2 S 2 π R dΔi d d t - - - ( 13 ) ;
Differential mode inductance can be expressed as:
When stable state, id1=id2, the electric current flowing through coil is equal, and cancelling out each other in the magnetic field produced in magnetic core, does not have coupling between coil;Now, the magnetic flux in coil is and the leakage magnetic flux of air hinge, and coupling inductance is equivalent in loop of power circuit stray inductance:
L σ = n 2 μ 0 S l - - - ( 15 ) ;
Now, DUT1 and DUT2 total current idpWith out-of-balance current idn=Δ id, have:
I = i d p i d n = 1 1 1 - 1 i d 1 i d 2 - - - ( 16 ) ;
Corresponding impedance loop ZpAnd Zn, have:
Z p Z n = 1 1 1 - 1 Z 1 Z 2 + L σ L d i f f - - - ( 17 )
The impedance loop of balanced balanced current and out-of-balance current component when Section 1 is do not adopt coupling inductance on the right of equation, Section 2 is introduced by coupling inductance;Wherein,
Z = Z 1 Z 2 = R 1 + sL 1 + R d s 1 R 1 + sL 1 + R d s 2 - - - ( 18 )
The voltage of DUT1 and DUT2 parallel connected end
v d s = Z T I = Z p Z n i d p i d n = Z p i d p + Z n i d n - - - ( 19 )
Due to vdsFixed for limited constant, and Ldiff>>Lσ, when device is in non-off state, have | Zn|>>|Zp|, the out-of-balance current i of devices in paralleldnGo to zero.
Beneficial effects of the present invention: the SiCMOSFET current balance method in parallel based on coupling inductance provided by the invention; the out-of-balance current including dynamic unbalance electric current and static unbalance electric current can be suppressed; thus ensureing the current balance of each branch road of SiCMOSFET in parallel; and that effectively reduces each SiCMOSFET device turns on and off loss; the phenomenon being prevented effectively from unbalanced stress weighing apparatus occurs; each SiCMOSFET device is effectively protected; increase the service life, promote electric property and the ruggedness of devices in parallel.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is the equivalent schematic of traditional structure.
Fig. 2 is the structural representation of the present invention.
Fig. 3 is the current stress experimental result of traditional structure double impulse test.
Fig. 4 is the current stress experimental result of double impulse test after employing this method.
Fig. 5 is the experimental result in the SiCMOSFET device opening process of traditional structure.
Fig. 6 is the experimental result after employing this method in SiCMOSFET device opening process.
Fig. 7 is the experimental result in the SiCMOSFET device turn off process of traditional structure.
Fig. 8 is the experimental result after the employing present invention in SiCMOSFET device turn off process.
Fig. 9 is the loss waveform in the opening process after adopting before the present invention and adopting the present invention.
Detailed description of the invention
nullFig. 1 is the equivalent schematic of traditional structure,Fig. 2 is the structural representation of the present invention,As shown in the figure,A kind of SiCMOSFET current balance method in parallel based on coupling inductance provided by the invention,Each branch road of SiCMOSFET in parallel is all connected an inductance coil,And the inductance coil of each branch road is coupled on a public magnetic core,Pass through this method,The out-of-balance current including dynamic unbalance electric current and static unbalance electric current can be suppressed,Thus ensureing the current balance of each branch road of SiCMOSFET in parallel,And that effectively reduces each SiCMOSFET device turns on and off loss,The phenomenon being prevented effectively from unbalanced stress weighing apparatus occurs,Each SiCMOSFET device is effectively protected,Increase the service life,Promote electric property and the ruggedness of devices in parallel.
In the present embodiment, the equal turn numbers of the inductance coil of each branch road, by this structure, it is possible to effectively suppresses the out-of-balance current of each branch road of SiCMOSFET device, promotes the current balance of each branch road.
In using below for tradition, the principle of current-unbalance and the balanced each branch current of this method is described in further detail:
Traditional structure: as shown in Figure 1, three measured devices DUT1, DUT2 and DUT3 in Fig. 1 represent each SiCMOSFET device respectively, and wherein, DUT3 is turned off by the reversed bias voltage of grid, wherein DUT1 and DUT2 parallel running and one drive circuit of function drive, and driving resistance is RG, driving voltage is VGS, the operational factor of each device in Fig. 2 includes: inner grid resistance Rg, gate leakage capacitance Cgd, gate-source capacitance Cgs, drain source capacitance Cds, stray inductance L that package lead introduces respectively at grid, leakage, source electrodeg、LdAnd Ls, Ldp1、Ldp2And Rdp1、Rdp2Outside for device, drain electrode wiring the stray inductance caused and resistance, in like manner Lgn1、Lgn2And Rgn1、Rgn2For the outer stray inductance introduced by source connection of device and resistance;Lg12And Rg12The stray inductance introduced for driver circuit between DUT1 and DUT2 and resistance.L is load inductance, CdcFor dc-link capacitance, UdcFor DC bus-bar voltage, in Fig. 1, equivalent parasitic inductance and resistance are respectively as follows:
L 1 = L d p 1 + L g n 1 + L d 1 + L s 1 R 1 = R d p 1 + R g n 1 L 2 = L d p 2 + L g n 2 + L d 2 + L s 2 R 2 = R d p 2 + R g n 2 - - - ( 1 ) ;
The drain-source resistance Rds of SiCMOSFET device is subject to the control of device gate source voltage vgs, it may be assumed that
R d s = v d s ( t ) i d = &infin; v g s < V t h U d c i d V t h < v g s < V G P U d c - ( V G S - V G P ) t C g d , a v ( R G + R g ) I L V G P < v g s < V G S R d s , o n v g s = V G S - - - ( 2 ) ;
vdsT drain-source voltage that () is device, gate source voltage VthFor the threshold voltage of device, VGPFor the platform voltage produced by the Miller effect, Cgd,avFor device gate-drain capacitance meansigma methods;Drain current id meets relation:
i d = 0 v g s < V t h g m &lsqb; v g s ( t ) - V t h &rsqb; V t h < v g s < V G P I L v g s > V G P - - - ( 3 ) ;
Wherein, gmFor mutual conductance, and
g m = &mu;C O X W L C H &lsqb; v g s ( t ) - V t h &rsqb; = &beta; &lsqb; v g s ( t ) - V t h &rsqb; - - - ( 4 ) ;
vgsT () is the device gate source voltage in t, μ is carrier effective mobility, COXFor the unit-area capacitance of gate oxide, W and LCHRespectively channel width and length, factor beta is:
ILCan be expressed as:Δ t is the service time of device.
From above-mentioned: the drain current of device is directly decided by several key parameters of device: mutual conductance gm, threshold voltage Vth, conducting resistance Rds,on, input capacitance Ciss.Meanwhile, resistance R is drivenGThe same climbing determining drain current, the stray inductance that device encapsulation introduces also can affect the dynamic characteristic of electric current.In the process that multi-chip or device are in parallel, it is very easy to introduce these unbalanced factors.
For conducting state, the main consideration road impact by resistance, it is assumed that the conducting resistance of two devices (DUT1 and DUT2) respectively maximum RdsonmaxWith minima Rdsonmin, then maximum electric current got by the minimum device of conducting resistance:
I max = R d s o n max R d s o n min + R d s o n max I d p = 1 1 + R d s o n min / R d s o n max I d p - - - ( 7 ) ;
Wherein, IdpIt it is the output electric current sum of two devices.Visible, the current-sharing ability of device, it is subject to the impact of conducting resistance distribution.Device fabrication is more ripe, and conducting resistance is more balanced, coefficients Rdsonmin/RdsonmaxBeing closer to 1, the current-sharing effect of device is more good.
For on off state, by formula (3) and (4) it can be seen that drain current is controlled by gate source voltage vgs(t) and threshold voltage Vth, i.e. id=β [vgs(t)-Vth]2(8),
From the foregoing, it will be observed that the device that threshold voltage is little, first turn in opening process, share more electric current;Turn off process but ends afterwards, shares less electric current.
To sum up stating, there is unbalanced electric current in SiCMOSFET device in parallel, and is from source, it cannot be solved in prior art.
And in this method, as shown in Figure 1, example is operated to two SiCMOSFET devices in parallel, the this method effect by coupling inductance, the electric current of parallel branch is equal, and the flow direction that both produce in magnetic core is contrary, equal in magnitude, and the magnetic flux of synthesis is close to zero, thus electric current is inoperative, and then reach the generation of active suppression out-of-balance current.
This method realizes as follows:
According to Ampere circuital theorem:Wherein, n is coil turn, and i is the electric current flowing through coil, and H is magnetic field intensity, and R is the radius of coil;When two coil turns are equal, the differential mode inductance in the loop out-of-balance current to two branch roads, namely differential-mode current Δ id=id1–id2Inhibited, differential mode inductance LdiffWith the induction electromotive force u produced by differential-mode currentdiffMeet:
ΔΦ=Δ BS is different mode flux, and S is the cross-sectional area of magnetic core, and Δ B is magnetic field intensity, it may be assumed that
Δ B=μrμ0(H1-H2) (11),
Wherein, μ0For air permeability, μrFor the relative permeability of magnetic core, H1And H2Respectively by the electric current i flowing through DUT1d1With the i flowing through DUT2d2The magnetic field intensity produced, therefore, by (11) Shi Ke get:
Induction electromotive force u can be obtained by (10) and (12) formuladiffFor:
u d i f f = L d i f f d&Delta;i d d t = &mu; r &mu; 0 n 2 S 2 &pi; R d&Delta;i d d t - - - ( 13 ) ;
Differential mode inductance can be expressed as:Thus, differential-mode current is subject to differential mode inductance L in coupling inductancediffRestriction, its size is by core material μr, size S and coil turn n together decides on;
When stable state, id1=id2, the electric current flowing through coil is equal, and cancelling out each other in the magnetic field produced in magnetic core, does not have coupling between coil.Now, the magnetic flux in coil is and the leakage magnetic flux of air hinge, and coupling inductance is equivalent in loop of power circuit stray inductance
L &sigma; = n 2 &mu; 0 S l - - - ( 15 ) ;
Coupling inductance suppresses the essence of out-of-balance current to be in that: the inductance that out-of-balance current Δ id runs into is the mutual inductance between two coils, relatively larger;What the electric current of each branch road ran into is the leakage inductance of coil, smaller;
Now, DUT1 and DUT2 total current idpWith out-of-balance current idn=Δ id, have:
I = i d p i d n = 1 1 1 - 1 i d 1 i d 2 - - - ( 16 ) ;
Corresponding impedance loop ZpAnd Zn, have:
Z p Z n = 1 1 1 - 1 Z 1 Z 2 + L &sigma; L d i f f - - - ( 17 )
The impedance loop of balanced balanced current and out-of-balance current component when Section 1 is do not adopt coupling inductance on the right of equation, Section 2 is introduced by coupling inductance;Wherein,
Z = Z 1 Z 2 = R 1 + sL 1 + R d s 1 R 1 + sL 1 + R d s 2 - - - ( 18 )
The voltage of DUT1 and DUT2 parallel connected end
v d s = Z T I = Z p Z n i d p i d n = Z p i d p + Z n i d n - - - ( 19 )
Due to vdsFixed for limited constant, and Ldiff>>Lσ, when device is in non-off state, have | Zn|>>|Zp|, the out-of-balance current i of devices in paralleldnCan go to zero, thus reaching the purpose of current balance.
In an experiment, load inductance L is 580 μ H, DUT is the second filial generation SiCMOSFET device C2M0080120D of Cree company, and the loop of power circuit of two devices in parallel DUT1 and DUT2 layout on PCB is balanced as far as possible;Oscillograph adopts the DPO3054, bandwidth 500MHz of Tektronix company;Current sensor adopts the 2877 of Pearson company;Voltage probe adopts the P6139A, bandwidth 500MHz of Tektronix company;The driving pulse of test is obtained by DSP28335 programming;It will be seen that this method can effective current stress between two devices in parallel of active balancing in Fig. 3 and Fig. 4, say, that in Fig. 4, the current curve of DUT1 and DUT2 overlaps, and has reached stress equilibrium.
As shown in Figure 5 and Figure 6, all there is bigger current-unbalance phenomenon in two SiCMOSFET devices in parallel, particularly in dynamic process, maximum imbalance current is about 4A, and the maximum degree of unbalancedness of electric current reaches 40% before and after conducting.When opening dynamic, electric current is inconsistent, and to be because the threshold voltage of two devices inconsistent.Calculate and find: when not having coupling inductance, the turn-on consumption of DUT1 and DUT2 respectively 76.09 μ J and 119.62 μ J, total turn-on consumption is 195.72 μ J;After adopting coupling inductance, turn-on consumption is reduced to 46.15 μ J and 46.40 μ J respectively, and total losses are 92.55 μ J.Visible, after adopting coupling inductance, the loss between device is more uniform, and respective value during relatively without coupling inductance is lower.In addition, when there is no coupling inductance, the peak point current of two DUT respectively 10.56A and 14.16A, there is bigger gap in maximum current stress, after adopting coupling inductance, peak current stresses is reduced to 9.76A and 9.92A respectively, more balanced, as shown in Figure 6, turn on process essentially coincides before and after the electric current id peak of curve of DUT1 and DUT2, and Fig. 9 can be seen that, curve respectively DUT1 and the DUT2 that two peak values are bigger does not adopt the turn-on consumption during method of the present invention, the turn-on consumption that curve is use latter two devices in parallel of the present invention that amplitude is minimum, after adopting the present invention, the loss of two devices in parallel is basically identical, wear leveling, thus ensure that stability in use.
As shown in Figure 7 and Figure 8, in the disconnected journey of switch, before shutoff, there is the difference between current of 1A in two SiCMOSFET device DUT1 and DUT2 in parallel between two DUT, be because the conducting resistance of two devices and loop dead resistance there are differences and causes.After adopting the method for the present invention, this out-of-balance current still had rejection ability.Degree of unbalancedness is reduced to 8% from 21%.When there is no coupling inductance, the turn-off power loss of two DUT respectively 71.32 μ J and 80.40 μ J;After introducing coupling inductance, turn-off power loss is reduced in 79.08 μ J and 81.68 μ J, Fig. 8 respectively it can be seen that DUT1 and the DUT2 current curve in turn off process overlaps, it is achieved that balanced.
What finally illustrate is, above example is only in order to illustrate technical scheme and unrestricted, although the present invention being described in detail with reference to preferred embodiment, it will be understood by those within the art that, technical scheme can be modified or equivalent replacement, without deviating from objective and the scope of technical solution of the present invention, it all should be encompassed in the middle of scope of the presently claimed invention.

Claims (3)

1. the SiCMOSFET current sharing control method based on coupling inductance, it is characterised in that: an inductance coil of all connecting on each branch road of two SiCMOSFET in parallel, and the inductance coil of each branch road is coupled on a public magnetic core.
2. according to claim 1 based on the SiCMOSFET current sharing control method of coupling inductance, it is characterised in that: the equal turn numbers of the inductance coil of each branch road.
3. according to claim 2 based on the SiCMOSFET current sharing control method of coupling inductance, it is characterised in that: according to the coupling inductance electric current according to the balanced each branch road of following method:
According to Ampere circuital theorem:
Wherein, n is coil turn, and i is the electric current flowing through coil, and H is magnetic field intensity, and R is the radius of coil;When two coil turns are equal, differential mode inductance LdiffWith the induction electromotive force u produced by differential-mode currentdiffMeet:
ΔΦ=Δ BS is different mode flux, and S is the cross-sectional area of magnetic core, and Δ B is magnetic field intensity:
△ B=μrμ0(H1-H2) (11), wherein, μ0For air permeability, μrFor the relative permeability of magnetic core, H1And H2Respectively by electric current id1And id2The magnetic field intensity produced, therefore, by (11) Shi Ke get:
&Delta; B = n&mu; r &mu; 0 i d 1 - i d 2 2 &pi; R - - - ( 12 ) ;
Induction electromotive force u can be obtained by (10) and (12) formuladiffFor:
u d i f f = L d i f f d&Delta;i d d t = &mu; r &mu; 0 n 2 S 2 &pi; R d&Delta;i d d t - - - ( 13 ) ;
Differential mode inductance can be expressed as:
When stable state, id1=id2, the electric current flowing through coil is equal, and cancelling out each other in the magnetic field produced in magnetic core, does not have coupling between coil;Now, the magnetic flux in coil is and the leakage magnetic flux of air hinge, and coupling inductance is equivalent in loop of power circuit stray inductance:
Now, DUT1 and DUT2 total current idpWith out-of-balance current idn=Δ id, have:
I = i d p i d n = 1 1 1 - 1 i d 1 i d 2 - - - ( 16 ) ;
Corresponding impedance loop ZpAnd Zn, have:
Z p Z n = 1 1 1 - 1 Z 1 Z 2 + L &sigma; L d i f f - - - ( 17 )
The impedance loop of balanced balanced current and out-of-balance current component when Section 1 is do not adopt coupling inductance on the right of equation, Section 2 is introduced by coupling inductance;Wherein,
Z = Z 1 Z 2 = R 1 + s L 1 + R d s 1 R 1 + sL 1 + R d s 2 - - - ( 18 )
The voltage of DUT1 and DUT2 parallel connected end
v d s = Z T I = Z p Z n i d p i d n = Z p i d p + Z n i d n - - - ( 19 )
Due to vdsFixed for limited constant, and Ldiff>>Lσ, when device is in non-off state, have | Zn|>>|Zp|, the out-of-balance current i of devices in paralleldnGo to zero.
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CN113489287A (en) * 2021-06-09 2021-10-08 西安理工大学 Active parallel current sharing control method for SiCMOS MOSFET module

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