CN105789422A - Preparation method for LED lamp tube, and prepared LED lamp tube and LED lamp - Google Patents
Preparation method for LED lamp tube, and prepared LED lamp tube and LED lamp Download PDFInfo
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- CN105789422A CN105789422A CN201410831226.6A CN201410831226A CN105789422A CN 105789422 A CN105789422 A CN 105789422A CN 201410831226 A CN201410831226 A CN 201410831226A CN 105789422 A CN105789422 A CN 105789422A
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Abstract
The invention provides a preparation method for an LED lamp tube, and the prepared LED lamp tube and LED lamp. The preparation method for the LED lamp tube comprises the steps of assembling an LED chip COB packaging substrate and a glass tube; enabling nanoscale glass powder to be filled into the interior space of the glass tube from the glass tube opening, and enabling all gaps in the glass tube to be filled with the glass powder to form the lamp tube part; and putting the lamp tube part in a thermotank to be sintered until the nanoscale glass powder is converted into a transparent glass body. By adoption of the preparation method for the LED lamp tube, and the prepared LED lamp tube and LED lamp provided by the invention, the problems of poor thermal radiation and the small light extraction angle of the LED chip are solved; and meanwhile, the manufacturing cost is lowered and the effect of environmental protection is promoted.
Description
Technical field
The present invention relates to lighting technical field, particularly relate to the preparation method of a kind of LED lamp tube and the LED lamp tube of preparation thereof and LED lamp.
Background technology
Being currently used in LED lamp tube or the light fixture of illumination, generally all use metal heat sink to dispel the heat, LED chip COB base plate for packaging is mounted on metal heat sink, and not only chip attachment face can not go out light completely, and the heat sink extraction also stopping light with lampshade or light cover joint portion.It addition, metal heat sink generally adopts the noble metals such as aluminum, copper, silver to prepare, the manufacturing cost causing LED lamp tube or light fixture is strengthened by this, and metal heat sink to environment, can be unfavorable for environmental protection after LED lamp tube or light fixture are discarded.Current high light efficiency LED chip is nitrogen gallium indium blue light series, and its backing material is mainly sapphire, and sapphire is non-thermally conductive material, greatly reduces the radiating effect of metal heat sink.Although LED chip can also again at the bottom of thinning even peeling liner after making, to increase the heat conduction of this one side or to go out light, even regardless of expense takes flip-chip (i.e. chip front side be mounted on heat sink on) technology；But thinning in any case or stripping, chip is still gone back remaining sapphire；In addition peel off the cost necessarily increasing LED chip, general lighting chip amount is big and wants low cost, so, generally all do not take substrate desquamation, less see flip-chip and make the LED of general lighting.
To sum up, the LED lamp tube of existing employing metal heat sink or light fixture light draw that angle is little, light ejection efficiency is low, radiating effect is bad, and manufacturing cost is high, not environmentally.
Summary of the invention
In order to solve above-mentioned technical problem, the present invention uses the heat sink metal heat sink thermal component as LED lamp tube or light fixture replacing prior art of glass.
For achieving the above object, the preparation method that the present invention provides a kind of LED lamp tube, including:
By LED chip COB base plate for packaging and glass tubing assembling；
Nanometer glass powder body is filled into glass tube space from glass tubing opening, and all spaces in full glass tubing, form fluorescent tube parts；And
Above-mentioned fluorescent tube parts are put in calorstat and fires, until described nanometer glass powder body is changed into transparent vitreous body.
Wherein, described nanometer glass powder body is made by following steps:
By weight accounting respectively 8% Na2O, 1% Al2O3, 18% B2O3With 73% SiO2Homogeneous phase mixing glass former, this glass material is put into crucible furnace, founds and become vitreous humour material, described glass liquid material wire drawing is made glass fibre and pulverized, being then placed in ball milling altar and carry out ball milling, the center granularity of making is the nanometer glass powder body of 100 to 400 nanometers.
Wherein, before glass material is put into crucible furnace, it is additionally included in glass material to mix the step of titanium dioxide and iron sesquioxide.
Wherein, before LED chip COB base plate for packaging is assembled with glass tubing, also include being coated on LED chip COB base plate for packaging the suspension of nanometer glass powder body and reddish yellow fluorescent material, and at ambient temperature, natural drying solidifies.
Wherein said suspension is prepared by being mixed with reddish yellow fluorescent material, dehydrated alcohol by nanometer glass powder body and carrying out ball milling.
The present invention also provides for a kind of LED lamp tube, including: LED chip COB base plate for packaging, glass tubing and glass are heat sink, wherein
LED chip COB base plate for packaging and glass tubing assembling；
Glass is heat sink to be close to LED chip COB base plate for packaging and is full of all of space of glass tube；And
Described glass is heat sink is the transparent vitreous body fired through calorstat by nanometer glass powder body.
Wherein, described nanometer glass powder body is made by following steps:
By weight accounting respectively 8% Na2O, 1% Al2O3, 18% B2O3With 73% SiO2Homogeneous phase mixing glass former, and put into crucible furnace and found and become vitreous humour material, makes glass fibre by described glass liquid material wire drawing, pulverizes described glass fibre and puts into ball milling altar and carry out ball milling, and the center granularity of making is the nanometer glass powder body of 100 to 400 nanometers.
Wherein, the surface of described LED chip COB base plate for packaging is also covered with the translucent glass body that thickness is 50 to 150 μm fired by nanometer glass powder body, reddish yellow phosphor combination.
Further, the lead-in wire of the lead-in wire of positive terminal and the negative terminal drawn from glass tubing opening is also included.
The present invention also provides for a kind of LED lamp, and this LED lamp includes shell, glass cover-plate and above-mentioned LED lamp tube, and wherein, this LED lamp tube is assemblied in inside shell and glass cover-plate.
Glass is employed heat sink owing to the present invention replaces metal heat sink of the prior art, therefore the LED lamp tube formed and light fixture are capable of following Advantageous Effects: due to the light transmission of glass, glass is heat sink can be centered around around whole LED chip, the light not only not affecting LED chip is drawn, and improve light ejection efficiency, while solving chip cooling, light extraction angle minor issue, replace metal material will greatly reduce manufacturing cost with glass material, and glass heat sink to after abandoning without as metallics to environment.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, below in conjunction with accompanying drawing, the embodiment of the present invention is described, wherein:
Figure 1A is the schematic diagram of the light fixture of the strip glass tubing shape of a kind of bottom lock according to the present invention；And
Figure 1B is the schematic diagram of the light fixture of a kind of strip glass tubing shape at bottom package bead according to the present invention.
Detailed description of the invention
Hereinafter, the preferred embodiment of the present invention will be described in detail with reference to the attached drawings.Noting, in the present description and drawings, substantially the same step and element are denoted by the same reference numerals, and the repetition of explanation of these steps and element will be omitted.
The preparation method that the present invention provides a kind of LED lamp tube.As shown in Figure 1A, Figure 1B, LED chip COB base plate for packaging 1 is assemblied in glass tubing 2, nanometer glass powder body 3 is filled into from the opening portion of glass tubing glass tube all spaces in full LED lamp tube, form fluorescent tube parts；And
Above-mentioned fluorescent tube parts are put in calorstat and fires, until described nanometer glass powder body is changed into transparent vitreous body.
In the preparation method of the LED lamp tube of the present invention, use the heat sink metal heat sink thermal component as LED lamp tube replacing prior art of glass.
Glass how to prepare LED lamp tube is explained below heat sink.
First nanometer glass powder body is prepared:
It is the Na of 8% by weight accounting2O, 1% Al2O3, 18% B2O3With 73% SiO2Material mix homogeneously, and put into crucible furnace and found 10 to 12 hours, become glass liquid material, glass fibre is made in the melted direct wire drawing of glass liquid material, and pulverize, then placing into ball milling altar ball milling more than 72 hours, preparation becomes the nanometer glass powder body of center granularity 100 to 400 nanometers.
It is also preferred that the left be the Na of 8% by weight accounting2O, 1% Al2O3, 18% B2O3With 73% SiO2After material mix homogeneously, it is also possible to mix the metal-oxide such as titanium dioxide and iron sesquioxide with " rich blue light " part absorbing in the light that LED semiconductor chip sends, reduce the injury that human eye is produced by " rich blue light ", and improve light transmittance.The gross weight of the metal-oxide such as titanium dioxide and iron sesquioxide preferably accounts for 50 to the 100ppm (1ppm is equal to 1/1000000th) of glass material.
Secondly, the good nanometer glass powder body 3 of preparation is circulated in glass tubing 2:
LED lamp tube for the tubular type shown in Figure 1A, 1B: put in transparent glass tube 2 by LED chip COB base plate for packaging 1, then pours into nanometer glass powder body 3 in glass tubing 2.Need to rock, vibrate glass tubing in pouring into process, until nanometer glass powder body 3 fully fills the space within transparent glass tube 2, now define LED lamp tube parts to be sintered.
Figure 1A, 1B illustrate only the glass tubing that glass tubing is straight cylindrical shape, and those skilled in the art are it should be clear that any other tubulose, for instance the tubular glass tubing of bending all can as the glass tubing of the present invention.
In order to effectively promote the color rendering properties of LED semiconductor chip, before LED chip COB base plate for packaging 1 is assembled with glass tubing 2, it is possible to the coating of LED chip COB base plate for packaging is contained the suspension of reddish yellow fluorescent material.
Suspension can be made in the following manner: by the above-mentioned nanometer glass powder body prepared according to weight proportion 1:1 and reddish yellow fluorescent material dispensing, the glass powder good according still further to 1kg proportioning and reddish yellow fluorescent material add the mixing of 1000mL dehydrated alcohol, put into ball grinder, after ball grinder is closed, ball milling 12 hours on ball mill, preparation becomes nanometer glass powder body and the suspension of reddish yellow fluorescent material.
This suspension of preparation is coated in the surface of LED chip COB base plate for packaging.Uniformly trickling can be adopted (namely, need in charge cask to add a cover and continuous stirring, prevent liquid layered and precipitation) or uniform feeding method is (namely, slurry and coated workpiece are all controlled, material relies on gravity and viscous consistency trickling, is uniformly distributed and average thickness controls at about 50 to 150 μm) etc. painting method be coated, be fired as translucent glass body by this suspension after follow-up firing.
After coating terminates, at ambient temperature, natural drying solidifies 2 to 3 hours, forms coat；Then it is coated with the LED chip COB base plate for packaging 1 of suspension again through mode as above to put in transparent glass tube 2.
Can first the strand of LED lamp 1 or lead-in wire 41,42 be drawn out to outside LED lamp tube before pouring into nanometer glass powder body, to prevent nanometer glass powder body from hindering strand or the connection of lead-in wire 41,42 after being fired into transparent vitreous body.Such as, for the LED lamp tube of Figure 1A, it is possible to by lead-in wire 42 doubling 180 degree of the negative terminal of LED chip COB base plate for packaging, all draw from the opening of transparent glass tube 2 with the lead-in wire 41 of positive terminal.Or, as shown in Figure 1B, when glass tubing about 2 two ends all have opening, the lead-in wire 42 of the LED chip COB negative terminal encapsulated can be drawn from glass tubing 2 under shed, the lead-in wire 41 of positive terminal is drawn from the upper shed of glass tubing, and encapsulate bead 5 under shed, in order to nanometer glass material 3 is circulated in glass tubing 3 from upper shed.
Finally, fluorescent tube is fired:
Above-mentioned fluorescent tube is put in the calorstat of 300 ± 10 DEG C and fire 30 to 45 minutes, until the glass powder poured into is changed into transparent vitreous body, become glass heat sink.
Owing to nanometer glass powder body is fully circulated into glass tube, so the heat sink glass tube space that is also just filled with of glass being finally fired into, and be close on LED chip COB base plate for packaging.Due to the light transmission of transparent vitreous body, it is heat sink that the light that LED chip sends can pass through this glass.And, surrounding being sent to the LED chip of light, it will not block, as existing metal heat sink, the some light that LED chip sends, and is effectively improved light ejection efficiency.
After sintering makes the transition, it is possible to light source part or lamp part are tested, to check whether light source part or lamp part can be used.Carry out after light source part or lamp part being electrically connected with driver being energized, trying bright inspection.After upchecking, it is possible to the LED lamp tube of above-mentioned preparation is assembled into LED lamp.This LED lamp tube is assembled into LED lamp with shell and transparent glass cover-plate.
The glass of employing the inventive method making is heat sink from the whole exiting surface conduction heat of LED chip, owing to the metal heat sink of prior art can only fit to the back side of chip, can only be conducted heat from substrate one side, and can not conduct from the whole light-emitting area of LED chip hot.Therefore, the present invention is effectively improved the radiating effect of LED.The glass of the present invention is heat sink is conducive to environmental protection, is also beneficial to LED sustainable development.The LED of prior art consumes yellow gold in a large number, metallic aluminium makes heat sink, causes the waste of metal material, and pollutes the environment after discarding.And the formula of the heat sink selection natural material composition of glass of the present invention, it is only necessary to pulverize, be transformed into transparent vitreous body through about 300 DEG C low temperature；Especially after discarded, also only needing Footwall drift, such as lamp holder, metal basal board etc., other parts are pulverized just can fill out road, because the component of glass material is mostly silicon, and silicon accounts for the 70% of composition earth element, is back to nature, is beneficial to environmental protection.
It is understood that above detailed description of the invention is intended to be merely illustrative of the present the exemplary embodiment with the heat sink LED of glass and preparation method thereof, but the invention is not limited in this.For those skilled in the art, without departing under the spirit of the present invention and essence, it is possible to making various modification and improvement, these modification and improvement will be regarded as protection scope of the present invention.
Claims (10)
1. a preparation method for LED lamp tube, including:
By LED chip COB base plate for packaging and glass tubing assembling；
Nanometer glass powder body is filled into glass tube space from glass tubing opening, and all spaces in full glass tubing, form fluorescent tube parts；And
Above-mentioned fluorescent tube parts are put in calorstat and fires, until described nanometer glass powder body is changed into transparent vitreous body.
2. method according to claim 1, wherein, described nanometer glass powder body is made by following steps:
By weight accounting respectively 8% Na2O, 1% Al2O3, 18% B2O3With 73% SiO2Homogeneous phase mixing glass former, this glass material is put into crucible furnace, founds and become vitreous humour material, described glass liquid material wire drawing is made glass fibre and pulverized, being then placed in ball milling altar and carry out ball milling, the center granularity of making is the nanometer glass powder body of 100 to 400 nanometers.
3. method according to claim 2, wherein, before glass material is put into crucible furnace, is additionally included in glass material to mix the step of titanium dioxide and iron sesquioxide.
4. according to the method in claim 2 or 3, wherein, before being assembled with glass tubing by LED chip COB base plate for packaging, also include being coated in by the suspension of nanometer glass powder body and reddish yellow fluorescent material on LED chip COB base plate for packaging, and at ambient temperature, natural drying solidifies.
5. method according to claim 4, wherein said suspension is prepared by being mixed with reddish yellow fluorescent material, dehydrated alcohol by nanometer glass powder body and carrying out ball milling.
6. a LED lamp tube, including: LED chip COB base plate for packaging, glass tubing and glass are heat sink, wherein
LED chip COB base plate for packaging and glass tubing assembling；
Glass is heat sink to be close to LED chip COB base plate for packaging and is full of all of space of glass tube；And
Described glass is heat sink is the transparent vitreous body fired through calorstat by nanometer glass powder body.
7. LED lamp tube according to claim 6, wherein, described nanometer glass powder body is made by following steps:
By weight accounting respectively 8% Na2O, 1% Al2O3, 18% B2O3With 73% SiO2Homogeneous phase mixing glass former, and put into crucible furnace and found and become vitreous humour material, makes glass fibre by described glass liquid material wire drawing, pulverizes described glass fibre and puts into ball milling altar and carry out ball milling, and the center granularity of making is the nanometer glass powder body of 100 to 400 nanometers.
8. LED lamp tube according to claim 7, wherein, the surface of described LED chip COB base plate for packaging is also covered with the translucent glass body that thickness is 50 to 150 μm fired by nanometer glass powder body, reddish yellow phosphor combination.
9. the LED lamp tube according to claim 7 or 8, also includes the lead-in wire of the lead-in wire of positive terminal and the negative terminal drawn from glass tubing opening.
10. a LED lamp, this LED lamp includes shell, glass cover-plate and according to the arbitrary described LED lamp tube of claim 6-9, and wherein, this LED lamp tube is assemblied in inside shell and glass cover-plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410831226.6A CN105789422A (en) | 2014-12-25 | 2014-12-25 | Preparation method for LED lamp tube, and prepared LED lamp tube and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410831226.6A CN105789422A (en) | 2014-12-25 | 2014-12-25 | Preparation method for LED lamp tube, and prepared LED lamp tube and LED lamp |
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| CN105789422A true CN105789422A (en) | 2016-07-20 |
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| CN201410831226.6A Pending CN105789422A (en) | 2014-12-25 | 2014-12-25 | Preparation method for LED lamp tube, and prepared LED lamp tube and LED lamp |
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Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1970481A (en) * | 2006-11-27 | 2007-05-30 | 建大电子(苏州)有限公司 | Cold-cathode fluorescence lamp tube of back light source |
| CN101419962A (en) * | 2007-10-24 | 2009-04-29 | 张守仁 | LED, production method therefore and illuminator manufactured by the LED |
| JP5316232B2 (en) * | 2009-06-04 | 2013-10-16 | コニカミノルタ株式会社 | Method for producing phosphor-dispersed glass |
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Application publication date: 20160720 |
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