CN105742266B - Fixed plastic packaging ontology - Google Patents
Fixed plastic packaging ontology Download PDFInfo
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- CN105742266B CN105742266B CN201610250184.6A CN201610250184A CN105742266B CN 105742266 B CN105742266 B CN 105742266B CN 201610250184 A CN201610250184 A CN 201610250184A CN 105742266 B CN105742266 B CN 105742266B
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- tablet
- plastic packaging
- chip
- epoxy resin
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
Fixed plastic packaging ontology, belongs to electronics and IT products field.It is characterized by comprising the first tablet, the second tablet, chip and epoxy resin plastic packaging blocks, grip chip between the first tablet and the second tablet；Further include weld tabs, is welded and fixed together between the first tablet and the second tablet by weld tabs；Epoxy resin plastic packaging block can single side wrap up the first tablet of plastic packaging, wherein the second tablet and chip are between epoxy resin plastic packaging block and the first tablet.The present invention is able to ascend the sealing compactness and heat-sinking capability of patch encapsulation technology.
Description
Technical field
The invention belongs to electronics and IT products fields, and in particular to a kind of patch packaging system.
Background technique
Patch encapsulation technology existing many years, conventional patch encapsulation technology generally use the frame structure of full closed, adopt
With the product of this structure, compactness and reliability are more stable, but as industry is intended to increasingly product power
Big requirement causes product to develop towards single, high-power direction, and the following heat dissipation problem is the skill firstly the need of solution
Art problem.Therefore, existing product mostly uses superthick cooling fin, half pouch-type encapsulation technology.The shortcomings that half pouch-type encapsulates is plastic packaging
The combination leakproofness of epoxy and copper base is inadequate.Because of epoxy and the copper material that be two kinds of completions different, from associativity,
It cannot accomplish to be fully sealed, and the use environment of product may be quite severe, if do not sealed, moisture is be easy to cause to invade
Generate product failure.If the operation under hot and humid environment long will cause the paralysis of entire route.In addition, traditional encapsulation
Technology generally uses tin cream as welding intermediate medium, but the smearing thickness of tin cream is difficult to keep constant, can not determine best burning
Junction temperature, and sintering process has tin sweat(ing) generation, influences product quality.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of fixed plastic packaging ontologies, are able to ascend patch encapsulation technology
Seal compactness and heat-sinking capability.
In order to solve the above technical problems, the technical scheme is that a kind of invention fixed plastic packaging ontology, including
First tablet, the second tablet, chip and epoxy resin plastic packaging block, grip chip between the first tablet and the second tablet,
It is characterized by also including weld tabs, it is welded and fixed together between the first tablet and the second tablet by weld tabs；Epoxy resin modeling
Sealing block being capable of single side package the first tablet of plastic packaging；Wherein, the second tablet and chip are located at epoxy resin plastic packaging block and the first tablet
Between.
Preferably, latticed kerve is installed in the chip fixed bit of the first tablet.
Preferably, the diversion trench of twice or more is set around the fixed position of the chip of the first tablet.
Preferably, the latticed kerve is connected with diversion trench.
Preferably, burr is set in the groove body of diversion trench.
Preferably, the depth of diversion trench is greater than 1mm.
Preferably, fixed groove, the upper and lower end of epoxy resin plastic packaging block is respectively set in the upper and lower part of the first tablet
It is respectively clamped into fixed groove.
Preferably, burr is set on the fixed groove of the first tablet lower part.
Compared with prior art, the beneficial effects of the present invention are:
1. fixed groove is respectively set in the upper and lower part of the first tablet, the base for being fixed easily epoxy resin plastic packaging block is formed
Plinth, has added the diversion trench of hairiness thorn-like bottom, but can during epoxy forms and melts effective water conservancy diversion.Formed product
When, epoxy resin melts after high temperature, and during flowing, epoxy resin is contacted with the burr in diversion trench, and increase connects
Resistance is touched, it is not easily to fall off after solidification, and it is equipped with twice diversion trench, form dual grip.Water conservancy diversion trench bottom and face have 1-2mm
The depth of left and right prevents the moisture of outside from entering on the chip of frame center position, and enables barrier power more with twice diversion trench
By force.
2. installing latticed kerve in the chip fixed bit of the first tablet, latticed kerve is connected with diversion trench, just
The organic matters such as the stomata or tin sweat(ing) that generate in weld tabs melting process when welding, are effectively volatilized by diversion trench, reach good
The purpose of good Ohmic contact.
3. this product has good heat dissipation performance, and epoxy resin plastic packaging block can for the service performance of product
Single side wraps up the first tablet of plastic packaging, is preferentially radiated using the back exposure of the first tablet of copper, can solve product and used
Fever phenomenon in journey reduces the generation of product failure situation, it is bad to device bring to can reduce harsh working environment
It influences.
4. saying from the reliability of product, capsulation material can be more effectively fixed on by the design of grid kerve and diversion trench
On cooling fin, and this product has passed through the test verifying of the severe tests such as autoclaving.
5. the design of grid kerve and diversion trench forms a guard circle in the surrounding of chip for the quality of production,
Epoxy powder coating material when by water conservancy diversion, due to its special structure the impact force of the epoxy resin of flowing is formed it is slow
Punching, reduces the impact dynamics to chip, is effectively reduced a possibility that chip is impaired, improves yield rate.
6. solving the unevenness because of tin amount instead of the uncontrollable tin cream of thickness with the uniform weld tabs of thickness, can not determining
The problem of suitably welding furnace temperature, and causing tin sweat(ing) to generate, influence product quality.
Detailed description of the invention
Fig. 1 is into the structural schematic diagram of the first tablet of plate；
Fig. 2 is the structural schematic diagram of the first tablet of monolithic；
Fig. 3 is the A-A of Fig. 2 to structural schematic diagram；
Fig. 4 is the structural schematic diagram of the second tablet；
Fig. 5 is the paster structure schematic diagram at plate after welding；
Fig. 6 is the paster structure schematic diagram of the monolithic after welding；
Fig. 7 is the B-B direction structural schematic diagram of Fig. 6；
Fig. 8 is finished product structure schematic diagram of the present invention at plate；
Fig. 9 is finished product rearview of the present invention at plate；
Figure 10 is the finished product structure schematic diagram of monolithic of the present invention；
Figure 11 is the finished product rearview of monolithic of the present invention；
Figure 12 is the C-C of Figure 10 to structural schematic diagram.
In figure: 1, the first tablet: 1.1, diversion trench；1.2, latticed kerve；1.3, fixed groove；
2, the second tablet；3, weld tabs；4, chip；5, epoxy resin plastic packaging block.
Specific embodiment
Present invention is further described in detail with specific embodiment with reference to the accompanying drawing.
As shown in figs. 10-12, fixed plastic packaging ontology of the present invention, including the first tablet 1, the second tablet 2, chip 4
With epoxy resin plastic packaging block 5, chip 4 is gripped between the first tablet 1 and the second tablet 2.It further include weld tabs 3, the first material
It is welded and fixed together between piece 1 and the second tablet 2 by weld tabs 3；Epoxy resin plastic packaging block 5 being capable of single side package plastic packaging first
Tablet 1；Wherein, the second tablet 2 and chip 4 are located between epoxy resin plastic packaging block 5 and the first tablet 1.
As shown in Figure 1-3, the chip fixed bit in the first tablet 1 installs latticed kerve 1.2.In the first tablet 1
The diversion trench 1.1 of twice or more is set around the fixed position of chip.The latticed kerve 1.2 is connected with diversion trench 1.1.
Burr is set in the groove body of diversion trench 1.1.The depth of diversion trench 1.1 is greater than 1mm.In the upper and lower part of the first tablet 1 point
Not She Zhi fixed groove 1.3, the upper and lower end of epoxy resin plastic packaging block 5 is respectively clamped into fixed groove 1.3.Under the first tablet 1
Burr is set on the fixed groove 1.3 in portion.The structure of second tablet is as shown in Figure 4.
Production process of the invention is as follows, clamps chip 4 with two panels weld tabs 3 first and is placed on the second tablet 2, then most
The first tablet 1 is placed in top, enables welding position to just, is then carried out high temperature sintering in a mold, obtained as illustrated in figs. 5-7
Structure.Epoxy resin single side encapsulation process link is then carried out, the epoxy resin of thawing is contacted with the burr in diversion trench, is increased
Add contact resistance, it is not easily to fall off after solidification.Epoxy resin plastic packaging block 5 being capable of single side package the first tablet of plastic packaging 1；Wherein, second
Tablet 2 and chip 4, by 5 plastic packaging of epoxy resin plastic packaging block between epoxy resin plastic packaging block 5 and the first tablet 1.Epoxy resin modeling
The upper and lower end of envelope block 5 is respectively clamped into fixed groove 1.3, and fixation is stronger.
Product after molding has excellent heat dissipation and sealing performance, is tested by the test of the severe tests such as autoclaving
Card, weatherability is strong, is suitable in industry popularizing production.
The above described is only a preferred embodiment of the present invention, being not that the invention has other forms of limitations, appoint
It is the present invention that those skilled in the art, which is combined possibly also with the technology contents of the disclosure above, changes or retrofits,
Equivalent embodiment.But without departing from the technical solutions of the present invention, implement according to the technical essence of the invention to above
Any simple modification, equivalent variations and remodeling, still fall within the protection scope of technical solution of the present invention made by example.
Claims (3)
1. a kind of fixed plastic packaging ontology, including the first tablet, the second tablet, chip and epoxy resin plastic packaging block, in the first tablet
And second grip chip between tablet, it is characterised in that: further include weld tabs, pass through weldering between the first tablet and the second tablet
Piece is welded and fixed together；Epoxy resin plastic packaging block can single side wrap up the first tablet of plastic packaging, wherein the second tablet and chip position
Between epoxy resin plastic packaging block and the first tablet；
Latticed kerve is installed in the chip fixed bit of the first tablet；
The diversion trench of twice or more is set around the fixed position of chip of the first tablet；
The latticed kerve is connected with diversion trench；
Burr is set in the groove body of diversion trench；
The depth of diversion trench is greater than 1mm.
2. fixed plastic packaging ontology according to claim 1, it is characterised in that: set respectively in the upper and lower part of the first tablet
Fixed groove is set, the upper and lower end of epoxy resin plastic packaging block is respectively clamped into fixed groove.
3. fixed plastic packaging ontology according to claim 1, it is characterised in that: set on the fixed groove of the first tablet lower part
Set burr.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610250184.6A CN105742266B (en) | 2016-04-21 | 2016-04-21 | Fixed plastic packaging ontology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610250184.6A CN105742266B (en) | 2016-04-21 | 2016-04-21 | Fixed plastic packaging ontology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105742266A CN105742266A (en) | 2016-07-06 |
| CN105742266B true CN105742266B (en) | 2019-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610250184.6A Active CN105742266B (en) | 2016-04-21 | 2016-04-21 | Fixed plastic packaging ontology |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201838576U (en) * | 2010-09-04 | 2011-05-18 | 江苏长电科技股份有限公司 | Single packaging structure for direct arranging of chip with double-sided graphics |
| CN202957235U (en) * | 2012-12-14 | 2013-05-29 | 重庆平伟实业股份有限公司 | Solder anti-flowing device for material of surface mount diode |
| CN205645800U (en) * | 2016-04-21 | 2016-10-12 | 淄博晨启电子有限公司 | Fixed plastic envelope body |
-
2016
- 2016-04-21 CN CN201610250184.6A patent/CN105742266B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201838576U (en) * | 2010-09-04 | 2011-05-18 | 江苏长电科技股份有限公司 | Single packaging structure for direct arranging of chip with double-sided graphics |
| CN202957235U (en) * | 2012-12-14 | 2013-05-29 | 重庆平伟实业股份有限公司 | Solder anti-flowing device for material of surface mount diode |
| CN205645800U (en) * | 2016-04-21 | 2016-10-12 | 淄博晨启电子有限公司 | Fixed plastic envelope body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105742266A (en) | 2016-07-06 |
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