CN205508751U - Thermal fuse - Google Patents

Thermal fuse Download PDF

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Publication number
CN205508751U
CN205508751U CN201620070339.3U CN201620070339U CN205508751U CN 205508751 U CN205508751 U CN 205508751U CN 201620070339 U CN201620070339 U CN 201620070339U CN 205508751 U CN205508751 U CN 205508751U
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CN
China
Prior art keywords
pin
shell
fusible alloy
frame
pin frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620070339.3U
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Chinese (zh)
Inventor
黄泉善
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Individual
Original Assignee
Individual
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Filing date
Publication date
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Priority to CN201620070339.3U priority Critical patent/CN205508751U/en
Application granted granted Critical
Publication of CN205508751U publication Critical patent/CN205508751U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a thermal fuse, including the pin, the resin seals, and a housing, flux disconnected dose, fusible alloy, the head of pin and fusible alloy's both ends welded connection, fusible alloy and partial pin are by sealing the resin package in the shell insulates the space, the shell with seal the airtight space in inside of resin package in pack the disconnected agent of fluxing, an installation pin frame is used for fixed pin in the shell, the both sides of pin frame have the support limit that a pair of slant set up, the obliquely support the limit alternately have on the position with pin corresponding ground pin hole, the centre of pin frame has one to the discharge orifice, upper portion and lower part to the discharge orifice set up a main notch respectively, it also has a side notch to support the edge. The utility model discloses, utilizing the pin frame to ensure that fusible alloy and two pins are in position placed in the middle in the shell, sealing the in -process that toasts solidification of resin, the skew can not take place in the position of the inside of shell for fusible alloy and two pins to avoid the hidden danger that thermal fuse can not break off under the breakpoint temperature.

Description

A kind of Thermal Cutoffs
Technical field
This utility model relates to special resistance product scope in electronic circuit, particularly relates to a kind of Thermal Cutoffs.
Background technology
Thermal Cutoffs is the most reducible device of one-time action, is widely used in the Thermal protection of equipment, prevents one or more position from reaching the temperature of danger under fault conditions.Existing Thermal Cutoffs is mainly based on alloy-type temperature fuse, it is made up of the fusible alloy with low melting point and disconnected agent of fluxing, it is encapsulated in the shell of plastics or pottery, in normal operating conditions, fusible alloy and two pins keep connecting, when Thermal Cutoffs is experienced abnormal heating and reaches predetermined melting temperature, fusible alloy melts, and disconnecting circuit under the effect of disconnected agent of fluxing.
nullThe Thermal Cutoffs of prior art,During producing,First in shell, fill certain disconnected agent of fluxing,Then at heating condition,Disconnected agent of fluxing in shell is the disconnected agent of fluxing being inserted in shell by two pins being welded with fusible alloy under semi-solid state,Sealing resin is coated at last faucal outside,And its product is toasted,Make to seal resin solidification,Obtain the finished product that can use,But,Prior art,During the baking-curing of sealing resin,The disconnected agent of fluxing of enclosure is the most easily susceptible to soften even melt,Thus,Fusible alloy and two pins are easy to offset in the position of the inside of shell,Make fusible alloy and two pins can not be centered at the inside of shell,Fusible alloy and two pins are partial to the side of shell,It is on the low side that the consequence caused is exactly the disconnected agent of fluxing of fusible alloy cladding,During use,Flux disconnected agent fusible alloy contraction is weakened,Therefore will result in the situation that Thermal Cutoffs can not disconnect under breakpoint temperature or breakpoint temperature is higher,Certain hidden danger is brought to using,Therefore,Based on security concern,This utility model provides a kind of Thermal Cutoffs,Structurally carry out anti-offset design,During can effectively reducing the baking-curing of sealing resin,Fusible alloy and the situation of two pin offset,Avoid the hidden danger that Thermal Cutoffs can not disconnect under breakpoint temperature.
Summary of the invention
This utility model is realized by below scheme: a kind of Thermal Cutoffs, including pin, sealing resin, shell, flux disconnected agent, fusible alloy, the head of pin and the two ends of fusible alloy are welded to connect, fusible alloy and part pin are by sealing resin-encapsulated in shell insulating space, and fill, in the inside confined space of shell and sealing resin-encapsulated, disconnected agent of fluxing, it is characterized in that: in described shell, be mounted with that a pin frame is for fixing pin, the both sides of described pin frame have a pair angularly disposed support edge, have in oblique support edge crossover sites and pin pin bores accordingly, the centre of described pin frame has one for convection holes that disconnected agent of fluxing is passed through, the upper and lower of convection holes is also respectively provided with a main recess, and also there is on described support edge a side recess.Utilizing four oblique support edges on pin frame, pin frame can be relatively fixed the inside at shell, utilizes on pin frame two pin bores to be fixed by two pins, it is ensured that fusible alloy and two pins are in middle position in the enclosure.
This utility model, utilizes pin frame, and during the baking-curing of sealing resin, fusible alloy and two pins will not offset in the position of the inside of shell, thus avoid the hidden danger that Thermal Cutoffs can not disconnect under breakpoint temperature.
This utility model, pin frame can be by the chamber being partitioned into two, left and right of enclosure, two, left and right chamber is by the convection holes on pin frame and two mutual UNICOMs of main recess of the upper and lower of convection holes, at Thermal Cutoffs when arriving breakpoint temperature, disconnected agent of fluxing can be transmitted by the convection current of convection holes and main recess, it is simple to fusible alloy is shunk in disconnected agent of fluxing.
This utility model, oblique support edge on pin frame forms the chamber of two sidepieces, side recess is set on support edge, the chamber and two, the left and right chamber that make two sidepieces that supported on both sides limit formed communicate, Thermal Cutoffs is during using, the heat produced on pin can strengthen heat exchange by side recess, it is simple to fusible alloy is shunk in disconnected agent of fluxing.
Accompanying drawing explanation
Fig. 1 is this utility model schematic cross-section.
Axonometric chart when Fig. 2 is shell installation fusible alloy and two pins.
Fig. 3 is pin frame schematic perspective view.
Fig. 4 is Fig. 3 front view.
Fig. 5 is Fig. 3 top view.
Fig. 6 is Fig. 3 left view.
Wherein: 1-pin, 2-sealing resin, 3-shell, 4-are fluxed disconnected agent, 5-fusible alloy, 6-pin frame, 61-pin bores, 62-convection holes, the main recess of 63-, 64-side recess, 65-support edge.
Detailed description of the invention
nullA kind of Thermal Cutoffs,Including pin (1)、Sealing resin (2)、Shell (3)、Flux disconnected agent (4)、Fusible alloy (5),The head of pin (1) and the two ends of fusible alloy (5) are welded to connect,Fusible alloy (5) and part pin (1) are encapsulated in shell (3) insulating space by sealing resin (2),And fill, in the inside confined space that shell (3) and sealing resin (2) encapsulate, disconnected agent (4) of fluxing,It is mounted with in shell (3) that a pin frame (6) is used for fixing pin (1),The both sides of pin frame (6) have a pair angularly disposed support edge (65),Have and pin (1) pin bores accordingly (61) in oblique support edge (65) crossover sites,There is one in the centre of pin frame (6) for convection holes (62) that disconnected agent (4) of fluxing is passed through,The upper and lower of convection holes (62) is also respectively provided with a main recess (63),And also there is on described support edge (65) a side recess (64).Utilize four oblique support edges (65) on pin frame (6), pin frame (6) can be relatively fixed the inside in shell (3), two pin bores (61) on pin frame (6) are utilized two pins (1) to be fixed, it is ensured that fusible alloy (5) and two pins (1) are in middle position in shell (3).
During assembling, two pins (1) that first will be welded with fusible alloy (5) are inserted in two pin bores (61) of pin frame (6), after pin frame (6) is directly nested in the inside of shell (3), by four support edges (65) on pin frame (6), pin frame (6) can be relatively fixed the inside in shell (3), fill certain semi liquid state in the shell (3) to flux disconnected agent (4), last coating at shell (3) mouth seals resin (2), and its product is toasted, make to seal resin (2) solidification, obtain the finished product that can use.

Claims (1)

1. a Thermal Cutoffs, including pin, sealing resin, shell, flux disconnected agent, fusible alloy, the head of pin and the two ends of fusible alloy are welded to connect, fusible alloy and part pin are by sealing resin-encapsulated in shell insulating space, and fill, in the inside confined space of shell and sealing resin-encapsulated, disconnected agent of fluxing, it is characterized in that: in described shell, be mounted with that a pin frame is for fixing pin, the both sides of described pin frame have a pair angularly disposed support edge, have in oblique support edge crossover sites and pin pin bores accordingly, the centre of described pin frame has one for convection holes that disconnected agent of fluxing is passed through, the upper and lower of convection holes is also respectively provided with a main recess, and also there is on described support edge a side recess.
CN201620070339.3U 2016-01-26 2016-01-26 Thermal fuse Expired - Fee Related CN205508751U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620070339.3U CN205508751U (en) 2016-01-26 2016-01-26 Thermal fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620070339.3U CN205508751U (en) 2016-01-26 2016-01-26 Thermal fuse

Publications (1)

Publication Number Publication Date
CN205508751U true CN205508751U (en) 2016-08-24

Family

ID=56721843

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620070339.3U Expired - Fee Related CN205508751U (en) 2016-01-26 2016-01-26 Thermal fuse

Country Status (1)

Country Link
CN (1) CN205508751U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106601570A (en) * 2017-01-10 2017-04-26 上海查尔斯电子有限公司 Fuse
CN108717159A (en) * 2018-05-25 2018-10-30 上海华岭集成电路技术股份有限公司 A kind of probe card for integrated circuit test and test system protection structure
WO2019001590A1 (en) * 2017-06-30 2019-01-03 厦门赛尔特电子有限公司 High-voltage direct-current thermal fuse

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106601570A (en) * 2017-01-10 2017-04-26 上海查尔斯电子有限公司 Fuse
WO2019001590A1 (en) * 2017-06-30 2019-01-03 厦门赛尔特电子有限公司 High-voltage direct-current thermal fuse
US11049683B2 (en) 2017-06-30 2021-06-29 Xiamen Set Electronics Co., Ltd High-voltage direct-current thermal fuse
CN108717159A (en) * 2018-05-25 2018-10-30 上海华岭集成电路技术股份有限公司 A kind of probe card for integrated circuit test and test system protection structure

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160824

Termination date: 20170126