CN105712283A - LCC package stress release structure - Google Patents
LCC package stress release structure Download PDFInfo
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- CN105712283A CN105712283A CN201410720844.3A CN201410720844A CN105712283A CN 105712283 A CN105712283 A CN 105712283A CN 201410720844 A CN201410720844 A CN 201410720844A CN 105712283 A CN105712283 A CN 105712283A
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- release structure
- stress release
- lcc
- anchor point
- strain relief
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Abstract
The invention belongs to the packaging field, and specifically relates to an LCC package stress release structure. The LCC package stress release structure comprises a stress release structure matched with the shape of a chip, and the stress release structure is provided with an anchor point and a supporting point; and the anchor point and the supporting point are connected with each other through a connecting beam. The LCC package stress release structure provided by the invention has the following effects: 1), on the premise of not changing original LCC shell materials and increasing the process cost, the stress release structure can effectively reduce thermal stresses caused by the mismatch of the material thermal expansion coefficients; 2), on the premise of not obviously increasing the volume, the stress release structure located inside an LCC shell can effectively isolate and attenuate external vibration, impact and other mechanical inputs, reduce mechanical stresses, protect the chip, and improve the mechanical environment adaptability of a system.
Description
Technical field
The invention belongs to encapsulation field, be specifically related to a kind of LCC encapsulation stress release structure.
Background technology
LCC encapsulation is the packing forms that MEMS is common, as it is shown in figure 1, have batch micro operations, low cost and other advantages, it is possible to provide fine vacuum high stable closed environment for MEMS sensing element (chip), be beneficial to the small integrated of the system of realization simultaneously；It is now widely used in the encapsulation such as MEMS gyro, mems accelerometer.
Existing LCC encapsulation in, usually by gold tin solder by MEMS chip and LCC housing Direct Bonding, as in figure 2 it is shown, this packaged type there are the following problems.
1) LCC case material generally selects Al2O3Pottery, its thermal coefficient of expansion is 6～7ppm/ DEG C, and MEMS chip is generally silicon materials, and its thermal coefficient of expansion is 2～3ppm/ DEG C.MEMS package generally need to adapt to bigger range of temperature, and such as room temperature～+300 DEG C, thermal coefficient of expansion bigger between LCC housing and chip does not mate and very easily produces stress, and then worsens the overall performance of system.
2) MEMS chip characteristic size is generally in micron dimension, part also adopts cantilever design, relatively fragile, directly LCC housing is welded with chip and be easily introduced the interference of the mechanics such as extraneous vibration, impact, on the one hand bigger challenge is proposed MEMS chip intensity, it is easily caused material creep and sluggishness on the other hand, and then reduces the mechanical environment adaptability of system.
The AlN ceramic selecting thermal coefficient of expansion relatively small can reduce encapsulation stress to a certain extent as LCC case material, but its price is up to Al2O37～10 times of pottery, considerably increases cost.
Summary of the invention
It is an object of the invention to the defect for prior art, it is provided that a kind of LCC encapsulation stress release structure.
The present invention is achieved in that a kind of LCC encapsulation stress release structure, including the strain relief with chip form fit, strain relief arranges anchor point and the strong point, is connected by tie-beam between anchor point and the strong point.
A kind of LCC encapsulation stress release structure as above, wherein, described anchor point is centrally disposed, and the strong point is arranged on surrounding.
A kind of LCC encapsulation stress release structure as above, wherein, described anchor point is arranged on strain relief center, being shaped as of anchor point is square or circular, anchor point is connected with LCC housing by the mode of bonding or gluing, and centered by anchor point, radioactivity arranges 4 or more tie-beam, arranging the strong point with tie-beam quantity Matching in strain relief outermost, the strong point is connected by tie-beam with anchor point.
A kind of LCC encapsulation stress release structure as above, wherein, anchor point is arranged below being anchored boss.
A kind of LCC encapsulation stress release structure as above, wherein, described anchor point is arranged on surrounding, and the strong point is centrally disposed.
A kind of LCC encapsulation stress release structure as above, wherein, described anchor point is arranged on strain relief surrounding, being shaped as of anchor point is square or circular, anchor point is connected with LCC housing by the mode of bonding or gluing, and by anchor point for pinpointing centered by strain relief geometric center, radioactivity arranges 4 or more tie-beam, arrange the strong point with tie-beam quantity Matching in strain relief center, the strong point is connected by tie-beam with anchor point.
A kind of LCC encapsulation stress release structure as above, wherein, anchor point is arranged below being anchored boss.
A kind of LCC encapsulation stress release structure as above, wherein, the material of strain relief is 7740 glass or 4J44 iron cobalt nickel alloy.
The effect of the present invention is: 1) under the premise not changing original LCC case material, increase process costs, can effectively be reduced by strain relief and not mate the thermal stress caused because of material thermal expansion coefficient.2) under the premise not enlarging markedly volume, by be positioned at the strain relief of LCC enclosure interior can be effectively isolated and decay the mechanics such as extraneous vibration, impact input, reduce mechanical stress, protection chip, promote system mechanical environment adaptability.
Accompanying drawing explanation
Fig. 1 is that MEMS LCC encapsulates schematic diagram；
Fig. 2 is that a kind of existing LCC encapsulates sectional view；
Fig. 3 is a kind of strain relief that the present invention is corresponding；
Fig. 4 is the encapsulation combination schematic diagram that strain relief shown in Fig. 3 is corresponding；
Fig. 5 is the another kind of strain relief that the present invention is corresponding；
Fig. 6 is the encapsulation combination schematic diagram that strain relief shown in Fig. 5 is corresponding.
In figure: 1.LCC housing, 2. chip, 3. solder, 4. strain relief, 41. anchor points, 42. tie-beams, 43. frames, 44. bonding regions, 411. anchor boss, 5. strain reliefs, 51. tie-beams, 52. frames, 53. anchor points, 531. anchor boss.
Detailed description of the invention
Embodiment 1
As it is shown on figure 3, a kind of LCC encapsulation stress release structure symmetrically formula distribution, mainly it is made up of anchor point 41, tie-beam 42, frame 43 and bonding region 44 etc..Anchor point 41 is centrally located, and is generally square or circular, and its underpart is for being anchored boss 411, and the mode that can pass through bonding or gluing is connected with LCC housing.Tie-beam 42 is radially uniformly distributed in anchor point surrounding, is generally at least 4.Frame 43 is connected with the other end of tie-beam 42, is distributed in outside, and frame 43 and tie-beam 42 constitute cantilever style combined beam structure, can be equivalent to spring, it is possible to be effectively isolated stress.Bonding region 44 is evenly distributed on the drift angle place of frame, is generally square or circular, and its top can be passed through the mode of bonding or gluing and be connected with chip bottom, plays a supportive role.
The global shape of strain relief 4 correspondingly can adjust according to chip profile, is generally square or circular, can choose the material close with chip body material thermal expansion coefficient, such as 7740 glass or 4J44 iron cobalt nickel alloy etc..
The combination schematic diagram of LCC housing 1, chip 2 and strain relief 4 is as shown in Figure 4.
The feature of strain relief 4 is that center is anchored, surrounding supports.
Embodiment 2
Another mutation of the present invention is as shown in Figure 5.
Strain relief 5 symmetrically formula is distributed, and is mainly made up of tie-beam 51, frame 52, anchor point 53 etc..Tie-beam 51 is radially uniformly distributed around center, is generally at least 4, and its top can be passed through the mode of bonding or gluing and be connected with chip bottom, plays a supportive role.Frame 52 is connected with tie-beam 51, is distributed in outside, and frame 52 and tie-beam 51 constitute cantilever style combined beam structure, can be equivalent to spring, it is possible to be effectively isolated stress.Anchor point 53 is evenly distributed on the drift angle place of frame, is generally square or circular, and its underpart is for being anchored boss 531, and the mode that can pass through bonding or gluing is connected with LCC housing.
Strain relief 5 adopts surrounding to be anchored, the mode of central supported.
The global shape of strain relief 5 correspondingly can adjust according to chip profile, is generally square or circular, can choose the material close with chip body material thermal expansion coefficient, such as 7740 glass or 4J44 iron cobalt nickel alloy etc..
The combination schematic diagram of LCC housing 1, chip 2 and strain relief 5 is as shown in Figure 6.
Claims (8)
1. a LCC encapsulation stress release structure, including the strain relief with chip form fit, it is characterised in that: strain relief arranges anchor point and the strong point, is connected by tie-beam between anchor point and the strong point.
2. a kind of LCC encapsulation stress release structure as claimed in claim 1, it is characterised in that: described anchor point is centrally disposed, and the strong point is arranged on surrounding.
3. a kind of LCC encapsulation stress release structure as claimed in claim 2, it is characterized in that: described anchor point is arranged on strain relief center, being shaped as of anchor point is square or circular, anchor point is connected with LCC housing by the mode of bonding or gluing, centered by anchor point, radioactivity arranges 4 or more tie-beam, arranges the strong point with tie-beam quantity Matching in strain relief outermost, and the strong point is connected by tie-beam with anchor point.
4. a kind of LCC encapsulation stress release structure as claimed in claim 3, it is characterised in that: anchor point is arranged below being anchored boss.
5. a kind of LCC encapsulation stress release structure as claimed in claim 1, it is characterised in that: described anchor point is arranged on surrounding, and the strong point is centrally disposed.
6. a kind of LCC encapsulation stress release structure as claimed in claim 5, it is characterized in that: described anchor point is arranged on strain relief surrounding, being shaped as of anchor point is square or circular, anchor point is connected with LCC housing by the mode of bonding or gluing, by anchor point for pinpointing centered by strain relief geometric center, radioactivity arranges 4 or more tie-beam, arranges the strong point with tie-beam quantity Matching in strain relief center, and the strong point is connected by tie-beam with anchor point.
7. a kind of LCC encapsulation stress release structure as claimed in claim 6, it is characterised in that: anchor point is arranged below being anchored boss.
8. a kind of LCC encapsulation stress release structure as described in any one claim in claim 1～7, it is characterised in that: the material of strain relief is 7740 glass or 4J44 iron cobalt nickel alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410720844.3A CN105712283B (en) | 2014-12-02 | 2014-12-02 | A kind of LCC encapsulation stress release structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410720844.3A CN105712283B (en) | 2014-12-02 | 2014-12-02 | A kind of LCC encapsulation stress release structure |
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| Publication Number | Publication Date |
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| CN105712283A true CN105712283A (en) | 2016-06-29 |
| CN105712283B CN105712283B (en) | 2018-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410720844.3A Active CN105712283B (en) | 2014-12-02 | 2014-12-02 | A kind of LCC encapsulation stress release structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108358160A (en) * | 2018-04-18 | 2018-08-03 | 中国兵器工业集团第二四研究所苏州研发中心 | The MEMS device encapsulating structure of the releasable stress of lift-on/lift-off type |
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| CN1678513A (en) * | 2002-09-04 | 2005-10-05 | 模拟设备公司 | Microchip with thermal stress relief means |
| KR20070111608A (en) * | 2006-05-18 | 2007-11-22 | 삼성전기주식회사 | Mems package and manufacturing method thereof |
| CN101920926A (en) * | 2010-09-30 | 2010-12-22 | 无锡中微高科电子有限公司 | Unmatched seal stress release structure |
| CN102040186A (en) * | 2010-11-09 | 2011-05-04 | 北京自动化控制设备研究所 | High vacuum ceramic LCC packaging method |
| CN202886664U (en) * | 2012-11-19 | 2013-04-17 | 青岛海信宽带多媒体技术有限公司 | Optical module adopting LCC (Leadless Chip Carrier) packaging structure |
| CN203238029U (en) * | 2013-04-22 | 2013-10-16 | 安徽北方芯动联科微系统技术有限公司 | MEMS element provided with structure reducing packaging stress |
| CN103500737A (en) * | 2013-10-24 | 2014-01-08 | 中国兵器工业集团第二一四研究所苏州研发中心 | Overload-resistant integral LCC (Leadless Chip Carrier) package based on LTCC (Low Temperature Co-Fired Ceramic) substrate |
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2014
- 2014-12-02 CN CN201410720844.3A patent/CN105712283B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1678513A (en) * | 2002-09-04 | 2005-10-05 | 模拟设备公司 | Microchip with thermal stress relief means |
| KR20070111608A (en) * | 2006-05-18 | 2007-11-22 | 삼성전기주식회사 | Mems package and manufacturing method thereof |
| CN101920926A (en) * | 2010-09-30 | 2010-12-22 | 无锡中微高科电子有限公司 | Unmatched seal stress release structure |
| CN102040186A (en) * | 2010-11-09 | 2011-05-04 | 北京自动化控制设备研究所 | High vacuum ceramic LCC packaging method |
| CN202886664U (en) * | 2012-11-19 | 2013-04-17 | 青岛海信宽带多媒体技术有限公司 | Optical module adopting LCC (Leadless Chip Carrier) packaging structure |
| CN203238029U (en) * | 2013-04-22 | 2013-10-16 | 安徽北方芯动联科微系统技术有限公司 | MEMS element provided with structure reducing packaging stress |
| CN103500737A (en) * | 2013-10-24 | 2014-01-08 | 中国兵器工业集团第二一四研究所苏州研发中心 | Overload-resistant integral LCC (Leadless Chip Carrier) package based on LTCC (Low Temperature Co-Fired Ceramic) substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108358160A (en) * | 2018-04-18 | 2018-08-03 | 中国兵器工业集团第二四研究所苏州研发中心 | The MEMS device encapsulating structure of the releasable stress of lift-on/lift-off type |
| CN108358160B (en) * | 2018-04-18 | 2023-08-01 | 中国兵器工业集团第二一四研究所苏州研发中心 | Hoisting type MEMS device packaging structure capable of releasing stress |
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| Publication number | Publication date |
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| CN105712283B (en) | 2018-07-31 |
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