CN105711228A - Substrate attaching method and attaching unit - Google Patents
Substrate attaching method and attaching unit Download PDFInfo
- Publication number
- CN105711228A CN105711228A CN201610039169.7A CN201610039169A CN105711228A CN 105711228 A CN105711228 A CN 105711228A CN 201610039169 A CN201610039169 A CN 201610039169A CN 105711228 A CN105711228 A CN 105711228A
- Authority
- CN
- China
- Prior art keywords
- substrate
- unit
- substrate processing
- transport
- attaching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
Abstract
An attaching unit is provided which comprises a substrate arrangement unit, a vacuum cavity, an exhaust unit and a plurality of attaching force applying devices. The substrate arrangement unit arranges transported processing substrates and substrates for transportation. The exhaust unit exhausts the inside of the vacuum cavity to produce a vacuum. When the process substrates and the substrates for delivery are attached, no adhesive material is used, the plurality of attaching force applying devices respectively control the produced attaching forces so as to apply different attaching forces for attachement according to substrate positions. According to the above structure, the damage in the procedure of transporting processing substrates is minimized even through thin processing substrates are used.
Description
This case is divisional application, and its female case is the application that the application number being entitled as " method for bonding substrate " is 2012101695973 submitted on May 28th, 2012, and its priority date is December in 2011 30.
Technical field
The present invention relates to a kind of method for bonding substrate and laminating unit, more particularly, it relates to the method for bonding substrate of substrate processing and transport substrate and laminating unit.
Background technology
Recently, the thickness requirement slimming to the display device adopting LCD, OLED etc..Slimming for display device, it is necessary to by colored filter (CF) substrate, TFT substrate, oled substrate self thickness do thin.
At present, removed the glass substrate portion of these substrate processings by etch process, so that lower thickness.But, this etch process is costly, therefore becomes the reason (Korea S special permission publication number 10-2005-0076108) of cost increase.
On the other hand, if using the substrate processing that thickness is thin at the very start, then there is the problem manufacturing and being easily damaged in transport process.
At first technical literature
Patent documentation
Korea S special permission publication number 10-2005-0076108
Summary of the invention
Need to develop and also be able to, even with thin substrate processing, the method and system that make the damage in substrate processing transport process minimize.
The technical problem of the present invention is not limited in above mentioned technical problem, and those skilled in the art can be expressly understood that other technical problem NM by following record.
The method for bonding substrate that the present invention for solving described problem relates to, comprises the steps: a) to prepare substrate processing and transport substrate；B) by described substrate processing and described transport base plate transfer to laminating unit；C) after described laminating unit forms vacuum state, fit described substrate processing and described transport substrate time, do not use jointing material, multiple adhesive force bringing devices control produced adhesive force respectively, in order to apply different adhesive forces by substrate position and fit.
Additionally, the present invention also provides for a kind of laminating unit, including substrate arrangement unit, vacuum chamber, exhaust unit and multiple adhesive force bringing device, the described substrate arrangement unit substrate processing to moving into and transport substrate arrange, described vacuum chamber is exhausted and forms vacuum by described exhaust unit, when described substrate processing of fitting is with described transport substrate, do not use jointing material, produced adhesive force is controlled respectively, in order to apply different adhesive forces by substrate position and fit by the plurality of adhesive force bringing device.
According to the present invention, it also is able to make the damage in substrate processing transport process minimize even with thin substrate processing.
The technique effect of the present invention is not limited in above mentioned effect, and those skilled in the art can be expressly understood that other technique effect NM by following record.
Accompanying drawing explanation
Fig. 1 is an illustration for the schematic diagram of the baseplate-laminating process that embodiments of the invention relate to.
Fig. 2 is the module map of the Base Plate Lamination Device that embodiments of the invention relate to.
Fig. 3 is the flow chart of the method for bonding substrate that embodiments of the invention relate to.
Detailed description of the invention
Describe embodiments of the invention with reference to the accompanying drawings in detail.But, the present embodiment is not limited to embodiment disclosed below, it is possible to realize in a variety of manners, and the present embodiment comprehensive disclosure present invention, so that those of ordinary skill in the art understands protection scope of the present invention and provides.In order to definitely illustrate, in accompanying drawing, the shape etc. of key element is likely to the part having exaggeration to represent, the key element of same tag mark represents identical element in the accompanying drawings.
Fig. 1 is an illustration for the schematic diagram of the baseplate-laminating process that embodiments of the invention relate to.
As it is shown in figure 1, substrate processing S1 and transport substrate S2 fits and forms adhesive substrates S3.Substrate processing S1 is the element of finished product, and transport substrate S2 is the temporary component only used in finished product manufacture process, is not intended that finished product.
Substrate processing S1 can be OLED (Organic Light Emitting Diode) substrate, the colored filter substrate of LCD display device or TFT substrate.Recently, along with the requirement of display device slimming, the research of the lower thickness of colored filter substrate or TFT substrate is made further.But, problem is as the lower thickness of colored filter substrate or TFT substrate, and the manufacture process of finished product is more difficult.Owing to substrate thickness is too thin, substrate is susceptible to damage or deformation in transfer process or laminating process.
In order to solve these problems, using transport substrate S2, this transport substrate S2 is additional on substrate processing S1 in manufacture course of products, manufactures and can remove after terminating.Substrate processing S1 is not limited in oled substrate, colored filter (CF) substrate or TFT substrate, it is possible to be have, as the substrate that thickness is thin, the various substrates damaging risk in transfer process.
When substrate processing S1 is colored filter (CF) substrate or TFT substrate, the thickness of substrate processing S1 can be 0.2～0.5 millimeter.Colored filter (CF) substrate can be the substrate forming color filter patterns on the surface of glass substrate, and TFT (ThinFilmTransistor: thin film transistor (TFT)) substrate can be the substrate forming tft array pattern on the surface of glass substrate.
There is the substrate of these thickness damage in transfer process and manufacture process and have a big risk.The thickness of the transport substrate S2 being temporarily additional on substrate processing S1 is about 0.5～0.7 millimeter or above.
Fig. 2 is the module map of the Base Plate Lamination Device that embodiments of the invention relate to.
As in figure 2 it is shown, this Base Plate Lamination Device 100 includes substrate processing puts into unit 110, substrate processing laminating unit 120 and inspection unit 130.
Substrate processing puts into unit 110 and includes the first load units 111, cutter unit 112, cleaning unit the 113, first unloading unit the 114, second unloading unit 115.
About the first load units 111, the substrate processing S1 put into from outside is moved to the first load units 111.
About cutter unit 112, the substrate processing S1 being moved on the first load units 111 is moved to cutter unit 112, cuts into appropriate size.When the substrate processing S1 that moves into is appropriately sized, it is not necessary to cutter unit 112.
About cleaning unit 113, it is moved to cleaning unit 113 at the substrate processing S1 that cutter unit 112 is cleaved and is carried out operation.As required, it is also possible to omit cleaning unit 113.
About the first unloading unit 114, after the cleaning of substrate processing S1 is terminated by cleaning unit 113, substrate processing S1 takes out of the first unloading unit 114 from cleaning unit 113.
About the second unloading unit 115, transport substrate S2 is moved to the process that substrate processing puts into unit 110 from outside, and transport substrate S2 moves into and be loaded into the second unloading unit 115.
Substrate processing laminating unit 120 includes the first transfer unit 121, roll-over unit the 122, second transfer unit 123, laminating unit the 124, the 3rd unloading unit 125.
First transfer unit 121 takes out of the substrate processing S1 being loaded on the first unloading unit 114 and is transplanted on roll-over unit 122.First transfer unit 121 can be made up of robotic arm.
Roll-over unit 122 overturns substrate processing S1 after receiving substrate processing S1 from the first transfer unit 121.The one side of substrate processing S1 is formed OLED pattern, colorized optical filtering (CF) pattern or TFT pattern.Therefore, when substrate processing S1 is moved to laminating unit 124, if the face being formed with these patterns is opposed with transport substrate S2, then need upset substrate processing S1.When being moved to laminating unit 124, formed the opposing face of figuratum opposed with transport substrate S time, it is also possible to need not roll-over unit 122, substrate processing S1 skips roll-over unit 122 can directly move into unit 124 of fitting.
The substrate processing S1 or transport substrate S2 that are moved to roll-over unit 122 are moved into laminating unit 124 by the second transfer unit 123, and are taken out of on the 3rd unloading unit 125 by the adhesive substrates S3 through laminating.
About laminating unit 124, substrate processing S1 and transport substrate S2 is moved into laminating unit 124 by the second transfer unit 123.Laminating unit 124 includes vacuum chamber, exhaust unit, substrate arrangement unit.Vacuum chamber is exhausted by exhaust unit and forms vacuum after moving into vacuum chamber and carrying out substrate arrangement by substrate processing S1 and transport substrate S2.Then, make substrate processing S1 and transport substrate S2 closer to each other under vacuum conditions, by applying adhesive force, then without using other jointing material, it is also possible to form fit-state each other.Thus, adhesive substrates S3 is formed.Laminating unit can by substrate position adjusting adhesive force.That is, when substrate being applied adhesive force, being formed with multiple adhesive force bringing device, the adhesive force of adhesive force bringing device can be respectively controlled.Thereby, it is possible to press substrate position adjusting adhesive force.
The adhesive substrates S3 of vacuum chamber is taken out of on the 3rd unloading unit 125 by the second transfer unit 123.
Finally, it is moved to the adhesive substrates S3 on the 3rd unloading unit 125, in order to check fit-state, is shifted into inspection unit 130.When fit-state is defective, in patterning process later and substrate arrangement process, error is likely to become big, and the pattern therefore formed occurs underproof probability big.In operation later, adhesive substrates S3 and other baseplate-laminating and when there is regulation rigidity as entirety, utilize independent disconnector, isolate transport substrate S2 from substrate processing S1.
Below, the method for bonding substrate that embodiments of the invention relate to is described.
Fig. 3 is the flow chart of the method for bonding substrate that embodiments of the invention relate to.As an embodiment, each step arranges by smooth, but when each step order to each other is not explicitly defined in detail in the claims, it is possible to be different from order described below enforcement.
First, step S01, substrate processing S1 is moved to substrate processing and puts into unit 110.Afterwards, step S02, substrate processing S1 is cut into given size.Then, step S03, it is transplanted on cleaning unit 113 and is carried out operation.Step S04, cleaned substrate processing S1 is shifted into the first unloading unit 114.
It is transplanted on the second unloading unit 115 it addition, step S05, transport substrate S2 are moved to after substrate processing puts into unit 110.
Secondly, step S06, the first transfer unit 120 overturns substrate processing S1 after the substrate processing S1 on first unloading unit 114 is transplanted on roll-over unit 122.
Secondly, step S07, the substrate processing S1 being inverted is moved into laminating unit 124 by the second transfer unit 123.
Secondly, step S08, the first transfer unit 121 sends transport substrate S2 to second transfer unit 123, and it is internal that transport substrate S2 is moved to laminating unit 124 by the second transfer unit 123.
As other embodiments, step S08 can also perform prior to step S06 and S07.
Secondly, perform step S09, undertaken fitting by the substrate processing S1 and transport substrate S2 that are moved to laminating unit 124 and form adhesive substrates S3.
Secondly, perform step S10, adhesive substrates S3 is taken out of on the 3rd unloading unit 125.
Secondly, perform step S11, the adhesive substrates S3 being moved on the 3rd unloading unit 125 is transplanted on inspection unit 130 and checks fit-state.
One embodiment of the invention described above and shown in the drawings, it is impossible to be construed to limit the technological thought of the present invention.Protection scope of the present invention should be as the criterion with the record of claims, for general technical staff of the technical field of the invention, it is possible to the technological thought of the present invention is carried out various forms of improvement change.Therefore, for these improvement general technical staff of the technical field of the invention and to change be self-evident, belong to protection scope of the present invention.
Claims (2)
1. a method for bonding substrate, it is characterised in that comprise the steps:
A) substrate processing and transport substrate are prepared；
B) by described substrate processing and described transport base plate transfer to laminating unit；
C) after described laminating unit forms vacuum state, fit described substrate processing and described transport substrate time, do not use jointing material, multiple adhesive force bringing devices control produced adhesive force respectively, in order to apply different adhesive forces by substrate position and fit.
2. a laminating unit, it is characterised in that
Including substrate arrangement unit, vacuum chamber, exhaust unit and multiple adhesive force bringing device,
The described substrate arrangement unit substrate processing to moving into and transport substrate arrange,
Described vacuum chamber is exhausted and forms vacuum by described exhaust unit,
When described substrate processing of fitting is with described transport substrate, does not use jointing material, the plurality of adhesive force bringing device control produced adhesive force respectively, in order to apply different adhesive forces by substrate position and fit.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0147940 | 2011-12-30 | ||
| KR1020110147940A KR20130078810A (en) | 2011-12-30 | 2011-12-30 | Substrate attaching method |
| CN201210169597.3A CN103182826B (en) | 2011-12-30 | 2012-05-28 | Method for bonding substrate |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210169597.3A Division CN103182826B (en) | 2011-12-30 | 2012-05-28 | Method for bonding substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105711228A true CN105711228A (en) | 2016-06-29 |
| CN105711228B CN105711228B (en) | 2018-10-16 |
Family
ID=48674390
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610039169.7A Expired - Fee Related CN105711228B (en) | 2011-12-30 | 2012-05-28 | Method for bonding substrate and fitting unit |
| CN201210169597.3A Expired - Fee Related CN103182826B (en) | 2011-12-30 | 2012-05-28 | Method for bonding substrate |
| CN201610040130.7A Expired - Fee Related CN105563993B (en) | 2011-12-30 | 2012-05-28 | Base Plate Lamination Device |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210169597.3A Expired - Fee Related CN103182826B (en) | 2011-12-30 | 2012-05-28 | Method for bonding substrate |
| CN201610040130.7A Expired - Fee Related CN105563993B (en) | 2011-12-30 | 2012-05-28 | Base Plate Lamination Device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20130078810A (en) |
| CN (3) | CN105711228B (en) |
| TW (1) | TW201327626A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109830617A (en) * | 2019-01-14 | 2019-05-31 | 深圳市华星光电半导体显示技术有限公司 | Abutted equipment |
| CN110596921A (en) * | 2019-09-04 | 2019-12-20 | 深圳市联得自动化装备股份有限公司 | Liquid crystal display screen detection device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1530714A (en) * | 2003-03-11 | 2004-09-22 | 富士通株式会社 | Placode binder and binding method |
| CN101242951A (en) * | 2005-08-09 | 2008-08-13 | 旭硝子株式会社 | Thin sheet glass laminate and method for manufacturing display using thin sheet glass laminate |
| US20090120572A1 (en) * | 2005-08-30 | 2009-05-14 | Sampica James D | Substrate lamination system and method |
| WO2011048979A1 (en) * | 2009-10-20 | 2011-04-28 | 旭硝子株式会社 | Glass laminate, glass laminate manufacturing method, display panel manufacturing method, and display panel obtained by means of display panel manufacturing method |
| CN102173238A (en) * | 2010-12-29 | 2011-09-07 | 友达光电股份有限公司 | Vacuum imprinting device, vacuum laminating device and manufacturing method of laminated optical assembly |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11326857A (en) * | 1998-05-13 | 1999-11-26 | Toshiba Corp | Device for assembling substrate and its method |
| JP3202718B2 (en) * | 1999-02-23 | 2001-08-27 | 鹿児島日本電気株式会社 | Display device manufacturing jig and display device manufacturing method using the same |
| KR100510718B1 (en) * | 2002-02-04 | 2005-08-30 | 엘지.필립스 엘시디 주식회사 | manufacturing device for manufacturing of liquid crystal device |
| KR100884995B1 (en) * | 2002-06-12 | 2009-02-20 | 엘지디스플레이 주식회사 | Liquid crystal display device fabrication line and manufacturing method using it |
| CN2916690Y (en) * | 2004-04-28 | 2007-06-27 | 鸿富锦精密工业（深圳）有限公司 | Baseplate attaching device |
| CN1996550A (en) * | 2005-12-28 | 2007-07-11 | 上海广电Nec液晶显示器有限公司 | Joint method of the base plate |
| JP2009282385A (en) * | 2008-05-23 | 2009-12-03 | Nitto Denko Corp | Method of manufacturing optical display device |
| WO2010047273A1 (en) * | 2008-10-23 | 2010-04-29 | 旭硝子株式会社 | Glass substrate laminated device and method for producing laminate glass substrate |
| KR101888158B1 (en) * | 2011-12-02 | 2018-08-14 | 엘지디스플레이 주식회사 | Method of fabrciation line for attaching thin glass substrate for flat display device |
-
2011
- 2011-12-30 KR KR1020110147940A patent/KR20130078810A/en active Search and Examination
-
2012
- 2012-05-28 CN CN201610039169.7A patent/CN105711228B/en not_active Expired - Fee Related
- 2012-05-28 CN CN201210169597.3A patent/CN103182826B/en not_active Expired - Fee Related
- 2012-05-28 CN CN201610040130.7A patent/CN105563993B/en not_active Expired - Fee Related
- 2012-07-23 TW TW101126489A patent/TW201327626A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1530714A (en) * | 2003-03-11 | 2004-09-22 | 富士通株式会社 | Placode binder and binding method |
| CN101242951A (en) * | 2005-08-09 | 2008-08-13 | 旭硝子株式会社 | Thin sheet glass laminate and method for manufacturing display using thin sheet glass laminate |
| US20090120572A1 (en) * | 2005-08-30 | 2009-05-14 | Sampica James D | Substrate lamination system and method |
| WO2011048979A1 (en) * | 2009-10-20 | 2011-04-28 | 旭硝子株式会社 | Glass laminate, glass laminate manufacturing method, display panel manufacturing method, and display panel obtained by means of display panel manufacturing method |
| CN102173238A (en) * | 2010-12-29 | 2011-09-07 | 友达光电股份有限公司 | Vacuum imprinting device, vacuum laminating device and manufacturing method of laminated optical assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103182826A (en) | 2013-07-03 |
| CN103182826B (en) | 2016-03-30 |
| CN105711228B (en) | 2018-10-16 |
| KR20130078810A (en) | 2013-07-10 |
| CN105563993A (en) | 2016-05-11 |
| CN105563993B (en) | 2018-06-05 |
| TW201327626A (en) | 2013-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107851603B (en) | Substrate mounting method, film forming method, and method for manufacturing electronic device | |
| KR101770009B1 (en) | Substrate separation method, manufacturing method of a semiconductor apparatus, substrate separation device, load lock device and substrate adhesion device | |
| KR20150070978A (en) | Manufacturing method of support substrate with resin layer, manufacturing method of glass laminated body and manufacturing method of electronic device | |
| JP6105414B2 (en) | Bonded substrate processing equipment | |
| US8918989B2 (en) | Device for aligning and pre-fixing a wafer | |
| KR20140136878A (en) | Joining device, joining system, joining method and computer storage medium | |
| CN105711228A (en) | Substrate attaching method and attaching unit | |
| CN104246991A (en) | Wafer etching system and wafer etching process using same | |
| CN103632997A (en) | Laminating method and laminating system | |
| TWI423938B (en) | Method of picking up unit display panel from mother substrate | |
| KR102253447B1 (en) | Manufacturing apparatus for display apparatus | |
| US11479030B2 (en) | Apparatus for supporting debonding and debonding method using the same | |
| KR101955335B1 (en) | Stamp structure and transfer method using the same | |
| JP6135113B2 (en) | Substrate pasting device, substrate pasting method, and substrate pasting program | |
| KR102656505B1 (en) | Die-to-wafer bonding utilizing micro-transfer printing | |
| JP2008192746A (en) | Carrying tool of article, apparatus and method for reversing article, and apparatus and method for manufacturing flat panel display | |
| US20160346948A1 (en) | Clamping system and substrate-cutting apparatus employing the same | |
| CN105765645B (en) | Flexible substrates joint method | |
| JP2014515875A (en) | Multi-chamber solar cell module processing system and method | |
| KR20150138062A (en) | Support substrate with resin layer and manufacturing method thereof, glass laminated body, and manufacturing method of electronic device | |
| KR101458472B1 (en) | Substrate attaching system | |
| KR20200141674A (en) | Protective film recovery apparatus | |
| US20120218719A1 (en) | System and Method of Forming Semiconductor Devices | |
| KR102221103B1 (en) | Apparatus for manufacturing optical sheet and method of manufacturing optical sheet | |
| JP2003168718A (en) | Single wafer transfer device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200925 Address after: 100102 Beijing city Chaoyang District Lize Street No. 8 8-1-2301 Patentee after: Li Yingjin Address before: 224000 in Jiangsu province in the south of Yancheng City District New River street, 9 century avenue, building 103, Gary Garden 1 room 104 Patentee before: LIG ADP Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181016 Termination date: 20210528 |