CN105700653A - Heat expansion-type heat-sink device - Google Patents
Heat expansion-type heat-sink device Download PDFInfo
- Publication number
- CN105700653A CN105700653A CN201610239831.3A CN201610239831A CN105700653A CN 105700653 A CN105700653 A CN 105700653A CN 201610239831 A CN201610239831 A CN 201610239831A CN 105700653 A CN105700653 A CN 105700653A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- thermo
- pipe
- expansion type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000013528 metallic particle Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 230000001413 cellular effect Effects 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 241000168254 Siro Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat expansion-type heat-sink device.The heat expansion-type heat-sink device comprises a heat-contact part, a heat-sink part and at least one heat conduction pipe connected between the heat-contact part and the heat-sink part; one end of each heat conduction pipe is provided with a heat-contact end, and the other end of the heat conduction pipe is provided with a heat-sink end; the section of each heat-contact end and/or each heat-sink end is in a non-circular shape, the two ends of each heat conduction pipe are closed, and a closed inner cavity is formed; the heat-contact part is provided with first connecting holes, wherein the shape and size of each first connecting hole are matched with those of the corresponding heat-contact end, and the number of the first connecting holes is the same as that of the heat conduction pipes; the heat-sink part is provided with second connecting holes, wherein the shape and size of each second connecting hole are matched with those of the corresponding heat-sink end, and the number of the second connecting holes is the same as that of the heat conduction pipes; the heat-contact end of each heat conduction pipe is inserted into the corresponding first connecting hole of the heat-contact part in a connected mode, and each heat-sink end is inserted into the corresponding second connecting hole of the heat-sink part in a connected mode.The heat expansion-type heat-sink device has the advantages of being easy to machine and assemble, small in heat resistance and good in heat transfer effect.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly to a kind of heat expansion type heat abstractor。
Background technology
Along with the increase of semiconductor integrated circuit number of transistors, the caloric value of device also increases as。Current computer chip CPU or other hardware heating problem have become the obstacle in development of computer process, and radiator is the equipment dispelled the heat after solving the heating of these hardware。At present, conventional heat abstractor mostly includes metal heat-conducting pedestal, radiating fin group and the heat pipe being connected respectively with metal heat-conducting pedestal, radiating fin group, the heat that electronic devices and components produce is sent in radiating fin group by heat pipe by metal heat-conducting pedestal, large-area radiating fin group and outside air heat exchange dispel the heat。But the connected mode between existing heat pipe and radiating fin or metal heat-conducting pedestal is usually: adopting between metalwork and nonmetal parts and snap connection, junction cannot be in close contact, and there is the problem that thermal resistance is big；Adopt between metalwork with metalwork and weld, there is processing and assembling complexity, the shortcoming of heat-transfer effect difference。
Summary of the invention
In order to overcome the deficiencies in the prior art, it is an object of the invention to provide a kind of heat expansion type heat abstractor, there is processing and assemble the feature simple, thermal resistance is little, heat-transfer effect is good。
For solving the problems referred to above, the technical scheme that the purpose of the present invention adopts is as follows:
A kind of heat expansion type heat abstractor, including thermally contacting part, radiating piece and at least one heat pipe being connected between thermo-contact part and radiating piece；It is characterized in that:
One end of each heat pipe is provided with thermo-contact end, and its other end is provided with radiating end；The cross sectional shape of described thermo-contact end and/or radiating end is non-circular shape；The closed at both ends of each heat pipe, formation one closing inner chamber；
Described thermo-contact part is provided with cross sectional shape size and the first connecting hole thermally contacting end and matching, and the quantity of described first connecting hole is identical with the quantity of heat pipe；
Described radiating piece is provided with the second connecting hole that cross sectional shape size matches with radiating end, and the quantity of described second connecting hole is identical with the quantity of described heat pipe；
The thermo-contact end of each heat pipe is plugged in first connecting hole of described thermo-contact part, and its radiating end is plugged in second connecting hole of described radiating piece。
As preferably, described non-circular be shaped as ellipse, rhombus, triangle, square, rectangle, parallelogram, regular polygon, trapezoidal, there is the square of circular arc chamfering, there is the rectangle of circular arc chamfering or there is the trapezoidal of circular arc chamfering。
As preferably, described heat pipe be shaped as U-shaped, Z-shaped, L-shaped or " one " font。
As preferably, described heat pipe is metal heat-conducting tube。
As preferably, described heat pipe is copper heat pipe, aluminum heat pipe or rustless steel heat pipe。
As preferably, the pipe thickness of described copper heat pipe or aluminum heat pipe is 0.1-1mm, and the pipe thickness of described rustless steel heat pipe is 2mm。
As preferably, the inside sealing inner chamber of described heat pipe is provided with gas, liquid, metallic particles or non-metallic particle；Or, the sealing inner chamber of described heat pipe is vacuum state。
As preferably, described radiating piece and/or thermo-contact part are the radiator structure of lamellar, cellular or entity。
As preferably, described radiating piece and/or thermo-contact part are made by metal heat-conducting material or nonmetallic heat conductive material。
As preferably, described metal heat-conducting material is aluminum, copper or rustless steel；Described nonmetallic heat conductive material is graphite, pottery or diamond。
Compared to existing technology, the beneficial effects of the present invention is:
One end of each heat pipe of the present invention is provided with thermo-contact end, and its other end is provided with radiating end；The cross sectional shape of described thermo-contact end and/or radiating end is non-circular shape；The closed at both ends of each heat pipe, formation one closing inner chamber。The present invention utilizes the tube wall of heat pipe to expand, the thermo-contact end and the radiating end that make heat pipe rise with the inwall thermally contacting part and radiating piece respectively and connect, make heat pipe and be combined into physical expansion structure with thermally contacting between part, radiating piece, this structure solves metal and metal, metal and nonmetal physics mode realize compact siro spinning technology, when heat pipe respectively with thermally contact part, after radiating piece connects, only need to improve the temperature of heat pipe, when default temperature and time, it becomes possible to complete the assembly work of heat abstractor。
In sum, the present invention has processing and assembles the feature simple, thermal resistance is little, heat-transfer effect is good。
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail。
Accompanying drawing explanation
Fig. 1 is the structural representation of the heat expansion type heat abstractor described in embodiment 1。
Fig. 2 is the cut-away view of the heat expansion type heat abstractor described in embodiment 1。
Fig. 3 is the side view of the heat expansion type heat abstractor described in embodiment 2。
Fig. 4 is the structural representation of the radiating piece described in embodiment 3。
Fig. 5 is the structural representation of the radiating piece described in embodiment 4。
Wherein, 1, thermo-contact part；11, the first connecting hole；2, radiating piece；21, the second connecting hole；3, heat pipe；31, thermo-contact end；32, radiating end；33, inner chamber is closed。
Detailed description of the invention
Embodiment 1:
With reference to Fig. 1-2, a kind of heat expansion type heat abstractor described in the present embodiment, including thermally contacting part 1, radiating piece 2 and the heat pipe 3 being connected between thermo-contact part 1 and radiating piece 2；
One end of each heat pipe 3 is provided with thermo-contact end 31, and its other end is provided with radiating end 32；The cross sectional shape of described thermo-contact end 31 is circular, and the cross sectional shape of described radiating end 32 is non-circular shape, the described non-circular rectangle being shaped as having circular arc chamfering；The closed at both ends of each heat pipe, formation one closing inner chamber 33；
Described thermo-contact part 1 is provided with cross sectional shape size and 31 the first connecting holes 11 matched that thermally contact end, and the quantity of described first connecting hole 11 is identical with the quantity of heat pipe 3；
Described radiating piece 2 is provided with the second connecting hole 21 that cross sectional shape size matches with radiating end 32, and the quantity of described second connecting hole 21 is identical with the quantity of described heat pipe 3；
The thermo-contact end 31 of each heat pipe 3 is plugged in first connecting hole 11 of described thermo-contact part 1, and its radiating end 32 is plugged in second connecting hole 21 of described radiating piece 2。
As preferably, described heat pipe 3 be shaped as U-shaped。Described heat pipe 3 is aluminum heat pipe。The sealing inner chamber of described heat pipe 3 is vacuum state。The pipe thickness of described heat pipe 3 is 0.5mm。
As preferably, described radiating piece 2 and thermo-contact part 1 are the radiator structure of entity。Described radiating piece 2 and thermo-contact part 1 are made by metal heat-conducting material。Described metal heat-conducting material is copper。
The operation principle of the present embodiment:
The heat pipe of the present invention has sealing inner chamber, seal inner chamber when temperature promotes, in sealing, the pressure of intracavity can increase, owing to the thermo-contact end of heat pipe and the cross sectional shape of radiating end are non-circular shape, along with the internal pressure sealing inner chamber of heat pipe is gradually increased, when internal pressure pressure born more than the tube wall of heat pipe, tube wall is because being that non-circular shape can produce dilatancy so that the thermo-contact end of heat pipe and radiating end are in close contact with inwall thermally contact part and radiating piece respectively。
Embodiment 2:
With reference to Fig. 3, the feature of the present embodiment is: the cross sectional shape of described thermo-contact end 31 is the rectangle with circular arc chamfering, and the cross sectional shape of described radiating end 32 is the rectangle with circular arc chamfering。Other are identical with embodiment 1。
Embodiment 3:
With reference to Fig. 4, the feature of the present embodiment is: described radiating piece 2 is cellular radiator structure。Other are identical with embodiment 1。
Embodiment 4:
With reference to Fig. 5, the feature of the present embodiment is: described radiating piece 2 is the radiator structure of lamellar。Other are identical with embodiment 1。
Other embodiments:
As preferably, described non-circular be shaped as ellipse, rhombus, triangle, square, rectangle, parallelogram, regular polygon, trapezoidal, have circular arc chamfering square or have the trapezoidal of circular arc chamfering or other。
As preferably, described heat pipe is copper heat pipe or rustless steel heat pipe。As preferably, the inside sealing inner chamber of described heat pipe is provided with gas, liquid, metallic particles or non-metallic particle。As preferably, the pipe thickness of described rustless steel heat pipe is 2mm, and the quantity of described heat pipe is 2-10 or more。Being shaped as of described heat pipe is Z-shaped, L-shaped or " one " font。
As preferably, described radiating piece and/or thermo-contact part are made by metal heat-conducting material or nonmetallic heat conductive material。As preferably, described metal heat-conducting material is aluminum, copper or rustless steel；Described nonmetallic heat conductive material is graphite, pottery or diamond。
Above-mentioned embodiment is only the preferred embodiment of the present invention, it is impossible to limit the scope of protection of the invention with this, and the change of any unsubstantiality that those skilled in the art does on the basis of the present invention and replacement belong to present invention scope required for protection。
Claims (10)
1. a heat expansion type heat abstractor, including thermally contacting part, radiating piece and at least one heat pipe being connected between thermo-contact part and radiating piece；It is characterized in that:
One end of each heat pipe is provided with thermo-contact end, and its other end is provided with radiating end；The cross sectional shape of described thermo-contact end and/or radiating end is non-circular shape；The closed at both ends of each heat pipe, formation one closing inner chamber；
Described thermo-contact part is provided with cross sectional shape size and the first connecting hole thermally contacting end and matching, and the quantity of described first connecting hole is identical with the quantity of heat pipe；
Described radiating piece is provided with the second connecting hole that cross sectional shape size matches with radiating end, and the quantity of described second connecting hole is identical with the quantity of described heat pipe；
The thermo-contact end of each heat pipe is plugged in first connecting hole of described thermo-contact part, and its radiating end is plugged in second connecting hole of described radiating piece。
2. heat expansion type heat abstractor according to claim 1, it is characterized in that, described non-circular be shaped as ellipse, rhombus, triangle, square, rectangle, parallelogram, regular polygon, trapezoidal, there is the square of circular arc chamfering, there is the rectangle of circular arc chamfering or there is the trapezoidal of circular arc chamfering。
3. heat expansion type heat abstractor according to claim 1, it is characterised in that described heat pipe be shaped as U-shaped, Z-shaped, L-shaped or " one " font。
4. heat expansion type heat abstractor according to claim 1, it is characterised in that described heat pipe is metal heat-conducting tube。
5. heat expansion type heat abstractor according to claim 4, it is characterised in that described heat pipe is copper heat pipe, aluminum heat pipe or rustless steel heat pipe。
6. heat expansion type heat abstractor according to claim 5, it is characterised in that the pipe thickness of described copper heat pipe or aluminum heat pipe is 0.1-1mm, the pipe thickness of described rustless steel heat pipe is 2mm。
7. heat expansion type heat abstractor according to claim 1, it is characterised in that the inside sealing inner chamber of described heat pipe is provided with gas, liquid, metallic particles or non-metallic particle；Or, the sealing inner chamber of described heat pipe is vacuum state。
8. heat expansion type heat abstractor according to claim 1, it is characterised in that described radiating piece and/or thermo-contact part are the radiator structure of lamellar, cellular or entity。
9. heat expansion type heat abstractor according to claim 1, it is characterised in that described radiating piece and/or thermo-contact part are made by metal heat-conducting material or nonmetallic heat conductive material。
10. heat expansion type heat abstractor according to claim 8 or claim 9, it is characterised in that described metal heat-conducting material is aluminum, copper or rustless steel；Described nonmetallic heat conductive material is graphite, pottery or diamond。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610239831.3A CN105700653A (en) | 2016-04-15 | 2016-04-15 | Heat expansion-type heat-sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610239831.3A CN105700653A (en) | 2016-04-15 | 2016-04-15 | Heat expansion-type heat-sink device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105700653A true CN105700653A (en) | 2016-06-22 |
Family
ID=56217153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610239831.3A Pending CN105700653A (en) | 2016-04-15 | 2016-04-15 | Heat expansion-type heat-sink device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105700653A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI691830B (en) * | 2018-12-05 | 2020-04-21 | 宏碁股份有限公司 | Heat dissipation module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW464801B (en) * | 1999-08-26 | 2001-11-21 | Foxconn Prec Components Co Ltd | Heat dissipation device and its manufacturing method |
| CN1661797A (en) * | 2004-02-27 | 2005-08-31 | 全懋精密科技股份有限公司 | Constructed configuration of heat sink capable of embedding semiconductor of electronic module |
| CN201064068Y (en) * | 2007-07-19 | 2008-05-21 | 黄崇贤 | Composition improvement of heat radiator |
| CN201115192Y (en) * | 2007-09-11 | 2008-09-10 | 黄崇贤 | Horizontal heat radiator |
| US20100132925A1 (en) * | 2008-12-03 | 2010-06-03 | Donald Carson Lewis | Partable Thermal Heat Pipe |
-
2016
- 2016-04-15 CN CN201610239831.3A patent/CN105700653A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW464801B (en) * | 1999-08-26 | 2001-11-21 | Foxconn Prec Components Co Ltd | Heat dissipation device and its manufacturing method |
| CN1661797A (en) * | 2004-02-27 | 2005-08-31 | 全懋精密科技股份有限公司 | Constructed configuration of heat sink capable of embedding semiconductor of electronic module |
| CN201064068Y (en) * | 2007-07-19 | 2008-05-21 | 黄崇贤 | Composition improvement of heat radiator |
| CN201115192Y (en) * | 2007-09-11 | 2008-09-10 | 黄崇贤 | Horizontal heat radiator |
| US20100132925A1 (en) * | 2008-12-03 | 2010-06-03 | Donald Carson Lewis | Partable Thermal Heat Pipe |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI691830B (en) * | 2018-12-05 | 2020-04-21 | 宏碁股份有限公司 | Heat dissipation module |
| US10928869B2 (en) | 2018-12-05 | 2021-02-23 | Acer Incorporated | Heat dissipation module |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160622 |
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| RJ01 | Rejection of invention patent application after publication |