464801 五、發明說明（1) 【發明領域】 本發明係關於一種散熱裝置及其製造方法，尤指一種 α又有‘熱管及藉由喪入成於基板上之散熱部，同時組裝方 便、成本低廉、散熱效率高且易於自動生產之散熱裝置。 【習知背景】 隨著電腦技術快速發展及其應用範圍愈來愈廣，對電 腦内部電子元件處理速度的要求亦愈來愈高，伴隨著運行 速度的提高，相關電子元件所產生之熱量亦大量增加，若 不及時將此熱量排出’使用時之穩定性及品質將大受影 響。習知用來協助電子元件排出熱量之相關散熱裝置之構 造’可參考美國專利第5, 621，615、5, 620,469號等。該等 專利所揭示之散熱裝置係於基板之頂面上凸設有若干散熱 鶴片’藉基板貼靠於中央處理器將熱量傳導出，再經由散 熱鰭片將熱量對流散出。惟，在該等構造中由於模具強度 及相關技術水平之限制，一般在鋁擠過程中，散熱鰭月之 高度與散熱鰭片間溝槽之寬度間的比值，難以達到令人滿 意之比值（至多約達13:1)，因而其散熱效果難以滿足電 子元件之實際使用需求。 第六圖所示為另一類習知之散熱裝置構造。該散熱裝 置80包括一長方形板狀體之基板81及黏著其上之散熱部 83、接觸部85與導熱管87，該接觸部85之頂面84係與電子 元件貼靠。於散熱部83及接觸部85底部之中央位置形成有 槽道82、86 ’可供導熱管87裝設，在散熱部83上方並裝設 有風扇8 9，以增加整體散熱效果。此種散熱裝置8 〇雖具有464801 V. Description of the invention (1) [Field of the invention] The present invention relates to a heat dissipation device and a manufacturing method thereof, especially an α-type heat pipe and a heat dissipation part formed on a substrate by being buried. At the same time, it is easy to assemble and cost. Cooling device with low cost, high heat dissipation efficiency and easy automatic production. [Knowledge background] With the rapid development of computer technology and its wider application, the requirements for the processing speed of electronic components in computers have become higher and higher. With the increase of operating speed, the heat generated by related electronic components has also increased. A large increase, if this heat is not discharged in time, the stability and quality during use will be greatly affected. For the construction of the related heat-dissipating device that is conventionally used to assist the electronic components in discharging heat, reference may be made to U.S. Patent Nos. 5,621,615, 5,620,469 and the like. The heat-dissipating devices disclosed in these patents are provided with a plurality of heat-dissipating crane fins protruded on the top surface of the substrate. The substrate is placed against the central processor to conduct heat, and the heat is convectively dissipated through the heat-radiating fins. However, due to the limitation of the mold strength and related technical level in these structures, the ratio between the height of the cooling fins and the width of the grooves between the cooling fins in the aluminum extrusion process is difficult to achieve a satisfactory ratio ( Up to about 13: 1), so its heat dissipation effect is difficult to meet the actual use requirements of electronic components. The sixth figure shows another conventional heat sink structure. The heat dissipation device 80 includes a substrate 81 of a rectangular plate-like body, a heat dissipation portion 83 adhered thereto, a contact portion 85 and a heat pipe 87, and a top surface 84 of the contact portion 85 is in contact with an electronic component. Channels 82, 86 'are formed at the central positions of the bottom of the heat radiation portion 83 and the contact portion 85 for the heat pipe 87 to be installed, and a fan 89 is installed above the heat radiation portion 83 to increase the overall heat radiation effect. Such a heat sink 8 〇
第4頁 4 6 4 8 0 1 五、發明說明（2) 較佳之散熱效果其係先將導熱管8?黏著於 之後將散熱部83及接觸部85黏著於基板81上並道Μ、 86結”導熱管87接觸’最後再將風扇⑽裝設心 上，組裝過程顯然極為繁瑣，導致生產效率很底。， 因此，實需一種散熱裝置來解決上述諸項缺 【發明目的】 ' ^本發明之目的在於提供一種其散熱部係藉由嵌入成型 而付，且成本低廉、組裝方便快捷、散熱效率高之散熱裝 置。 ”、 一本發明之另一目的在於提供一種易於實現自動化而提 高生產效率、降低成本之散熱裝置之製造方法。 【發明特徵】 本發明散熱裝置包括一基板、自基板頂面一體向上延 伸之散熱部與接觸部’以及一裝設於基板上之導熱管β該 基板、散熱部及接觸部係藉嵌入成型方法而得之一體結 構’其中該接觸部之頂面係與電子元件貼靠。該基板底面 在散熱部與接觸部之位置處，以及散熱部與接觸部間之位 置處形成一延續溝槽，用以容置導熱管，使導熱管同時與 散熱部及接觸部接觸，而將接觸部上之熱量經由導熱管傳 — 導至散熱部後排出。該導熱管在組裝時，係由基板底面往 上裝入基板之溝槽内’並藉由尺寸配合直接嵌卡於溝槽， 或者使用導熱膠（如環氧樹脂膠等）而黏附於溝槽中，使 導熱管與散熱部及接觸部緊密貼合，並保持與基板底面齊 平。Page 4 4 6 4 8 0 1 V. Explanation of the invention (2) The better heat dissipation effect is to first adhere the heat pipe 8? To the heat dissipation portion 83 and the contact portion 85 on the substrate 81 and then pass the M and 86 junctions. "The heat pipe 87 comes into contact with the fan, and then the fan is installed on the center. The assembly process is obviously very tedious, resulting in very low production efficiency. Therefore, a heat sink is needed to solve the above-mentioned shortcomings [Objective of the Invention] ^ The present invention The purpose is to provide a heat dissipating device whose heat dissipating part is paid by insert molding, and has low cost, convenient and quick assembly, and high heat dissipating efficiency. "Another object of the present invention is to provide a method for easily realizing automation and improving production efficiency 2. Manufacturing method of heat dissipation device with reduced cost. [Features of the invention] The heat dissipation device of the present invention includes a substrate, a heat dissipation portion and a contact portion extending upward from the top surface of the substrate as a whole, and a heat pipe installed on the substrate. The substrate, the heat dissipation portion and the contact portion are formed by insert molding. The obtained body structure is in which the top surface of the contact portion is in contact with the electronic component. A continuous groove is formed on the bottom surface of the substrate at the position of the heat dissipation part and the contact part, and between the heat dissipation part and the contact part, for accommodating the heat pipe, so that the heat pipe is in contact with the heat dissipation part and the contact part at the same time. The heat on the contact part is transferred through the heat transfer tube-conducted to the heat dissipation part and discharged. When the heat pipe is assembled, it is inserted into the groove of the substrate from the bottom surface of the substrate upwards, and is directly inserted into the groove by size matching, or is adhered to the groove by using a thermally conductive adhesive (such as epoxy resin). In the process, the heat pipe is closely adhered to the heat radiation part and the contact part, and kept flush with the bottom surface of the substrate.
第5頁 4 6 4 8 0 1 五、發明說明（3) 【圖式簡單說明】 第 f — 圖 係 本發 明 散 熱 裝置 之立 .體 視 圖 〇 第 圖 係 第一 圖 散 熱 裝置 嵌入 -成 型 方 法之 示意 圖 〇 第 二 圖 係 本發 明 散 教 裝置 另一 實 施 例 之立 體視 圖 0 第 四 圖 係 第三 圖 散 熱 裝置 嵌·入 ‘成 型 方 法之 示意 圖 α 第 五 圖 係 本發 明 散 熱 裝置 另一 實 施 例 中部 份元 件 之 立 體 示 意 圖。 第 六 圖 係 習知 散 熱 裝 置之 立體 :視 圖 〇 [ 主 要 元 件標 號 說 明 ] 散 熱 裝 置 10 '50 基板 12 52 頂 面 14 散 熱部 16 、 54 接 觸 部 18 '56 導 勃i管 22 、 58 溝 槽 24 散熱鰭 片 26 X 62 凸 台 28 上 模塊 32 > 64 下 模 塊 34 '66 内 模 36 68 分 模 38 洗 鑄口 42 、 76 長 槽 44 頂 出銷 46 、 78 滑 塊 72 插 片 74 [ 較 佳 實 施例 請 一 併參 閱 第 一 圖及 第二圖 ， 係 本發 明散 熱 裝 置 10 之 立 體 視 圖 及製 造 方 法 示意 圖， 其 包 括 一基 板12 、 自 基 板 頂 面 14 一 體 向上 延 伸 之 散熱 部1 6與 接 觸 部18 ，以 及 裝 5又 於 基 板 上 之 導熱 管22 0 該 基 板12 底 面 在 散熱 部16與 接 觸 部18 之位 置 ‘處 1 以 及Page 5 4 6 4 8 0 1 V. Description of the invention (3) [Simplified illustration of the drawing] The f-figure is the stand of the heat sink of the present invention. Schematic diagram ○ The second diagram is a perspective view of another embodiment of the teaching device of the present invention. 0 The fourth diagram is a schematic diagram of the third embodiment of the heat sink embedding and molding method. The fifth diagram is in another embodiment of the heat sink of the present invention. Schematic diagram of some components. The sixth figure is a three-dimensional view of a conventional heat sink: [the description of the main component numbers] The heat sink 10'50 substrate 12 52 top surface 14 heat sink 16, 54 contact 18 '56 guide tube 22, 58 groove 24 Cooling fins 26 X 62 Boss 28 Upper module 32 > 64 Lower module 34 '66 Inner mold 36 68 Split mold 38 Washing port 42, 76 Long slot 44 Ejector pin 46, 78 Slider 72 Insert 74 [Comparison For a preferred embodiment, please refer to the first and second figures together, which are a three-dimensional view and a schematic diagram of a manufacturing method of the heat dissipation device 10 of the present invention. The heat dissipation device 10 includes a substrate 12 and a heat dissipation portion 16 extending integrally upward from the top surface 14 of the substrate. Part 18, and a heat conducting tube 22 mounted on the substrate 5 and the bottom surface of the substrate 12 is at the position '1' between the heat dissipation part 16 and the contact part 18, and
第6頁 416 4 8 Ο 1 五、發明說明（4) 散熱部1 6與接觸部18間之位置處形成一延續溝槽24，用以 容置導熱管22，使導熱管22與散熱部16及接觸部18接觸， 而將接觸部1 8上之熱量經由導熱管2 2傳導至散熱部1 6後排 出。該導熱管22在組裝時，係由基板12底面往上裝入基板 12之溝槽24内（如第一圖箭頭Α所示方向），並藉由尺寸 配合直接嵌卡於溝槽24，或者使用導熱膠（如環氧樹脂膠 等，圖未示）而黏附於溝槽24中，該導熱管22同時亦與散 熱部1 6及接觸部1 8緊密貼合，並與基板1 2底面保持齊平。 該散熱部1 6位於基板1 2頂面1 4之一端，主要係由嵌入 成型於基板12上之複數散熱鰭片26組成，而該散熱鰭片26 與基板12之間進一步設一凸台28，該凸台28可進一步作為 散熱鰭片2 6定位之依據。 該接觸部1 8係凸設於基板1 2頂面1 4之另一端，其頂面 直接貼靠於電子元件（如CPU，圖未示），以吸取電子元 件所產生之熱量，藉由與該接觸部18底面緊密貼合之導熱 管22將該熱量傳導至散熱部16，再由複數散熱鰭片26散發 出去。 其中該散熱部1 6所採用嵌入成型法之主要結構包括上 模塊32、下模塊34及内模36 (第二圖參照），其中該上模 塊32與下模塊34間係以基板12之底面（或頂面）為分模面 38 ’澆鑄口 42係成形於上模塊32，下模塊34形成之模腔主 要係用以形成基板1 2、散熱部1 6及接觸部1 8所組成之一體 結構，同時於下模塊3 4進一步設一空腔以容置内模3 6，該 内模36設有複數長槽44，以供複數散熱鰭片26之部份長度Page 6 416 4 8 Ο 1 V. Description of the invention (4) A continuation groove 24 is formed at a position between the heat dissipation portion 16 and the contact portion 18 to receive the heat transfer tube 22, so that the heat transfer tube 22 and the heat dissipation portion 16 It is in contact with the contact portion 18, and the heat on the contact portion 18 is conducted to the heat dissipation portion 16 through the heat pipe 22 and discharged. When the heat pipe 22 is assembled, it is inserted into the groove 24 of the substrate 12 from the bottom surface of the substrate 12 (in the direction shown by the arrow A in the first figure), and is directly inserted into the groove 24 by size matching, or A thermally conductive adhesive (such as epoxy resin, etc., not shown) is used to adhere to the groove 24, and the thermally conductive tube 22 is also closely attached to the heat dissipation portion 16 and the contact portion 18, and is held on the bottom surface of the substrate 12 Flush. The heat dissipation part 16 is located at one end of the top surface 14 of the substrate 12 and is mainly composed of a plurality of heat dissipation fins 26 embedded on the substrate 12. A protrusion 28 is further provided between the heat dissipation fins 26 and the substrate 12. The projection 28 can be further used as a basis for positioning the heat dissipation fins 26. The contact portion 18 is convexly disposed on the other end of the top surface 14 of the substrate 12, and the top surface directly contacts the electronic component (such as a CPU, not shown) to absorb the heat generated by the electronic component. The heat-conducting tube 22 closely adhered to the bottom surface of the contact portion 18 conducts the heat to the heat-radiating portion 16, and is then radiated from the plurality of heat-radiating fins 26. The main structure of the heat sink 16 using the insert molding method includes an upper module 32, a lower module 34, and an inner mold 36 (refer to the second figure). The upper module 32 and the lower module 34 are connected by the bottom surface of the substrate 12 ( (Or top surface) is the parting surface 38 '. The casting port 42 is formed on the upper module 32, and the cavity formed by the lower module 34 is mainly used to form a body structure composed of the substrate 1, 2, the heat sink 16, and the contact 18. At the same time, a cavity is further provided in the lower module 34 to accommodate the inner mold 36. The inner mold 36 is provided with a plurality of long grooves 44 for a part of the length of the plurality of heat dissipation fins 26.
第7頁 ^48 0 1 五、發明綱⑸ --- :密插置其中，而露出之鰭片26長度供延伸在模腔内，與 楹2之鋁水固結為一體’再者’該内模36之頂面稍底於下 j塊34模腔之底面’即於散熱縛片26與基板12間形成凸台 =，以進一步固定散熱鰭片。在嵌入成型過程中，先將複 厂散熱鰭片26緊密插置於内模36中之複數長槽44中，再進 二合模，並於澆鑄口42向模腔内澆鑄鋁水（圖未示），待 冷卻後，開模並藉頂出銷46抵頂内模36，將内模36與散熱 =置1 0之半成品抵頂出模，最後使散熱鰭片2 6與内模3 6分 ，即可仟到基板1 2、散熱部1 6及接觸部1 8組成之一體結 構形態。 請再一併參閱第三、四、五圖，係本發明散熱裝置之 另一實施例及其製造方法。該散熱裝置5〇亦包括有基板 52、散熱部54、接觸部56及導熱f58，其中該散熱部54係 由嵌入成型於基板52上之連續彎折之鰭片62所組成◦其成 型方法之主要結構除包括上模塊64、下模塊66及内模68 外，進一步設有一滑塊72，該滑塊72大至呈一倒τ字形， 設有複數插；i 74。於嵌人成型之前，將滑塊72之各插月74 相應緊密插入連續彎折之鰭片62各溝槽之部份空間（如第 五圖箭頭B所示方向），使隔熔化之鋁水進入插片74上方 之鰭片62溝槽内，與鰭片62固結，並阻隔鋁水進入插片 下方之鰭片62之溝槽内。當合模後’於澆鑄口 76處向模腔 内邊鑄紹水（圖未示）’待冷卻，然後開模，同時滑塊^ 水平滑開，使插片74與鰭片62相分離，再藉頂出銷78抿頂 内模68 (如第五圖箭頭c所示方向）’即可將基板52、散Page 7 ^ 48 0 1 V. Outline of the invention ⑸ ---: Closely inserted into it, and the exposed fins 26 are for extension in the mold cavity, and are consolidated with the aluminum water of 楹 2 into one. The top surface of the inner mold 36 is slightly lower than the bottom surface of the cavity of the lower j block 34, that is, a boss is formed between the heat dissipation fins 26 and the substrate 12, to further fix the heat dissipation fins. In the insert molding process, the heat sink fins 26 of the factory are closely inserted into the plurality of long grooves 44 in the inner mold 36, and then the two molds are closed, and aluminum water is poured into the mold cavity at the casting port 42 (not shown in the figure). (Shown), after cooling, open the mold and push the inner mold 36 by the ejector pin 46, and push the inner mold 36 and the semi-finished product with heat dissipation = 10 to eject the mold, and finally make the heat sink fins 2 6 and the inner mold 3 6 It can be divided into one body structure form consisting of the substrate 1, 2, the heat sink 16, and the contact 18. Please refer to the third, fourth, and fifth drawings together, which are another embodiment of the heat dissipation device of the present invention and a manufacturing method thereof. The heat dissipation device 50 also includes a substrate 52, a heat dissipation portion 54, a contact portion 56, and a thermally conductive f58. The heat dissipation portion 54 is composed of continuously bent fins 62 embedded on the substrate 52. The main structure, in addition to the upper module 64, the lower module 66 and the inner mold 68, is further provided with a slider 72, which is as large as an inverted τ-shape with a plurality of inserts; i 74. Before insert molding, insert each inserting lug 74 of the slider 72 tightly into the space of each groove of the continuously bent fin 62 (in the direction shown by arrow B in the fifth figure), so as to separate the molten aluminum water. It enters the groove of the fin 62 above the insert 74 and is consolidated with the fin 62, and blocks aluminum water from entering the groove of the fin 62 below the insert. When the mold is closed, "cast water to the inside of the mold cavity (not shown) at the casting port 76" to cool, then open the mold, and at the same time, the slider ^ water is smoothly opened to separate the insert 74 and the fin 62, Then by ejecting the pin 78 and the inner mold 68 (in the direction shown by the arrow c in the fifth figure) ', the substrate 52,
第8頁 46 4B Ο 1 五、發明說明（6) 熱部5 4及接觸部5 6組成之一體結構抵頂出模。 另外’上所述之散熱鰭片26/62與基板12/52於嵌入成 型過程中’兩者可為同一材質或不同材質（如同為鋁材或 銅材，或分別為銘材及銅材）。 本發明散熱裝置10/50不僅散熱效果良好，且由於基 板12/52、散熱部16/54及接觸部18/56為一體結構，因此 組裝時方便快捷，同時’該嵌入成型過程中可據需要採用 一腔多模，並易於實現自動化，進行批量生產，故可降低 成本’而大幅度提高生產效率’且在導熱管之配合下，亦 大幅度提高散熱效率。 綜上所述，本發明明顯符合發明專利要件，爰依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施例， 舉凡熟悉本案技術之人士，在援依本案發明精神所做之等 效修飾或變化’皆應涵蓋在以下之申請專利範圍内。Page 8 46 4B Ο 1 V. Description of the invention (6) The body structure composed of the hot part 54 and the contact part 56 is against the die. In addition, the above-mentioned heat dissipation fins 26/62 and the substrate 12/52 during the insert molding process can be the same material or different materials (such as aluminum or copper, or Ming and copper, respectively) . The heat dissipation device 10/50 of the present invention not only has a good heat dissipation effect, but because the substrate 12/52, the heat dissipation portion 16/54, and the contact portion 18/56 are integrated structures, it is convenient and quick to assemble, and at the same time, 'the insert molding process can be used as needed. Adopting a multi-cavity mold, and easy to realize automation and mass production, can reduce costs 'and greatly improve production efficiency' and with the cooperation of heat pipes, also greatly improve heat dissipation efficiency. To sum up, the present invention obviously meets the requirements for invention patents, and a patent application is filed in accordance with the law. However, the above is only a preferred embodiment of the present invention. For those who are familiar with the technology of the present case, equivalent modifications or changes made in accordance with the spirit of the present invention should be included in the scope of the following patent applications.