TW476024B - Cooling device and its manufacturing method - Google Patents

Abstract

Provided is a cooling device including a heat conduction tube and a radiator. The heat conduction tube equips the first and second point. The first point connects to the chip with heat, and the second point is surrounded a radiator outside. The radiator consists of two cooling objects. Each cooling object has a base. One side of the base in opposition to the heat conduction tube has the slot. Partial outside surfaces of the second point of the heat conduction tube stick on the inside wall of the slot with heat conduction. After buckling the two cooling objects together in slots, the second point of the heat conduction tube completely stick on between the two slots. The cooling object base has the opposite side of the slot. There are multiple cooling slices lodged above it to distribute heat of the base.

Description

476024

———— Case No. 88114B4 & V. Description of the invention (1) [Field of invention] A method for improving heat dissipation through a heat pipe and cost, and the present invention relates to a heat dissipation device, especially a heat sink for heat transfer and heat dissipation, and can A heat sink that reduces production efficiency. [Background of the Invention] With the rapid development of the information industry, the ability to send data to CPUs and graphics acceleration chips has become stronger and stronger. However, the heat it accompanies is also quickly and rapidly discharged, allowing the chip to be processed, stored, and transmitted in a quality cooling system. The conventional heat dissipation system and a fan, the heat generated by the chip, are then installed in the heat dissipation convection to discharge the heat. However, the amount of heat generated has also increased significantly, and it needs to be increased accordingly, which has led to a trend of thinness, shortness and shortness of the entire industry, and there are also doubts about reliability. Furthermore, it is made of a plurality of columnar heat sinks to improve the heat dissipation effect, that is, a series of structures such as aluminum extrusion, polishing, and anodizing. Of course, this type of process is quite complex and also accounts for a considerable proportion of the overall material, which is obviously not an ideal design. The chip inside the computer (such as the computing speed is getting faster and faster, and its processing speed increases with the increase in chip computing speed. In order to allow these heat to run at normal operating temperature, to ensure the number: usually in the computer Inside is equipped with a radiator mounted on the surface of the wafer. The fan is first transmitted to the fan attached to the wafer, which strengthens the speed of the air due to the increase in the speed of transport. The heat sink is an increase in body reset, not only does not conform to computer vibration, shock and other related tests. One of the surfaces of this type of heat sink is usually a configuration to increase the surface area of the heat sink and cut, cut, depilate, After the sanding and processing procedures, the final impurities can be obtained and the waste generated by the trenching procedure is heavy. Therefore, production efficiency and cost considerations are considered 476024 88114649 V. Description of the invention (2) In addition, because the mold is flat, the general radiator In terms of heat dissipation ratio, it is impossible to obtain a full piece separated from the base, and the reheater (refer to the US patent system, the direct insertion of the heat sink fin is obviously insufficient, and Gap, so that the overall heat transfer and dissipation. Therefore, how to provide a dispersion of the requirements of the central processor. [Objective of the invention] The purpose of the present invention is heat and heat dissipation, and another object of the present invention is to fin insert molding To improve heat dissipation and production efficiency on the base, another object of the present invention, wherein the heat dissipation device is provided with a base and a plurality of heat dissipation fins, which can improve heat dissipation and production. [Inventive Features] The heat dissipation device of the present invention includes a first, At the second end, the bean tip is tied to the outer shell of the JL. The eight-phase material is formed by surrounding the Γ plane. The limit on each degree, and the ratio of the scale height to the heat dissipation confusion. No. 5, 308, 8 5 8) In the socket of the base, the thermal effect between the film and the socket of the base is greatly reduced. In order to improve the aforementioned heat-deficiency devices, it is a pole

Correction on page 5 _ Related technology The width of the groove between the water fins is also formed by inserting the heat sink fins, but the overall structure of this type of heat sink is stable, and it is easy to produce vacancies, which is in line with the problems to be solved today . Provided is a heat radiation device for transmitting heat radiation efficiency through a heat pipe and a radiator. Provided is a heat sink including a heat pipe and a heat sink, which can reduce production costs and a heat sink. That is to provide a heat dissipation device that has a heat sink and a heat pipe, and the heat sink has a structure and efficiency obtained by the enemy's molding method.

V includes a heat pipe and a heat sink. The first end of the heat pipe is thermally connected to the chip, while the second heat sink has two bases. The heat sink has a base and one of the bases. 476024

A groove is formed corresponding to the outer surface of the heat conducting tube. The outer surface of the second blade of the heat conducting tube is thermally attached to the inner wall of the groove. After the two pieces of heat are dissipated, the second end of the Xiao heat conducting tube can be inserted into the groove. The fully fit container is placed between two's, and the heat sink base is opposite to the other side provided with a groove, and a plurality of heat sink fins are provided by the embedded method to radiate heat from the base. As the heat dissipation device is a body structure obtained by inserting the heat sink fins into the base, it can arbitrarily adjust the ratio between the height of the heat sink fins and the width between the heat sink fins / grooves without cutting. A series of processing procedures, such as groove cutting, hair removal, sanding, polishing, and anodizing, so this heat sink can completely overcome the lack of known technology, so as to improve heat dissipation and production efficiency, and reduce costs. [Description of the preferred embodiment] Please refer to the first figure and the second figure together. The heat sink of the present invention includes a heat pipe 10 and a heat sink 20. The heat pipe 10 is provided with first and second ends 1 2, 1 and 4. The first end 12 is thermally connected to the wafer (not shown) to absorb the heat generated by the wafer, and the second end 1 4 is a guide contact set in a heat sink 20, which is used to dissipate the heat absorbed by the heat transfer tube 10 from the wafer (see below for details). The heat sink 20 is composed of two symmetrical heat sinks 21, the heat sink 21 has a base 22, and a groove 224 is formed on one side of the base 22 opposite to the heat pipe 10, and the heat pipe 10 is second A part of the outer surface of the end 14 is thermally adhered to the inner wall of the groove 224. After the grooves 224 of the two heat sinks 21 are fastened to each other, the second end 14 of the heat pipe 10 can be completely fitted and accommodated in the two Between slots 224. In addition, convexities are integrally extended at both ends of the base 22, respectively.

Page 6 476024 Amendment V. Description of the invention (4) I After placing it between the two slots 224 of the heat sink 21, pass the screw holes of the two heat sinks 21 with screws 30 (or similar fixing devices). 2 2 2. If the cap 32 is fixed, the second end of the heat pipe 10 can be “heat-conducted and fixed between the grooves 224 of the heat body 21. Furthermore, in the gap between the second end 14 and 224 of the heat pipe 10, ㉟ It is often filled with heat conduction f (not shown), and the heat transfer effect between the second end 14 of the south heat pipe 10 and the bottom of the heat sink is "Electrical heat body 2 1 base 2 2 from the heat pipe 1 〇 the second end丨 4 absorbs the guide tube; heat from the first end 12. The heat sink 21 is at the base 22: there are; ^ other / surface, a plurality of circular convex plates 26 are provided, and the plurality of circular convex The shape plate 26 is provided with a plurality of heat dissipation fins in an insert molding method, which are used to disperse the base 22, ..., and thereby improve the overall heat dissipation efficiency. Refer to the second figure for a schematic diagram of the method of the base 22 of the heat sink 21 and the plurality of heat sink fins 24 = 1 = 1. "Includes an upper module 40 and a lower module 42 = 44, wherein the upper module 40 is provided with a convex strip for forming a groove 224 on the heat sink 21 f seat 22, wherein the inner mold is provided with a circular isolated cavity, A plurality of long grooves 46 are provided in the center, so that the plurality of radiating Korean sheets 24 can be tightly inserted into the cymbals, and the base 22 of the radiating body 21 is formed by a mold cavity 47 composed of an upper module 40 and an inner mold 44; First, the plurality of heat dissipation fins 24 are tightly inserted into 44, and the plurality of long grooves 46 are then 'clamped, and the wash cavity 48 is directed to the mold cavity = > Yao Xiangshui (not shown in the figure)' after cooling, Opening the mold and by ejecting the top of the pin M = die 44 ', a heat sink with a plurality of heat sinks can be integrated to prevent the heat dissipation device of the present invention from being formed by bulging the heat sink Korean sheet into the base, and at the same time, It can also be adjusted arbitrarily as required ^ £ 5 The ratio between the heights of the heat sinks does not need to be cut

Sanding and polishing, anodizing, etc. — can completely overcome the lack of conventional technology ’and reduce the cost. A series of processing procedures have been lost, so you and Gui μΓ, so the heat dissipation device A ', so as to improve the survey # You Huizheng heat and production efficiency application: The essential elements of the invention patent are described in detail, and the law is specifically proposed to be familiar with the technology of this case. The presenter is only a preferred embodiment of the present invention, and all modifications or equivalents should be included in the scope of the following patent applications.

Page 8 476024 _Case No. 88114649_ Year Month Amendment _ Brief Description of Drawings [Simplified Description of Drawings] The first drawing is a three-dimensional combined drawing of the heat dissipation device of the present invention. The second figure is an exploded perspective view of the heat sink of the present invention. The third figure is a schematic diagram of an insert molding method between a heat sink base and a plurality of heat sink fins of the heat sink of the present invention. [Description of component symbols] Heat pipe 10 First end 12 Second end 14 Radiator 20 Radiator 21 Base 22 Flange 220 Screw hole 222 Slot 224 Radiating fin 24 Round convex plate 26 Screw 30 Nut 32 Upper module 40 down Module 42 Inner mold 44 Long groove 46 Cavity 47 Washing port 48 Ejector pin 49

Page 9

Claims (1)

476024 _case number 88114649_year month__ VI. Patent application scope 1. A heat dissipation device, comprising: a heat pipe with first and second ends, wherein the first end is thermally connected to the chip 5 to absorb The heat generated by the chip 'and a heat sink are formed by the relative combination of two heat sinks, wherein the heat sink includes a base and a plurality of heat sinking fins which are integrally molded, and one side of the base is opened corresponding to the shape of the heat pipe. There is a groove, and the second end of the heat pipe is thermally bonded to the inner wall of the groove. 2. The heat dissipation device according to item 1 of the scope of patent application, wherein the base has flanges extending at its two ends, respectively. 3. The heat dissipation device according to item 2 of the scope of the patent application, wherein the flange is further provided with a screw hole, and the second end of the heat pipe can be held between the two heat sinks by the fixing device. 4. The heat dissipation device according to item 3 of the scope of patent application, wherein a gap between the outer surface of the second end of the heat pipe and the inner wall of the groove is filled with a heat conductive paste to improve heat transfer efficiency. 5. The heat dissipation device according to item 1 or 2 of the scope of the patent application, wherein the heat sink base is provided with a plurality of heat dissipation fins on the other side opposite to the groove, for radiating heat from the base. 6. The heat dissipation device according to item 5 of the scope of patent application, wherein the other side of the heat sink base opposite to the groove is a round convex surface. 7. A method for manufacturing a heat dissipation device, comprising: providing a convex strip on an upper module; providing an internal cavity in an internal mold; forming a cavity in the lower module to accommodate the internal mold, and using the upper module and the lower mold Page 10 476024 ----- Case No. 8811464A__ 月 日 _ Amendment_ VI. The patent application scope and the cavity formed by the inner mold to form the base of the heat sink; a plurality of long grooves are provided in the inner cavity of the inner mold For the plurality of heat sinking fins to be inserted tightly therebetween; the plurality of heat sinking fins are correspondingly tightly inserted into the plurality of long grooves in the inner mold respectively; the mold is closed and aluminum water is poured into the mold cavity at the casting mouth; After cooling, open the mold and push the ejector pin against the inner mold to lift the integrated heat sink against the ejector; place a heat transfer tube between the two heat sinks placed opposite each other and fasten the device The heat pipe can be heat-fixed in the grooves of the two heat sinks. 8. The manufacturing method of the heat dissipation device as described in item 7 of the scope of the patent application, wherein the convex strip of the upper module is used to form a groove on the base of the heat sink, and a portion of the heat conducting tube is valley-shaped. 9 · The manufacturing method of the heat dissipation device according to item 7 of the declared patent scope, wherein the inner cavity of the inner mold is arc-shaped. Page 11