CN105695076B - A kind of aqueous diamond wire silicon chip cutting fluid - Google Patents
A kind of aqueous diamond wire silicon chip cutting fluid Download PDFInfo
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- CN105695076B CN105695076B CN201610109455.6A CN201610109455A CN105695076B CN 105695076 B CN105695076 B CN 105695076B CN 201610109455 A CN201610109455 A CN 201610109455A CN 105695076 B CN105695076 B CN 105695076B
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/087—Boron oxides, acids or salts
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2205/00—Organic macromolecular hydrocarbon compounds or fractions, whether or not modified by oxidation as ingredients in lubricant compositions
- C10M2205/04—Organic macromolecular hydrocarbon compounds or fractions, whether or not modified by oxidation as ingredients in lubricant compositions containing aromatic monomers, e.g. styrene
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2205/00—Organic macromolecular hydrocarbon compounds or fractions, whether or not modified by oxidation as ingredients in lubricant compositions
- C10M2205/06—Organic macromolecular hydrocarbon compounds or fractions, whether or not modified by oxidation as ingredients in lubricant compositions containing conjugated dienes
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/041—Siloxanes with specific structure containing aliphatic substituents
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/04—Detergent property or dispersant property
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Abstract
The invention belongs to silicon crystal cutting technique field more particularly to a kind of aqueous diamond wire silicon chip cutting fluids.The component of aqueous diamond wire silicon chip cutting fluid includes extreme pressure agent, surfactant, antifoaming agent, bleeding agent, SBR emulsion adhesive and deionized water, the aqueous diamond wire silicon chip cutting fluid of the formula have the function of it is excellent lubricate, cool down, anti-corrosion, antirust, anti-extreme pressure on the basis of, preparation method is simple for process, condition is easily-controllable, of low cost, low for equipment requirements, is suitable for industrialized production.
Description
Technical field
The invention belongs to silicon crystal cutting technique field more particularly to a kind of aqueous diamond wire silicon chip cutting fluids.
Background technology
With the rapid development of global solar and microelectronic industry, the demand rapid growth to silicon chip.Slice is silicon chip
Processing the first procedure, while be also cause silicon chip stress, surface layer and subsurface stratum damage and chipping one of master operation, and
The performance of cutting liquid is to influence one of the key factor of silicon chip cutting efficiency and quality.
The mainly free mortar cutting suspension of use and the boart boart wire cutting of current silicon chip cutting technique, and diamond
Abrasive wire sawing is a kind of more novel cutting technique, and the diamond being coated with using sand line outer layer is cut with silicon chip friction
It cuts, cutting liquid is no longer needed for suspension and carbonation silicon particle, also no longer needs to have higher viscosity, need not be mixed into the solution
Silicon carbide blade material, cutting speed are 2~3 times of steel wire in mortar cutting technique, and piece rate is also higher than mortar cutting mode, and
Its water power consumed reduces 2/3rds than mortar cutting technique, and the silica flour generated after cutting can all recycle use, because
This will be substantially reduced in the depreciation of specific yield, artificial and energy cost, be energy-saving and environment-friendly.
But due to diamond that in boart boart wire cutting technology, sand line outer layer is coated with and silicon chip friction, and Buddha's warrior attendant
The frictional force that stone sand line generates wants high more than mortar suspension, and when cutting generates moment stronger high temperature, and chip silica flour due to
Granularity is too thin, and specific surface area greatly increases, and which results in the silicon chip surfaces after cutting can difficult cleaning of solid silica fine powder
End, to make product smoothness decline, yield is low, easy warpage.
Invention content
Technical problem to be solved by the present invention lies in：In the technique for avoiding boart boart wire cutting silicon chip, gained silicon chip
There are the solid silicon fine powders for being much not easy to wash on surface, so that it is guaranteed that the surface flatness of silicon chip product.
In order to solve the above technical problems, the technical solution adopted by the present invention is：A kind of aqueous diamond wire silicon chip cutting is provided
Liquid, component include extreme pressure agent, surfactant, antifoaming agent, bleeding agent, SBR emulsion adhesive, deionized water,
Specifically, above-mentioned aqueous diamond wire silicon chip cutting fluid is in parts by weight, including following each component：
Wherein, extreme pressure agent selects synthesizing ester extreme pressure agent, and such as borate ester extreme pressure agent, borate ester extreme pressure agent is as a kind of
Novel Water Soluble EP Additives, anti-extreme pressure ability are much larger than sulphur phosphorous and chlorine lead-type additive, and tasteless, nontoxic,
Corrosion-free to metal with good extreme pressure anti-wear and thermal stability, inhibition is efficient；In addition, strong due to borate oil film
Degree is high, and friction coefficient is low, there is good antifriction antiwear greasy property and sealing material to have under high-temperature and high-pressure conditions good
Compatibility, effect harmless to the human body are a kind of ideal environmental type additives, effectively increase the tribology of cutting liquid
Performance embodies preferable resistance to extreme pressure；
Surfactant is alcohols nonionic surfactant, and structure is RO (C3H6O)a(CH2CH2O)b(C3H6O) cH,
Wherein, R H, allyl, normal-butyl or isobutyl group, a=10~30, b=10~30, c=10~30, the surface
Activating agent promotes the stability of system, and has good greasy property, and high temperature resistant section is wide, viscosity with temperature variation
Small, cooling performance is good, realizes that the silicon chip surface stria after cutting is relatively light or almost without making the consumption line amount of carborundum line also obtain
It is substantially reduced；
Antifoaming agent is silicon class antifoaming agent, such as dimethicone, and the antifoaming agent added in formula, main function is to press down
System generates a large amount of bubbles during hydro-peening, prevents slot phenomenon generation of overflowing, the antifoaming agent is fast with antifoaming speed, foaming capacity is low
The characteristics of；
Bleeding agent is fatty alcohol polyoxyethylene ether or alkyl phenol polyoxyethylene ether, has splendid wetting ability to silicon chip, makes
The maximum effect of sprawling can be played by obtaining the cutting liquid in cutting process；
SBR emulsion adhesive is water soluble latex, preferably SBR l006 types adhesive, this analog assistant is to cutting
The meticulous silica flour of generated granularity has good adhesive effect in the process, which is placed in cutting liquid in advance
In, then by generated partial heat when cutting, taking advantage of a situation can cause these tiny silica flours in system to reunite again, tie
The relatively large particle of grain size is synthesized, these particle parts can smoothly be deposited to cutting liquid bottom, with cutting liquid system shape
Ingredient is from even if the surface that another part has rested on silicon chip product is washed away by that can be easier if subsequent rinse, avoiding
The problem of " silica flour is not easy to be washed away since grain size is meticulous after being attached to silicon chip surface ".
The present invention also provides a kind of preparation methods of above-mentioned aqueous diamond wire silicon chip cutting fluid, are added into deionized water
Surfactant, bleeding agent, antifoaming agent, SBR emulsion adhesive and extreme pressure agent, stir evenly and obtain aqueous Buddha's warrior attendant
Line silicon chip cutting fluid.
The beneficial effects of the present invention are：The aqueous diamond wire silicon chip cutting fluid of the present invention, with it is excellent lubricate, it is cold
But, on the basis of anti-corrosion, antirust, anti-extreme pressure function, cutting process is made by SBR emulsion adhesive a small amount of in formula
In generated tiny silica flour reunite again, be combined into the relatively large particle of grain size, avoid be attached to it is thin on silicon chip surface
Silica flour is not easy the problem of being washed away.And this aqueous diamond wire silicon chip cutting fluid preparation method is simple for process, condition is easily-controllable, at low cost
It is honest and clean, low for equipment requirements, it is suitable for industrialized production.
Specific implementation mode
Embodiment 1
A kind of aqueous diamond wire silicon chip cutting fluid is in parts by weight following each component：
Above-mentioned surfactant is alcohols nonionic surfactant, and structure is RO (C3H6O)a(CH2CH2O)b(C3H6O)
CH,
Wherein, R is normal-butyl, a=18, b=20, c=15；
The preparation method of aqueous diamond wire silicon chip cutting fluid in the present embodiment is：
Under room temperature (25 DEG C), above-mentioned surfactant, bleeding agent, antifoaming agent, butadiene-styrene rubber breast are added into deionized water
Bonding agent and extreme pressure agent stir evenly and obtain aqueous diamond wire silicon chip cutting fluid.
Embodiment 2
A kind of aqueous diamond wire silicon chip cutting fluid is in parts by weight following each component：
Above-mentioned surfactant is alcohols nonionic surfactant, and structure is RO (C3H6O)a(CH2CH2O)b(C3H6O)
CH,
Wherein, R is isobutyl group, a=14, b=23, c=13；
The preparation method of aqueous diamond wire silicon chip cutting fluid in the present embodiment is：
Under room temperature, above-mentioned surfactant, bleeding agent, antifoaming agent, SBR emulsion bonding are added into deionized water
Agent and extreme pressure agent stir evenly and obtain aqueous diamond wire silicon chip cutting fluid.
Comparative example 1
Remaining each component is identical as being corresponded in the formula of embodiment 1, only eliminates " SBR l006 types adhesive ", presses
Parts by weight are calculated as following each component：
Preparation method is：
Under room temperature, above-mentioned surfactant, bleeding agent, antifoaming agent, extreme pressure agent are added into deionized water, stirs evenly i.e.
Obtain aqueous diamond wire silicon chip cutting fluid.
Comparative example 2
Remaining each component is identical as being corresponded in the formula of embodiment 2, only eliminates " SBR l006 types adhesive ", presses
Parts by weight are calculated as following each component：
Preparation method is：
Under room temperature, above-mentioned surfactant, bleeding agent, antifoaming agent, extreme pressure agent are added into deionized water, stirs evenly i.e.
Obtain aqueous diamond wire silicon chip cutting fluid.
After the cutting liquid in the various embodiments described above, comparative example is diluted 350 times with deionized water respectively, to same specification
Silicon rod carries out boart boart wire cutting, after cutting to silicon chip product carry out conventional cleaning (in each embodiment, comparative example, cutter
Skill, cleaning are consistent), using the cutting liquid in embodiment 1,2, wear-resisting property is good, and cooling performance is good, and silicon chip is cut into
Product rate is 98.7%, and silicon chip easy cleaning, the results are shown in Table 1 for related experiment：
Table 1
Cutting liquid bottom is examined after dicing, one layer of very thin sediment is arranged at the cutting liquid bottom in embodiment 1,2,
This should be exactly the silicon particle for combining and settling down of reuniting；And the cutting liquid bottom in comparative example 1,2 is without this phenomenon.This
It has absolutely proved in embodiment 1,2 through the addition of SBR l006 type adhesive, has played the intervention effect to fine silica powder, hence it is evident that
It avoids fine silica powder and is attached directly to silicon chip surface under the premise of no reunion, and cause subsequently to clean difficulty, increase silicon
The roughness on piece surface, influences performance.
Claims (7)
1. a kind of aqueous diamond wire silicon chip cutting fluid, it is characterised in that：The group subpackage of the aqueous diamond wire silicon chip cutting fluid
Include extreme pressure agent, surfactant, antifoaming agent, bleeding agent, SBR emulsion adhesive and deionized water；Wherein, the water
Property diamond wire silicon chip cutting fluid in parts by weight, including following each component,
2. aqueous diamond wire silicon chip cutting fluid as described in claim 1, it is characterised in that：The extreme pressure agent is borate ester
Extreme pressure agent.
3. aqueous diamond wire silicon chip cutting fluid as described in claim 1, it is characterised in that：The surfactant is alcohols
Nonionic surfactant, structure are RO (C3H6O)a(CH2CH2O)b(C3H6O) cH, wherein R H, allyl, normal-butyl or
Isobutyl group；A=10~30, b=10~30, c=10~30.
4. aqueous diamond wire silicon chip cutting fluid as described in claim 1, it is characterised in that：The antifoaming agent is dimethyl-silicon
Oil.
5. aqueous diamond wire silicon chip cutting fluid as described in claim 1, it is characterised in that：The bleeding agent is poly alkyl alcohol
Ethylene oxide ether or alkyl phenol polyoxyethylene ether.
6. aqueous diamond wire silicon chip cutting fluid as described in claim 1, it is characterised in that：The SBR emulsion bonding
Agent is SBR l006 type adhesive.
7. the preparation method of aqueous diamond wire silicon chip cutting fluid as described in claim 1, it is characterised in that：The preparation method
For,
Surfactant, bleeding agent, antifoaming agent, SBR emulsion adhesive and extreme pressure agent are added into deionized water, stirs
It mixes and uniformly obtains aqueous diamond wire silicon chip cutting fluid.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610109455.6A CN105695076B (en) | 2016-02-26 | 2016-02-26 | A kind of aqueous diamond wire silicon chip cutting fluid |
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| CN201610109455.6A CN105695076B (en) | 2016-02-26 | 2016-02-26 | A kind of aqueous diamond wire silicon chip cutting fluid |
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| CN105695076B true CN105695076B (en) | 2018-09-18 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106753734B (en) * | 2017-01-23 | 2020-01-14 | 杭州传化精细化工有限公司 | Silicon wafer cutting fluid |
| CN106939182A (en) * | 2017-03-01 | 2017-07-11 | 苏州润德新材料有限公司 | A kind of aqueous diamond wire silicon chip cutting fluid and preparation method thereof |
| CN107603698A (en) * | 2017-08-17 | 2018-01-19 | 郑明� | Diamond wire Special cutting fluid |
| CN109777588A (en) * | 2017-11-13 | 2019-05-21 | 苏州禾川化学技术服务有限公司 | A kind of one-component Buddha's warrior attendant wire cutting liquid for silicon wafer |
| CN109439425A (en) * | 2018-12-18 | 2019-03-08 | 武汉风帆电化科技股份有限公司 | Cooling cutting liquid of a kind of diamond wire and preparation method thereof |
| CN111303981B (en) * | 2020-03-26 | 2022-05-03 | 常州高特新材料股份有限公司 | Diamond wire cutting fluid and preparation method thereof |
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| CN1257908A (en) * | 1999-12-29 | 2000-06-28 | 上海宝钢集团公司 | Lubricant for heat processing of metals |
| CN1353176A (en) * | 2000-11-02 | 2002-06-12 | 中国石油化工股份有限公司 | Water-based lubricant containing polystyrene copolymer and its preparing process |
| CN103184093A (en) * | 2011-12-29 | 2013-07-03 | 辽宁奥克化学股份有限公司 | Cutting liquid used for sapphire cutting by diamond wire |
| CN103525532A (en) * | 2013-10-18 | 2014-01-22 | 山东昊达化学有限公司 | Emery line cutting liquid and preparation method thereof |
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2016
- 2016-02-26 CN CN201610109455.6A patent/CN105695076B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87106375A (en) * | 1986-09-23 | 1988-04-06 | 隆察股份公司 | The lubricant that the moulding of steel chipless is used |
| CN1257908A (en) * | 1999-12-29 | 2000-06-28 | 上海宝钢集团公司 | Lubricant for heat processing of metals |
| CN1353176A (en) * | 2000-11-02 | 2002-06-12 | 中国石油化工股份有限公司 | Water-based lubricant containing polystyrene copolymer and its preparing process |
| CN103184093A (en) * | 2011-12-29 | 2013-07-03 | 辽宁奥克化学股份有限公司 | Cutting liquid used for sapphire cutting by diamond wire |
| CN103525532A (en) * | 2013-10-18 | 2014-01-22 | 山东昊达化学有限公司 | Emery line cutting liquid and preparation method thereof |
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Address after: No. 310, Wuyi Road, Lucheng street, Wujin District, Changzhou City, Jiangsu Province Patentee after: Changzhou Gaote New Material Co., Ltd Address before: 213100 Jiangsu Province, Changzhou city Wujin District streets Lucheng Fumin Road No. 299 Patentee before: CHANGZHOU GREATOP NEW MATERIAL CO., LTD. |