CN105679724A - 使用分立半导体部件的半导体功率模块 - Google Patents

使用分立半导体部件的半导体功率模块 Download PDF

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CN105679724A
CN105679724A CN201511028182.4A CN201511028182A CN105679724A CN 105679724 A CN105679724 A CN 105679724A CN 201511028182 A CN201511028182 A CN 201511028182A CN 105679724 A CN105679724 A CN 105679724A
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electronic device
discrete electronic
substrate
power module
built
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R·J·博诺
吉本一郎
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Littelfuse Inc
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Littelfuse Inc
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Abstract

本公开涉及使用分立半导体部件的半导体功率模块，并且公开了一种电子功率模块。该模块包括基板；和安装在该基板上的多个内部绝缘的分立电子器件，使得他们的电导线定位为远离该基板。该电导线耦合至印刷电路板(PCB)。公开的其他特征包括热界面材料和专用热沉。该组件通过注射模制进行二次模制或采用封装体进行灌封。示例的电子器件包括晶闸管、二极管或晶体管。

Description

使用分立半导体部件的半导体功率模块
背景技术
使用直接键合铜(“DBC”)衬底来构造一些电子模块。可由具有将铜直接键合至陶瓷绝缘体的一面上的陶瓷绝缘体来形成DBC衬底。尽管DBC衬底提供半导体芯片的增强的热回复性(thermalresilience)，但是DBC衬底大大地增加了在组装之前测试元件的难度。另外，DBC衬底部件的组装成本相对于非DBC部件较高。而且，当较难成比例改变(scale)形成在DBC衬底上的元件。更特别的是，当将部件安装至DBC衬底时，较难成比例改变可能包含在一个器件上的元件数量。此外可获得的电路拓扑结构的数量会受到限制。本公开是针对这些问题的。
发明内容
下文是简单的概述以提供对文中描述的一些实施例的基本理解。该概述不是泛泛的综述，且意图不是确定关键/紧要元件或描述其范围。其唯一目的是以简单的形式描述一些概念作为后面出现的更详细说明的序言。
各种实施例总体涉及由多个分立半导体部件形成的电子器件，该半导体部件相对于传统的技术能够提供增强的热回复性。根据本公开的各种实施例的该电子器件可改变比例以提供各种不同部件和/或电路拓扑结构，同时相对于传统技术仍能保特热回复性。
在一个实施例中，分立电子器件安装在基板上，优选地具有远离该基板定位的电导线。典型地将电子器件理解为用在电子系统中以影响电子或电场的物理实体。该基板可包括热导材料，例如铜，以使得热远离内部绝缘分立电子器件来传导。
在一个实施例中，使用诸如螺丝、弹簧夹等机械固定件将该器件安装在基板上。在一个实施例中，每个器件具有形成为相对于基板呈90度角的电导线以提供通孔印刷电路板(“PCB”)安装。该组件可被焊接至PCB中，该PCB提供所需的特定拓扑结构。一个或多个专用热沉被安装到基板上。可通过注射模制(injectedmolded)或者使用密封剂的灌封(pottedusingencapsulant)来二次模制(overmold)该整体组件。
附图说明
图1是描述根据本公开的至少一个实施例排列的电子器件的底视图的框图。
图2是描述图1的电子器件的侧视图的框图。
图3是描述根据本公开的至少一个实施例排列的电子器件的框图，该电子器件由密封剂进行灌封。
图4是描述根据本公开的至少一个实施例排列的电子器件的框图，该电子器件由绝缘体进行过浇铸。
图5是描述根据本公开的至少一个实施例排列的电子器件的框图，该电子器件可操作性地连接至PCB。
图6是描述根据本公开的至少一个实施例排列的电子器件的框图，该电子器件可操作性地连接至PCB并由封装体进行灌封。
图7是描述根据本公开的至少一个实施例排列的电子器件的框图，该电子器件可操作性地连接至PCB并由绝缘体进行二次模制。
具体实施方式
现在，本公开自此以后将参照附图进行更充分的描述。但是应当理解，前述的权利要求可以以多种不同形式来实施并且不应该被解释为限于文中所提出的实施例。相反地，提供这些实施例是为了使本公开彻底和完整，且将所要求保护的主题范围传达给本领域技术人员。在附图中，类似的附图标记自始至终代表类似的元件。
图1-2示出了从多个分立电子器件120-a形成的电子器件100。特别地，图1示出了器件100的底视图而图2示出了器件100的侧视图。应当理解，本文中使用的“一个”可以指任何正整数。而且，尽管图1-2示出了分立电子器件120-1至120-6，本文不限制于这些示例。更特别地，器件100可包括任意数量的分立电子器件120。
更特别地转向图1，该电子器件100包括分立电子器件120-1、120-2、120-3、120-4、120-5和120-6。一般地，该分立电子器件120-a可是多种电子器件中的任一，例如电阻器、电容器、半导体闸流管、二极管、晶体管、天线、电机器件、压电器件等。而且，该分立电子器件120-a可是多种分立电路中的任一，例如放大器、振荡器、转换器等。
在一些示例中，该分立电子器件是内部彼此绝缘的。更特别地，每个分立电子器件120-a是与其它器件120-a电绝缘的。在一些示例中，该分立电子器件120-a可具有操作为内部绝缘该器件的铸件(casting)。该铸件可由金属、塑料、玻璃、陶瓷或其它绝缘材料制成。
内部绝缘的一些优点包括抗撞击和腐蚀保护，对于(用于将该电子器件连接至外部电路的)接触管脚或引线的稳定保持，以及消散器件中产生的热。此外，在该器件100中采用内部绝缘的分立电子器件120-a的优势是每个分立电子器件120-a可在器件100被装配和/或完全形成之前被测试。
该器件100还包括基板140。每个分立电子器件120-a固定至该基板140。图1-2示出通过螺丝130-a将该分立电子器件120-a固定至该基板。特别地，示出分立电子器件120-1至120-6分别采用螺丝130-1至130-6来固定。然而，在本文不限于该示例。特别地，该分立电子器件120-a可通过多种技术中的任意一种来固定至基板140，例如铆定、卷夹、焊接、锡焊、铜焊、胶带、接合或采用粘合剂(例如，热树脂等)。
一般地，基板140可包括多种热传导材料中的任意一种。例如，基板140可是铜、银、金、铝、铁、钢、黄铜、青铜、水银、石墨或包含这些或其他热导材料中的一种或多种的合金。
应当理解，该分立电子器件120-a可包括任意数量的电导线110-ab，其中导线数量取决于每个独立的分立电子器件120-a的特性。可是，为了方便和清楚，示出的分立电子器件120-a具有三(3)个电导线110-ab。特别地，分立电子器件120-1包括电导线110-11、110-12和110-13。分立电子器件120-2包括电导线110-21、110-22和110-23。分立电子器件120-3包括电导线110-31、110-32和110-33。分立电子器件120-4包括电导线110-41、110-42和110-43。分立电子器件120-5包括电导线110-51、110-52和110-53。分立电子器件120-6包括电导线110-61、110-62和110-63。每个分立电子器件120可是诸如半导体晶闸管、二极管、晶体管的电子器件或其它类型电子器件的电子器件。每个分立电子器件120是内部绝缘的，意味着其具有由金属、塑料、玻璃、陶瓷或其它材料制成的铸件。每个分立电子器件120可包括各自在硅片中蚀刻成的分立元件。
热界面材料150被示出在该分立电子器件120-a和基板140之间。热界面材料150可以是具有类似油脂特性的粘性流体物质，其通过填充由于分离电子器件120-a与基板140之间的表面中的不完整性引起的气隙，而增加了基板140和分离电子器件120-a的热导率，从而允许进一步的热消散。在一个示例中，热界面材料150包括悬浮在硅树脂热组合物中的金属氧化物和氮化物颗粒。在其它示例中，热界面材料150包括水、热油脂、氧化铝、氧化锌、钢、氟化钠铝、铜、银、蓝宝石、氧化铍、氮化铝、氧化锌、二氧化硅、镓或其它材料。
图3从侧视图描绘电子器件300。图3示出了分别通过螺丝130-1和130-2固定至基板140的分立电子器件120-1和120-2。可是本文并不限于这些示例。特别地，该分立电子器件120-a可通过多种技术中的任一固定至基板140，例如，铆定、卷夹、焊接、锡焊、铜焊、胶带、接合或采用粘合剂(例如，热树脂等)。
应当理解，该分立电子器件120-a可包括任意数量的电导线110-ab，其中导线数量取决于每个独立的分立电子器件120-a的特性。可是，为了方便和清楚，示出的分立电子器件120-a具有电导线110-1和110-2。在该示例中，电导线110-1和110-2定位为远离基板140。
在正常工作期间，该分立电子器件120-a产生大量的热。如果不去除该分立电子器件120-a在工作期间产生的热，则该分立电子器件120-a或靠近它们的其它电子器件将会过热，导致损坏该分立电子器件120-a，损坏它们附近的器件，或引起性能退化。在该示例中，专用热沉310已经安装至基板140，以辅助散热。需要平衡热沉310的散热需求与其它因素。如果热沉的热膨胀系数显著不同于基板140或其它附着的元件，该热沉310可能会破裂、损坏或和与之附着的电子元件相分离。此外，用于制备热沉的许多材料是相对较重的。如果该分立电子器件120-a或组件的其它部分遭受振动或撞击，热沉310的重量可能会破裂、损坏或引起热沉310与基板140分离。因此，在选择热沉时，优化热沉的散热、重量、成本、机械加工性和其它特性是有利的。因此，热沉310对于器件300的应用是专用的。
关于一些示例，采取措施以免受震动和振荡的影响，并且保护电子元件免受水汽和腐蚀剂的腐蚀。特别地，该组件可用封装体320进行罐封。封装体320可以是固体或凝胶状组合物，其提供对震动和振荡的抵抗，以及辅助排除湿气和腐蚀剂。封装体320可以包括诸如聚氨酯或硅树脂的化合物。
图4从侧视图示出器件400。分立电子器件120-1和120-2被示出为分别通过螺丝130-1和130-2固定至基板140。然而，本文不限制于这些示例。特别地，该分立电子器件120-a可通过多种技术中的任一固定至基板140，例如，铆定、卷夹、焊接、锡焊、铜焊、胶带、接合或采用粘合剂(例如，热树脂等)。
应该理解，该分立电子器件120-a可包括任意数量的电导线110-ab，其中导线数量取决于每个独立的分立电子器件120-a的特性。可是，为了方便和清楚，示出的分立电子器件120-a具有电导线110-1和110-2。专用热沉310被安装至基板140上。采取描施以免受震动和振荡的影响以及保护电子元件免受水汽和腐蚀剂的腐蚀。在本示例中，组件已经通过注射模制进行了二次模制。在该步骤中，材料被置于加热的桶中，进行混合，并压入由热沉310形成的空腔中，其中材料被冷却并固化为结构420。示例的材料包括金属、玻璃、弹性体和膏剂，以及热塑性和热固性聚合物。
图5从侧面示出器件500。示出的分立电子器件120-1和120-2分别通过螺丝130-1和130-2固定在基板140上。然而，本文不限于这些示例。特别地，该分立电子器件120-a可通过多种技术中的任一固定至基板140，例如，铆定、卷夹、焊接、锡焊、铜焊、胶带、接合或采用粘合剂(例如，热树脂等)。
应该理解，该分立电子器件120-a可包括任意数量的电导线110-ab，其中导线数量取决于每个独立的分立电子器件120-a的特性。可是，为了方便和清楚，示出的分立电子器件120-a具有电导线110-1和110-2。希望能机械支撑并电连接电子器件120-a。在本示例中，电导线110-a焊接至具有电导线520-a的印刷电路板(PCB)510上，使得印刷电路板510机械支撑并电连接分立电子器件120-a。PCB510包括导电迹线、焊垫以及其他由非导电性衬底上层叠的导电片蚀刻而得的特征。相比于其他电连接分立电子器件120的方法，由于组装步骤自动完成，使用PCB510可以更便宜且更快捷。使用PCB510还有其他的优点，例如降低线路错误。电连接分立电子器件120的可替换的方式可能包括手动接线缠绕和使用终端线条的点到点结构。
图6从侧面示出器件600。示出的分立电子器件120-1和120-2分别通过螺丝130-1和130-2固定在基板140上。然而，本文不限于这些示例。特别地，该分立电子器件120-a可通过多种技术中的任一固定至基板140，例如，铆定、卷夹、焊接、锡焊、铜焊、胶带、接合或采用粘合剂(例如，热树脂等)。
应该理解，该分立电子器件120-a可包括任意数量的电导线110-ab，其中导线数量取决于每个独立的分立电子器件120-a的特性。可是，为了方便和清楚，示出的分立电子器件120-a具有电导线110-1和110-2。电导线110-1和110-2焊接至具有电导线520-1和520-2的PCB510上。专用热沉310被安装至基板140上。之后该组件通过封装体320灌封。
图7从侧面示出器件700。图7示出的分立电子器件120-1和120-2分别通过螺丝130-1和130-2固定在基板140上。然而，本文不限于这些示例。特别地，该分立电子器件120-a可通过多种技术中的任一固定至基板140，例如，铆定、卷夹、焊接、锡焊、铜焊、胶带、接合或采用粘合剂(例如，热树脂等)。
应该理解，该分立电子器件120-a可包括任意数量的电导线110-ab，其中导线数量取决于每个独立的分立电子器件120-a的特性。可是，为了方便和清楚，示出的分立电子器件120-a具有电导线110-1和110-2。在本示例中，电导线110-1和110-2定位为远离基板140。电导线110-1和110-2焊接至具有电导线520-1和520-2的PCB510上。专用热沉310被安装至基板140上。该组件通过注射模制进行二次模制。在该步骤中，材料被改置到加热的桶中，进行混合，并压入由热沉310形成的空腔，其中材料被冷却并固化为结构420。示例的材料包括金属、玻璃、弹性体以及膏剂等热塑性和热固性聚合物。
应当理解，对本文描述的本优选实施例的各种变形和修改对本领域技术人员来说都是清楚的。这种变形和修改的做出是不偏离本发明精神和范围的且不会减少本发明的优点。因此这意味着这种变形和修改被所附权利要求所覆盖。

Claims (20)

1.一种电子功率模块，包括：
基板；和
安装在基板上的多个内部绝缘的分立电子器件；
其中多个内部绝缘的分立电子器件中的每一个都包括被定位成远离基板的电导线。
2.根据权利要求1所述的电子功率模块，还包括：
设置在多个内部绝缘的分立电子器件和基板之间的热界面材料。
3.根据权利要求2所述的电子功率模块，其中：
热界面材料包括氧化铍、氮化铝、氧化锌或二氧化硅。
4.根据权利要求1所述的电子功率模块，其中：
所述基板包括铜。
5.根据权利要求1所述的电子功率模块，其中：
所述电导线耦合至印刷电路板(PCB)。
6.根据权利要求5所述的电子功率模块，其中：
所述电导线通过焊接耦合至PCB。
7.根据权利要求1所述的电子功率模块，其中：
所述基板耦合到至少一个热沉。
8.根据权利要求1所述的电子功率模块，其中：
所述多个内部绝缘的分立电子器件和所述基板通过注射模制进行二次模制。
9.根据权利要求1所述的电子功率模块，其中：
所述多个内部绝缘的分立电子器件和所述基板采用封装体进行灌封。
10.根据权利要求1所述的电子功率模块，其中：
每一个分立电子器件可以是晶闸管、二极管或晶体管。
11.一种制备电子功率模块的方法，包括；
将多个内部绝缘的分立电子器件安装到基板，其中所述多个内部绝缘的分立电子器件中的每一个都包括电导线，使得所述导线定位为远离所述基板。
12.根据权利要求11所述的方法，还包括
在所述多个内部绝缘的分立电子器件和所述基板之间设置热界面材料。
13.根据权利要求12所述的方法，其中：
所述热界面材料包括氧化铍、氮化铝、氧化锌或二氧化硅。
14.根据权利要求11所述的方法，其中：
所述基板包括铜。
15.根据权利要求11所述的方法，还包括：
耦合所述电导线至印刷电路板(PCB)。
16.根据权利要求11所述的方法，还包括：
将所述电导线焊接至印刷电路板(PCB)。
17.根据权利要求11所述的方法，还包括：
耦合所述基板到至少一个热沉。
18.根据权利要求11所述的方法，还包括：
通过注射模制对所述多个内部绝缘的分立电子器件和所述基板进行二次模制。
19.根据权利要求11所述的方法，还包括：
采用封装体对所述多个内部绝缘的分立电子器件和所述基板进行灌封。
20.根据权利要求11所述的方法，其中：
每一个分立电子器件是晶闸管、二极管或晶体管。
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