CN105659028A - 用于将至少一个光源电连接至电源供应系统的系统 - Google Patents
用于将至少一个光源电连接至电源供应系统的系统 Download PDFInfo
- Publication number
- CN105659028A CN105659028A CN201480056628.1A CN201480056628A CN105659028A CN 105659028 A CN105659028 A CN 105659028A CN 201480056628 A CN201480056628 A CN 201480056628A CN 105659028 A CN105659028 A CN 105659028A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- light source
- heat
- electric power
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005286 illumination Methods 0.000 claims description 16
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 238000004020 luminiscence type Methods 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000002689 soil Substances 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
- F21S43/195—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
本发明涉及一种用于将至少一个光源(2)电连接至电源供应系统的系统(1),其特征在于:所述连接系统(1)包括:连接格栅(3),所述连接格栅适于被电连接至电源供应系统,所述连接格栅(3)包括至少一个连接端子(4);至少一个连接装置(5),所述至少一个连接装置使连接格栅(3)的连接端子(4)被连接至光源(2);连接端子(4)和连接装置(5)通过使光源(2)被设置为与连接格栅(3)分开而适于将光源(2)电连接至连接格栅(3)。
Description
技术领域
本发明的主题为一种用于将至少一个光源电连接至用于供应电功率的系统的系统。
背景技术
通常地但是非排他地,它可应用于允许至少一个发光二极管被电连接至用于供应机动车辆的电功率的系统的系统。
专利申请FR2906347公开了一种车辆的灯装置,其包括照明模块,该模块包括:
-照明装置,每个照明装置包括发光单元;
-传导板,所述传导板包括用于接收照明装置的空腔,该板允许照明装置尤其是利用电迹线被电连接至电功率的源;
-散热保持器,照明装置放置在所述散热保持器上;
-粘合剂部分,所述粘合剂部分放置在散热保持器和传导板之间,其尤其是允许照明装置精确地定位在传导板的空腔中。
已经发现作为专利申请FR2906347的主题的照明模块的传导板必须必然地包括所述空腔以便能够将照明装置放置于其中。因而必须实施附加的形成操作以便给予传导板特定的形状。
此外,为了保持照明装置的光效能,推荐使用用于散热的系统,例如所述散热保持器,由此使照明模块的结构复杂化。
发明内容
本发明的目的尤其是,通过提供用于将至少一个诸如发光二极管的光源电连接至用于供应电功率的系统的系统,而解决这些缺点,其简化的结构尤其允许降低设计和制造成本。
为此目的,本发明提供了一种用于将至少一个光源电连接至用于供应电功率的系统的系统,其特征在于:所述连接系统包括:
-引线框架,所述引线框架能够被电连接至用于供应电功率的系统,所述引线框架包括至少一个连接端子;和
-至少一个连接装置,所述至少一个连接装置允许引线框架的连接端子被电连接至光源,
连接端子和连接装置能够将光源电连接至引线框架,由此允许与引线框架分开地放置光源。
在上面以及下文中,引线框架为传导迹线的结构,所述结构为整体构造。该引线框架例如可以为被冲压形成电迹线然后在绝缘基板上二次模制的板,并且在二次模制之后,除了形成迹线的部分的部分与板分离。
以这种方式,光源被电连接至引线框架,同时远离并离开引线框架,由此有利地允许简化引线框架的结构。特别地,不再需要在引线框架中提供特定的位置以便将光源放置于其中或者将用于特别地耗散由光源发出的热量的装置固定至引线框架。光源与引线框架分开的布置被限定为光源距离引线框架一定距离的布置,这显著减小或者甚至防止引线框架暴露给光源发出的热量,由此使得能够免于将引线框架固定至能够特别地耗散光源的热量的装置。
优选地,引线框架包括用于散热的第一装置,所述第一装置允许耗散由引线框架产生的热量。
优选地,用于散热的第一装置为电阻电路。
优选地,引线框架包括转换器,所述转换器允许将由用于供应电功率的系统传递的电流的尤其为AC的电压转换为施加于引线框架的连接端子的尤其为DC的电压。
施加给连接端子的电压优选地适于给光源供电。
引线框架可以包括用于防护电磁干扰的装置。
有利地,用于散热的第一装置由转换器组成。在该实例中,转换器能够在即使存在大量热耗散的情况下继续正常工作。
有利地,引线框架包括控制电路,所述控制电路控制施加于所述连接端子的电流的电压。
优选地,引线框架的连接端子为连接垫,所述连接垫能够允许通过应用线结合技术连接光源。该连接可以例如通过传导桥获得。
优选地,连接装置为导电线。
优选地,引线框架包括印刷电路板,电子器件能够连接于所述印刷电路板上。
该板包括允许输送电流的多个电迹线,电子器件使用连接插脚被焊接至这些迹线上。
如果需要,电子器件的连接插脚的端部穿过板中的通孔,由此允许利用光学装置实施对形成在这些端部上的焊接接头的质量的目视检查。
优选地,引线框架包括有利地电绝缘的边沿,所述边沿从所述板上垂直地延伸,该边沿包括:
两个基本上平行的纵向壁;和
两个基本上平行的横向壁,两个基本上平行的横向壁每个都连接两个纵向壁。
所述边沿和所述板有利地限定密封托盘,该托盘填充有熔化的塑料制品。
所述边沿的纵向壁中的一个纵向壁包括凹部,连接端子放置在所述凹部中。
优选地,所述边沿的横向壁中的一个横向壁在其外表面上包括突出壳体,所述突出壳体的壁基本上垂直于所述横向壁延伸,引线框架包括放置在该壳体中的至少一个电连接器,该连接器允许将引线框架连接至用于供应电功率的系统。
外表面在这里为指向引线框架的外部的表面。
本发明的另一个主题是一种发光组件,其特征在于:所述发光组件包括:
根据本发明的一种用于将至少一个光源电连接至用于供应电功率的系统的系统;
至少一个光源;和
用于散热的第二装置,所述第二装置允许耗散由光源产生的热量,该用于散热的第二装置与引线框架不连接。
有利地,用于散热的第一装置能够比用于散热的第二装置耗散更多的热量。
优选地,光源为发光二极管(LED),该发光二极管能够为单或多模二极管。
用于散热的第二装置优选地为光源的保持器。
有利地,用于散热的第二装置由基板组成,光源安装在所述基板上。该保持器例如可以由金属或陶瓷制成。
根据本发明的一个变形实施例,用于散热的第二装置包括散热器,所述散热器接近光源放置或与光源接触地放置,该用于散热的第二装置能够与热管关联,所述热管在其一端处与引线框架连接,并且在其另一端处与散热器连接。利用光源与引线框架分开的布置使热管的使用成为可能,这允许减小引线框架的体积。
根据本发明的一个变形实施例,用于散热的第二装置包括散热器和前述类型的金属保持器。
本发明的另一个主题为一种用于机动车辆的照明和/或信号指示装置,其特征在于:所述照明和/或信号指示装置包括根据本发明的发光组件。
附图说明
通过阅读下面的示例和所附的附图,本发明的其它特征和优点将变得显而易见,通过完全非限制性的图示的方式给出所述示例和附图。
图1是根据本发明的系统的引线框架的示意性立体图;以及
图2是根据本发明的系统的引线框架的示意性立体图,其中光源被连接于其上。
具体实施方式
为了清楚起见,已经示意性地但是非成比例地示出了仅仅对于本发明的理解而言必要的元件。
例如如图1所示,根据本发明的电连接系统1包括引线框架3,所述引线框架能够被电连接至用于供应电功率的系统(未示出),例如车辆的电路。
引线框架3基本上采取托盘的形式,所述托盘包括:
●印刷电路板7,电子器件可以连接于印刷电路板上;和
●边沿,包括:
○两个基本上平行的纵向壁8、8’,这些纵向壁中的一个纵向壁8包括凹部9;和
○两个基本上平行的横向壁10、10’,它们每个都连接两个纵向壁8、8’,这些横向壁中的一个横向壁10在其外表面上包括突出壳体11,突出壳体的壁基本上垂直于所述横向壁10延伸,该壳体11包括:
■两个基本上平行的纵向壁12、12’;和
■两个基本上平行的横向壁13、13’,它们每个都连接纵向壁12、12’。
板7例如为PCB(印刷电路板),PCB包括使用电绝缘材料(例如环氧树脂或玻璃纤维)二次模制的至少一个传导层。
该板7包括允许输送电流的电迹线14,这些电迹线14通过使板7的传导层经受冲压工艺而制成。
引线框架3包括电子器件,所述电子器件通常通过激光焊接而连接于所述板7上,根据图1的定向,这些电子器件在板7之上延伸。
电子器件的连接插脚的端部穿过板7,由此允许利用光学装置实施对形成在这些端部上的焊接接头的质量的目视检查。
引线框架3包括放置在壳体11中的至少一个电连接器15,该连接器15与电迹线14中的至少一个连接。连接器15允许引线框架3被连接至用于供应电功率的系统1。电连接器15例如可以为连接垫,所述连接垫能够允许通过应用线结合技术连接用于供应电功率的系统。
引线框架3还包括放置在凹部9中的至少一个连接端子4,该连接端子4能够与连接装置5相互作用以将光源2电连接至引线框架3。
连接端子4为连接垫,所述连接垫能够允许通过应用线结合技术连接光源2,连接装置5为导电线。
此外,引线框架3包括用于散热的第一装置6,所述第一装置允许耗散由引线框架3产生的热量,该用于散热的第一装置6由电阻电路组成。
而且,引线框架3包括:
-允许由用于供应电功率的系统传递的电流的AC电压转换为施加于引线框架3的连接端子4的DC电压的装置;和
-转换电路,所述转换电路控制施加于所述连接端子4的电流的电压,所述转换电路例如能够确保该电压包含在限定的区间内。
以这种方式,引线框架3允许转换和调整由用于供应电功率的系统传递的电流的电压,以便施加给连接端子4合适的电压。
根据本发明的一个变形实施例,由引线框架3的边沿界定的空间可以填充有熔化的塑料制品(使用灌封工艺)。
例如如图2所示,根据本发明的照明组件16包括:
●如上所述的用于将至少一个光源2电连接至用于供应电功率的系统的系统1;
●至少一个光源2;和
●用于散热的第二装置17,所述第二装置允许耗散由光源2产生的热量,该用于散热的第二装置17与引线框架3不连接。
这样,每个连接装置5将一个连接端子4连接至与至少一个光源2连接的传导垫18。
光源2和所述传导垫18放置在用于散热的第二装置17上,组成金属保持器的当前实例。
光源2为发光二极管,其发射部由半导体芯片或多个半导体芯片构成,在第一实例中,二极管为所谓的单芯片二极管,并且在第二实例中,二极管为所谓的多芯片二极管。
与引线框架3分开地放置光源2使得能够简化引线框架的结构,这不再需要用于特别地耗散由光源2发出的热量的装置。
Claims (16)
1.一种用于将至少一个光源(2)电连接至用于供应电功率的系统的系统(1),其特征在于:所述连接系统(1)包括:
-引线框架(3),所述引线框架能够被电连接至用于供应电功率的系统,所述引线框架(3)包括至少一个连接端子(4);和
-至少一个连接装置(5),所述至少一个连接装置允许引线框架(3)的连接端子(4)被电连接至光源(2),
连接端子(4)和连接装置(5)能够将光源(2)电连接至引线框架(3),由此允许与引线框架(3)分开地放置光源(2)。
2.根据权利要求1所述的系统(1),其特征在于:引线框架(3)包括用于散热的第一装置(6),所述第一装置允许耗散由引线框架(3)产生的热量。
3.根据权利要求2所述的系统(1),其特征在于:用于散热的第一装置(6)为电阻电路。
4.根据权利要求1-3中任一项所述的系统(1),其特征在于:引线框架(3)包括转换器,所述转换器允许将由用于供应电功率的系统传递的电流的尤其为AC的电压转换为施加于引线框架(3)的连接端子(4)的尤其为DC的电压。
5.根据权利要求1-4中任一项所述的系统(1),其特征在于:引线框架(3)包括控制电路,所述控制电路控制施加于所述连接端子(4)的电流的电压。
6.根据前述权利要求中任一项所述的系统(1),其特征在于:引线框架(3)的连接端子(4)为连接垫,所述连接垫能够允许通过应用线结合技术连接光源(2)。
7.根据前述权利要求中任一项所述的系统(1),其特征在于:连接装置(5)为导电线。
8.根据前述权利要求中任一项所述的系统(1),其特征在于:引线框架(3)包括印刷电路板(7),电子器件能够连接于所述印刷电路板上。
9.根据权利要求8所述的系统(1),其特征在于:引线框架包括边沿,所述边沿从所述板(7)上垂直地延伸,该边沿包括:
两个基本上平行的纵向壁(8、8’);和
两个基本上平行的横向壁(10、10’),两个基本上平行的横向壁每个都连接两个纵向壁(8、8’)。
10.根据权利要求9所述的系统(1),其特征在于:所述边沿和所述板(7)限定密封托盘,该托盘填充有熔化的塑料制品。
11.根据权利要求8或9所述的系统(1),其特征在于:所述边沿的纵向壁中的一个纵向壁(8)包括凹部(9),连接端子(4)放置在所述凹部中。
12.根据权利要求8-10中任一项所述的系统(1),其特征在于:所述边沿的横向壁中的一个横向壁(10)在其外表面上包括突出壳体(11),所述突出壳体的壁基本上垂直于所述横向壁(10)延伸,引线框架(3)包括放置在该壳体(11)中的至少一个电连接器(15),该连接器(15)允许将引线框架(3)连接至用于供应电功率的系统(1)。
13.一种发光组件(16),其特征在于:所述发光组件包括:
根据权利要求1-12中任一项所述的一种用于将至少一个光源(2)电连接至用于供应电功率的系统的系统(1);
至少一个光源(2);和
用于散热的第二装置(17),所述第二装置允许耗散由光源(2)产生的热量,该用于散热的第二装置(17)与引线框架(3)不连接。
14.根据权利要求13所述的发光组件(16),其特征在于:光源(2)为发光二极管。
15.根据权利要求13或14所述的发光组件(16),其特征在于:用于散热的第二装置(17)为光源的保持器。
16.一种用于机动车辆的照明和/或信号指示装置,其特征在于:所述照明和/或信号指示装置包括根据权利要求13-15中任一项所述的发光组件(16)。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010205186.XA CN111365677A (zh) | 2013-10-18 | 2014-10-17 | 用于将至少一个光源电连接至电源供应系统的系统 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1360174A FR3012204B1 (fr) | 2013-10-18 | 2013-10-18 | Systeme de connexion electrique d'au moins une source de lumiere a un systeme d'alimentation electrique |
FR1360174 | 2013-10-18 | ||
PCT/EP2014/072343 WO2015055827A1 (fr) | 2013-10-18 | 2014-10-17 | Systeme de connexion electrique d'au moins une source de lumiere a un systeme d'alimentation electrique |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010205186.XA Division CN111365677A (zh) | 2013-10-18 | 2014-10-17 | 用于将至少一个光源电连接至电源供应系统的系统 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105659028A true CN105659028A (zh) | 2016-06-08 |
Family
ID=49911690
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480056628.1A Pending CN105659028A (zh) | 2013-10-18 | 2014-10-17 | 用于将至少一个光源电连接至电源供应系统的系统 |
CN202010205186.XA Pending CN111365677A (zh) | 2013-10-18 | 2014-10-17 | 用于将至少一个光源电连接至电源供应系统的系统 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010205186.XA Pending CN111365677A (zh) | 2013-10-18 | 2014-10-17 | 用于将至少一个光源电连接至电源供应系统的系统 |
Country Status (7)
Country | Link |
---|---|
US (3) | US20160245474A1 (zh) |
EP (1) | EP3058273B1 (zh) |
JP (1) | JP6509837B2 (zh) |
KR (1) | KR20160072118A (zh) |
CN (2) | CN105659028A (zh) |
FR (1) | FR3012204B1 (zh) |
WO (1) | WO2015055827A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113748297A (zh) * | 2019-03-07 | 2021-12-03 | 亮锐控股有限公司 | 在连接电气部件时具有高灵活性的照明设备 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022513728A (ja) * | 2018-12-05 | 2022-02-09 | ルミレッズ リミテッド ライアビリティ カンパニー | 照明モジュールのためのキャリアベースモジュール |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1338890A (zh) * | 2000-07-28 | 2002-03-06 | 松下电器产业株式会社 | 电子零件及其制造方法 |
CN201198968Y (zh) * | 2008-04-23 | 2009-02-25 | 泰兴玩具(深圳)有限公司 | 变色灯串 |
JP2011253795A (ja) * | 2010-06-04 | 2011-12-15 | Piaa Corp | 灯具用電源アダプタ及びこれを用いた車両用灯具 |
CN102313225A (zh) * | 2010-06-17 | 2012-01-11 | 株式会社电装 | 具有增强热耗散能力的照明设备 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5010463A (en) * | 1990-04-30 | 1991-04-23 | Ross David L | Electrified bulletin board with illuminable push-pin |
US5803579A (en) * | 1996-06-13 | 1998-09-08 | Gentex Corporation | Illuminator assembly incorporating light emitting diodes |
US6521916B2 (en) * | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
AUPQ818100A0 (en) * | 2000-06-15 | 2000-07-06 | Arlec Australia Limited | Led lamp |
US6857756B2 (en) * | 2001-04-11 | 2005-02-22 | General Manufacturing, Inc. | LED work light |
US6737811B2 (en) * | 2001-06-16 | 2004-05-18 | A L Lightech, Inc. | High intensity light source arrangement |
US6465961B1 (en) * | 2001-08-24 | 2002-10-15 | Cao Group, Inc. | Semiconductor light source using a heat sink with a plurality of panels |
CN2690729Y (zh) * | 2004-01-19 | 2005-04-06 | 上海华翔电子光源有限公司 | 光源装置 |
DE112005001285B4 (de) * | 2004-06-03 | 2013-07-18 | International Rectifier Corp. | Halbleitervorrichtungsmodul mit Flipchip-Vorrichtungen auf einem gemeinsamen Leiterrahmen |
KR100593919B1 (ko) * | 2004-07-01 | 2006-06-30 | 삼성전기주식회사 | 차량 전조등용 발광 다이오드 모듈 및 이를 구비한 차량전조등 |
WO2006023149A2 (en) * | 2004-07-08 | 2006-03-02 | Color Kinetics Incorporated | Led package methods and systems |
US7758223B2 (en) * | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
FR2906347B1 (fr) | 2006-09-22 | 2008-12-12 | Valeo Vision Sa | Module d'eclairage |
CN101165850A (zh) * | 2006-10-16 | 2008-04-23 | 张家训 | 一体化的陶瓷金属卤化物灯 |
KR100845856B1 (ko) * | 2006-12-21 | 2008-07-14 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
US7614771B2 (en) * | 2007-07-05 | 2009-11-10 | Tyco Electronics Corporation | Wireless controlled light emitting assembly |
US8791471B2 (en) * | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
CN102341926A (zh) * | 2009-03-05 | 2012-02-01 | 株式会社小糸制作所 | 发光模块、发光模块的制造方法及灯具单元 |
US8382331B2 (en) * | 2009-04-03 | 2013-02-26 | Yung Pun Cheng | LED lighting lamp |
US9362138B2 (en) * | 2009-09-02 | 2016-06-07 | Kaixin, Inc. | IC package and method for manufacturing the same |
JPWO2011027517A1 (ja) * | 2009-09-03 | 2013-01-31 | 株式会社小糸製作所 | 車両用前照灯 |
WO2011064817A1 (ja) * | 2009-11-26 | 2011-06-03 | パナソニック株式会社 | 半導体装置とその製造方法 |
JP5390372B2 (ja) * | 2009-12-25 | 2014-01-15 | 株式会社小糸製作所 | 光源ユニット及び車輌用灯具 |
JP2011165833A (ja) * | 2010-02-08 | 2011-08-25 | Toshiba Corp | Ledモジュール |
JP2012174539A (ja) * | 2011-02-22 | 2012-09-10 | Ichikoh Ind Ltd | 車両用前照灯 |
US20120281424A1 (en) * | 2011-05-02 | 2012-11-08 | Peterson Manufacturing Company | Illumination lamp with dual beam functions |
US9134003B2 (en) * | 2011-06-13 | 2015-09-15 | Koito Manufacturing Co., Ltd. | Automotive headlamp, heat radiating mechanism, light-emitting apparatus and light source fixing member |
JP5698081B2 (ja) * | 2011-06-28 | 2015-04-08 | 株式会社小糸製作所 | 放熱機構および発光装置 |
US9322543B2 (en) * | 2012-04-13 | 2016-04-26 | Cree, Inc. | Gas cooled LED lamp with heat conductive submount |
TWM443324U (en) * | 2012-07-13 | 2012-12-11 | Shun-An Liao | Power supply devices of low temperature led lighting |
US9318674B2 (en) * | 2013-02-05 | 2016-04-19 | Cree, Inc. | Submount-free light emitting diode (LED) components and methods of fabricating same |
US9618163B2 (en) * | 2014-06-17 | 2017-04-11 | Cree, Inc. | LED lamp with electronics board to submount connection |
-
2013
- 2013-10-18 FR FR1360174A patent/FR3012204B1/fr active Active
-
2014
- 2014-10-17 CN CN201480056628.1A patent/CN105659028A/zh active Pending
- 2014-10-17 JP JP2016524107A patent/JP6509837B2/ja active Active
- 2014-10-17 EP EP14786187.6A patent/EP3058273B1/fr active Active
- 2014-10-17 KR KR1020167009922A patent/KR20160072118A/ko not_active Application Discontinuation
- 2014-10-17 US US15/027,309 patent/US20160245474A1/en not_active Abandoned
- 2014-10-17 WO PCT/EP2014/072343 patent/WO2015055827A1/fr active Application Filing
- 2014-10-17 CN CN202010205186.XA patent/CN111365677A/zh active Pending
-
2019
- 2019-10-07 US US16/594,465 patent/US10865957B2/en active Active
-
2020
- 2020-11-18 US US16/951,534 patent/US11353190B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1338890A (zh) * | 2000-07-28 | 2002-03-06 | 松下电器产业株式会社 | 电子零件及其制造方法 |
CN201198968Y (zh) * | 2008-04-23 | 2009-02-25 | 泰兴玩具(深圳)有限公司 | 变色灯串 |
JP2011253795A (ja) * | 2010-06-04 | 2011-12-15 | Piaa Corp | 灯具用電源アダプタ及びこれを用いた車両用灯具 |
CN102313225A (zh) * | 2010-06-17 | 2012-01-11 | 株式会社电装 | 具有增强热耗散能力的照明设备 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113748297A (zh) * | 2019-03-07 | 2021-12-03 | 亮锐控股有限公司 | 在连接电气部件时具有高灵活性的照明设备 |
Also Published As
Publication number | Publication date |
---|---|
US20210071840A1 (en) | 2021-03-11 |
EP3058273A1 (fr) | 2016-08-24 |
US10865957B2 (en) | 2020-12-15 |
JP6509837B2 (ja) | 2019-05-08 |
EP3058273B1 (fr) | 2019-11-13 |
FR3012204B1 (fr) | 2015-10-30 |
US20160245474A1 (en) | 2016-08-25 |
US11353190B2 (en) | 2022-06-07 |
WO2015055827A1 (fr) | 2015-04-23 |
US20200041105A1 (en) | 2020-02-06 |
CN111365677A (zh) | 2020-07-03 |
JP2016533621A (ja) | 2016-10-27 |
KR20160072118A (ko) | 2016-06-22 |
FR3012204A1 (fr) | 2015-04-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10578266B2 (en) | LED substrate with electrical connection by bridging | |
US9175842B2 (en) | Heat sink assembly for opto-electronic components and a method for producing the same | |
CN105895792A (zh) | 发光组件 | |
CN105594309B (zh) | 用于位置稳定的焊接的方法 | |
JP4981600B2 (ja) | 照明器具 | |
CN204678211U (zh) | 移动体用照明装置 | |
CN103050602A (zh) | 发光装置 | |
CN106684076B (zh) | 封装结构及其制造方法 | |
CN105814682A (zh) | 半导体装置 | |
US11353190B2 (en) | System for the electrically connecting at least one light source to an electrical power supply system | |
CN104427712A (zh) | 照明装置 | |
CN205226982U (zh) | 发光模块及其灯具 | |
CN103258946A (zh) | 发光二极管灯条及其制造方法 | |
JP6338136B2 (ja) | 車両用照明装置、および車両用灯具 | |
CN102938442B (zh) | Led封装单元及包括其的led封装系统 | |
KR101004929B1 (ko) | 발광다이오드 패키지 및 이를 구비한 발광다이오드 패키지 모듈 | |
CN103606545A (zh) | 一种led软板光源模组及其制造方法 | |
CN107768366A (zh) | 一种填埋热保护ic的cob封装及其封装方法 | |
JP7094182B2 (ja) | 灯具ユニット | |
JP2012064676A (ja) | 照明装置 | |
CN105960715B (zh) | 光电子部件及其生产方法 | |
CN202927510U (zh) | 直接将led芯片倒装在导电胶线路上的led灯具模组 | |
CN104022091A (zh) | 半导体芯片封装 | |
KR101469014B1 (ko) | 방열용 열가소성 플라스틱 기판을 갖는 조명 장치 | |
CN104157770A (zh) | 发光二极管模组 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160608 |
|
RJ01 | Rejection of invention patent application after publication |