CN105647106B - 一种中空陶瓷微珠peek复合覆铜板及其制备方法 - Google Patents
一种中空陶瓷微珠peek复合覆铜板及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种中空陶瓷微珠PEEK复合覆铜板,包括下述重量份数的原料:陶瓷微珠:0~50重量份;偶联剂:0~5重量份;PEEK:50~100重量份。本发明还公开了复合覆铜板的制备方法,包括如下步骤:(1)混炼成型:偶联剂活化处理陶瓷微珠,然后加入PEEK在温度320~400℃下混炼成型;(2)热层压合:步骤(1)混炼成型的材料压合铜箔,在90Kpa的真空条件下,于温度350~380℃,压力15~20Mpa,电加热层压机中保压3~6h。本发明的优点是:本发明目的在于提供一种中空陶瓷微珠PEEK复合覆铜板的制作方法,其制成的复合覆铜板具有极低的介电常数(~1.34)、低介质损耗,极高的耐热性等优点,拉伸强度和吸水率仅略有下降。
Description
技术领域
本发明属于高分子材料技术领域,尤其涉及一种中空陶瓷微珠PEEK复合覆铜板及其制备方法。
背景技术
聚醚醚酮(PEEK)树脂是一种性能优异的特种工程塑料,与其他特种工程塑料相比具有诸多显著优势,耐高温、机械性能优异、自润滑性好、耐化学品腐蚀、阻燃、耐剥离性、耐辐照性、绝缘性稳定、耐水解和易加工等,在航空航天、汽车制造、电子电气、医疗和食品加工等领域得到应用。也被应用于高频的基板材料,尤其是地面微波视讯、卫星通信、移动手机、军工雷达、航天航空、导弹导航等领域,但PEEK材料价格昂贵。阻碍了其广泛使用。虽然有学者研究了中空玻璃微珠在聚四氟乙烯(PTFE)等材料中的应用,但缺乏中空陶瓷微珠在成型工艺和性能极具特点的PEEK材料中的应用工艺研究。
发明内容
为了解决上述问题,本发明采用的技术方案为:
一种中空陶瓷微珠PEEK复合覆铜板,包括下述重量份数的原料:陶瓷微珠:0~50重量份;偶联剂:0~5重量份;PEEK:50~100重量份。偶联剂为硅烷偶联剂、钛酸酯偶联剂或二者的混合。
利用空心陶瓷微珠介电常数小、刚性大、热膨胀系数小等特点,将空心陶瓷微珠与PEEK共混,制备高频微波复合介电材料,可提高高频微波复合介电材料的电学和力学性能,同时,显著降低材料的成本(最大可降低40%)。
空心陶瓷微珠主要成分为TiO2、SiO2和Al2O3等,粒径:0.1~100μm。
一种中空陶瓷微珠PEEK复合覆铜板制备方法,包括如下步骤:
(1)混炼成型:偶联剂活化处理陶瓷微珠,然后加入PEEK在温度320~400℃下混炼成型;
(2)热层压合:步骤(1)混炼成型的材料压合铜箔,在90Kpa的真空条件下,于温度350~380℃,压力15~20Mpa,电加热层压机中保压3~6h。所述铜箔是厚度是0.01~0.05mm。
得到的中空陶瓷微珠PEEK复合覆铜板,介电常数1.34~3.15、耗散因子0.0011~0.007。
本发明优点是:得到的复合覆铜板
①极低的介电常数,最小可达1.34;
②极低的介质损耗率;
③良好的力学性能;
④显著降低成本。
具体实施方式
实施例1:用0.5重量份的硅烷偶联剂活化处理10重量份的陶瓷微珠,然后,与90重量份的PEEK在320℃下混炼成型。在90Kpa的真空条件下,于温380℃,15Mpa下电加热层压机中保压6小时热层压合铜箔。层压板材料的介电常数3.15、耗散因子0.007。
实施例2:用1.0重量份的钛酸酯偶联剂活化处理20重量份的陶瓷微珠,然后,与80重量份的PEEK在340℃下混炼成型。在90Kpa的真空条件下,于温度370℃,15Mpa下电加热层压机中保压5小时热层压合铜箔,铜箔厚0.01mm。层压板材料的介电常数2.7、耗散因子0.0035。
实施例3:用1.5重量份的硅烷偶联剂活化处理30重量份的陶瓷微珠,然后,与70重量份的PEEK在360℃下混炼成型。在90Kpa的真空条件下,于温度360℃,16Mpa下电加热层压机中保压5小时热层压合铜箔,铜箔厚0.05mm。层压板材料的介电常数2.3、耗散因子0.0026。
实施例4:用0.5重量份的硅烷偶联剂和0.5重量份的钛酸酯偶联剂活化处理20重量份的陶瓷微珠,然后,与80重量份的PEEK在370℃下混炼成型。在90Kpa的真空条件下,于温度350℃,17Mpa下电加热层压机中保压4小时热层压合铜箔,铜箔厚0.02mm。层压板材料的介电常数2.8、耗散因子0.0035。
实施例5:用0.5重量份的硅烷偶联剂和1.0重量份的钛酸酯偶联剂活化处理30重量份的陶瓷微珠,然后,与70重量份的PEEK在380℃下混炼成型。在90Kpa的真空条件下,于温度365℃,18Mpa下电加热层压机中保压3小时热层压合铜箔。层压板材料的介电常数2.35、耗散因子0.0027。
实施例6:用0.5重量份的硅烷偶联剂和1.0重量份的钛酸酯偶联剂活化处理40重量份的陶瓷微珠,然后,与60重量份的PEEK在390℃下混炼成型。在90Kpa的真空条件下,于温度375℃,19Mpa下电加热层压机中保压4小时热层压合铜箔。层压板材料的介电常数1.85、耗散因子0.0021。
实施例7:用1.5重量份的钛酸酯偶联剂活化处理40重量份的陶瓷微珠,然后,与70重量份的PEEK在400℃下混炼成型。在90Kpa的真空条件下,于温度375℃,20Mpa下电加热层压机中保压5小时热层压合铜箔,铜箔厚0.03mm。层压板材料的介电常数1.80、耗散因子0.002。
实施例8:用0.5重量份的硅烷偶联剂和1.0重量份的钛酸酯偶联剂活化处理50重量份的陶瓷微珠,然后,与50重量份的PEEK在400℃下混炼成型。在90Kpa的真空条件下,于温度380℃,20Mpa下电加热层压机中保压6小时热层压合铜箔,铜箔厚0.04mm。层压板材料的介电常数1.35、耗散因子0.0013。
实施例9:用1.5重量份的硅烷偶联剂活化处理50重量份的陶瓷微珠,然后,与50重量份的PEEK在400℃下混炼成型。在90Kpa的真空条件下,于温度380℃,20Mpa下电加热层压机中保压6小时热层压合铜箔。层压板材料的介电常数1.34、耗散因子0.0011。
实施例10:用2.5重量份的硅烷偶联剂和2.5重量份的钛酸酯偶联剂活化处理50重量份的陶瓷微珠,然后,与50重量份的PEEK在400℃下混炼成型。在90Kpa的真空条件下,于温度380℃,20Mpa下电加热层压机中保压6小时热层压合铜箔,铜箔厚0.04mm。层压板材料的介电常数1.35、耗散因子0.0013。
Claims (2)
1.一种中空陶瓷微珠PEEK复合覆铜板,其特征在于,用0.5重量份的硅烷偶联剂和1.0重量份的钛酸酯偶联剂活化处理50重量份的陶瓷微珠,然后,与50重量份的PEEK在400℃下混炼成型,在90Kpa的真空条件下,于温度380℃,20Mpa下电加热层压机中保压6小时热层压合铜箔,铜箔厚0.04mm,层压板材料的介电常数1.35、耗散因子0.0013。
2.一种中空陶瓷微珠PEEK复合覆铜板,其特征在于,用1.5重量份的硅烷偶联剂活化处理50重量份的陶瓷微珠,然后,与50重量份的PEEK在400℃下混炼成型,在90Kpa的真空条件下,于温度380℃,20Mpa下电加热层压机中保压6小时热层压合铜箔,层压板材料的介电常数1.34、耗散因子0.0011。
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