CN105643917B - Suitable for the heating means for the non-formation plate material for being pasted with film - Google Patents
Suitable for the heating means for the non-formation plate material for being pasted with film Download PDFInfo
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- CN105643917B CN105643917B CN201610113086.8A CN201610113086A CN105643917B CN 105643917 B CN105643917 B CN 105643917B CN 201610113086 A CN201610113086 A CN 201610113086A CN 105643917 B CN105643917 B CN 105643917B
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- film
- component
- heating
- plate material
- pasted
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
Abstract
A kind of heating means for being suitable to be pasted with the non-formation plate material of film, be based primarily upon by upper cavity component, lower chamber component and the heating chamber formed with the vacuum generator that upper and lower cavity component is connected, lower chamber component and upper cavity component and between formed with into passage.When the heating target of the non-formation plate material to being pasted with film heats, upper cavity component is vacuumized by vacuum generator, when it is evacuated to designated value, make lower chamber component vacuum breaker, be fitted in so that the film being attached on non-formation plate material presses on non-formation plate material；Then, gases at high pressure are passed through to lower chamber component, the laminate pressure being fitted on non-formation plate material is pressed to increase film；After reaching specified time, make upper cavity component vacuum breaker, and lower chamber component is discharged gases at high pressure；Then, lower chamber component is made away from upper cavity component, until returning to initial position；Finally, the non-formation plate material for being pasted with film for making to have heated exits into passage.
Description
Technical field
The present invention relates to the technical field of firing equipment, more particularly to a kind of non-formation plate material for being suitable to be pasted with film
Heating means.
Background technology
In circuit board fabrication industry, after sheet material is produced, often encapsulated using film, in case follow-up add
Work needs.And for some non-formation plate materials, due to its surface is out-of-flatness structure or is uneven, to will be thin
Film is attached on non-formation plate material, current embodiment specifically, first by film it is non-compact be attached in advance on non-formation plate material,
Afterwards, heat the non-formation plate material for being pasted with film, so as to which non-formation plate material can be attached to after film is heated completely
On.But firing equipment is mostly infrared heating equipment used by such a embodiment, although and this equipment can add
Hot film so that its soften, then it is close on non-formation plate material, still, due to film simply heat it is soft
Change, not by others be bonded active forces, its on non-formation plate material is further close to after still easily produce bubble,
The defects of protuberance, it is difficult to obtain the effect that film is close on non-formation plate material completely.
Therefore, it is necessary to a kind of technological means is provided to solve drawbacks described above.
The content of the invention
It is an object of the invention to overcome the defect of prior art, there is provided a kind of non-formation plate material for being suitable to be pasted with film
Heating means, be difficult to make to film to be close to asking on non-formation plate material completely to solve firing equipment of the prior art
Topic.
The present invention is achieved in that the heating means of the non-formation plate material suitable for being pasted with film, including：
The upper cavity component, the heatable lower chamber component for producing heat and vacuum for preparing heatable generation heat occur
Device；
Make formed with the non-formation plate material for being pasted with film to enter between the lower chamber component and the upper cavity component
What is entered enters passage；
The vacuum generator is set to be connected respectively with the upper cavity component and the lower chamber component, with can be to described
Upper cavity component and the lower chamber component vacuumize；
It is respectively heated the upper cavity component and the lower chamber component, so that the upper cavity component and described
The temperature into passage formed between lower chamber component reaches assigned temperature value；
The lower chamber component is vacuumized by the vacuum generator；
The non-formation plate material for being pasted with film is entered passage into described, and the lower chamber component is close on described
Cavity component；
The upper cavity component is vacuumized by the vacuum generator；
When the upper cavity component is evacuated to designated value, make the lower chamber component vacuum breaker, so as to be attached to non-
Film on smooth sheet material, which presses to, to be fitted on the non-formation plate material；
Gases at high pressure are passed through to the lower chamber component, the fitting pressure being fitted on non-formation plate material is pressed to increase film
Power；
After reaching specified time, make the upper cavity component vacuum breaker, and make the lower chamber component discharge gases at high pressure；
Make the lower chamber component away from the upper cavity component, until returning to initial position；
The non-formation plate material for being pasted with film for making to have heated, which leaves, described enters passage.
Specifically, the upper cavity component is set to include the upper cavity mounting seat with cavity, upper heating plate, upper temperature control list
First, upper thermal insulation board and upper rubber slab.
Make the upper heating plate in the upper cavity mounting seat；
Make the upper temperature conditioning unit in the upper cavity mounting seat, to control the temperature of the upper heating plate；
Thermal insulation board is set to be located between the upper heating plate and the upper cavity mounting seat, to deaden the upper heating plate
Heat distributes；
The upper rubber slab is covered on the upper end of the upper heating plate, dissipated with heat caused by deadening the upper heating plate
Hair.
Further, the upper heating plate is set to include the first silica gel panel, the second silica gel panel, heating on several
Silk and to detect temperature and coherent signal can be sent to the upper probe of the upper temperature conditioning unit；
The first silica gel panel is connected with the second silica gel panel and form one first sealing space, make described
Heating wire is arranged in first sealing space on several.
Further, make the density for being arranged in the upper heating wire of the first sealing space edge opening position big
In the density for the upper heating wire for being arranged in the first sealing space middle position.
It is preferred that the upper cavity component is set also to include the first interval metallic plate and the second interval metallic plate；
First interval metallic plate is located between the upper heating plate and the upper rubber slab, and make between described second
It is located at every metallic plate between the upper thermal insulation board and the upper cavity mounting seat.
Specifically, the lower chamber component is set to include the lower chamber mounting seat with cavity, lower heating plate, lower temperature control list
First, lower thermal insulation board and lower closure assemblies；
Make the lower heating plate in the lower chamber mounting seat；
Make the lower temperature conditioning unit in the lower chamber mounting seat, to control the temperature of the lower heating plate；
The lower thermal insulation board is set to be located between the lower heating plate and the lower chamber mounting seat, to deaden the lower heating
The heat of plate distributes；
The lower closure assemblies is covered on the upper end of the lower heating plate so that the lower heating plate be enclosed in it is described
In lower chamber mounting seat.
Further, the lower heating plate is set to include the 3rd silica gel panel, the 4th silica gel panel, several lower heatings
Silk and to detect temperature and coherent signal can be sent to the lower probe of the lower temperature conditioning unit；
The 3rd silica gel panel is connected with the 4th silica gel panel and form one second sealing space, make described
Several lower heating wires are arranged in second sealing space.
Further, make the density for being arranged in the lower heating wire of the second sealing space edge opening position big
In the density for the lower heating wire for being arranged in the second sealing space middle position.
It is preferred that the lower closure assemblies are set to include lower metal frame, lower rubber slab, lower metallic plate and lower metal caul；
Make the lower rubber slab on the lower metal frame；
Make the lower metallic plate on the lower rubber slab；
The lower metal caul is set to be located between the lower rubber slab and the lower metallic plate, so that the lower metallic plate serves as a contrast
Pad.
It is preferred that setting the lower chamber component also to include the 3rd interval metallic plate and the 4th interval metallic plate, make described
3rd interval metallic plate is located at the 4th interval metallic plate between the lower heating plate and the lower capping board component
Between the lower thermal insulation board and the lower chamber mounting seat.
It is preferred that setting the lower chamber component also to include compressing member, the compressing member is set to be located at the lower closure assemblies
On, to extrude the film being attached on the non-formation plate material, so that the film is close on the non-formation plate material completely.
Further, it is an air bag to set the compressing member.
The technique effect of heating means for being suitable to be pasted with the non-formation plate material of film of the present invention is：Thin to being pasted with
When the heating target of the non-formation plate material of film is heated, upper cavity component is vacuumized by vacuum generator, treats upper cavity
When component is evacuated to designated value, make lower chamber component vacuum breaker, so that the film being attached on non-formation plate material presses to fitting
On the non-formation plate material；Then, gases at high pressure are passed through to lower chamber component, with further increase film press to be fitted in it is non-flat
Laminate pressure on whole plate material；After reaching specified time, make upper cavity component vacuum breaker, and lower chamber component is discharged high pressure gas
Body；Then, lower chamber component is made away from upper cavity component, until returning to initial position；Finally, make that has heated to be pasted with film
Non- formation plate material exit into passage.
It can be seen that by the heating means that this is suitable to be pasted with the non-formation plate material of film, can make to be close to completely to film
On non-formation plate material, and heating effect is good, and film adhered quality is high.
Brief description of the drawings
Fig. 1 be the present invention heating means suitable for the non-formation plate material for being pasted with film used by heating chamber show
It is intended to；
Heating chamber is another used by the heating means suitable for the non-formation plate material for being pasted with film that Fig. 2 is Fig. 1
The schematic diagram of angle；
Fig. 3 is heating chamber heating used by the heating means suitable for the non-formation plate material for being pasted with film of the invention
It is pasted with the schematic diagram of the non-formation plate material of film；
Fig. 4 be the present invention the heating means suitable for the non-formation plate material for being pasted with film used by heating chamber it is upper
The explosive view of cavity component；
Fig. 5 be the present invention the heating means suitable for the non-formation plate material for being pasted with film used by heating chamber it is upper
The structural representation of the upper heating plate of cavity component；
Fig. 6 be the present invention the heating means suitable for the non-formation plate material for being pasted with film used by under heating chamber
The explosive view of cavity component；
Fig. 7 be the present invention the heating means suitable for the non-formation plate material for being pasted with film used by under heating chamber
The structural representation of the lower heating plate of cavity component.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Fig. 1 to Fig. 3 is referred to, below to the reality for being suitable to be pasted with the heating means of the non-formation plate material of film of the present invention
Example is applied to be illustrated.
The heating means 100 for being suitable to be pasted with the non-formation plate material of film of the present embodiment, suitable for being pasted with film
The heating of non-formation plate material in circuit boards industry is close to, and certainly, also can be applicable on the non-formation plate material of other industries
The heating of film is close to.Specifically, it comprises the following steps：
S101, prepare it is heatable produce heat upper cavity component 10, it is heatable produce heat lower chamber component 20 and
Vacuum generator (does not indicate) in figure；
S102, lower chamber component 20 is located at the lower section of upper cavity component 10 and be oppositely arranged, make lower chamber component 20 with
Enter passage 30 formed with the non-formation plate material entrance for being pasted with film between upper cavity component 10；
S103, vacuum generator is set to be connected respectively with upper cavity component 10 and lower chamber component 20, with can be to upper cavity
Component 10 and lower chamber component 20 vacuumize, so that upper cavity component 10 and lower chamber component 20 produce vacuum ring as needed
Border；It is preferred that making the upper cavity component 10 be provided with upper vacuum passage T1, lower chamber component 20 is provided with lower vacuum passage T2, lead to
Piping is connected with upper vacuum passage T1 and vacuum generator is connected with upper cavity component 10, similarly, by pipeline with
Lower vacuum passage T2 is connected and vacuum generator is connected with lower chamber component 20, is easy to vacuum generator right respectively with this
Upper cavity component 10, lower chamber component 20 are vacuumized；
S104, it is respectively heated upper cavity component 10 and lower chamber component 20, so that upper cavity component 10 and cavity of resorption
The temperature into passage 30 formed between body component 20 reaches assigned temperature value；
S105, by vacuum generator lower chamber component 20 is vacuumized；
S106, the non-formation plate material for being pasted with film is entered passage 30, and lower chamber component 20 is close to epicoele
Body component 10, with further compression into the space length of passage 30, it can both prevent heat quickly to wander away, can also preferably ensure
Into passage 30 temperature in the range of pre-control, be advantageous to heat the non-formation plate material for being pasted with film；
S107, by vacuum generator upper cavity component 10 is vacuumized；
S108, when upper cavity component 10 is evacuated to designated value, make the vacuum breaker of lower chamber component 20, so as to be attached to non-
Film on smooth sheet material, which presses to, to be fitted on the non-formation plate material；
S109, to lower chamber component 20 gases at high pressure are passed through, are pressed to further to increase film and be fitted in non-formation plate material
On laminate pressure；
S110, after reaching specified time, make the vacuum breaker of upper cavity component 10, and lower chamber component 20 is discharged high pressure gas
Body；
S111, make lower chamber component 20 away from upper cavity component 10, until returning to initial position；
S112, the non-formation plate material for being pasted with film for making to have heated exit into passage 30.
It can be seen that by the heating means that this is suitable to be pasted with the non-formation plate material of film, can make to be close to completely to film
On non-formation plate material, and heating effect is good, and film adhered quality is high.
Referring to Fig. 4, in the present embodiment, set upper cavity component 10 include the upper cavity mounting seat 11 with cavity,
Upper heating plate 12, upper temperature conditioning unit (not indicated in figure), upper thermal insulation board 13 and upper rubber slab 14；
Make heating plate 12 in upper cavity mounting seat 11；Make temperature conditioning unit in upper cavity mounting seat 11, with
The temperature of heating plate 12 in control；
Thermal insulation board 13 is set to be located between upper heating plate 12 and upper cavity mounting seat 11, to deaden the heat of upper heating plate 12
Distribute；
Rubber slab 14 is covered on the upper end of heating plate 22, distributed with deadening above heat caused by heating plate 12.
Accordingly, when the non-formation plate material with film that upper cavity component 10 is opposite on transport membrane is heated, on
Heating plate 12 can carry out heating work, and its caused heat can be radiated on the non-formation plate material with film；Simultaneously, upper temperature
Control unit can according to caused by the upper reality of heating plate 12 heat and control the heating work of upper heating plate 12, be effectively ensured non-smooth
Film on sheet material can appropriate heating, and can be attached to completely after the heating on non-formation plate material；In addition, by upper thermal insulation board
13 setting, the heat that can deaden heating plate 12 distribute to other place radiation, avoid the waste of heat.
If referring to Fig. 5, it is preferred that set upper heating plate 12 include the first silica gel panel 121, the second silica gel panel 122,
Do a upper heating wire 123 and (do not marked in figure to detect temperature and coherent signal can be sent to the upper probe of upper temperature conditioning unit
Show), the first silica gel panel 121 is connected with the second silica gel panel 122 and form one first sealing space 124, make several
Upper heating wire 123 is arranged in the first sealing space 124, and the setting of the first sealing space 124, except that can ensure several
The normal work of upper heating wire 123, it can also avoid directly contacting and causing with other parts when heating wire 123 works on several
Influence.
In addition, in order to ensure that the film on non-formation plate material can be heated uniformly, it is non-that preferably can be attached to completely
On smooth sheet material, it is more than the density for being arranged in the upper heating wire 123 of the edge opening position of the first sealing space 124 and is arranged in
The density of the upper heating wire 223 of the middle position of first sealing space 124.
Referring to Fig. 4, further, upper cavity component 10 is set also to include the first interval interval of metallic plate 15 and second gold
Belong to plate 16, the first interval metallic plate 15 is located between upper heating plate 12 and upper rubber slab 14, set the second interval metallic plate 16
Between upper thermal insulation board 13 and upper cavity mounting seat 11.And it is spaced setting for metallic plate 16 by the first interval metallic plate 15, second
Put, can further slow down heat caused by upper heating plate 12 to external radiation；It is preferred that the first interval metallic plate 15, second is set
Interval metallic plate 16 is stainless steel materials, or aluminium sheet.
Referring to Fig. 6, in the present embodiment, set lower chamber component 20 include the lower chamber mounting seat 21 with cavity,
Lower heating plate 22, lower temperature conditioning unit (not indicated in figure), lower thermal insulation board 23 and lower closure assemblies 24；
Make lower heating plate 22 in lower chamber mounting seat 21；
Make lower temperature conditioning unit in lower chamber mounting seat 21, to control the temperature of lower heating plate 22；
Lower thermal insulation board 23 is set to be located between lower heating plate 22 and lower chamber mounting seat 21, to deaden the heat of lower heating plate 22
Distribute；
Lower closure assemblies 24 are made to be covered on the upper end of lower heating plate 22, so that lower heating plate 22 is enclosed in lower chamber installation
On seat 21.
Accordingly, when the non-formation plate material with film that lower chamber component 20 is opposite on transport membrane is heated, under
Heating plate 22 can carry out heating work, and its caused heat can be radiated on the non-formation plate material with film；Simultaneously, lower temperature
Control unit can according to caused by the lower reality of heating plate 22 heat and control the heating work of lower heating plate 22, be effectively ensured non-smooth
Film on sheet material can appropriate heating, and can be attached to completely after the heating on non-formation plate material；In addition, by lower thermal insulation board
23 setting, the heat that can deaden lower heating plate 22 distribute to other place radiation, avoid the waste of heat.
If referring to Fig. 7, it is preferred that set lower heating plate 22 include the 3rd silica gel panel 221, the 4th silica gel panel 222,
Do a lower heating wire 223 and (do not marked in figure to detect temperature and coherent signal can be sent to the lower probe of lower temperature conditioning unit
Show), the 3rd silica gel panel 221 is connected with the 4th silica gel panel 222 and form one second sealing space 224, make several
Lower heating wire 223 is arranged in the second sealing space 224, and the setting of the second sealing space 224, except that can ensure several
The normal work of lower heating wire 223, directly contact and cause with other parts when can also avoid several lower heating wires 223 from working
Influence.
In addition, in order to ensure that the film on non-formation plate material can be heated uniformly, it is non-that preferably can be attached to completely
On smooth sheet material, it is more than the density for being arranged in the lower heating wire 223 of the edge opening position of the second sealing space 224 and is arranged in
The density of the lower heating wire 223 of the middle position of second sealing space 224.
Referring to Fig. 6, in the present embodiment, set lower closure assemblies 24 include lower metal frame 241, lower rubber slab 242, under
Metallic plate 243 and lower metal caul 244, make lower rubber slab 242 on lower metal frame 241；Lower metallic plate 243 is set to be located at lower rubber
On offset plate 242；Lower metal caul 244 is set to be located between lower rubber slab 242 and lower metallic plate 243, so that lower metallic plate 243 serves as a contrast
Pad.Wherein, it is stainless steel materials to set lower metallic plate 243, in favor of slowing down heat caused by lower heating plate 22 to external radiation.
Further, set lower chamber component 20 also to include the 3rd interval metallic plate 25 and the 4th and be spaced metallic plate 26, make
3rd interval metallic plate 25 located at lower heating plate 22 and it is lower capping board component 24 between, make the 4th interval metallic plate 26 be located at down every
Between hot plate 23 and lower chamber mounting seat 21.And the setting of metallic plate 26 is spaced by the 3rd interval metallic plate the 25, the 4th, it can enter
One step slows down heat caused by lower heating plate 22 to external radiation；It is preferred that the 3rd interval metallic plate the 25, the 4th is set to be spaced metal
Plate 26 is stainless steel materials.
Referring to Fig. 3, in the present embodiment, set lower chamber component 20 also to include compressing member 27, be located at compressing member 27
On lower closure assemblies 24, to extrude the film being attached on non-formation plate material, so that the film is close to non-formation plate completely
On material.It it can be seen that by the setting of lower closure assemblies 24, can be advantageous to make film be close to completely on non-formation plate material, improve thin
The attaching quality being attached on non-formation plate material of film.
And during in order to ensure that compressing member 27 is pressed on non-formation plate material, avoid that non-formation plate material is caused to weigh wounded, it is preferred that
Setting compressing member 27 is an air bag.
So, in lower chamber 20 vacuum breaker of component, the air bag of lower chamber component 20 will extrude beating film, be made with this
Press to and be fitted on the non-formation plate material to the film being attached on non-formation plate material.
The foregoing is only preferred embodiments of the present invention, its structure is not limited to the above-mentioned shape enumerated, it is all
All any modification, equivalent and improvement made within the spirit and principles in the present invention etc., it should be included in the protection of the present invention
Within the scope of.
Claims (11)
1. the heating means of the non-formation plate material suitable for being pasted with film, it is characterised in that including：
Prepare the upper cavity component of heatable generation heat, the heatable lower chamber component and vacuum generator for producing heat；
Make between the lower chamber component and the upper cavity component formed with the non-formation plate material entrance for being pasted with film
Into passage；
The vacuum generator is set to be connected respectively with the upper cavity component and the lower chamber component, with can be to the epicoele
Body component and the lower chamber component vacuumize；
It is respectively heated the upper cavity component and the lower chamber component, so that the upper cavity component and the cavity of resorption
The temperature into passage formed between body component reaches assigned temperature value；
The lower chamber component is vacuumized by the vacuum generator；
The non-formation plate material for being pasted with film is entered passage into described, and the lower chamber component is close to the upper cavity
Component；
The upper cavity component is vacuumized by the vacuum generator；
When the upper cavity component is evacuated to designated value, make the lower chamber component vacuum breaker, so as to be attached to non-smooth
Film on sheet material, which presses to, to be fitted on the non-formation plate material；
Gases at high pressure are passed through to the lower chamber component, the laminate pressure being fitted on non-formation plate material is pressed to increase film；
After reaching specified time, make the upper cavity component vacuum breaker, and make the lower chamber component discharge gases at high pressure；
Make the lower chamber component away from the upper cavity component, until returning to initial position；
The non-formation plate material for being pasted with film for making to have heated, which leaves, described enters passage；
Wherein, the upper cavity component is included with the upper cavity mounting seat of cavity, upper heating plate, upper temperature conditioning unit, upper heat-insulated
Plate and upper rubber slab；
Make the upper heating plate in the upper cavity mounting seat；
Make the upper temperature conditioning unit in the upper cavity mounting seat, to control the temperature of the upper heating plate；
Thermal insulation board is set to be located between the upper heating plate and the upper cavity mounting seat, to deaden the heat of the upper heating plate
Distribute；
The upper rubber slab is covered on the upper end of the upper heating plate, distributed with heat caused by deadening the upper heating plate.
2. the heating means as claimed in claim 1 for being suitable to be pasted with the non-formation plate material of film, it is characterised in that：Institute is set
State heating plate and include the first silica gel panel, the second silica gel panel, heating wire and to detect temperature and can be by phase on several
OFF signal is sent to the upper probe of the upper temperature conditioning unit；
The first silica gel panel is connected with the second silica gel panel and form one first sealing space, make described some
Individual upper heating wire is arranged in first sealing space.
3. the heating means as claimed in claim 2 for being suitable to be pasted with the non-formation plate material of film, it is characterised in that：Make arrangement
It is more than in the density of the upper heating wire of the first sealing space edge opening position and is arranged in the first sealing sky
Between middle position the upper heating wire density.
4. the heating means as claimed in claim 1 for being suitable to be pasted with the non-formation plate material of film, it is characterised in that：Institute is set
Stating upper cavity component also includes the first interval metallic plate and the second interval metallic plate；
First interval metallic plate is located between the upper heating plate and the upper rubber slab, and make second interval gold
Belong to plate to be located between the upper thermal insulation board and the upper cavity mounting seat.
5. the heating means for being suitable to be pasted with the non-formation plate material of film as described in claim any one of 1-4, its feature exist
In：The lower chamber component is set to include the lower chamber mounting seat with cavity, lower heating plate, lower temperature conditioning unit, lower thermal insulation board
And lower closure assemblies；
Make the lower heating plate in the lower chamber mounting seat；
Make the lower temperature conditioning unit in the lower chamber mounting seat, to control the temperature of the lower heating plate；
The lower thermal insulation board is set to be located between the lower heating plate and the lower chamber mounting seat, to deaden the lower heating plate
Heat distributes；
The lower closure assemblies are made to be covered on the upper end of the lower heating plate, so that the lower heating plate is enclosed in the cavity of resorption
In body mounting seat.
6. the heating means as claimed in claim 5 for being suitable to be pasted with the non-formation plate material of film, it is characterised in that：Institute is set
Stating lower heating plate includes the 3rd silica gel panel, the 4th silica gel panel, several lower heating wires and to detect temperature and can be by phase
OFF signal is sent to the lower probe of the lower temperature conditioning unit；
The 3rd silica gel panel is connected with the 4th silica gel panel and form one second sealing space, make described some
Individual lower heating wire is arranged in second sealing space.
7. the heating means as claimed in claim 6 for being suitable to be pasted with the non-formation plate material of film, it is characterised in that：Make arrangement
It is more than in the density of the lower heating wire of the second sealing space edge opening position and is arranged in the second sealing sky
Between middle position the lower heating wire density.
8. the heating means as claimed in claim 5 for being suitable to be pasted with the non-formation plate material of film, it is characterised in that：Institute is set
Stating lower closure assemblies includes lower metal frame, lower rubber slab, lower metallic plate and lower metal caul；
Make the lower rubber slab on the lower metal frame；
Make the lower metallic plate on the lower rubber slab；
The lower metal caul is set to be located between the lower rubber slab and the lower metallic plate, so that the lower metallic plate pads.
9. the heating means as claimed in claim 5 for being suitable to be pasted with the non-formation plate material of film, it is characterised in that：Institute is set
Stating lower chamber component also includes the 3rd interval metallic plate and the 4th interval metallic plate, makes the 3rd interval metallic plate located at described
Between lower heating plate and the lower capping board component, make the 4th interval metallic plate located at the lower thermal insulation board and the cavity of resorption
Between body mounting seat.
10. the heating means as claimed in claim 5 for being suitable to be pasted with the non-formation plate material of film, it is characterised in that：Set
The lower chamber component also includes compressing member, makes the compressing member on the lower closure assemblies, is attached to extruding described
Film on non-formation plate material, so that the film is close on the non-formation plate material completely.
11. the heating means as claimed in claim 10 for being suitable to be pasted with the non-formation plate material of film, it is characterised in that：Set
The compressing member is an air bag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610113086.8A CN105643917B (en) | 2016-02-29 | 2016-02-29 | Suitable for the heating means for the non-formation plate material for being pasted with film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610113086.8A CN105643917B (en) | 2016-02-29 | 2016-02-29 | Suitable for the heating means for the non-formation plate material for being pasted with film |
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| Publication Number | Publication Date |
|---|---|
| CN105643917A CN105643917A (en) | 2016-06-08 |
| CN105643917B true CN105643917B (en) | 2018-01-02 |
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| CN106739298A (en) * | 2016-12-23 | 2017-05-31 | 深圳市福和达自动化有限公司 | A kind of silica gel cavity body structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498062A (en) * | 2002-10-21 | 2004-05-19 | 三荣技研股份有限公司 | Pressure device and method |
| CN1526534A (en) * | 2003-03-04 | 2004-09-08 | 三荣技研股份有限公司 | Laminatea compression moulding apparatus and method |
| CN202781576U (en) * | 2012-03-21 | 2013-03-13 | 蔡维杰 | Film forming machine capable of adjusting distance between material heating position and forming die |
| CN103052282A (en) * | 2011-10-13 | 2013-04-17 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacturing method thereof |
| CN203381301U (en) * | 2013-08-01 | 2014-01-08 | 群达塑胶电子（深圳）有限公司 | Surface film coating equipment |
-
2016
- 2016-02-29 CN CN201610113086.8A patent/CN105643917B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498062A (en) * | 2002-10-21 | 2004-05-19 | 三荣技研股份有限公司 | Pressure device and method |
| CN1526534A (en) * | 2003-03-04 | 2004-09-08 | 三荣技研股份有限公司 | Laminatea compression moulding apparatus and method |
| CN103052282A (en) * | 2011-10-13 | 2013-04-17 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacturing method thereof |
| CN202781576U (en) * | 2012-03-21 | 2013-03-13 | 蔡维杰 | Film forming machine capable of adjusting distance between material heating position and forming die |
| CN203381301U (en) * | 2013-08-01 | 2014-01-08 | 群达塑胶电子（深圳）有限公司 | Surface film coating equipment |
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| CN105643917A (en) | 2016-06-08 |
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