CN205631628U - Heating cavity - Google Patents
Heating cavity Download PDFInfo
- Publication number
- CN205631628U CN205631628U CN201620152745.4U CN201620152745U CN205631628U CN 205631628 U CN205631628 U CN 205631628U CN 201620152745 U CN201620152745 U CN 201620152745U CN 205631628 U CN205631628 U CN 205631628U
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- Prior art keywords
- heating
- chamber
- described lower
- component
- heating plate
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Abstract
The utility model provides a heating cavity, includes cavity member, down cavity member and vacuum generator, lower cavity member and last cavity member are formed with the admission passage between and, vacuum generator is connected with lower cavity member with last cavity member respectively. When heating the attached heating object that has the non -flat panel of film, through vacuum generator to the evacuation of last cavity member, when treating its evacuation to designated value, make the broken vacuum of cavity member down to make attached film on non -flat panel press to the laminating on non -flat panel, after that, the cavity component lets in high -pressure gas downwards to it presses to the laminating pressure of laminating on non -flat panel to increase the film, after reaching the fixed time, the broken vacuum of cavity member on the messenger to make cavity member discharge high -pressure gas down, after that, the cavity member is kept away from to the cavity member under making, until getting back to initial position, it is last, make the attached non -flat panel that has the film of heated leave the admission passage.
Description
Technical field
This utility model relates to the technical field of firing equipment, particularly relates to a kind of heating chamber.
Background technology
In circuit board fabrication industry, after sheet material is produced, thin film is often used to be encapsulated, in case following process needs.And for some non-formation plate materials, owing to its surface is out-of-flatness structure or rough reason, to thin film is attached on non-formation plate material, current embodiment is specially, first thin film non-compact ground is attached on non-formation plate material in advance, afterwards, make to be pasted with the non-formation plate material heating of thin film, so that can be attached to completely on non-formation plate material after thin film is heated.But, the firing equipment that this kind of embodiment is used is mostly infrared heating equipment, and although this equipment can heat thin film so that it softens, then it can be made further to be close on non-formation plate material, but, owing to thin film is thermoplastic, not by other laminating active force, it still easily produces the defect such as bubble, protuberance after being close to further on non-formation plate material, it is difficult to obtain the effect that thin film is close on non-formation plate material completely.
Therefore, it is necessary to provide a kind of technological means to solve drawbacks described above.
Utility model content
The purpose of this utility model is to overcome the defect of prior art, it is provided that a kind of heating chamber, to solve the problem that firing equipment of the prior art is difficult to make thin film be close on non-formation plate material completely.
This utility model is achieved in that heating chamber, including:
The upper cavity component of heatable generation heat；
The lower chamber component of heatable generation heat, described lower chamber component and described upper cavity component and between be formed for heating target enter described heating chamber interior entrance passage；
In order to described upper cavity component and the vacuum generator of described lower chamber component evacuation, described vacuum generator is connected with described upper cavity component and described lower chamber component respectively.
Specifically, described upper cavity component include the upper cavity mounting seat with cavity, the upper heating plate being located in described upper cavity mounting seat, be located in described upper cavity mounting seat temperature to control described upper heating plate upper temperature conditioning unit, be located between described upper heating plate and described upper cavity mounting seat the upper thermal insulation board distributed with the heat deadening described upper heating plate, the upper rubber slab that distributes of heat that the upper end that is covered on described upper heating plate produces to deaden described upper heating plate.
Further, described upper heating plate includes the first silica gel panel, the second silica gel panel, heating wire and in order to detect temperature and coherent signal can be sent to the upper probe of described upper temperature conditioning unit on several, described first silica gel panel is connected with described second silica gel panel and forms one first sealing space, and several upper heating wires described are arranged in described first sealing space.
Further, the density of the described first described upper heating wire sealing position, edge, space it is arranged in more than the density being arranged in the described first described upper heating wire sealing space middle position.
It is preferred that described upper cavity component also includes the be located between described upper heating plate and described upper rubber slab first interval metallic plate and the second interval metallic plate being located between described upper thermal insulation board and described upper cavity mounting seat.
Specifically, described lower chamber component include the lower chamber mounting seat with cavity, the lower heating plate being located in described lower chamber mounting seat, be located in described lower chamber mounting seat with control described lower heating plate temperature lower temperature conditioning unit, be located between described lower heating plate and described lower chamber mounting seat with deaden described lower heating plate heat distribute lower thermal insulation board, be covered on described lower heating plate upper end so that described lower heating plate is enclosed in the lower closure assemblies in described lower chamber mounting seat.
Further, described lower heating plate includes the 3rd silica gel panel, the 4th silica gel panel, several lower heating wires and in order to detect temperature and coherent signal can be sent to the lower probe of described lower temperature conditioning unit, described 3rd silica gel panel is connected with described 4th silica gel panel and forms one second sealing space, and several lower heating wires described are arranged in described second and seal in space.
Further, the density of the described second described lower heating wire sealing position, edge, space it is arranged in more than the density being arranged in the described second described lower heating wire sealing space middle position.
It is preferred that described lower closure assemblies includes lower metal frame, the lower rubber slab being located on described lower metal frame, the lower metallic plate being located on described lower rubber slab and is located between described lower rubber slab and described lower metallic plate the lower metal caul for described lower metallic plate liner.
It is preferred that described lower chamber component also includes the be located between described lower heating plate and described lower capping board component the 3rd interval metallic plate and the 4th interval metallic plate being located between described lower thermal insulation board and described lower chamber mounting seat.
It is preferred that described lower chamber component also includes extruding the thin film being attached on non-formation plate material so that this thin film is close to the compressing member on described non-formation plate material completely, described compressing member is located on described lower closure assemblies.
Further, described compressing member is an air bag.
The technique effect of heating chamber of the present utility model is: when heating the heating target of the non-formation plate material being pasted with thin film, by vacuum generator to upper cavity component evacuation, when upper cavity component is evacuated to designated value, make lower chamber component vacuum breaker, so that the thin film being attached on non-formation plate material presses to be fitted on this non-formation plate material；Then, it is passed through gases at high pressure to lower chamber component, to increase the laminate pressure that thin film presses to be fitted on non-formation plate material further；After reaching the appointment time, make upper cavity component vacuum breaker, and make lower chamber component discharge gases at high pressure；Then, make lower chamber component away from upper cavity component, until returning to initial position；Finally, the non-formation plate material being pasted with thin film heated is made to exit into passage.Visible, by this heating chamber, thin film can be made to be close to completely on non-formation plate material, and heats is good, film adhered quality is high.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of heating chamber of the present utility model；
Fig. 2 is the schematic diagram of another angle of the heating chamber of Fig. 1；
Fig. 3 is the schematic diagram that heating chamber of the present utility model heating is pasted with the non-formation plate material of thin film；
Fig. 4 is the explosive view of the upper cavity component of heating chamber of the present utility model；
Fig. 5 is the structural representation of the upper heating plate of the upper cavity component of heating chamber of the present utility model；
Fig. 6 is the explosive view of the lower chamber component of heating chamber of the present utility model；
Fig. 7 is the structural representation of the lower heating plate of the lower chamber component of heating chamber of the present utility model.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, this utility model is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain this utility model, is not used to limit this utility model.
Refer to Fig. 1 to Fig. 3, below the embodiment of heating chamber of the present utility model is illustrated.
The heating chamber 100 of the present embodiment, is suitable to be close to the heating of the non-formation plate material in the circuit boards industry being pasted with thin film, and certainly, the heating that also can be applicable to the thin film on the non-formation plate material of other industry is close to.Wherein, heating chamber 100 includes upper cavity component 10, lower chamber component 20 and vacuum generator (not indicating in figure), is described further each parts of heating chamber 100 below:
Upper cavity component 10 heatable generation heat, to heat the non-formation plate material being pasted with thin film；
Lower chamber component 20 heatable generation heat, so that the non-formation plate material being pasted with thin film is heated, wherein, lower chamber component 20 is positioned at the lower section of upper cavity component 10 and is oppositely arranged, itself and upper cavity component 10 and between be formed for heating target and enter heating entrance passage 30 within chamber 100；
Vacuum generator is in order to upper cavity component 10 and lower chamber component 20 evacuation, so that upper cavity component 10 and lower chamber component 20 produce vacuum environment as required, wherein, vacuum generator is connected with upper cavity component 10 and lower chamber component 20 respectively, specifically, this upper cavity component 10 is provided with vacuum passage T1, lower chamber component 20 is provided with lower vacuum passage T2, vacuum generator is connected with upper vacuum passage T1 by pipeline and is connected with upper cavity component 10, in like manner, vacuum generator is connected with lower vacuum passage T2 by pipeline and is connected with lower chamber component 20, it is easy to vacuum generator respectively to upper cavity component 10 with this, lower chamber component 20 carries out evacuation.
Accordingly, when utilize heating chamber 100 the non-formation plate material being pasted with thin film is heated to be close to thereon completely by the thin film on non-formation plate material time, itself particularly as follows:
S101, upper cavity component 10 and lower chamber component 20 is made to be respectively heated, so that the temperature entering passage 30 formed between upper cavity component 10 and lower chamber component 20 reaches assigned temperature value；
S102, by vacuum generator to lower chamber component 20 evacuation；
S103, the non-formation plate material making to be pasted with thin film enter passage 30, and make lower chamber component 20 be close to upper cavity component 10, the space length of passage 30 is entered with further compression, both heat can have been prevented quickly to wander away, also can preferably ensure that the temperature entering passage 30, in the range of pre-control, is conducive to heating the non-formation plate material being pasted with thin film；
S104, by vacuum generator to upper cavity component 10 evacuation；
S105, when upper cavity component 10 is evacuated to designated value, make lower chamber component 20 vacuum breaker, so that the thin film being attached on non-formation plate material presses to be fitted on this non-formation plate material；
S106, it is passed through gases at high pressure to lower chamber component 20, to increase the laminate pressure that thin film presses to be fitted on non-formation plate material further；
S107, reach the appointment time after, make upper cavity component 10 vacuum breaker, and make lower chamber component 20 discharge gases at high pressure；
S108, make lower chamber component 20 away from upper cavity component 10, until returning to initial position；
S109, the non-formation plate material being pasted with thin film heated is made to exit into passage 30.
Visible, by this heating chamber 100, thin film can be made to be close to completely on non-formation plate material, and heats is good, film adhered quality is high.
Refer to Fig. 4, specifically, upper cavity component 10 include the upper cavity mounting seat 11 with cavity, the upper heating plate 12 being located in upper cavity mounting seat 11, be located in upper cavity mounting seat 11 temperature to control upper heating plate 12 upper temperature conditioning unit (not indicating in figure), be located between upper heating plate 12 and upper cavity mounting seat 11 the upper thermal insulation board 13 distributed with the heat deadening upper heating plate 12, upper rubber slab 14 that heat that the upper end that is covered on upper heating plate 22 produces to deaden upper heating plate 12 distributes.
Accordingly, when the non-formation plate material with thin film that upper cavity component 10 is opposite on transport membrane heats, upper heating plate 12 can carry out work of generating heat, and its heat produced can be radiated to on the non-formation plate material of thin film；Simultaneously, upper temperature conditioning unit can control the heating work of upper heating plate 12 according to the actual heat produced of upper heating plate 12, be effectively ensured the thin film on non-formation plate material can appropriate heating, and can be attached to the most completely on non-formation plate material；Additionally, by the setting of upper thermal insulation board 13, the heat that can deaden heating plate 12 distributes to other local radiation, it is to avoid the waste of heat.
Refer to Fig. 5, preferably, on this, the preferred structure of heating plate 12 is, it includes the first silica gel panel 121, second silica gel panel 122, heating wire 123 on several, and in order to detect temperature and coherent signal can be sent to the upper probe (not indicating in figure) of upper temperature conditioning unit, first silica gel panel 121 is connected with the second silica gel panel 122 and forms one first sealing space 124, in on several, heating wire 123 is arranged in the first sealing space 124, and the setting in the first sealing space 124, except can ensure that the normal work of heating wire 123 on several, the impact that also can avoid directly contacting with other parts when heating wire 123 works on several and cause.
Additionally, in order to ensure that the thin film on non-formation plate material can uniformly heat, can be attached to the most completely on non-formation plate material, the density of the upper heating wire 123 being arranged in the first position, edge, sealing space 124 is more than the density of the upper heating wire 223 being arranged in the first sealing space 124 middle position.
Refer to Fig. 4, further, upper cavity component 10 also includes the be located between heating plate 12 and upper rubber slab 14 first interval metallic plate 15 and the second interval metallic plate 16 being located between thermal insulation board 13 and upper cavity mounting seat 11, and the setting of metallic plate 16 it is spaced by the first interval metallic plate 15, second, the heat of upper heating plate 12 generation can be slowed down further to external radiation；It is preferred that it is stainless steel materials that the first interval metallic plate 15, second is spaced metallic plate 16, or aluminium sheet.
Refer to Fig. 6, specifically, lower chamber component 20 include the lower chamber mounting seat 21 with cavity, the lower heating plate 22 being located in lower chamber mounting seat 21, be located in lower chamber mounting seat 21 temperature to control lower heating plate 22 lower temperature conditioning unit (not indicating in figure), be located between lower heating plate 22 and lower chamber mounting seat 21 the lower thermal insulation board 23 distributed with the heat deadening lower heating plate 22, the upper end that is covered on lower heating plate 22 is so that lower heating plate 22 is enclosed in the lower closure assemblies 24 in lower chamber mounting seat 21.
Accordingly, when the non-formation plate material with thin film that lower chamber component 20 is opposite on transport membrane heats, lower heating plate 22 can carry out work of generating heat, and its heat produced can be radiated to on the non-formation plate material of thin film；Simultaneously, lower temperature conditioning unit can control the heating work of lower heating plate 22 according to the actual heat produced of lower heating plate 22, be effectively ensured the thin film on non-formation plate material can appropriate heating, and can be attached to the most completely on non-formation plate material；Additionally, by the setting of lower thermal insulation board 23, the heat that can deaden lower heating plate 22 distributes to other local radiation, it is to avoid the waste of heat.
Refer to Fig. 7, preferably, the preferred structure of this lower heating plate 22 is, it includes the 3rd silica gel panel 221, 4th silica gel panel 222, several lower heating wires 223, and in order to detect temperature and coherent signal can be sent to the lower probe (not indicating in figure) of lower temperature conditioning unit, 3rd silica gel panel 221 is connected with the 4th silica gel panel 222 and forms one second sealing space 224, several lower heating wires 223 are arranged in the second sealing space 224, and the setting in the second sealing space 224, except can ensure that the normal work of several lower heating wires 223, the impact that several lower heating wires 223 also can be avoided directly to contact with other parts when working and cause.
Additionally, in order to ensure that the thin film on non-formation plate material can uniformly heat, can be attached to the most completely on non-formation plate material, the density of the lower heating wire 223 being arranged in the second position, edge, sealing space 224 is more than the density of the lower heating wire 223 being arranged in the second sealing space 224 middle position.
Refer to Fig. 6, lower closure assemblies 24 in the present embodiment includes lower metal frame 241, the lower rubber slab 242 being located on lower metal frame 241, the lower metallic plate 243 being located on lower rubber slab 242 and is located between lower rubber slab 242 and lower metallic plate 243 the lower metal caul 244 for lower metallic plate 243 liner, wherein, lower metallic plate 243 is stainless steel materials, is beneficial to slow down the heat of lower heating plate 22 generation to external radiation.
Further, lower chamber component 20 also includes the be located between lower heating plate 22 and lower capping board component 24 the 3rd interval metallic plate 25 and the 4th interval metallic plate 26 being located between lower thermal insulation board 23 and lower chamber mounting seat 21, and by the setting of the 3rd metallic plate the 25, the 4th interval, interval metallic plate 26, the heat of lower heating plate 22 generation can be slowed down further to external radiation；It is preferred that the 3rd metallic plate the 25, the 4th interval, interval metallic plate 26 is stainless steel materials.
Refer to Fig. 3, the lower chamber component 20 of the present embodiment also includes extruding the thin film being attached on non-formation plate material so that this thin film is close to the compressing member 27 on non-formation plate material completely, compressing member 27 is located on lower closure assemblies 24, and by the setting of lower closure assemblies 24, can be conducive to making thin film be close to completely on non-formation plate material, improve the attaching quality being attached on non-formation plate material of thin film.
And during in order to ensure that compressing member 27 presses on non-formation plate material, it is to avoid non-formation plate material is caused to be weighed wounded, it is preferred that compressing member 27 is an air bag.
Below in conjunction with each graphic, the operation principle of heating chamber 100 of the present utility model is described further:
S101, upper cavity component 10 and lower chamber component 20 is made to be respectively heated, so that the temperature entering passage 30 formed between upper cavity component 10 and lower chamber component 20 reaches assigned temperature value；
S102, by vacuum generator to lower chamber component 20 evacuation；
S103, the non-formation plate material making to be pasted with thin film enter passage 30, and make lower chamber component 20 be close to upper cavity component 10, the space length of passage 30 is entered with further compression, both heat can have been prevented quickly to wander away, also can preferably ensure that the temperature entering passage 30, in the range of pre-control, is conducive to heating the non-formation plate material being pasted with thin film；
S104, by vacuum generator to upper cavity component 10 evacuation；
S105, when upper cavity component 10 is evacuated to designated value, make lower chamber component 20 vacuum breaker so that lower chamber component 20 air sac pressing pat thin film so that pressing to be fitted on this non-formation plate material to the thin film being attached on non-formation plate material；
S106, it is passed through gases at high pressure to lower chamber component 20, to increase the laminate pressure that thin film presses to be fitted on non-formation plate material further；
S107, reach the appointment time after, make upper cavity component 10 vacuum breaker, and make lower chamber component 20 discharge gases at high pressure, and now, the air bag of lower chamber component 20 stops extruding and pats thin film；
S108, make lower chamber component 20 away from upper cavity component 10, until returning to initial position；
S109, the non-formation plate material being pasted with thin film heated is made to exit into passage 30.
Claims (12)
1. heating chamber, it is characterised in that including:
The upper cavity component of heatable generation heat；
The lower chamber component of heatable generation heat, is formed for heating target and enters the entrance passage of described heating chamber interior between described lower chamber component and described upper cavity component；
In order to described upper cavity component and the vacuum generator of described lower chamber component evacuation, described vacuum generator is connected with described upper cavity component and described lower chamber component respectively.
Heat chamber the most as claimed in claim 1, it is characterised in that: described upper cavity component include the upper cavity mounting seat with cavity, the upper heating plate being located in described upper cavity mounting seat, be located in described upper cavity mounting seat temperature to control described upper heating plate upper temperature conditioning unit, be located between described upper heating plate and described upper cavity mounting seat the upper thermal insulation board distributed with the heat deadening described upper heating plate, the upper rubber slab that distributes of heat that the upper end that is covered on described upper heating plate produces to deaden described upper heating plate.
Heat chamber the most as claimed in claim 2, it is characterized in that: described upper heating plate includes the first silica gel panel, the second silica gel panel, heating wire and in order to detect temperature and coherent signal can be sent to the upper probe of described upper temperature conditioning unit on several, described first silica gel panel is connected with described second silica gel panel and forms one first sealing space, and several upper heating wires described are arranged in described first sealing space.
Heat chamber the most as claimed in claim 3, it is characterised in that: it is arranged in the density of the described first described upper heating wire sealing position, edge, space more than the density being arranged in the described first described upper heating wire sealing space middle position.
Heat chamber the most as claimed in claim 2, it is characterised in that: described upper cavity component also includes the be located between described upper heating plate and described upper rubber slab first interval metallic plate and the second interval metallic plate being located between described upper thermal insulation board and described upper cavity mounting seat.
6. the heating chamber as described in any one of claim 1-5, it is characterised in that: described lower chamber component include the lower chamber mounting seat with cavity, the lower heating plate being located in described lower chamber mounting seat, be located in described lower chamber mounting seat with control described lower heating plate temperature lower temperature conditioning unit, be located between described lower heating plate and described lower chamber mounting seat with deaden described lower heating plate heat distribute lower thermal insulation board, be covered on described lower heating plate upper end so that described lower heating plate is enclosed in the lower closure assemblies in described lower chamber mounting seat.
Heat chamber the most as claimed in claim 6, it is characterized in that: described lower heating plate includes the 3rd silica gel panel, the 4th silica gel panel, several lower heating wires and in order to detect temperature and coherent signal can be sent to the lower probe of described lower temperature conditioning unit, described 3rd silica gel panel is connected with described 4th silica gel panel and forms one second sealing space, and several lower heating wires described are arranged in described second and seal in space.
Heat chamber the most as claimed in claim 7, it is characterised in that: it is arranged in the density of the described second described lower heating wire sealing position, edge, space more than the density being arranged in the described second described lower heating wire sealing space middle position.
Heat chamber the most as claimed in claim 6, it is characterised in that: described lower closure assemblies includes lower metal frame, the lower rubber slab being located on described lower metal frame, the lower metallic plate being located on described lower rubber slab and is located between described lower rubber slab and described lower metallic plate the lower metal caul for described lower metallic plate liner.
Heat chamber the most as claimed in claim 6, it is characterised in that: described lower chamber component also includes the be located between described lower heating plate and described lower capping board component the 3rd interval metallic plate and the 4th interval metallic plate being located between described lower thermal insulation board and described lower chamber mounting seat.
11. heat chamber as claimed in claim 6, it is characterized in that: described lower chamber component also includes extruding the thin film being attached on non-formation plate material so that this thin film is close to the compressing member on described non-formation plate material completely, and described compressing member is located on described lower closure assemblies.
12. heat chamber as claimed in claim 11, it is characterised in that: described compressing member is an air bag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620152745.4U CN205631628U (en) | 2016-02-29 | 2016-02-29 | Heating cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620152745.4U CN205631628U (en) | 2016-02-29 | 2016-02-29 | Heating cavity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205631628U true CN205631628U (en) | 2016-10-12 |
Family
ID=57076852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620152745.4U Withdrawn - After Issue CN205631628U (en) | 2016-02-29 | 2016-02-29 | Heating cavity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205631628U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105729973A (en) * | 2016-02-29 | 2016-07-06 | 广东思沃精密机械有限公司 | Heating chamber |
| CN106626685A (en) * | 2016-12-28 | 2017-05-10 | 深圳天珑无线科技有限公司 | Film-sticking mold and film-sticking process |
-
2016
- 2016-02-29 CN CN201620152745.4U patent/CN205631628U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105729973A (en) * | 2016-02-29 | 2016-07-06 | 广东思沃精密机械有限公司 | Heating chamber |
| CN106626685A (en) * | 2016-12-28 | 2017-05-10 | 深圳天珑无线科技有限公司 | Film-sticking mold and film-sticking process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20161012 Effective date of abandoning: 20180102 |
|
| AV01 | Patent right actively abandoned |