CN105643917A - Heating method suitable for non-flat panel to which film is attached - Google Patents
Heating method suitable for non-flat panel to which film is attached Download PDFInfo
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- CN105643917A CN105643917A CN201610113086.8A CN201610113086A CN105643917A CN 105643917 A CN105643917 A CN 105643917A CN 201610113086 A CN201610113086 A CN 201610113086A CN 105643917 A CN105643917 A CN 105643917A
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- described lower
- thin film
- component
- plate material
- upper cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
Abstract
The invention discloses a heating method suitable for a non-flat panel to which a film is attached. Mainly, on the basis of a heating cavity composed of an upper cavity component, a lower cavity component and a vacuum generator connected with the upper cavity component and the lower cavity component, and an inlet channel is formed between the lower cavity component and the upper cavity component. When a heating object, namely the non-flat panel to which the film is attached is heated, the upper cavity component is vacuumized through the vacuum generator, and when the upper cavity component is vacuumized to a designated value, the lower cavity component is subjected to vacuum breaking, and therefore the film attached to the non-flat panel is pressed towards and attached to the non-flat panel; then, high-pressure gas is led into the lower cavity component so that the attaching pressure produced when the film is pressed towards and attached to the non-flat panel can be increased; after the designated time is up, the upper cavity component is subjected to vacuum breaking, and the lower cavity component exhausts the high-pressure gas; then, the lower cavity component gets far away from the upper cavity component till the lower cavity component returns to the initial position; and finally, the heated non-flat panel to which the film is attached leaves the inlet channel.
Description
Technical field
The present invention relates to the technical field of firing equipment, particularly relate to the heating means of a kind of non-formation plate material being suitable to be pasted with thin film.
Background technology
In circuit board fabrication industry, after sheet material is produced, often adopt thin film to be encapsulated, need in order to following process. And for some non-formation plate materials, owing to its surface is out-of-flatness structure or rough reason, to thin film is attached on non-formation plate material, current embodiment is specially, first thin film non-compact ground is attached on non-formation plate material in advance, afterwards, make to be pasted with the non-formation plate material heating of thin film so that thin film heated after can be attached to completely on non-formation plate material. But, the firing equipment that this kind of embodiment adopts is mostly infrared heating equipment, and although this equipment can heat thin film so that it softens, then it can be made further to be close on non-formation plate material, but, owing to thin film is thermoplastic, it is not subject to other laminating active force, it still easily produces the defect such as bubble, protuberance after being close on non-formation plate material further, it is difficult to obtain the effect that thin film is close on non-formation plate material completely.
Therefore, it is necessary to provide a kind of technological means to solve drawbacks described above.
Summary of the invention
It is an object of the invention to overcome the defect of prior art, it is provided that a kind of heating means being suitable to be pasted with the non-formation plate material of thin film, to solve the problem that firing equipment of the prior art is difficult to make thin film be close on non-formation plate material completely.
The present invention is achieved in that the heating means of the non-formation plate material being suitable to be pasted with thin film, including:
Prepare the upper cavity component of heatable generation heat, the lower chamber component of heatable generation heat and vacuum generator;
Make the entrance passage that the non-formation plate material being formed for being pasted with thin film between described lower chamber component and described upper cavity component enters;
Described vacuum generator is made to be connected with described upper cavity component and described lower chamber component respectively, with can to described upper cavity component and described lower chamber component evacuation;
Described upper cavity component and described lower chamber component is made to be respectively heated, so that the temperature of the described entrance passage formed between described upper cavity component and described lower chamber component reaches assigned temperature value;
By described vacuum generator to described lower chamber component evacuation;
Make the non-formation plate material being pasted with thin film enter described entrance passage, and make described lower chamber component be close to described upper cavity component;
By described vacuum generator to described upper cavity component evacuation;
When described upper cavity component is evacuated to designated value, make described lower chamber component vacuum breaker, be fitted on this non-formation plate material so that the thin film being attached on non-formation plate material presses to;
Gases at high pressure are passed into, the laminate pressure being fitted on non-formation plate material to increase thin film to press to described lower chamber component;
After reaching the appointment time, make described upper cavity component vacuum breaker, and make described lower chamber component discharge gases at high pressure;
Make described lower chamber component away from described upper cavity component, until returning to initial position;
The non-formation plate material being pasted with thin film heated is made to leave described entrance passage.
Specifically, arrange described upper cavity component to include with the upper cavity mounting seat of cavity, upper hot plate, upper temperature conditioning unit, upper thermal insulation board and upper rubber slab.
Described upper hot plate is made to be located in described upper cavity mounting seat;
Described upper temperature conditioning unit is made to be located in described upper cavity mounting seat, to control the temperature of described upper hot plate;
Making thermal insulation board be located between described upper hot plate and described upper cavity mounting seat, the heat to deaden described upper hot plate distributes;
Making described upper rubber slab be covered on the upper end of described upper hot plate, the heat produced to deaden described upper hot plate distributes.
Further, described upper hot plate is set and includes the first silica gel panel, the second silica gel panel, heating wire and in order to detect temperature and coherent signal can be sent to the upper probe of described upper temperature conditioning unit on several;
Make described first silica gel panel be connected with described second silica gel panel and form one first sealing space, making several upper heating wires described be arranged in described first sealing space.
Further, make the density being arranged in the described first described upper heating wire sealing position, edge, space more than the density being arranged in the described first described upper heating wire sealing space middle position.
It is preferred that arrange described upper cavity component also include the first interval metallic plate and the second interval metallic plate;
Make described first interval metallic plate be located between described upper hot plate and described upper rubber slab, and make described second interval metallic plate be located between described upper thermal insulation board and described upper cavity mounting seat.
Specifically, described lower chamber component is set and includes with the lower chamber mounting seat of cavity, lower hot plate, lower temperature conditioning unit, lower thermal insulation board and lower closure assemblies;
Described lower hot plate is made to be located in described lower chamber mounting seat;
Described lower temperature conditioning unit is made to be located in described lower chamber mounting seat, to control the temperature of described lower hot plate;
Making described lower thermal insulation board be located between described lower hot plate and described lower chamber mounting seat, the heat to deaden described lower hot plate distributes;
Described lower closure assemblies is made to be covered on the upper end of described lower hot plate, so that described lower hot plate is enclosed in described lower chamber mounting seat.
Further, described lower hot plate is set and includes the 3rd silica gel panel, the 4th silica gel panel, several lower heating wires and in order to detect temperature and coherent signal can be sent to the lower probe of described lower temperature conditioning unit;
Make described 3rd silica gel panel be connected with described 4th silica gel panel and form one second sealing space, making several lower heating wires described be arranged in described second and seal in space.
Further, make the density being arranged in the described second described lower heating wire sealing position, edge, space more than the density being arranged in the described second described lower heating wire sealing space middle position.
It is preferred that arrange described lower closure assemblies to include lower metal frame, lower rubber slab, lower metallic plate and lower metal caul;
Described lower rubber slab is made to be located on described lower metal frame;
Described lower metallic plate is made to be located on described lower rubber slab;
Described lower metal caul is made to be located between described lower rubber slab and described lower metallic plate, for described lower metallic plate liner.
Preferably, described lower chamber component is set and also includes the 3rd interval metallic plate and the 4th interval metallic plate, make described 3rd interval metallic plate be located between described lower hot plate and described lower capping board component, make described 4th interval metallic plate be located between described lower thermal insulation board and described lower chamber mounting seat.
It is preferred that arrange described lower chamber component also include compressing member, make described compressing member be located on described lower closure assemblies, be attached to the thin film on described non-formation plate material with extruding, so that this thin film is close on described non-formation plate material completely.
Further, arranging described compressing member is an air bag.
The technique effect being suitable to be pasted with the heating means of the non-formation plate material of thin film of the present invention is: when the heating target of the non-formation plate material being pasted with thin film is heated, by vacuum generator to upper cavity component evacuation, when upper cavity component is evacuated to designated value, make lower chamber component vacuum breaker, be fitted on this non-formation plate material so that the thin film being attached on non-formation plate material presses to; Then, gases at high pressure are passed into lower chamber component, the laminate pressure being fitted on non-formation plate material to increase thin film to press to further; After reaching the appointment time, make upper cavity component vacuum breaker, and make lower chamber component discharge gases at high pressure; Then, make lower chamber component away from upper cavity component, until returning to initial position; Finally, the non-formation plate material being pasted with thin film heated is made to exit into passage.
Visible, by these heating means being suitable to be pasted with the non-formation plate material of thin film, thin film can be made to be close to completely on non-formation plate material, and heats is good, film adhered quality is high.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the heating chamber that the heating means of the non-formation plate material being suitable to be pasted with thin film of the present invention adopt;
Fig. 2 is the schematic diagram of another angle of the heating chamber that the heating means of the non-formation plate material being suitable to be pasted with thin film of Fig. 1 adopt;
Fig. 3 is the schematic diagram that the heating chamber heating that the heating means of the non-formation plate material being suitable to be pasted with thin film of the present invention adopt is pasted with the non-formation plate material of thin film;
Fig. 4 is the explosive view of the upper cavity component of the heating chamber that the heating means of the non-formation plate material being suitable to be pasted with thin film of the present invention adopt;
Fig. 5 is the structural representation of the upper hot plate of the upper cavity component of the heating chamber that the heating means of the non-formation plate material being suitable to be pasted with thin film of the present invention adopt;
Fig. 6 is the explosive view of the lower chamber component of the heating chamber that the heating means of the non-formation plate material being suitable to be pasted with thin film of the present invention adopt;
Fig. 7 is the structural representation of the lower hot plate of the lower chamber component of the heating chamber that the heating means of the non-formation plate material being suitable to be pasted with thin film of the present invention adopt.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated. Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 1 to Fig. 3, below the embodiment being suitable to be pasted with the heating means of the non-formation plate material of thin film of the present invention is illustrated.
The present embodiment be suitable to be pasted with the heating means 100 of the non-formation plate material of thin film, be suitable to the heating of the non-formation plate material in the circuit boards industry being pasted with thin film is close to, certainly, also can be applicable to the heating of the thin film on the non-formation plate material of other industry to be close to. Specifically, it comprises the following steps:
S101, prepare the upper cavity component 10 of heatable generation heat, the lower chamber component 20 of heatable generation heat and vacuum generator (not indicating in figure);
S102, make lower chamber component 20 be positioned at the lower section of upper cavity component 10 and be oppositely arranged, make the entrance passage 30 that the non-formation plate material being formed for being pasted with thin film between lower chamber component 20 and upper cavity component 10 enters;
S103, make vacuum generator be connected with upper cavity component 10 and lower chamber component 20 respectively, with can to upper cavity component 10 and lower chamber component 20 evacuation so that upper cavity component 10 and lower chamber component 20 produce vacuum environment as required; Preferably, this upper cavity component 10 is made to be provided with vacuum passage T1, lower chamber component 20 is made to be provided with lower vacuum passage T2, it is connected with upper vacuum passage T1 by pipeline and makes vacuum generator be connected with upper cavity component 10, in like manner, being connected with lower vacuum passage T2 by pipeline and make vacuum generator be connected with lower chamber component 20, being easy to vacuum generator with this carries out evacuation to upper cavity component 10, lower chamber component 20 respectively;
S104, upper cavity component 10 and lower chamber component 20 is made to be respectively heated, so that the temperature entering passage 30 formed between upper cavity component 10 and lower chamber component 20 reaches assigned temperature value;
S105, by vacuum generator to lower chamber component 20 evacuation;
S106, the non-formation plate material making to be pasted with thin film enter passage 30, and make lower chamber component 20 be close to upper cavity component 10, the space length of passage 30 is entered with further compression, both heat can have been prevented quickly to wander away, also can ensure that the temperature entering passage 30 is within the scope of pre-control, is conducive to the non-formation plate material to being pasted with thin film to be heated preferably;
S107, by vacuum generator to upper cavity component 10 evacuation;
S108, when upper cavity component 10 is evacuated to designated value, make lower chamber component 20 vacuum breaker, be fitted on this non-formation plate material so that the thin film being attached on non-formation plate material presses to;
S109, pass into gases at high pressure to lower chamber component 20, the laminate pressure being fitted on non-formation plate material to increase thin film to press to further;
S110, reach the appointment time after, make upper cavity component 10 vacuum breaker, and make lower chamber component 20 discharge gases at high pressure;
S111, make lower chamber component 20 away from upper cavity component 10, until returning to initial position;
S112, the non-formation plate material being pasted with thin film heated is made to exit into passage 30.
Visible, by these heating means being suitable to be pasted with the non-formation plate material of thin film, thin film can be made to be close to completely on non-formation plate material, and heats is good, film adhered quality is high.
Refer to Fig. 4, in the present embodiment, upper cavity component 10 is set and includes with the upper cavity mounting seat 11 of cavity, upper hot plate 12, upper temperature conditioning unit (not indicating in figure), upper thermal insulation board 13 and upper rubber slab 14;
Hot plate 12 is made to be located in upper cavity mounting seat 11; Temperature conditioning unit is made to be located in upper cavity mounting seat 11, to control the temperature of upper hot plate 12;
Making thermal insulation board 13 be located between hot plate 12 and upper cavity mounting seat 11, the heat to deaden upper hot plate 12 distributes;
Making rubber slab 14 be covered on the upper end of hot plate 22, the heat produced to deaden upper hot plate 12 distributes.
Accordingly, when the non-formation plate material with thin film that upper cavity component 10 is opposite on transport membrane is heated, upper hot plate 12 can carry out heating work, and the heat of its generation can be radiated to on the non-formation plate material of thin film; Simultaneously, upper temperature conditioning unit can control the heating work of upper hot plate 12 according to the actual heat produced of upper hot plate 12, be effectively ensured the thin film on non-formation plate material can appropriate heating, and can be attached to completely after the heating on non-formation plate material; Additionally, by the setting of upper thermal insulation board 13, it is possible in deadening, the heat of hot plate 12 distributes to other local radiation, it is to avoid the waste of heat.
Refer to Fig. 5, preferably, hot plate 12 is set and includes the first silica gel panel 121, second silica gel panel 122, heating wire 123 on several, and in order to detect temperature and coherent signal can be sent to the upper probe (not indicating in figure) of upper temperature conditioning unit, make the first silica gel panel 121 be connected with the second silica gel panel 122 and form one first sealing space 124, heating wire 123 on several is made to be arranged in the first sealing space 124, and the setting in the first sealing space 124, except can ensure that the normal operation of heating wire 123 on several, the impact that also can avoid directly contacting with other parts when heating wire 123 works on several and cause.
Additionally, in order to ensure that the thin film on non-formation plate material can uniformly heat, being attached to completely preferably on non-formation plate material, make the density being arranged in the upper heating wire 123 of the first position, edge, sealing space 124 density more than the upper heating wire 223 being arranged in the first sealing space 124 middle position.
Refer to Fig. 4, further, upper cavity component 10 is set and also includes the first interval metallic plate 15 and the second interval metallic plate 16, make the first interval metallic plate 15 be located between hot plate 12 and upper rubber slab 14, make the second interval metallic plate 16 be located between thermal insulation board 13 and upper cavity mounting seat 11. And by the setting of first interval metallic plate the 15, second interval metallic plate 16, heat that upper hot plate 12 produces can be slowed down further to external radiation; It is preferred that arranging first interval metallic plate the 15, second interval metallic plate 16 is stainless steel materials, or aluminium sheet.
Refer to Fig. 6, in the present embodiment, lower chamber component 20 is set and includes with the lower chamber mounting seat 21 of cavity, lower hot plate 22, lower temperature conditioning unit (not indicating in figure), lower thermal insulation board 23 and lower closure assemblies 24;
Lower hot plate 22 is made to be located in lower chamber mounting seat 21;
Lower temperature conditioning unit is made to be located in lower chamber mounting seat 21, to control the temperature of lower hot plate 22;
Making lower thermal insulation board 23 be located between lower hot plate 22 and lower chamber mounting seat 21, the heat to deaden lower hot plate 22 distributes;
Lower closure assemblies 24 is made to be covered on the upper end of lower hot plate 22, so that lower hot plate 22 is enclosed in lower chamber mounting seat 21.
Accordingly, when the non-formation plate material with thin film that lower chamber component 20 is opposite on transport membrane is heated, lower hot plate 22 can carry out heating work, and the heat of its generation can be radiated to on the non-formation plate material of thin film; Simultaneously, lower temperature conditioning unit can control the heating work of lower hot plate 22 according to the actual heat produced of lower hot plate 22, be effectively ensured the thin film on non-formation plate material can appropriate heating, and can be attached to completely after the heating on non-formation plate material;Additionally, by the setting of lower thermal insulation board 23, it is possible to the heat deadening lower hot plate 22 distributes to other local radiation, it is to avoid the waste of heat.
Refer to Fig. 7, preferably, lower hot plate 22 is set and includes the 3rd silica gel panel 221, 4th silica gel panel 222, several lower heating wires 223, and in order to detect temperature and coherent signal can be sent to the lower probe (not indicating in figure) of lower temperature conditioning unit, make the 3rd silica gel panel 221 be connected with the 4th silica gel panel 222 and form one second sealing space 224, several lower heating wires 223 are made to be arranged in the second sealing space 224, and the setting in the second sealing space 224, except can ensure that the normal operation of several lower heating wires 223, the impact that several lower heating wires 223 also can be avoided directly to contact with other parts when working and cause.
Additionally, in order to ensure that the thin film on non-formation plate material can uniformly heat, being attached to completely preferably on non-formation plate material, make the density being arranged in the lower heating wire 223 of the second position, edge, sealing space 224 density more than the lower heating wire 223 being arranged in the second sealing space 224 middle position.
Refer to Fig. 6, in the present embodiment, lower closure assemblies 24 is set and includes lower metal frame 241, lower rubber slab 242, lower metallic plate 243 and lower metal caul 244, make lower rubber slab 242 be located on lower metal frame 241; Lower metallic plate 243 is made to be located on lower rubber slab 242; Lower metal caul 244 is made to be located between lower rubber slab 242 and lower metallic plate 243, for lower metallic plate 243 liner. Wherein, lower metallic plate 243 is set for stainless steel materials, is beneficial to slow down heat that lower hot plate 22 produces to external radiation.
Further, lower chamber component 20 is set and also includes the 3rd interval metallic plate 25 and the 4th interval metallic plate 26, make the 3rd interval metallic plate 25 be located between lower hot plate 22 and lower capping board component 24, make the 4th interval metallic plate 26 be located between lower thermal insulation board 23 and lower chamber mounting seat 21. And by the setting of the 3rd interval metallic plate the 25, the 4th interval metallic plate 26, heat that lower hot plate 22 produces can be slowed down further to external radiation; It is preferred that the 3rd interval metallic plate 25 is set, the 4th interval metallic plate 26 is stainless steel materials.
Refer to Fig. 3, in the present embodiment, lower chamber component 20 is set and also includes compressing member 27, make compressing member 27 be located on lower closure assemblies 24, be attached to the thin film on non-formation plate material with extruding, so that this thin film is close on non-formation plate material completely. Visible, by the setting of lower closure assemblies 24, can be conducive to making thin film be close on non-formation plate material completely, improve the attaching quality being attached on non-formation plate material of thin film.
And during in order to ensure that compressing member 27 presses on non-formation plate material, it is to avoid non-formation plate material is caused to be weighed wounded, it is preferred that, arranging compressing member 27 is an air bag.
So, when lower chamber component 20 vacuum breaker, the air bag of lower chamber component 20 will extrude beating thin film, makes the thin film being attached on non-formation plate material press to this and is fitted on this non-formation plate material.
The foregoing is only preferred embodiment of the present invention, its structure is not limited to the above-mentioned shape enumerated, all any amendment, equivalent replacement and improvement etc. made within the spirit and principles in the present invention, should be included within protection scope of the present invention.
Claims (12)
1. be suitable to be pasted with the heating means of the non-formation plate material of thin film, it is characterised in that including:
Prepare the upper cavity component of heatable generation heat, the lower chamber component of heatable generation heat and vacuum generator;
Make the entrance passage that the non-formation plate material being formed for being pasted with thin film between described lower chamber component and described upper cavity component enters;
Described vacuum generator is made to be connected with described upper cavity component and described lower chamber component respectively, with can to described upper cavity component and described lower chamber component evacuation;
Described upper cavity component and described lower chamber component is made to be respectively heated, so that the temperature of the described entrance passage formed between described upper cavity component and described lower chamber component reaches assigned temperature value;
By described vacuum generator to described lower chamber component evacuation;
Make the non-formation plate material being pasted with thin film enter described entrance passage, and make described lower chamber component be close to described upper cavity component;
By described vacuum generator to described upper cavity component evacuation;
When described upper cavity component is evacuated to designated value, make described lower chamber component vacuum breaker, be fitted on this non-formation plate material so that the thin film being attached on non-formation plate material presses to;
Gases at high pressure are passed into, the laminate pressure being fitted on non-formation plate material to increase thin film to press to described lower chamber component;
After reaching the appointment time, make described upper cavity component vacuum breaker, and make described lower chamber component discharge gases at high pressure;
Make described lower chamber component away from described upper cavity component, until returning to initial position;
The non-formation plate material being pasted with thin film heated is made to leave described entrance passage.
2. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 1, it is characterised in that: described upper cavity component is set and includes with the upper cavity mounting seat of cavity, upper hot plate, upper temperature conditioning unit, upper thermal insulation board and upper rubber slab.
Described upper hot plate is made to be located in described upper cavity mounting seat;
Described upper temperature conditioning unit is made to be located in described upper cavity mounting seat, to control the temperature of described upper hot plate;
Making thermal insulation board be located between described upper hot plate and described upper cavity mounting seat, the heat to deaden described upper hot plate distributes;
Making described upper rubber slab be covered on the upper end of described upper hot plate, the heat produced to deaden described upper hot plate distributes.
3. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 2, it is characterised in that: described upper hot plate is set and includes the first silica gel panel, the second silica gel panel, heating wire and in order to detect temperature and coherent signal can be sent to the upper probe of described upper temperature conditioning unit on several;
Make described first silica gel panel be connected with described second silica gel panel and form one first sealing space, making several upper heating wires described be arranged in described first sealing space.
4. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 3, it is characterised in that: make the density being arranged in the described first described upper heating wire sealing position, edge, space more than the density being arranged in the described first described upper heating wire sealing space middle position.
5. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 2, it is characterised in that: described upper cavity component is set and also includes the first interval metallic plate and the second interval metallic plate;
Make described first interval metallic plate be located between described upper hot plate and described upper rubber slab, and make described second interval metallic plate be located between described upper thermal insulation board and described upper cavity mounting seat.
6. being suitable to as described in any one of claim 1-5 is pasted with the heating means of the non-formation plate material of thin film, it is characterised in that: described lower chamber component is set and includes with the lower chamber mounting seat of cavity, lower hot plate, lower temperature conditioning unit, lower thermal insulation board and lower closure assemblies;
Described lower hot plate is made to be located in described lower chamber mounting seat;
Described lower temperature conditioning unit is made to be located in described lower chamber mounting seat, to control the temperature of described lower hot plate;
Making described lower thermal insulation board be located between described lower hot plate and described lower chamber mounting seat, the heat to deaden described lower hot plate distributes;
Described lower closure assemblies is made to be covered on the upper end of described lower hot plate, so that described lower hot plate is enclosed in described lower chamber mounting seat.
7. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 6, it is characterised in that: described lower hot plate is set and includes the 3rd silica gel panel, the 4th silica gel panel, several lower heating wires and in order to detect temperature and coherent signal can be sent to the lower probe of described lower temperature conditioning unit;
Make described 3rd silica gel panel be connected with described 4th silica gel panel and form one second sealing space, making several lower heating wires described be arranged in described second and seal in space.
8. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 7, it is characterised in that: make the density being arranged in the described second described lower heating wire sealing position, edge, space more than the density being arranged in the described second described lower heating wire sealing space middle position.
9. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 6, it is characterised in that: described lower closure assemblies is set and includes lower metal frame, lower rubber slab, lower metallic plate and lower metal caul;
Described lower rubber slab is made to be located on described lower metal frame;
Described lower metallic plate is made to be located on described lower rubber slab;
Described lower metal caul is made to be located between described lower rubber slab and described lower metallic plate, for described lower metallic plate liner.
10. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 6, it is characterized in that: described lower chamber component is set and also includes the 3rd interval metallic plate and the 4th interval metallic plate, make described 3rd interval metallic plate be located between described lower hot plate and described lower capping board component, make described 4th interval metallic plate be located between described lower thermal insulation board and described lower chamber mounting seat.
11. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 6, it is characterized in that: described lower chamber component is set and also includes compressing member, described compressing member is made to be located on described lower closure assemblies, the thin film on described non-formation plate material it is attached to, so that this thin film is close on described non-formation plate material completely with extruding.
12. be suitable to be pasted with the heating means of the non-formation plate material of thin film as claimed in claim 11, it is characterised in that: arranging described compressing member is an air bag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610113086.8A CN105643917B (en) | 2016-02-29 | 2016-02-29 | Suitable for the heating means for the non-formation plate material for being pasted with film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610113086.8A CN105643917B (en) | 2016-02-29 | 2016-02-29 | Suitable for the heating means for the non-formation plate material for being pasted with film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105643917A true CN105643917A (en) | 2016-06-08 |
| CN105643917B CN105643917B (en) | 2018-01-02 |
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| CN201610113086.8A Active CN105643917B (en) | 2016-02-29 | 2016-02-29 | Suitable for the heating means for the non-formation plate material for being pasted with film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106739298A (en) * | 2016-12-23 | 2017-05-31 | 深圳市福和达自动化有限公司 | A kind of silica gel cavity body structure |
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| CN105643917B (en) | 2018-01-02 |
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