CN105633259B - 基于热管原理的大功率led光源 - Google Patents

基于热管原理的大功率led光源 Download PDF

Info

Publication number
CN105633259B
CN105633259B CN201610085453.8A CN201610085453A CN105633259B CN 105633259 B CN105633259 B CN 105633259B CN 201610085453 A CN201610085453 A CN 201610085453A CN 105633259 B CN105633259 B CN 105633259B
Authority
CN
China
Prior art keywords
working medium
heat
led chip
insulating working
liquid storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610085453.8A
Other languages
English (en)
Other versions
CN105633259A (zh
Inventor
张国生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Green Printing And Packaging Industry Technology Research Institute Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201610085453.8A priority Critical patent/CN105633259B/zh
Publication of CN105633259A publication Critical patent/CN105633259A/zh
Priority to CA2945732A priority patent/CA2945732A1/en
Priority to EP16194997.9A priority patent/EP3203147A1/en
Priority to US15/331,838 priority patent/US20170219197A1/en
Priority to HK16112199.6A priority patent/HK1224084A1/zh
Priority to KR1020160146599A priority patent/KR20170092441A/ko
Priority to TW105137143A priority patent/TW201728855A/zh
Priority to JP2016225651A priority patent/JP2017139448A/ja
Application granted granted Critical
Publication of CN105633259B publication Critical patent/CN105633259B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/005Sealing arrangements therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本发明涉及LED照明领域,尤其涉及一种基于热管原理直接冷却LED芯片的大功率LED光源。该大功率LED光源包括发光部、存储有液态的绝缘工质的储液部和散热部;发光部用于通过毛细吸力原理将液态的绝缘工质吸入,使液态的绝缘工质充满在LED芯片周围,直接冷却LED芯片。绝缘工质吸热后气化相变后经毛细通道流入储液部;散热部用于降低气化后的绝缘工质的温度,使绝缘工质冷却液化。当LED芯片工作过程中产生热量时,吸收热量后气化的绝缘工质会流通到散热部,绝缘工质通过散热部将热量散发降温后液化。经过如此循环,绝缘工质能够将LED芯片产生的热量及时的传导出去,使LED芯片保持在绝缘工质气化温度的范围内。从而提高了LED芯片的使用寿命,并提高了发光效率。

Description

基于热管原理的大功率LED光源
技术领域
本发明涉及LED照明领域,尤其涉及一种基于热管原理的大功率LED光源。
背景技术
随着LED行业迅猛的发展,对其研究深入性更加完善,LED的散热现在越来越为人们所重视,这是因为LED的光衰或其寿命是直接和其结温有关,散热不好结温就高,光效低、寿命就短。依照阿雷纽斯法则,温度每降低10℃寿命会延长2倍。目前几乎绝大多数的LED灯具中都采用了铝基电路板。冷却降温部分位于金属基板的背面,间接冷却LED芯片。铝基板上电路的铜箔为了要导电和导热要有足够的厚度和宽度,其厚度在35μm-280μm之间。其宽度最好尽可能布满整个基板,以便把热传下去。而下面一层绝缘体则要求其绝缘性能很好,而且还要导热性能很好。然而这两个性能是矛盾的,通常都是导体的导热性能好,而绝缘体的导热性能差。又要导热好又要绝缘好是很难做到的。
发明内容
本发明提供了一种基于热管原理的大功率LED光源,直接冷却LED芯片,以解决上述技术问题。
为了达到上述目的,本发明的技术方案是这样实现的:
一种基于热管原理的大功率LED光源,包括发光部、存储有液态的绝缘工质的储液部和散热部,直接冷却LED芯片;
所述发光部内设置有第一腔室及位于所述第一腔室内的LED芯片;所述第一腔室内部间隙为0.01mm-2mm;所述发光部用于通过毛细吸力原理将液态的所述绝缘工质吸入,并使所述绝缘工质吸热后气化相变;
所述储液部设置有第二腔室;液态的所述绝缘工质存储在所述第二腔室内;所述散热部用于降低气化后的绝缘工质的温度,使气化后的绝缘工质液化相变。
优选地,所述第一腔室由两块透明材料夹持后将边缘密封而成。
优选地,所述第一腔室由金属基电路板与透明材料夹持后将边缘密封而成。
优选地,所述透明材料为透明玻璃或透明陶瓷或透明荧光陶瓷或荧光玻璃或荧光薄膜玻璃或点阵荧光薄膜玻璃或掺有荧光粉的高分子荧光薄膜或其它透明材料。
优选地,所述第一腔室内还设置有电路;所述电路及所述LED芯片在所述第一腔室内;所述LED芯片固定在所述电路上并于所述电路电连接。
优选地,所述发光部与所述储液部之间设置有具有毛细结构的连接部;所述连接部分别连通所述发光部和所述储液部。
优选地,储液部和散热部为金属一体化密封结构。
与现有技术相比,本发明的优点在于:该大功率LED光源采用热管的毛细原理直接冷却LED芯片,发光部的第一腔室内部间隙为0.01mm-2mm,形成了毛细结构,利用热管原理,在第一腔室内及连接部形成毛细通道。第一腔室通过毛细吸力将储液部的液态的绝缘工质吸入,使液态的绝缘工质充满在LED芯片周围,直接冷却LED芯片。当LED芯片工作过程中产生热量时,液态的绝缘工质吸热后直接气化相变,经连接部的毛细通道流入冷却部和储液部,气化相变的过程会将热量吸收。吸收热量后的绝缘工质经连接部流通到储液部,绝缘工质通过散热部将热量散发降温后液化。经过如此循环,绝缘工质能够通过气化和液化将LED芯片产生的热量及时的传导出去,使LED芯片保持在绝缘工质气化温度的范围内。从而提高了LED芯片的使用寿命,并提高了发光效率。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案,下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明实施例的基于热管原理的大功率LED光源的结构示意图;
图2为本发明实施例的基于热管原理的大功率LED光源的侧面结构示意图;
图3为本发明实施例的基于热管原理的大功率LED光源加装散热装置的结构示意图。
具体实施方式
以下将结合附图对本发明各实施例的技术方案进行清楚、完整的描述,显然,所描述的实施倒仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所得到的所有其它实施例,都属于本发明所保护的范围。
热管的原理:在加热热管的蒸发段,管芯内的工作液体(工质)受热蒸发,并带走热量,该热量为工作液体的蒸发潜热(汽化热),蒸汽从中心毛细通道流向热管的冷凝段,凝结成液体,同时放出潜热,在毛细力(表面张力)的作用下,液体回流到蒸发段。这样,就完成了一个闭合循环,从而将大量的热量从加热段快速传到散热段。热管原理简单的可以总结为:液态变气态吸热,气压作用传递气体,液态变气态放热。
实施例
如图1、图2和图3所示一种基于热管原理的大功率LED光源,包括发光部102、连接部103、存储有液态的绝缘工质107的储液部105和散热部106,直接冷却LED芯片;发光部102内设置有第一腔室及位于第一腔室内的LED芯片101;第一腔室内部间隙为0.01mm-2mm;发光部102用于通过毛细吸力原理将液态的绝缘工质吸入,并使绝缘工质吸热后气化相变;储液部105设置有第二腔室;液态的绝缘工质107存储在第二腔室内;散热部用于降低气化后的绝缘工质的温度,使气化后的绝缘工质液化相变。
该大功率LED光源采用热管的毛细原理直接冷却LED芯片,发光部的第一腔室内部间隙为0.01mm-2mm,形成了毛细结构,利用热管原理,在第一腔室内及连接部形成毛细通道。第一腔室通过毛细吸力将储液部的液态的绝缘工质吸入,使液态的绝缘工质充满在LED芯片周围,直接冷却LED芯片。当LED芯片工作过程中产生热量时,液态的绝缘工质吸热后直接气化相变,气化相变的过程会将热量吸收,经连接部的毛细通道流入连接有散热部的储液部,绝缘工质通过散热部将热量散发降温后液化。经过如此循环,绝缘工质能够通过气化和液化将LED芯片产生的热量及时的传导出去,使LED芯片保持在绝缘工质气化温度的范周内。从而提高了LED芯片的使用寿命,并提高了发光效率。
优选地,如图2所示,第一腔室由两块透明材料夹持后将边缘密封而成。另外,将边缘密封时,可以采用密封胶或玻璃胶胶接,也可以采用密封工艺和材料或者机械密封结构密封,只要确保第一腔室的边缘不漏气、不漏液。其中储液部和散热部可以为金属一体化密封结构。
另外,除了由两块透明材料而成外,第一腔室还可以由金属基电路板与透明材料夹持后将边缘密封而成。具体地,针对现有的常规LED光源的结构,本实施例的技术方案还可以在现有的LED光源结构上,采用金属基电路板如铝基电路板与透明材料夹持形成毛细结构。
其中透明材料为透明玻璃或透明陶瓷或透明荧光陶瓷或荧光玻璃或荧光薄膜玻璃或点阵荧光薄膜玻璃或掺有荧光粉的高分子荧光薄膜或其它透明材料。其中荧光薄膜玻璃及点阵荧光薄膜玻璃可以采用专利号为ZL201210228419.3的制备方法进行生产。
优选地,第一腔室内还设置有电路108;电路108及LED芯片101在第一腔室内;LED芯片固定在电路上并于电路电连接。具体地,电路可以印刷在第一腔室的内壁,或者直接游离在第一腔室内,同时电路从第一腔室内或连接部或第二腔室引出与外部的供电装置连接。由此LED芯片和电路在第一腔室内,绝缘工质在毛细吸力的作用下,进入到第一腔室内,填充在LED芯片周围,可以直接冷却LED芯片。
优选地,发光部与储液部之间设置有毛细结构的连接部103;连接部103分别连通发光部和储液部。具体地,连接部连通发光部和储液部。储液部的绝缘工质经连接部后进入到发光部,绝缘工质经加热后气化相变,然后再经连接部回流至储液部。
优选地,绝缘工质为二甲基硅油。工作介质的选择需要考虑不导电、低沸点、透光性、流淌性、传热系数、与玻璃没有任何亲和反应等因素,优选为低粘度硅油适合本发明的绝缘工质,尤其是二甲基硅油,当然工作介质还可以选用乙醇、乙醚等工质。
另外,绝缘工质的充装量对传热能力有较大的影响。如果充装的绝缘工质过多,那么过量的绝缘工质液体会积聚在储液部端部,大大增加储液部的热阻,使LED光源的温度升高。如果充入的绝缘工质过少,那么绝缘工质将不能完全使发光部内的空隙填满,造成发光部局部干涸,从而使传热能力下降。如果采用二甲基硅油做工质,由于二甲基硅油的沸点在100℃左右,因此,该大功率LED光源的LED芯片温度能长期保持在100℃以下。
为了进一步提高散热效果,避免散热部热量过大,如图3所示,该大功率LED光源还可以设置与储液部105连接的散热装置106。其中该散热装置106可以为铝基散热板。
对于本实施例的大功率LED光源,只要发光部及发光部与储液部之间通过毛细原理将绝缘工质吸入,形成吸热散热循环的热管形式直接冷却LED芯片结构,都属于本发明的保护范围。
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施倒,但凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。

Claims (4)

1.一种基于热管原理的大功率LED光源,其特征在于,包括内部设置有LED芯片的发光部和存储有液态绝缘工质的储液部,所述绝缘工质用于直接冷却所述LED芯片;
所述发光部具有毛细结构,用于通过毛细吸力原理将液态的所述绝缘工质吸入,并使所述绝缘工质吸热后气化相变;
所述储液部设置有与所述毛细结构连通的第二腔室;液态的所述绝缘工质存储在所述第二腔室内;
所述发光部内设置有形成所述毛细结构的第一腔室,所述LED芯片设置在所述第一腔室内;
所述第一腔室由两块透明材料夹持后将边缘密封而成,或者由金属基电路板与透明材料夹持后将边缘密封而成;
所述第一腔室的内部间隙为0.01mm-2mm。
2.如权利要求1所述的基于热管原理的大功率LED光源,其特征在于,所述透明材料为透明玻璃或透明陶瓷。
3.如权利要求1所述的基于热管原理的大功率LED光源,其特征在于,所述第一腔室内还设置有电路;所述电路及所述LED芯片在所述第一腔室内;所述LED芯片固定在所述电路上并于所述电路电连接。
4.如权利要求1所述的基于热管原理的大功率LED光源,其特征在于,所述发光部与所述储液部之间设置有毛细结构的连接部;所述连接部分别连通所述发光部和所述储液部。
CN201610085453.8A 2016-02-03 2016-02-03 基于热管原理的大功率led光源 Active CN105633259B (zh)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CN201610085453.8A CN105633259B (zh) 2016-02-03 2016-02-03 基于热管原理的大功率led光源
CA2945732A CA2945732A1 (en) 2016-02-03 2016-10-19 High power led illuminant based on heat pipe principle
EP16194997.9A EP3203147A1 (en) 2016-02-03 2016-10-21 High power led illuminant based on heat pipe principle
US15/331,838 US20170219197A1 (en) 2016-02-03 2016-10-22 High Power LED Illuminant Based on Heat Pipe Principle
HK16112199.6A HK1224084A1 (zh) 2016-02-03 2016-10-24 基於熱管原理的大功率 光源
KR1020160146599A KR20170092441A (ko) 2016-02-03 2016-11-04 히트파이프 원리에 의한 고성능 led광원
TW105137143A TW201728855A (zh) 2016-02-03 2016-11-14 基於熱管原理的大功率led光源
JP2016225651A JP2017139448A (ja) 2016-02-03 2016-11-21 ヒートパイプ原理に基づく高出力led光源

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610085453.8A CN105633259B (zh) 2016-02-03 2016-02-03 基于热管原理的大功率led光源

Publications (2)

Publication Number Publication Date
CN105633259A CN105633259A (zh) 2016-06-01
CN105633259B true CN105633259B (zh) 2019-12-06

Family

ID=56047989

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610085453.8A Active CN105633259B (zh) 2016-02-03 2016-02-03 基于热管原理的大功率led光源

Country Status (8)

Country Link
US (1) US20170219197A1 (zh)
EP (1) EP3203147A1 (zh)
JP (1) JP2017139448A (zh)
KR (1) KR20170092441A (zh)
CN (1) CN105633259B (zh)
CA (1) CA2945732A1 (zh)
HK (1) HK1224084A1 (zh)
TW (1) TW201728855A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106641761B (zh) * 2017-01-17 2023-11-24 北京印刷学院 基于热管原理的直冷式led光源
CN107654980B (zh) * 2017-08-29 2019-11-29 江苏浦亚照明科技股份有限公司 大功率led芯片散热结构
CN108167773A (zh) * 2018-02-11 2018-06-15 上海小糸车灯有限公司 Led发光系统及车灯
EP3597268B1 (en) 2018-07-19 2020-10-28 JK-Holding GmbH Irradiating device and irradiation method
KR102266867B1 (ko) 2019-06-24 2021-06-18 한라아이엠에스 주식회사 엘이디 조명기구의 방열구조

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2610491Y (zh) * 2003-02-26 2004-04-07 台达电子工业股份有限公司 循环式散热装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2229555B1 (de) * 2008-01-14 2011-11-02 Osram AG Anordnung zur kühlung von halbleiterlichtquellen und scheinwerfer mit dieser anordnung
DE102009019227A1 (de) * 2009-04-28 2011-01-13 Ledon Lighting Jennersdorf Gmbh LED lamp
TWI442527B (zh) * 2010-02-11 2014-06-21 寶福通光能有限公司 Hardened modular semiconductor device
WO2013042662A1 (ja) * 2011-09-20 2013-03-28 シチズンホールディングス株式会社 Ledモジュール及びそれを用いたledランプ
TWI558303B (zh) * 2013-11-21 2016-11-11 旭德科技股份有限公司 散熱裝置
WO2016012146A1 (en) * 2014-07-22 2016-01-28 Koninklijke Philips N.V. Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling or a light source assembly
US20160356479A1 (en) * 2015-06-03 2016-12-08 Haihua Wu LED Lighting Module, System, and Method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2610491Y (zh) * 2003-02-26 2004-04-07 台达电子工业股份有限公司 循环式散热装置

Also Published As

Publication number Publication date
KR20170092441A (ko) 2017-08-11
JP2017139448A (ja) 2017-08-10
HK1224084A1 (zh) 2017-08-11
US20170219197A1 (en) 2017-08-03
EP3203147A1 (en) 2017-08-09
TW201728855A (zh) 2017-08-16
CA2945732A1 (en) 2017-08-03
CN105633259A (zh) 2016-06-01

Similar Documents

Publication Publication Date Title
CN105633259B (zh) 基于热管原理的大功率led光源
CN101457918B (zh) 液冷led灯
CN103196116B (zh) 用于大功率led的改进型重力热管散热器
CN101408302A (zh) 具良好散热性能的光源模组
WO2010099733A1 (zh) 中空式液冷led灯
TW201019431A (en) Insulating and heat-dissipating structure of an electronic component
CN105333407A (zh) 散热结构及制造方法
CN101740678A (zh) 固态发光元件及光源模组
CN102454969A (zh) 具有超热导管的发光二极管可替换通用平台
CN102692002A (zh) 一种高功率led的散热装置
CN201448619U (zh) 一种液体散热led灯具
CN201448618U (zh) 一种分散型液体散热led灯具
CN201425286Y (zh) 一种led灯的散热结构
WO2014127594A1 (zh) 具有发光二极管的发光装置
CN203533494U (zh) 一种大功率led灯的散热系统
CN206572230U (zh) 基于热管原理的直冷式led光源
KR101447186B1 (ko) 발광 다이오드 조명 기기 어셈블리
CN205355086U (zh) 基于热管原理的大功率led光源
CN204611448U (zh) 一种散热一体化led灯
CN202747281U (zh) 一种高功率led的散热装置
KR20130107986A (ko) 발광 다이오드 조명 기기
CN208014696U (zh) 一种cob光源及led灯
CN101994912A (zh) 一种液体散热led灯具
CN213177740U (zh) 一种大功率led翅片式散热器
CN203503690U (zh) 一种带陶瓷散热基板的led灯

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1224084

Country of ref document: HK

GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20200519

Address after: Room 216, 2f, building 3, Beijing Printing Institute, west side of Xinghua North Road, Huangcun Town, Daxing District, Beijing 102627

Patentee after: Beijing green printing and Packaging Industry Technology Research Institute Co., Ltd.

Address before: 102600, two, Xinghua Road, 1 Beijing, Daxing District, Beijing Institute of Graphic Communication

Patentee before: Zhang Guosheng

REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1224084

Country of ref document: HK