CN105633068A - Dual-purpose LED device for communication and illumination - Google Patents
Dual-purpose LED device for communication and illumination Download PDFInfo
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- CN105633068A CN105633068A CN201511026137.5A CN201511026137A CN105633068A CN 105633068 A CN105633068 A CN 105633068A CN 201511026137 A CN201511026137 A CN 201511026137A CN 105633068 A CN105633068 A CN 105633068A
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- 238000005286 illumination Methods 0.000 title abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000005253 cladding Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000003071 parasitic effect Effects 0.000 abstract 1
- 230000008054 signal transmission Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005424 photoluminescence Methods 0.000 description 2
- 239000010981 turquoise Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the field of visible light communication and illumination technology, and provides a dual-purpose LED device for communication and illumination. The LED device comprises a substrate, a conductive covering layer, at least one LED chip group and a transparent layer. Each of the LED chip groups is formed by at least one LED which can be a red LED, a green LED, a blue LED or a white LED. Each of the LED chip groups also comprises a first electrode and a second electrode, which are electrically connected with the LEDs and the conductive covering layer. Voltage of each of the LED chip groups is larger than or equal to voltage of one LED, so light emitting efficiency of each of the LED chip groups is quite high. At least one LED chip group is arranged on the substrate, so the light emitting efficiency of the LED device is quite high. In addition, by connecting the first electrode and the second electrode to the conductive covering layer, connection of the LEDs and the substrate is achieved, so parasitic resistance and capacitance between the LED chip groups and the substrate can be reduced and modulation bandwidth is increased.
Description
Technical field
The invention belongs to the technical field of visible light communication and illumination, particularly relate to logical according to dual-purpose LED component.
Background technology
LED/light source, compared to general illumination, has higher electro-optical efficiency, is a kind of light source that can meet green illumination, and it is except for illumination, it is also possible to for communication signal transmissions, as being applied in visible light communication system. For the LED/light source taking into account illumination and communication signal transmissions simultaneously, the feature that it must possess luminous efficiency height, modulating performance is good.
At present, the LED/light source simultaneously taking into account illumination and communication signal transmissions mainly contains two classes: a class adopts blue-light LED chip+fluorescent material, such as blue-light LED chip+yellow fluorescent powder, blue-light LED chip+yellow fluorescent powder+red fluorescence powder, or, blue-light LED chip+green emitting phosphor+red fluorescence powder; Another class adopts red turquoise three-color LED chip, i.e. RGB-LED.
But, still there is such problem in the existing LED/light source simultaneously taking into account illumination and communication signal transmissions:
One, adopt the form of light source of blue-light LED chip+fluorescent material, its due to the response speed of fluorescent material slow, and, in the fluorescence excited by fluorescent material, some fluorescence can not by current-modulation, therefore, by, when in this, LED/light source is applied to communication signal transmissions, its modulation band-width is lower.
Two, adopting the form of light source of red turquoise three-color LED chip, the light that red LED chips, green LED chip and blue led chip send is mixed and obtain white light by it, and this white light can have higher modulation band-width. But, its usually by each LED chip individual packages on substrate, now, the voltage of each LED chip is at about 3V, and is the demand meeting communication signal transmissions, it is necessary to each LED chip connect. Owing to each independent LED chip is connected by the circuit realiration of substrate so that dead resistance and electric capacity between LED chip become big, therefore, add the energy of high pressure conversion when LED chip is applied, reduce its modulation band-width.
Summary of the invention
It is an object of the invention to provide logical according to dual-purpose LED component, it is intended to solve the problem that can not simultaneously have high-luminous-efficiency and modulation band-width when existing LED/light source is applied to communication signal transmissions and illumination concurrently.
For solving the problems of the technologies described above, the present invention provides logical according to dual-purpose LED component, the conductive cladding comprise substrate, being located on described substrate, the LED chip group being located on described conductive cladding and the transparent layer covered at outside described LED chip group, the quantity of described LED chip group is set at least one, each described LED chip group is made up of at least one LED, described LED is red LED, green LED, blue led or White LED, and described LED chip group also comprises the first electrode and the 2nd electrode that are connected and be connected with described conductive cladding respectively with described LED electrical.
Further, described LED comprises luminescent layer and reflector layer, and the downside of described luminescent layer is located at described first electrode and described reflector layer interval, and described 2nd electrode is located at the downside of described reflector layer; Or, the downside of described luminescent layer is located at described 2nd electrode and described reflector layer interval, and described first electrode is located at the downside of described reflector layer.
Further, the quantity of described LED chip group is set at least two, by connected in series or in parallel between different described LED chip group.
Further, in same described LED chip group, the quantity of described LED is set at least two, is connected in series between different described LED.
Further, the voltage of each described LED chip group is 5��48V.
Further, the voltage of described LED chip group is 24V.
Further, in same described LED chip group, the quantity of described LED is set to 6.
Further, described substrate is ceramic plate.
Further, described transparent layer is layer of silica gel.
Further, described conductive cladding is for covering copper.
The useful effect of the LED component that logical photograph provided by the invention is dual-purpose:
The dual-purpose LED component of above-mentioned logical photograph have employed at least one LED chip group, and each LED chip group is made up of at least one LED, and in same LED chip group, the color of LED is identical, and namely LED is any one in red LED, green LED, blue led or White LED. Owing to each LED chip group comprises at least one LED, therefore, the voltage of each LED chip group is greater than or equals the voltage of a LED, like this, the luminous efficiency of each LED chip group is higher, and, more at least one LED chip group is set on substrate so that the luminous efficiency of the LED component that whole above-mentioned logical photograph is dual-purpose is higher. In addition, it is connected with conductive cladding respectively by the first electrode and the 2nd electrode, realizes the connection of LED and substrate, like this, the dead resistance between LED chip group and substrate and electric capacity can be reduced, thus decrease the energy of high pressure conversion when LED chip group is applied, and, the first electrode and the 2nd electrode respectively with the connection of conductive cladding, bigger current density can be born, the carrier number flowing through LED chip group is made to measure increase, therefore, it is to increase its modulation band-width.
In sum, the dual-purpose LED component of above-mentioned logical photograph adopts on the basis of at least one LED at least one LED chip group of employing and each LED chip group, the connection engaging LED chip group and substrate is connected with conductive cladding respectively by the first electrode, the 2nd electrode and realizes, therefore, the dual-purpose LED component of above-mentioned logical photograph, while having higher photoluminescence efficiency, has higher modulation band-width.
Accompanying drawing explanation
Fig. 1 is the perspective view of the dual-purpose LED component of logical photograph that the embodiment of the present invention provides;
Fig. 2 is the enlarged diagram of the dual-purpose LED component of logical photograph that Fig. 1 provides at circle A place;
Fig. 3 is the sectional view of the dual-purpose LED component of logical photograph that the embodiment of the present invention provides;
Fig. 4 is the vertical view of the LED chip group of the dual-purpose LED component of logical photograph that the embodiment of the present invention provides.
Embodiment
In order to make the object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated. It is to be understood that specific embodiment described herein is only in order to explain the present invention, it is not intended to limit the present invention.
As shown in figures 1-4, it is better embodiment provided by the invention.
It should be noted that, when parts are called as " being fixed on " or " being arranged at " another parts, it can directly on another parts or may there are parts placed in the middle simultaneously. When parts are known as " being connected to " another parts, it can be directly connected to another parts or may there are parts placed in the middle simultaneously.
Also it should be noted that, the orientation term such as left and right, upper and lower in the present embodiment, be only concept or by reference of the normal service condition of product relatively each other, and should not be regarded as have restrictive.
As shown in Figure 1 to Figure 3, the LED component 10 that the logical photograph that the present embodiment provides is dual-purpose, comprise substrate 11, the conductive cladding 12 being located on substrate 11, the LED chip group 13 being located on conductive cladding 12 and the transparent layer 14 covered at outside LED chip group 13, the quantity of LED chip group 13 is set at least one, each LED chip group 13 is made up of at least one LED131, LED131 is red LED 1311, green LED 1312, blue led 1313 or White LED, LED chip group 13 also comprises the first electrode 141 and the 2nd electrode 142 that are electrically connected with LED131 and are connected with conductive cladding 12 respectively.
As shown in figures 1 and 3, the dual-purpose LED component 10 of above-mentioned logical photograph have employed at least one LED chip group 13, each LED chip group 13 is made up of at least one LED131, and in same LED chip group 13, the color of LED131 is identical, and namely LED131 is any one in red LED 1311, green LED 1312, blue led 1313 or White LED. Owing to each LED chip group 13 comprises at least one LED131, therefore, the voltage of each LED chip group 13 is greater than or equals the voltage of a LED131, like this, the luminous efficiency of each LED chip group 13 is higher, and, more at least one LED chip group 13 is set on substrate 11 so that the luminous efficiency of the LED component 10 that whole above-mentioned logical photograph is dual-purpose is higher. In addition, it is connected with conductive cladding 12 respectively by the first electrode 141 and the 2nd electrode 142, realize LED131 and the connection of substrate 11, like this, the dead resistance between LED chip group 13 and substrate 11 and electric capacity can be reduced, thus the energy of high pressure conversion when LED chip group 13 is applied is decreased, and, first electrode 141 and the 2nd electrode 142 respectively with the connection of conductive cladding 12, bigger current density can be born, the carrier number flowing through LED chip group 13 is made to measure increase, therefore, it is to increase its modulation band-width.
In sum, the dual-purpose LED component 10 of above-mentioned logical photograph adopts on the basis of at least one LED131 at least one LED chip group 13 of employing and each LED chip group 13, the connection engaging LED chip group 13 and substrate 11 is connected with conductive cladding 12 respectively by the first electrode 141, the 2nd electrode 142 and realizes, therefore, the dual-purpose LED component 10 of above-mentioned logical photograph, while having higher photoluminescence efficiency, has higher modulation band-width.
The present embodiment is about the preferred implementation of the concrete structure of LED131, as shown in figures 1 and 3, in order to improve the luminous efficiency of LED131, LED131 comprises luminescent layer 1314 and reflector layer 1315, the downside of luminescent layer 1314 is located at first electrode 141 and reflector layer 1315 interval, and the 2nd electrode 142 is located at the downside of reflector layer 1315; Or, the downside of luminescent layer 1314 is located at the 2nd electrode 142 and reflector layer 1315 interval, and the first electrode 141 is located at the downside of reflector layer 1315.
As shown in figures 1 and 3, about the preferred implementation of LED chip group 13 set-up mode on substrate 11, the quantity of LED chip group 13 is set at least two, by connected in series or in parallel between different LED chipset 13. Specifically, the color of LED131 between different LED chipset 13 is different. Such as, between two LED chip groups 13, the LED131 of two LED chip groups 13 can be the combination of any two kinds in red LED 1311, green LED 1312, blue led 1313 or White LED.
As shown in figures 1 and 3, in order to improve the voltage of each LED chip group 13, in same LED chip group 13, the quantity of LED131 is set at least two, is connected in series between different LED 131. like this, first through series connection between different LED 131 in same LED chip group 13, the connection of LED chip group 13 with substrate 11 is realized again by the connection of the first electrode 141 and the 2nd electrode 142 and conductive cladding 12, like this, prior art of comparing adopts the mode that each LED chip individual packages connects mutually again, the mode that the present embodiment adopts, it can reduce the dead resistance between LED chip group 13 and substrate 11 and electric capacity, and decrease the energy of high pressure conversion when LED chip group 13 is applied, and, first electrode 141 and the 2nd electrode 142 respectively with the connection of conductive cladding 12, bigger current density can be born, the carrier number flowing through LED chip group 13 is made to measure increase, therefore, improve its modulation band-width, be suitable for communication signal transmissions and illumination.
Owing to each LED chip group 13 comprises at least one LED131, therefore, the voltage of each LED chip group 13 is 5��48V. Specifically, the voltage of green LED 1312 be 5��48V, blue led 1313 voltage be the voltage of 5��48V or White LED be 5��48V, and red LED 1311 is 4��48V.
Preferably, in order to take into account the luminous efficiency and modulation band-width improving LED chip group 13, the voltage of LED chip group 13 is 24V. Specifically, the voltage of green LED 1312 be 24V, blue led 1313 voltage be the voltage of 24V or White LED be 24V, red LED 1311 is 24V.
As shown in Figures 1 to 4, owing to the voltage of each LED131 is at 4��5V, it is preferred, therefore, that in same LED chip group 13, the quantity of LED131 is set to 6. When each LED chip group 13 adopts 6 LED131, LED chip group 13 can have higher luminous efficiency and modulation band-width.
Refinement ground, substrate 11 is ceramic plate. Certainly, substrate 11 is insulcrete, and it can also be plastic plate etc.
Refinement ground, transparent layer 14 is layer of silica gel. Here, layer of silica gel, playing while light transmission LED chip group 13 launched goes out, also plays the effect of support, protection LED chip group 13, and certainly, transparent layer 14 also can be made up of other transparent materials.
Refinement ground, conductive cladding 12 is for covering copper. Like this, cover copper to ensure that and the firm contact of the first electrode 141 and the 2nd electrode 142, it is beneficial to and reduces the dead resistance and electric capacity covering between copper and the first electrode 141 and the 2nd electrode 142, decrease the energy waste of high pressure conversion when LED chip group 13 is applied simultaneously, therefore, it is beneficial to the modulation band-width improving LED chip group 13, is suitable for communication signal transmissions and illumination. Certainly, conductive cladding 12 also can be made up of other electro-conductive materials.
These are only the better embodiment of the present invention, not in order to limit the present invention, all any amendment, equivalent replacement and improvement etc. done within the spirit and principles in the present invention, all should be included within protection scope of the present invention.
Claims (10)
1. logical according to dual-purpose LED component, it is characterized in that, the conductive cladding comprise substrate, being located on described substrate, the LED chip group being located on described conductive cladding and the transparent layer covered at outside described LED chip group, the quantity of described LED chip group is set at least one, each described LED chip group is made up of at least one LED, described LED is red LED, green LED, blue led or White LED, and described LED chip group also comprises the first electrode and the 2nd electrode that are connected and be connected with described conductive cladding respectively with described LED electrical.
2. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that, described LED comprises luminescent layer and reflector layer, and the downside of described luminescent layer is located at described first electrode and described reflector layer interval, and described 2nd electrode is located at the downside of described reflector layer; Or, the downside of described luminescent layer is located at described 2nd electrode and described reflector layer interval, and described first electrode is located at the downside of described reflector layer.
3. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that, the quantity of described LED chip group is set at least two, connected in series or in parallel between different described LED chip group.
4. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that, in same described LED chip group, the quantity of described LED is set at least two, is connected in series between different described LED.
5. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that, the voltage of each described LED chip group is 5��48V.
6. as claimed in claim 5 logical according to dual-purpose LED component, it is characterised in that, the voltage of described LED chip group is 24V.
7. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that, in same described LED chip group, the quantity of described LED is set to 6.
8. the LED component that logical photograph as described in item as arbitrary in claim 1��7 is dual-purpose, it is characterised in that, described substrate is ceramic plate.
9. the LED component that logical photograph as described in item as arbitrary in claim 1��7 is dual-purpose, it is characterised in that, described transparent layer is layer of silica gel.
10. the LED component that logical photograph as described in item as arbitrary in claim 1��7 is dual-purpose, it is characterised in that, described conductive cladding is for covering copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026137.5A CN105633068B (en) | 2015-12-31 | 2015-12-31 | It is logical to shine dual-purpose LED component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026137.5A CN105633068B (en) | 2015-12-31 | 2015-12-31 | It is logical to shine dual-purpose LED component |
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| Publication Number | Publication Date |
|---|---|
| CN105633068A true CN105633068A (en) | 2016-06-01 |
| CN105633068B CN105633068B (en) | 2018-11-02 |
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| CN201511026137.5A Active CN105633068B (en) | 2015-12-31 | 2015-12-31 | It is logical to shine dual-purpose LED component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115127081A (en) * | 2021-03-18 | 2022-09-30 | 光宝科技股份有限公司 | Dimmable light emitting device |
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| CN101286542A (en) * | 2007-04-09 | 2008-10-15 | 台达电子工业股份有限公司 | LED apparatus |
| CN102214650A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | Light emitting diode (LED) pixel unit device structure and preparation method thereof |
| CN102347436A (en) * | 2011-10-26 | 2012-02-08 | 晶科电子（广州）有限公司 | LED (Light-emitting Diode) device and wafer-level LED device as well as packaging structure of LED device and wafer-level LED device |
| CN102748604A (en) * | 2011-04-19 | 2012-10-24 | 晶元光电股份有限公司 | Lighting apparatuses and led modules for both illumation and optical communication |
| CN205488122U (en) * | 2015-12-31 | 2016-08-17 | 深圳市瑞丰光电子股份有限公司 | Lead to and shine dual -purpose LED device |
-
2015
- 2015-12-31 CN CN201511026137.5A patent/CN105633068B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286542A (en) * | 2007-04-09 | 2008-10-15 | 台达电子工业股份有限公司 | LED apparatus |
| CN102748604A (en) * | 2011-04-19 | 2012-10-24 | 晶元光电股份有限公司 | Lighting apparatuses and led modules for both illumation and optical communication |
| CN102214650A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | Light emitting diode (LED) pixel unit device structure and preparation method thereof |
| CN102347436A (en) * | 2011-10-26 | 2012-02-08 | 晶科电子（广州）有限公司 | LED (Light-emitting Diode) device and wafer-level LED device as well as packaging structure of LED device and wafer-level LED device |
| CN205488122U (en) * | 2015-12-31 | 2016-08-17 | 深圳市瑞丰光电子股份有限公司 | Lead to and shine dual -purpose LED device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115127081A (en) * | 2021-03-18 | 2022-09-30 | 光宝科技股份有限公司 | Dimmable light emitting device |
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| CN105633068B (en) | 2018-11-02 |
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