CN205488122U - Lead to and shine dual -purpose LED device - Google Patents
Lead to and shine dual -purpose LED device Download PDFInfo
- Publication number
- CN205488122U CN205488122U CN201521138622.7U CN201521138622U CN205488122U CN 205488122 U CN205488122 U CN 205488122U CN 201521138622 U CN201521138622 U CN 201521138622U CN 205488122 U CN205488122 U CN 205488122U
- Authority
- CN
- China
- Prior art keywords
- led
- dual
- electrode
- led chip
- chipset
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a technical field of visible light communication and illumination provides lead to and shine dual -purpose LED device, including base plate, electrically conductive coating, LED chipset and stratum lucidum, the quantity of LED chipset is established to at least one, and each LED chipset comprises an at least LED, and LED is red LED, green LED, blue LED or white LED, and the LED chipset still includes first electrode and the second electrode of just being connected with electrically conductive coating respectively with LED electric connection. Because the voltage of each LED chipset will be more than or equal to a LED's voltage, like this, the luminous efficacy of each LED chipset is higher, and the base plate sets up an at least LED chipset, makes above -mentioned lead to and shine dual -purpose LED device's luminous efficacy higher. In addition, be connected with electrically conductive coating through first electrode and second electrode, realize LED and basic joining of plates, can reduce parasitic resistance and electric capacity between LED chipset and the base plate, improved its modulation bandwidth.
Description
Technical field
This utility model belongs to the technical field of visible light communication and illumination, particularly relates to logical according to dual-purpose LED
Device.
Background technology
LED light source, compared to general lighting, has higher electro-optical efficiency, is to disclosure satisfy that green photograph
Bright a kind of light source, it is in addition to for illumination, it is also possible to for communication signal transmissions, as be applied to can
See in optical communication system.For taking into account the LED light source of illumination and communication signal transmissions, it is necessary simultaneously
Possesses the feature that luminous efficiency is high, modulating performance is good.
At present, the LED light source simultaneously taking into account illumination and communication signal transmissions mainly has two classes: a class is to use
Blue-light LED chip+fluorescent material, such as blue-light LED chip+yellow fluorescent powder, blue-light LED chip+yellow
Fluorescent material+red fluorescence powder, or, blue-light LED chip+green emitting phosphor+red fluorescence powder；Another kind of
It is to use redgreenblue LED chip, i.e. RGB-LED.
But, existing take into account illumination and the LED light source of communication signal transmissions still suffers from such problem simultaneously:
One, using the form of light source of blue-light LED chip+fluorescent material, it is slow due to the response speed of fluorescent material,
And, fluorescent material in the fluorescence excited, some fluorescence can not be by current-modulation, therefore, and should
When middle LED light source is applied to communication signal transmissions, its modulation bandwidth is relatively low.
Two, using the form of light source of redgreenblue LED chip, it is by red LED chips, green LED
The light that chip and blue LED die send mixes and obtains white light, and this white light can have higher
Modulation bandwidth.But, its generally by each LED chip individual packages on substrate, now, each LED
The voltage of chip is at about 3V, and is the demand meeting communication signal transmissions, needs each LED chip string
Connection.Owing to each independent LED chip is connected by the circuit realiration of substrate so that between LED chip
Dead resistance and electric capacity become big, therefore, when adding LED chip application, the energy of high pressure conversion, reduces
Its modulation bandwidth.
Utility model content
The purpose of this utility model is to provide logical according to dual-purpose LED component, it is intended to solve existing LED light
The problem that source is applied to can not have high-luminous-efficiency and modulation bandwidth concurrently when communication signal transmissions and illumination simultaneously.
For solving above-mentioned technical problem, this utility model provides logical according to dual-purpose LED component, including substrate,
The LED chip group of be located at the conductive cladding on described substrate, being located on described conductive cladding and cover at institute
Stating the clear layer outside LED chip group, the quantity of described LED chip group is set at least one, each described LED
Chipset is made up of at least one LED, described LED be red LED, green LED, blue led or
White LED, described LED chip group also includes being electrically connected with described LED and covering with described conduction respectively
First electrode of layer connection and the second electrode.
Further, described LED includes luminescent layer and reflector layer, described first electrode and described reflective interlayer
Every being located at the downside of described luminescent layer, described second electrode is located at the downside of described reflector layer；Or, described
The downside of described luminescent layer is located at second electrode and described reflector layer interval, described first electrode be located at described instead
The downside of photosphere.
Further, the quantity of described LED chip group is set at least two, different described LED chip groups it
Between by connected in series or in parallel.
Further, in same described LED chip group, the quantity of described LED is set at least two, difference
It is connected in series between described LED.
Further, the voltage of each described LED chip group is 5～48V.
Further, the voltage of described LED chip group is 24V.
Further, in same described LED chip group, the quantity of described LED is set to 6.
Further, described substrate is ceramic wafer.
Further, described clear layer is layer of silica gel.
Further, described conductive cladding is for covering copper.
The logical beneficial effect according to dual-purpose LED component that this utility model provides:
Above-mentioned logical have employed at least one LED chip group according to dual-purpose LED component, each LED chip group by
At least one LED composition, and in same LED chip group, the color of LED is identical, i.e. LED is red
Any one in LED, green LED, blue led or White LED.Due to each LED chip group bag
Including at least one LED, therefore, the voltage of each LED chip group is greater than or is equal to the voltage of a LED,
So, the luminous efficiency of each LED chip group is higher, and, at least one LED is set on substrate
Chipset so that the whole above-mentioned logical luminous efficiency according to dual-purpose LED component is higher.Additionally, by first
Electrode and the second electrode are connected with conductive cladding respectively, realize the connection of LED and substrate, as such, it is possible to
Reduce the dead resistance between LED chip group and substrate and electric capacity, thus decrease the application of LED chip group
Time high pressure conversion energy, and, the first electrode and the second electrode respectively with the connection of conductive cladding, it is possible to
Bear bigger electric current density so that the carrier number flowing through LED chip group measures increase, therefore, carry
Its modulation bandwidth high.
In sum, the LED component that above-mentioned logical photograph is dual-purpose is using at least one LED chip group and each LED
On the basis of chipset uses at least one LED, joint LED chip group connects through the first electricity with substrate
Pole, the second electrode are connected with conductive cladding respectively and realize, and therefore, above-mentioned logical exist according to dual-purpose LED component
While there is higher photoluminescence efficiency, there is higher modulation bandwidth.
Accompanying drawing explanation
Fig. 1 is the logical perspective view according to dual-purpose LED component that this utility model embodiment provides；
Fig. 2 is the logical enlarged diagram according to dual-purpose LED component at circle A that Fig. 1 provides；
Fig. 3 is the logical sectional view according to dual-purpose LED component that this utility model embodiment provides；
Fig. 4 is bowing of the logical LED chip group according to dual-purpose LED component of this utility model embodiment offer
View.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing
And embodiment, this utility model is further elaborated.Should be appreciated that described herein specifically
Embodiment, only in order to explain this utility model, is not used to limit this utility model.
As shown in figures 1-4, the preferred embodiment provided for this utility model.
It should be noted that when parts are referred to as " being fixed on " or " being arranged at " another parts, and it can be straight
It is connected on another parts or may be simultaneously present parts placed in the middle.When parts are known as " being connected to "
Another parts, it can be directly to another parts or may be simultaneously present parts placed in the middle.
Also, it should be noted the orientation term such as left and right, upper and lower in the present embodiment, it it is only phase each other
To concept or with the normal operating condition of product as reference, and should not be regarded as restrictive.
As shown in Figure 1 to Figure 3, what the present embodiment provided is logical according to dual-purpose LED component 10, including substrate
11, the conductive cladding 12 being located on substrate 11, the LED chip group 13 being located on conductive cladding 12 and
Covering at the clear layer 14 outside LED chip group 13, the quantity of LED chip group 13 is set at least one, often
One LED chip group 13 is made up of at least one LED131, and LED131 is red LED 1311, green
LED1312, blue led 1313 or White LED, LED chip group 13 also includes electrical with LED131
The first electrode 141 and the second electrode 142 connected and be connected with conductive cladding 12 respectively.
As shown in figures 1 and 3, the dual-purpose LED component 10 of above-mentioned logical photograph have employed at least one LED chip
Group 13, each LED chip group 13 is made up of at least one LED131, and in same LED chip group 13,
The color of LED131 is identical, i.e. LED131 is red LED 1311, green LED 1312, blue led 1313
Or any one in White LED.Owing to each LED chip group 13 includes at least one LED131, therefore,
The voltage of each LED chip group 13 is greater than or is equal to the voltage of a LED131, so, each LED
The luminous efficiency of chipset 13 is higher, and, at least one LED chip group 13 is set on substrate 11,
Make the whole above-mentioned logical luminous efficiency according to dual-purpose LED component 10 higher.Additionally, by the first electrode
141 and second electrode 142 be connected with conductive cladding 12 respectively, realize the company of LED131 and substrate 11
Connect, as such, it is possible to the dead resistance reduced between LED chip group 13 and substrate 11 and electric capacity, thus subtract
Lack the energy of high pressure conversion when LED chip group 13 is applied, and, the first electrode 141 and the second electrode
142 respectively with the connection of conductive cladding 12, it is possible to bear bigger electric current density so that flow through LED core
The carrier number of sheet group 13 measures increase, this improves its modulation bandwidth.
In sum, the LED component 10 that above-mentioned logical photograph is dual-purpose is using at least one LED chip group 13 He
On the basis of each LED chip group 13 uses at least one LED131, engage LED chip group 13 and base
First electrode 141, second electrode 142 that connects through of plate 11 is connected with conductive cladding 12 respectively and realizes,
Therefore, above-mentioned logical according to dual-purpose LED component 10 while there is higher photoluminescence efficiency, have higher
Modulation bandwidth.
The present embodiment is about the preferred implementation of LED131 concrete structure, as shown in figures 1 and 3, for
Improving the luminous efficiency of LED131, LED131 includes luminescent layer 1314 and reflector layer 1315, the first electricity
The downside of luminescent layer 1314 is located at pole 141 and reflector layer 1315 interval, and the second electrode 142 is located at reflector layer
The downside of 1315；Or, the downside of luminescent layer 1314 is located at the second electrode 142 and reflector layer 1315 interval,
First electrode 141 is located at the downside of reflector layer 1315.
As shown in figures 1 and 3, about LED chip group 13 being preferable to carry out of set-up mode on substrate 11
Mode, the quantity of LED chip group 13 is set at least two, by series connection between different LED chip groups 13
Or be connected in parallel.Specifically, the color of the LED131 between different LED chip groups 13 is different.Such as,
Between two LED chip groups 13, the LED131 of two LED chip groups 13 can be red LED 1311,
The combination of any two kinds in green LED 1312, blue led 1313 or White LED.
As shown in figures 1 and 3, in order to improve the voltage of each LED chip group 13, same LED chip
In group 13, the quantity of LED131 is set at least two, is connected in series between different LED131.So, same
Series connection is first passed through between different LED131 in one LED chip group 13, then by the first electrode 141 He
The connection of the second electrode 142 and conductive cladding 12 realizes the connection of LED chip group 13 and substrate 11,
So, for the prior art that compares uses the mode that each LED chip individual packages is serially connected again, this
The mode that embodiment is used, its can reduce the dead resistance between LED chip group 13 and substrate 11 and
Electric capacity, and decrease the energy of high pressure conversion when LED chip group 13 is applied, and, the first electrode 141
With the second electrode 142 respectively with the connection of conductive cladding 12, it is possible to bear bigger electric current density so that stream
Measure increase through the carrier number of LED chip group 13, this improves its modulation bandwidth, be suitable to lead to
Letter signal transmission and illumination.
Owing to each LED chip group 13 includes at least one LED131, therefore, each LED chip group 13
Voltage be 5～48V.Specifically, the voltage of green LED 1312 be 5～48V, blue led 1313
Voltage is 5～48V or the voltage of White LED is 5～48V, and red LED 1311 is 4～48V.
Preferably, in order to take into account luminous efficiency and modulation bandwidth, the LED improving LED chip group 13
The voltage of chipset 13 is 24V.Specifically, the voltage of green LED 1312 be 24V, blue led 1313
The voltage that voltage is 24V or White LED be 24V, red LED 1311 is 24V.
As shown in Figures 1 to 4, owing to the voltage of each LED131 is 4～5V, it is therefore preferred that with
In one LED chip group 13, the quantity of LED131 is set to 6.6 are used in each LED chip group 13
During individual LED131, LED chip group 13 can have higher luminous efficiency and modulation bandwidth.
Refinement ground, substrate 11 is ceramic wafer.Certainly, substrate 11 is insulation board, and it can also be plastic plate
Deng.
Refinement ground, clear layer 14 is layer of silica gel.Here, LED chip group 13 is launched playing by layer of silica gel
Light transmission go out while, also act as support, protection LED chip group 13 effect, certainly, thoroughly
Bright layer 14 also can be made up of other transparent materials.
Refinement ground, conductive cladding 12 is for covering copper.So, cover copper to ensure that and the first electrode 141 and the second electricity
The firm contact of pole 142, is beneficial to reduce and covers the parasitism between copper and the first electrode 141 and the second electrode 142
Resistance and electric capacity, decrease the energy loss of the conversion of high pressure when LED chip group 13 is applied simultaneously, therefore,
It is beneficial to improve the modulation bandwidth of LED chip group 13, is suitable to communication signal transmissions and illumination.Certainly, conduction
Coating 12 also can be made up of other conductive materials.
These are only preferred embodiment of the present utility model, not in order to limit this utility model, all
Any amendment, equivalent and the improvement etc. made within spirit of the present utility model and principle, all should comprise
Within protection domain of the present utility model.
Claims (10)
1. logical according to dual-purpose LED component, it is characterised in that to include substrate, be located at leading on described substrate
Electricity coating, the LED chip group being located on described conductive cladding and cover at outside described LED chip group
Clear layer, the quantity of described LED chip group is set at least one, and each described LED chip group is by least one
LED forms, and described LED is red LED, green LED, blue led or White LED, described
LED chip group also includes the first electricity being electrically connected with described LED and being connected with described conductive cladding respectively
Pole and the second electrode.
2. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that described LED bag
Include luminescent layer and reflector layer, described first electrode and described reflector layer interval and be located at the downside of described luminescent layer,
Described second electrode is located at the downside of described reflector layer；Or, described second electrode and described reflector layer interval
Being located at the downside of described luminescent layer, described first electrode is located at the downside of described reflector layer.
3. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that described LED core
The quantity of sheet group is set at least two, connected in series or in parallel between different described LED chip groups.
4. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that same described LED
In chipset, the quantity of described LED is set at least two, is connected in series between different described LED.
5. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that each described LED
The voltage of chipset is 5～48V.
6. as claimed in claim 5 logical according to dual-purpose LED component, it is characterised in that described LED core
The voltage of sheet group is 24V.
7. as claimed in claim 1 logical according to dual-purpose LED component, it is characterised in that same described LED
In chipset, the quantity of described LED is set to 6.
8. logical according to dual-purpose LED component as described in any one of claim 1～7, it is characterised in that institute
Stating substrate is ceramic wafer.
9. logical according to dual-purpose LED component as described in any one of claim 1～7, it is characterised in that institute
Stating clear layer is layer of silica gel.
10. logical according to dual-purpose LED component as described in any one of claim 1～7, it is characterised in that institute
State conductive cladding for covering copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521138622.7U CN205488122U (en) | 2015-12-31 | 2015-12-31 | Lead to and shine dual -purpose LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521138622.7U CN205488122U (en) | 2015-12-31 | 2015-12-31 | Lead to and shine dual -purpose LED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488122U true CN205488122U (en) | 2016-08-17 |
Family
ID=56662114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521138622.7U Withdrawn - After Issue CN205488122U (en) | 2015-12-31 | 2015-12-31 | Lead to and shine dual -purpose LED device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488122U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633068A (en) * | 2015-12-31 | 2016-06-01 | 深圳市瑞丰光电子股份有限公司 | Dual-purpose LED device for communication and illumination |
-
2015
- 2015-12-31 CN CN201521138622.7U patent/CN205488122U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633068A (en) * | 2015-12-31 | 2016-06-01 | 深圳市瑞丰光电子股份有限公司 | Dual-purpose LED device for communication and illumination |
| CN105633068B (en) * | 2015-12-31 | 2018-11-02 | 深圳市瑞丰光电子股份有限公司 | It is logical to shine dual-purpose LED component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101958316B (en) | LED integrated packaging power source module | |
| US20160315228A1 (en) | Light emitting device | |
| CN204361094U (en) | Light-emitting device | |
| CN100508204C (en) | AC light emitting apparatus and preparation method thereof | |
| CN201122595Y (en) | LED capable of adjusting color temperature and developing color | |
| CN109148429A (en) | Light-emitting diode encapsulation structure | |
| CN201628103U (en) | Light mixed LED module | |
| CN203784667U (en) | LED (light emitting diode) lamp | |
| CN205177876U (en) | AC flexible LED filament that gives off light | |
| CN205488122U (en) | Lead to and shine dual -purpose LED device | |
| CN102456682A (en) | LED (light emitting diode) lamp structure | |
| CN101252120A (en) | Adjustable color temperature and color development luminous diode | |
| CN105633068B (en) | It is logical to shine dual-purpose LED component | |
| CN102709280A (en) | Chip on board (COB) integrated light source module | |
| CN202178255U (en) | Light-emitting diode (LED) module and lighting device | |
| CN202423386U (en) | Light emitting diode packaging structure | |
| CN102340918A (en) | Alternating current LED (Light Emitting Diode) device | |
| CN104993035A (en) | Warm white light LED luminescent apparatus | |
| CN107731801A (en) | Flexible light-emitting diodes structure and preparation method thereof | |
| CN104832801B (en) | A kind of plastic type white light AC LED light sources and its manufacturing method | |
| CN203951640U (en) | A kind of light emitting diode drive device | |
| CN103727438A (en) | LED lamp and manufacturing method | |
| CN202796944U (en) | Light-emitting diode (LED) and lamp | |
| CN103907401A (en) | Solid state lighting apparatus and methods of forming | |
| CN207517681U (en) | Flexible light-emitting diodes structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170522 Address after: 518000, Guangdong, Shenzhen, Baoan District Xixiang street, hang Chau Hengfeng Industrial City, B15 plant, five or six floor Patentee after: Shenzhen Lingtao Photoelectric Technology Co., Ltd. Address before: 518000 Guangdong province Shenzhen Guangming New District Office of Gongming Tianliao Village tenth Industrial Zone 1 building six floor Patentee before: Shenzhen Refond Optoelectronics Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160817 Effective date of abandoning: 20181102 |
|
| AV01 | Patent right actively abandoned |