CN103907401A - Solid state lighting apparatus and methods of forming - Google Patents
Solid state lighting apparatus and methods of forming Download PDFInfo
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- CN103907401A CN103907401A CN201280044036.9A CN201280044036A CN103907401A CN 103907401 A CN103907401 A CN 103907401A CN 201280044036 A CN201280044036 A CN 201280044036A CN 103907401 A CN103907401 A CN 103907401A
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/44—Details of LED load circuits with an active control inside an LED matrix
- H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
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- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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Abstract
A solid state lighting apparatus can include a substrate having first and second opposing surfaces, wherein at least one of the opposing surfaces is configured to mount devices thereon. A string of chip-on-board light emitting diode (LED) sets, can be on the first surface of the substrate and coupled in series with one another. An AC voltage source input, from outside the solid state lighting apparatus, can be coupled to the first or second surface of the substrate.
Description
The cross reference of related application and the requirement of priority
The application requires the U.S. Provisional Patent Application No.61/581 submitting on December 30th, 2011,923 priority, and it is that the title of submitting to common 28 days July in 2011 of entrusting is the U.S. Patent Application Serial Number 13/192 of Solid State Lighting Apparatus and Methods Using Integrated Driver Circuitry, 755 (agency's reel numbers: 5308-1364), the title that on September 16th, 2011 submits to is the U.S. Patent Application Serial Number 13/235 of Solid State Lighting Apparatus and Methods Using Energy Storage, the title that 103 (agency's reel numbers: 5308-1459) and on September 16th, 2011 submit to is the U.S. Patent Application Serial Number 13/235 of Solid State Lighting Apparatus and Methods Using Current Diversion Controlled By Lighting Device Bias States, the part continuation application of 127 (agency's reel numbers: 5308-1461), require its priority relevant to it, its whole disclosures are incorporated herein by reference.
Technical field
Subject content of the present invention relates to light-emitting device and method, or rather, relates to the method for solid luminous device and formation.
Background technology
Solid luminescent array is used to many luminous application.For example, comprise that the solid luminescent panel of Sony ericsson mobile comm ab array has been used as direct lighting source, for example, in building and/or accent lighting.Sony ericsson mobile comm ab can comprise for example luminescent device of encapsulation, comprise one or more light-emitting diodes (LED), they can comprise inorganic LED, this inorganic LED can comprise the semiconductor layer that forms p-n junction, and/or organic LED (OLED), can comprise organic luminous layer.
Solid luminescent array is used to many luminous application.For example, comprise that the solid luminescent panel of Sony ericsson mobile comm ab array has been used as direct lighting source, for example, in building and/or accent lighting.Sony ericsson mobile comm ab can comprise for example luminescent device of encapsulation, comprises one or more light-emitting diodes (LED).Inorganic in typical case LED comprises the semiconductor layer that forms p-n junction.The organic LED (OLED) that comprises organic luminous layer is the Sony ericsson mobile comm ab of another kind of type.In typical case, Sony ericsson mobile comm ab by luminescent layer or region again in conjunction with electron carrier, i.e. electronics and hole and produce light.
Solid luminescent panel is often used as the backlight of small-sized liquid crystal display (LCD) screen, such as LCD display used in portable electric appts.In addition, such as LCD television indicator, solid luminescent panel is used as to the more concern that has been subjected to backlight for larger display.
Although already proved that solid state light emitter had high color rendering index (CRI) (CRI) and/or high efficiency, but in Application in Building, a problem of the such light source of wide-scale adoption is that light fixture that commercial lamps photosystem adopts has and is designed to use the AN connector that exchanges (ac) power supply, can use house phase dimmer equipment house phase.In typical case, solid state light emitter is powered by power supply changeover device or is connected with it, and power supply changeover device is converted to DC power supply AC power, and DC power supply is used to light source to supply with energy.But, use such power supply changeover device may improve the cost of light source and/or overall facility, and may lower efficiency.
Some trial of solid state light emitter power supply has been related to and used the AC wave shape driving LED of rectification or string or the group of LED.But, because LED needs certain minimum forward voltage with conducting, so LED may be only in a part of conducting of the AC wave shape of rectification, this may cause visible flicker, may reduce undesirably system power factor and/or may raising system in resistive loss.
Other that exchange the solid state light emitter power supply that drives are attempted having related to LED is placed in to inverse parallel configuration, so at the LED of every half-cycle driving half of AC wave shape.But, this mode needs the LED of twice to produce the luminous flux identical with the AC signal that uses rectification.
Summary of the invention
Solid luminous device can comprise the substrate with the first and second contrast surface, and wherein described at least one, contrast surface is configured to assembly ware thereon.The string of chip on board (COB) light-emitting diode (LED) group can be positioned on the first surface of described substrate and be one another in series.Can be couple to first surface or the second surface of described substrate from the alternating-current voltage source input of described solid luminous device outside.
In some embodiment according to the present invention, solid luminous device can comprise rectifier circuit, described rectifier circuit is assembled on the surface that is contained in the substrate in described solid luminous device, is couple to the alternating-current voltage source that is configured to provide to described substrate rectified AC voltage.Current source circuit can be assemblied on the surface of described substrate and be couple to described rectifier circuit.The string of light-emitting diode (LED) group can be assemblied on the surface of described substrate, and is one another in series and is couple to described current source circuit.Multiple current shunting circuits can be assemblied on the surface of described substrate, and wherein current shunting circuit is separately coupled to the node separately of described string, and can be configured to change and operate in response to the bias state of the group separately of described LED group.
In some embodiment according to the present invention, at least described multiple current shunting circuits comprise can be assembled in described suprabasil discrete electronic component encapsulation.In some embodiment according to the present invention, the LED in described string can be the chip on board LED assembling on the surface of described substrate.In some embodiment according to the present invention, described substrate can be flexible circuit substrate, and wherein said device may further include fin, and described fin can be assembled in the contrast surface of described substrate, and heat is couple to the string of described LED group.In some embodiment according to the present invention, described substrate can be metal base printed circuit board (MCPCB).
In some embodiment according to the present invention, solid luminous device can comprise rectifier circuit, and described rectifier circuit can be configured to be couple to AC power so that rectified AC voltage to be provided.The string that current source circuit can be couple to the LED group of described rectifier circuit and series connection can be couple to the output of described current source circuit.At least one capacitor can be couple to the output of described current source circuit.Current limiter circuit can comprise current mirror circuit, it is to be less than the electric current being produced by described current source circuit that described current mirror circuit is configured to the current limit of organizing through LED described at least one, and in response to the rectified AC voltage of input that is applied to described current source circuit, make described at least one capacitor optionally via described current source circuit charging with via LED group electric discharge described at least one.Multiple current shunting circuits can be couple to the node separately between LED in described string, and are configured to change and optionally enable and forbid in response to the bias state of LED group described in the changes in amplitude along with described rectified AC voltage.
In some embodiment according to the present invention, the each of described multiple current shunting circuits can both comprise transistor, it can provide the controlled current path between the first node of described string and the terminal of described rectifier circuit and be couple to the Section Point of described string and the shut-off circuit of described transistorized control terminal, and can be configured to control in response to control inputs described current path.
In some embodiment according to the present invention, described device can also comprise the substrate with the first and second contrast surface, and wherein at least string, described multiple current shunting circuits, described rectifier circuit and the described current source circuit of the LED of series connection group are assembled in described substrate.In some embodiment according to the present invention, the LED in described string can be the chip on board LED assembling in described substrate.
In some embodiment according to the present invention, described substrate can be flexible PCB, and wherein said device can further comprise fin, and described fin can and closely be assemblied in described substrate with the string opposition of described LED group.In some embodiment according to the present invention, described substrate can be metal base printed circuit board (MCPCB).
In some embodiment according to the present invention, the method that forms solid luminescent circuit can be by being placed in multiple chip on board light-emitting diodes (LED) on substrate surface and providing with string configuration.Sealant material can be applied on described multiple chip on board LED and described sealant material can be formed as covering the layer of described multiple chip on board LED, thinks that described multiple chip on board LED provides lens.
In some embodiment according to the present invention, described method can also comprise multiple current shunting circuits, comprises discrete electronic component encapsulation, is placed on the surface of described substrate.In some embodiment according to the present invention, can provide and apply sealant material to cover surface part between described multiple chip on board LED and described multiple chip on board LED several by applying sealant material.
In some embodiment according to the present invention, by mold is contacted with described sealant material, to form the layer that covers described multiple chip on board LED simultaneously, think that described multiple chip on board LED provides described lens, can provide described sealant material is formed to layer, wherein said mold comprises chip on board LED recess, and this recess is arranged in the surface of the described mold opposing with described multiple chip on board LED.
In some embodiment according to the present invention, before described method can further be included in and apply sealant material, multiple current shunting circuits, comprise discrete electronic component encapsulation, be placed on the surface of described substrate.Wherein said mold further comprises discrete electronic component encapsulation recess, and this recess is arranged in the surface of the described mold opposing with described lip-deep described multiple current shunting circuits.In some embodiment according to the present invention, upper by described sealant material being assigned to dividually to described multiple chip on board LED, can provide and apply sealant material.
In some embodiment according to the present invention, upper by described sealant material is assigned to described multiple chip on board LED simultaneously, can provide and apply sealant material.In some embodiment according to the present invention, described sealant material is formed as covering to the layer of described multiple chip on board LED, think that described multiple chip on board LED provides lens, can provide by each the mobile sealant barrier separately that provides that leaves described multiple chip on board LED to applying described sealant material during sealant material.
In some embodiment according to the present invention, described sealant barrier surrounds at least in part described LED and is configured to reduce described sealant material during applying sealant material and leaves flowing of described LED, to promote described lens to form.In some embodiment according to the present invention, described method can further comprise from described lens removes described sealant barrier.
In some embodiment according to the present invention, printed circuit board (PCB) (PCB) can comprise the substrate that is configured to comprise solid luminous device, wherein said substrate can have the first and second contrast surface, wherein at least one contrast surface is configured to assemble multiple chip on board light-emitting diodes (LED) thereon, and described substrate is configured to be couple to the alternating-current voltage source input from described solid luminous device outside, and be configured to assemble multiple discrete electric diverting flow circuit devcies thereon, described current shunting circuit device is couple to the node separately between several LED and is configured in response to changing and optionally enable and forbid along with offering the bias state of LED group described in the changes in amplitude of rectified AC voltage of described LED.
In some embodiment according to the present invention, described substrate can be Metal Substrate PCB.In some embodiment according to the present invention, described first surface can be order wire circuit patterned layer and described second surface can be the foundation metal layer that thickness is greater than described order wire circuit patterned layer, and wherein said PCB can further be included in the insulating barrier between described order wire circuit patterned layer and described foundation metal layer.In some embodiment according to the present invention, described substrate can be flexible PCB.
In some embodiment according to the present invention, described PCB can further be included in described substrate, be positioned at its on to assemble the heat conduction filler rod of the ad-hoc location of the position opposition of the string of described chip on board LED group.In some embodiment according to the present invention, described PCB can further comprise sealant barrier, described sealant barrier protrudes from described surface, surround at least in part the position that will assemble LED described at least one on described surface, be configured to reduce described sealant material during applying sealant material and leave flowing of described LED, to promote the formation of the above lens of LED described at least one.
Accompanying drawing explanation
Fig. 1 is schematic block diagram, has shown the solid luminous device that comprises light-emitting diode (LED) drive circuit and LED serializer circuit at some embodiment according to the present invention;
Fig. 2 is schematic block diagram, has shown at some embodiment according to the present invention and has comprised rectifier circuit as shown in Figure 1 and current shunting circuit and the LED drive circuit of the LED serializer circuit that is attached thereto;
Fig. 3 is schematic block diagram, has shown Fig. 1 in some embodiment according to the present invention and the LED drive circuit shown in Fig. 2, further comprises the current limiter circuit and the capacitor that are couple to LED serializer circuit;
Fig. 4 A is the plane graph of the exemplary electrical circuit substrate in some embodiment according to the present invention, comprises suprabasil rectifier circuit in solid luminous device, LED serializer circuit and other discrete electronic component encapsulation;
Fig. 4 B is in some embodiment according to the present invention, the profile of the exemplary electrical circuit substrate shown in Fig. 4 A;
Fig. 4 C is the alternative profile that the LED serializer circuit part of Fig. 4 A in some embodiment according to the present invention and the exemplary electrical circuit substrate shown in Fig. 4 B comprises flexible circuit substrate;
Fig. 4 D is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of near symmetrical form factor;
Fig. 4 E is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of near symmetrical form factor;
Fig. 5 A is plane graph, has shown at some embodiment according to the present invention and has comprised rectifier circuit and be couple to the exemplary electrical circuit substrate of LED serializer circuit of capacitor;
Fig. 5 B is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor;
Fig. 5 C is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor;
Fig. 5 D is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor;
Fig. 5 E is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor;
Fig. 5 F is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor;
Fig. 6 to Fig. 9 is profile, has shown in some embodiment according to the present invention, uses mold to comprise the method that forms solid-state device in the circuit substrate of chip on board LED of assembling thereon;
Figure 10 to Figure 12 is profile, has shown in some embodiment according to the present invention, uses sealant barrier to form the method for the solid luminous device that comprises chip on board LED in circuit substrate;
Figure 13 A is circuit theory diagrams, has shown in some embodiment according to the present invention, is couple to the LED drive circuit of LED serializer circuit;
Figure 13 B to Figure 13 D is circuit theory diagrams, has shown the current shunting circuit in some embodiment according to the present invention;
Figure 13 E is circuit theory diagrams, has shown in some embodiment according to the present invention, is couple to the LED drive circuit of LED serializer circuit;
Figure 14 is form, has shown the performance data of the demonstration solid luminous device in some embodiment according to the present invention;
Figure 15 is form, has shown the performance data of the demonstration solid luminous device in some embodiment according to the present invention;
Figure 16 is in some embodiment according to the present invention, the demonstration solid luminous device holding in lighting.
Embodiment
Hereinafter more fully describe the embodiment of present theme of the present invention with reference to accompanying drawing, in accompanying drawing, shown the embodiment of theme of the present invention.But, theme of the present invention can be with much multi-form enforcement, so should not be interpreted as being limited to these embodiment that set forth herein.On the contrary, it is in order to make the disclosure by thorough and complete that these embodiment are provided, and the scope of theme of the present invention is conveyed to those skilled in the art all sidedly.Similar Reference numeral refers to similar element from start to finish.
Phrase used herein " light-emitting device " is not limited to just indicate this device can be luminous.Namely, light-emitting device can be the device in certain region of illumination or space, as building, swimming pool or bath center, room, warehouse, indicating device, road, parking lot, vehicle, mark is as road sign, billboard, boats and ships, toy, mirror, container, electronic device, ship, aircraft, stadium, computer, remote audio equipment, long-distance video equipment, cell phone, tree, window, LCD display, cave dwelling, tunnel, courtyard, device or the device array of lamppost or illumination enclosure wall, or for the device of side light or back lighting (as placard backlight, mark, LCD display), replacing bulb is (as for replacing interchange incandescent lamp, low voltage lamps, fluorescent lamp etc.), for the lamp of outdoor lighting, for the lamp of emergency lighting, for lamp (the wall formula installation of the outer illumination of house, roofbolt/column is installed), suspended ceiling lamp/sconce, under closet, throw light on, electric light (floor and/or desk and/or desk), Landscape Lighting, guide rail illumination, operation illumination, special illumination, Lamp with ceiling fan, archive office/artistic display lighting, high vibration/shock illumination, work light etc., the illumination of mirror/dressing table and any other light-emitting device.
Theme of the present invention further relates to the enclosure wall (its space can be illuminated equably or anisotropically) being illuminated, comprise enclosure space and at least one light-emitting device according to the inventive subject matter, wherein this light-emitting device (equably or anisotropically) has illuminated at least a portion of this enclosure space.
Fig. 1 is schematic block diagram, has shown the solid luminous device 101 in some embodiment according to the present invention.According to Fig. 1, solid luminous device 101 comprises light-emitting diode (LED) drive circuit 105, is coupled to LED serializer circuit 110, and these two is all assemblied on the surface of substrate 100.LED drive circuit 105 is couple to can provide electric current and voltage to LED serializer circuit 110 and device 101 other circuit that comprise, so that from the luminous alternating voltage of solid luminous device 101.
Will be appreciated that, the embodiment showing herein can (from external power source) directly applies alternating voltage and without comprising " plate " switch mode to device 101.In some embodiment according to the present invention, LED drive circuit 105 can change into LED serializer circuit 110 alternating voltage after rectification is provided, and provides acceptable light according to the ac voltage signal directly providing to solid luminous device 101 from this device.Be further appreciated that according to solid luminous device 101 of the present invention and can in any type of lighting, use, such as the displaying in Figure 16.
It is also understood that in some embodiment according to the present invention, LED serializer circuit 110 can utilize the LED device of encapsulation to replace COB LED.For example, in some embodiment according to the present invention, LED serializer circuit 110 can comprise the XML-HV LED that the Cree company of North Carolina state Durham produces.
So device 101 can be taked the form of relative small form factor circuit board, it is directly coupled to ac voltage signal and provides the ac voltage signal after rectification to serializer circuit 110, and does not use the power supply of switch mode on plate.In addition, serializer circuit 110 can be made up of the COB LED on circuit board or LED device.
Be to be understood that, term used herein " assembling " comprises that handle component (such as chip on board LED) is physically connected to substrate 100 and there is no to use such as the U.S. Patent Application Serial Number 13/192 of above referenced common trust the reel number 5308-1364 of 755(agency) in describe those between two parties time peace tear the configuration on base station, substrate, carrier or other surfaces open.So being described to " assembling " can be on the same surface in substrate at suprabasil assembly, also can be in the contrast surface of same substrate.For example, can be described to " assembling " in this substrate being placed in and being welded on same suprabasil assembly between erecting stage.
Should be appreciated that ac voltage signal can have any amplitude that is enough to running gear 101 in some embodiment according to the present invention.For example, in some embodiment according to the present invention, ac voltage signal can be 90 volts of interchanges, 110 volts of interchanges, 220 volts of interchanges, 230 volts of interchanges, 277 volts of interchanges or any intermediate voltage.In some embodiment according to the present invention, ac voltage signal provides from single phase alternating current (A.C.) voltage signal.But, in some embodiment according to the present invention, ac voltage signal can provide via the voltage signal of two lead-in wires from three-phase alternating voltage signal.So ac voltage signal can provide from more high-tension ac voltage signal, and and phase-independent.For example, in some embodiment according to the present invention, ac voltage signal can provide from the AC signal of 600 volts of three-phases.In further embodiment according to the present invention, ac voltage signal can be relative low voltage signal, such as 12 volts of interchanges.
Fig. 2 is schematic block diagram, has shown in some embodiment according to the present invention solid luminous device 101 shown in Fig. 1.According to Fig. 2, LED drive circuit 105 comprises rectifier circuit 205, is couple to current shunting circuit 210 and LED serializer circuit 110, and the latter comprises the multiple LED string groups that are one another in series and couple.As what further show in Fig. 2, current shunting circuit 210 is couple to the selected node between some LED groups in string 110.
These bias states that LED organizes separately that current shunting circuit 210 can be configured to 210 cross-over connections of response current shunt circuit change and operate.So in some embodiment according to the present invention, the LED group in string can respond the bias state of device in group and is incrementally activated and stops using.For example, while applying rectified AC voltage to LED serializer circuit 110, the forward bias that some circuit of current shunting circuit can respond LED group is activated and stops using.Current shunting circuit can comprise some transistors, around the some LED groups between the selected node that these transistors are configured to couple at current shunting circuit 210, provides separately controlled current distributing path.Biasing that these transistors can be organized by LED changes opening/closing, and LED group can be used for affecting this these transistorized biasing.For example, at common issued for approval U.S. Patent Application Serial Number 13/235 of entrusting, the reel number 5308-1461 of 127(agency) in further described the current shunting circuit together with the operation of LED string group.
Further show as Fig. 2, rectifier circuit 205, current shunting circuit 210 and LED serializer circuit 110 can be assembled in substrate 100, and each that makes these assemblies is provided on the single surface of substrate 100.According to other embodiments of the invention, some circuit described herein is assembled on the first surface of substrate 100, and remaining circuit is assembled in the opposite of substrate 100.But, in some embodiment according to the present invention, circuit described herein is assembled in substrate 100, and does not use substrate between two parties, inferior peace to tear base station, carrier open or be sometimes used to provide the surface of the other types of the lamination fitting-type in conventional structure.
In some embodiment according to the present invention, in the assembly of describing with reference to figure 2, at least some can be assembled in substrate 100, encapsulates as discrete electronic component.Further again, in some embodiment according to the present invention, some remaining circuit of describing with reference to figure 2 can be integrated among the single IC for both encapsulation of assembling in substrate 100.
Still with reference to figure 2, build and operation demonstration solid luminous device 101 according to the parameter of showing in Figure 14 form.Exactly, device 101 has utilized and has been couple to as shown in figure 13 the current shunting circuit of serializer circuit 110, and does not use the current limiter circuit shown in Figure 13 and capacitor.This device comprises the COB LED that 12 high voltages 16 are tied, and each size is approximately 1.4mm × 1.4mm × .170mm.Data in the form of Figure 14 demonstrate, exemplary electrical circuit plate is in the efficiency from about 71Lm/W to about 79Lm/W (lumen per watt) scope, lumen (Lm) from about 704Lm to about 816Lm scope is provided, acceptable color dot and relative high power factor are provided.But should be appreciated that in some embodiment according to the present invention, by for example increasing COB LED quantity on circuit board or by improving for driving the current level of COB LED, can realizing higher output.
Fig. 3 is schematic block diagram, show solid luminous device 101, comprise that LED drive circuit 105(comprises rectifier circuit 205 and current shunting circuit 210), described LED drive circuit 105 is couple to the current limiter circuit in parallel with capacitor 310 305, the two is all connected with LED serializer circuit 110, and they can both be assemblied on the surface of substrate 100.
Should be appreciated that and can use current limiter circuit 305 and capacitor 310 to reduce flicker, not so talk about, may produce flicker by the alternating voltage providing to solid luminous device 101.For example, capacitor 310 can approach the energy of crest voltage for storage, and the forward that is less than LED in string 110 when alternating voltage amplitude is while configuring needed voltage, uses the energy drives LED of storage to go here and there 110.Further again, current limiter circuit 305 can be configured to electric current to guide to capacitor 310, energy is stored in wherein or is configured to through LED string 110 charge discharges that make in capacitor 310.
Although Fig. 3 demonstrates capacitor 310 for storage and transferring energy, should be appreciated that any type electron energy memory device can both as the alternative of capacitor 310 or with its combination, such as inductor.Should be appreciated that for example at common issued for approval U.S. Patent Application Serial Number 13/235 of entrusting, the reel number 5308-1459 of 103(agency) in, further describe the use of current limiter circuit together with LED serializer circuit.
In some embodiment according to the present invention, the assembly shown in Fig. 3 can be assembled on the same surface of substrate 100.According to other embodiments of the invention, some of circuit shown in Fig. 3 can be assembled on the first surface of substrate 100, and remaining circuit be assembled in substrate 100 second, in contrast surface.In some embodiment according to the present invention, the LED comprising at LED serializer circuit 110 can be chip on board LED, they can be assembled on arbitrary surface of substrate 100 or in time peace that is couple to substrate 100 and tear open in base station or other substrates, as for example at common issued for approval U.S. Patent Application Serial Number 13/192 of entrusting, the reel number 5308-1364 of 755(agency) in description.
Still with reference to figure 3, for the data construct of showing in the form of Figure 15 is provided demonstration solid luminous device 101.Exactly, device 101 has utilized the current shunting circuit that is couple to as shown in figure 13 serializer circuit 110, uses together the current limiter circuit shown in Figure 13 and capacitor.This device comprises the COB LED that 12 high voltages 16 are tied, and each size is approximately 1.4mm × 1.4mm × .170mm.Data in the form of Figure 14 demonstrate, and exemplary electrical circuit plate, in the efficiency range from about 69Lm/W to about 74Lm/W, provides the scope of the Lm from about 674Lm to about 785Lm, and acceptable color dot and relative high power factor are provided.But should be appreciated that in some embodiment according to the present invention, by for example increasing COB LED quantity on circuit board or by improving for driving the current level of COB LED, can realizing higher output.
Fig. 4 A is plane graph, has shown the solid luminous device 101 that comprises substrate 100 at some embodiment according to the present invention, and described substrate comprises LED drive circuit 105 and the LED serializer circuit 110 of assembling in its surface.Fig. 4 B is the profile of a part for solid luminous device 101 shown in Fig. 4 A in some embodiment according to the present invention.Fig. 4 C is in some embodiment according to the present invention, the alternative profile of a part for solid luminous device 101, and wherein substrate 100 comprises embedding heat conduction filler rod 417 wherein, opposes with LED serializer circuit 110.
According to Fig. 4 A, in some embodiment according to the present invention, substrate 100 can be printed circuit board (PCB) (PCB).PCB can be formed by many different materials, can be arranged as desired electric insulation and high heat conductivity are provided.In certain embodiments, PCB can comprise that insulator is to provide desired electric insulation at least in part.According to other embodiments of the invention, PCB can comprise that ceramic material is such as aluminium oxide, aluminium nitride, carborundum or polymeric material are such as polyimides and polyester etc.
For the circuit board of making such as polyimides and polyester material, these circuit boards can be flexible (being sometimes referred to as flexible printed circuit board).This can allow circuit board to take on-plane surface or curved shape, and LED chip is also arranged with on-plane surface form.In some embodiment according to the present invention, circuit board can be that flexible printed substrates is such as Du Pont produces
polyimides.In some embodiment according to the present invention, circuit board can be the FR-4PCB of standard.
This can contribute to provide the circuit board of different luminous patterns, and molded non-planar allows the still less luminous pattern of directivity.In some embodiment according to the present invention, this layout can allow that more omnidirectional is luminous, such as the lighting angle with 0-180 °.In some embodiment according to the present invention, PCB can comprise the material that reflective is strong, such as reflecting ceramic or metal level are as silver, obtains light to strengthen from assembly.
In certain embodiments, PCB can comprise that insulating barrier 50, so that electric insulation to be provided, also comprises electric neutral material simultaneously, so that good heat conductivity to be provided.Different insulating material can be used for insulating barrier, comprise epoxy radicals insulator, include the heat conducting material of different electric neutrality.Many different materials be can use, aluminium oxide, aluminium nitride (AlN) boron nitride, diamond etc. included but not limited to.According to the present invention, different insulative layer can provide the electric insulation of different brackets, and the electric insulation that some embodiment provides punctures in the scope of 100 to 5000 volts.In certain embodiments, insulating barrier can provide the electric insulation within the scope of 1000 to 3000 volts.In other embodiments, insulating barrier can provide approximate 2000 to ambush the electric insulation of wearing.In some embodiment according to the present invention, insulating barrier can provide the heat conductivity of different brackets, and some has the heat conductivity in the scope of 1-40w/m/k.In certain embodiments, insulating barrier can have the heat conductivity that is greater than 10w/m/k.In other embodiments, insulating barrier can have the heat conductivity of approximate 3.5w/m/k.
Insulating barrier can have much different thickness so that desired electric insulation and heat conductivity feature to be provided, such as 10 to 100 microns (in μ scope m).In other embodiments, insulating barrier can have the m) thickness in scope at 20 to 50(μ.In other embodiments, insulating barrier can have approximate 35(μ thickness m).
In some embodiment according to the present invention, substrate 100 can be Metal Substrate PCB, " Thermal-Clad " (T-Clad) the dielectric base material of producing such as the Bergquist company of Minnesota State Chanhassen." Thermal-Clad " substrate can reduce thermal impedance heat by conduction more efficiently than the circuit board of standard.MCPCB can also comprise substrate on insulating barrier, opposes, and can comprise that heat conducting material helps thermal diffusion with LED serializer circuit 110.Substrate can comprise that different materials is such as copper, aluminium or aluminium nitride.Substrate can have different thickness, and such as in the scope of 100 to 2000 μ m, and other embodiment can have the thickness within the scope of 200 to 1000 μ m.Some embodiment can have the thickness of approximate 500 μ m.
With thick film ceramic with directly cover copper arrange compare, such substrate can mechanically robust.So the heat that metal base printed circuit board can produce the LED being comprised by LED serializer circuit 110 effectively passes out from solid luminous device 101.But, should be appreciated that substrate 100 can be to be suitable for LED drive circuit 105 and LED serializer circuit 110 to assemble any material on it, it provides from LED serializer circuit 110 carries out heat conduction fully.
In certain embodiments, MCPCB is included in the scolder assembly layer on the bottom surface of substrate, makes material and makes it be suitable for being directly assembled to fin, such as passing through solder reflow.These materials can comprise that one or more layers different metal is such as nickel, silver, gold, palladium.In certain embodiments, assembly layer can comprise nickel and silver layer, such as the silver within the scope of the nickel and 0.1 to the 1.0 μ m that have within the scope of thickness 2 to 3 μ m.In certain embodiments, assembly layer can comprise the soak gold of other laminations such as the electroless nickel plating of approximate 5 μ m, the electroless palladium plating that is similar to 0.25 μ m and approximate 0.15 μ m.MCPCB is welded direct to fin and can strengthens the thermal diffusion from circuit board to fin by the thermocontact area increasing between the two.This can both improve for vertical and the hot transmission of level.In some embodiment according to the present invention, MCPCB can utilize the performance to back side knot of approximate 0.4 ℃/W that the hot feature of different brackets is provided.
The size of substrate 100 can depend on different factors, changes such as the size of chip on board LED of assembling on it and quantity.For example in certain embodiments, substrate can be approximately 33mm for every limit.In some embodiment according to the present invention, in substrate, assembly can present the height of about 2.5mm.Also can use other sizes for substrate 100.
Should be appreciated that substrate 100 can be combined with being assembled to or integrating with intrabasement fin separately, carry out heat conduction fully to provide from solid luminous device 101, as shown in Figure 4 C.In some embodiment according to the present invention, can use flexible thermal conduction band, the GRAFIHX producing such as the GraphTech international corporation of Ohio Lakewood
tM, fin is couple to substrate 100.Fin can be any high-efficiency heat conduction material that makes substrate 100 abundant heat conduction.For example, fin can be metal, such as aluminium.In some embodiment according to the present invention, fin is graphite.In some embodiment according to the present invention, fin comprises and improves the reflecting surface that light obtains.
Further show as Fig. 4 A, solid luminous device 101 comprises in its surface the LED drive circuit 105 of assembling, is sometimes referred to as COB LED array together with the multiple chip on board LED(that are arranged as the multiple LED groups that couple of being one another in series for LED serializer circuit 110 is provided).In some embodiment according to the present invention, the COB LED of string 110 can arrange according to the specific pattern of the approximate center in substrate 100.But, should be appreciated that COB LED can arrange in any mode that is suitable for providing desired light to export from solid luminous device 101, for example, COB LED can arrange with sub-circular array, rectangular array, random array or half random array.In some embodiment according to the present invention, COB LED can be assembled in the substrate 100 of single circuit, has reduced the dead space between COB LED, and this can reduce the size of solid luminous device 101 or install the size of distributing to substrate 100 in 101.
In COB implements, microchip or crystal block be such as LED is mounted to its final circuit substrate electric interconnection with it, rather than through traditional assembling or be encapsulated as single led encapsulation or integrated circuit.Use COB when assembling to eliminate the encapsulation of conventional device, can simplified design and the whole technique of manufacture, can reduce space requirement, can reduce costs and can improve performance as the result of shorter interconnection path.COB technique can comprise three key steps: 1) LED crystal block connects or crystal block assembling; 2) wire bonds; And 3) encapsulation crystal block and lead-in wire.These COB layouts can also provide more advantages, allow directly assemble and with main device radiation sheet interface.
In some embodiment LED array embodiment, the each chip in array can both have thereon oneself lens that form, and the light when promoting first pass obtains and launches.The light of first pass obtains/launches the light referring to from specific LED chip transmitting and passes through lens separately, and the first pass of light from LED chip to main lens surface.That is to say, light is not reflected back, and such as by total internal reflection (TIR), wherein some light may be absorbed.This first transmitting can strengthen by reducing the absorbed LED light of possibility the luminous efficiency of LED assembly.Some embodiment can comprise that highdensity luminescence component makes light obtain maximization simultaneously, and this can improve the efficiency of solid luminous device separately.Some embodiment according to the present invention can be arranged in the LED chip subgroup in array, and each subgroup has its oneself main lens and obtains for improvement of light.In certain embodiments, lens can be hemispheres, and this can obtain by providing the photoemissive lens face of promotion first pass further to increase light.
In some embodiment according to the present invention, LED array can comprise the LED chip (as redness, green and blue led chip or subgroup, White LED and red LED chips or subgroup etc.) of transmitting same color or different colours light.Developed from multiple discrete light sources and produced white light so that the technology at the expectation CRI of expectation colour temperature to be provided, their utilize the different tones from different discrete light sources.Such technology is to describe in the U.S. Patent No. 7,213,940 of " Lighting Device and Lighting Method " at title, and its content is incorporated herein by reference.
In certain embodiments, except main lens or optics, can also use Secondary lens or optics, have the larger secondary optics of the luminescent device of primary optics as covered multi-group.According to the embodiment of the present invention, utilize to there is its oneself main lens or each luminescent device or the luminescent device group of optics can represent larger scalability so that the LED of larger array to be more easily provided.In some embodiment according to the present invention, LED serializer circuit 110 can comprise a hundreds of COB LED.
In certain embodiments, LED array can be the COB that is assembled to substrate 100, and the feature having provides improved operation.Substrate 100 can provide electric insulation feature, allows COB LED to realize the electric insulation of circuit board level.Circuit board can have some character simultaneously, provides from the High Efficiency Thermal path of COB LED heat radiation.The high efficiency and heat radiation of COB LED can cause the reliability of LED chip and the improvement of colour consistency.Substrate 100 can also be arranged as and allow to assemble efficiently main fin.In some embodiment according to the present invention, the feature that substrate 100 comprises allows to use machine tool that it easily and is efficiently assembled to fin.In other embodiments, circuit board can comprise and allow it efficiently and to be reliably welded to fin, such as through reflux technique, material.
The present invention can provide scalable LED array layout, some embodiment can be had few to three luminescent devices, and other may have nearly tens or a hundreds of luminescent device.
Should further understand, some assembly in LED drive circuit 105 can be the discrete electronic component encapsulation of assembling in substrate 100, so that the multiple current shunting circuits that for example assemble on substrate 100 surfaces to be provided.Should further understand, can in substrate 100, provide other electronic package, so that the remaining circuit comprising at solid luminous device 101 to be provided.
According to Fig. 4 B, substrate 100 can be Metal Substrate multi-layer PCB, comprises for the interactional upper metal level between the substrate 100 upper electronic package in surface is provided.Lower metal (or base) layer 415 can be used in to impel from LED serializer circuit 110 and transmits heat, and compare with upper metal level 405 can be relative thick.By heat conduction insulating barrier 410 separately, this heat conduction insulating barrier 410 can make metal level 405 and lower metal layer 415 electric insulations that the heat passage from LED serializer circuit 110 to lower metal layer 415 is still provided simultaneously for upper metal level 405 and lower metal layer 415.
So lower metal layer 415 can provide the fin dispelling the heat from LED serializer circuit 110.Further in embodiment, secondary heat spreader can being attached to the lower surface of lower metal layer 415, so that the supplementary heat transfer from LED serializer circuit 110 to be provided according to the present invention.
In some embodiment according to the present invention, lower metal layer 415 can be the metal such as aluminium, copper or beryllium oxide.In some embodiment according to the present invention, heat conduction insulating barrier 410 can be as welding medium and heat conducting heat passage, and the filling substrate synthetic of the insulating barrier between metal level 405 and lower metal layer 415 is provided.In some embodiment according to the present invention, the pyroconductivity of heat conduction insulating barrier 410 can be greater than about 4 times to about 16 times of conventional FR4 insulator.
Although Fig. 4 B has shown individual layer (going up) metal level 405, also can provide according to other embodiments of the invention, wherein additional signal layer is provided as a part of Metal Substrate PCB.For example,, in some embodiment according to the present invention, within affix metal level 405 can be provided in thicker heat conduction insulating barrier 410, so that two layers or more multi-layered many base printed circuit boards in some embodiment according to the present invention to be provided.According to the present invention further in embodiment, additional heat conduction insulating barrier can be provided in lower metal layer 415 belows, makes lower metal layer 415 within metal base printed circuit board, rather than on the surface of its exposure.
According to Fig. 4 C, provide flexible printed circuit board as LED serializer circuit 110 being assembled to the substrate 100 on it.Heat conduction filler rod 417 approaches LED serializer circuit 110 within can being embedded in substrate 100, dispels the heat to provide from LED serializer circuit 110.In some embodiment according to the present invention, heat conduction filler rod 417 can be the metal such as copper, aluminium or beryllium oxide.Also can use other heat conducting materials.
Fig. 4 D is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of near symmetrical form factor.According to Fig. 4 D, on the core 460 of substrate 100, assemble the part of six LED(as serializer circuit 110), in substrate 100, approach outer rim place and assembled alternating-current voltage source input J1.As shown in Figure 4 D, according to exporting from installing 101 expectation light, LED adopts the first layout in core 460.In some embodiment according to the present invention, reserve part 465 by substrate 100 separates multiple LED with all the other electronic building bricks that are assembled to substrate 100, wherein other electronic building bricks are only assembled between the reserve part 465 and neighboring 470 of the substrate 100 in substrate 100.In some embodiment according to the present invention, other electronic building bricks are assembled in reserve part 465.
Still with reference to figure 4D, built according to example embodiment of the present invention, wherein the substrate 100 center that is centered close to of LED in core 460.Six XTE-HV LED that shown device uses the Cree company of North Carolina state Durham to produce, produce about 2000 lumens at about 85 degrees Celsius.The about 21mm of diameter of the core 460 and size of whole plate is approximately 54mm × 60mm.The size of reserve part 465 has again 9.5mm outside core 460.The gross power providing to this device is about 31.4W, and wherein approximately 20.6W is consumed by LED, and the total power consumption of device 101 is 25.2W.
Fig. 4 E is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of another near symmetrical form factor.According to Fig. 4 E, on the core 460 of substrate 100, assemble the part of five LED(as serializer circuit 110), in substrate 100, approach outer rim place and assembled alternating-current voltage source input J1.As shown in Figure 4 E, according to exporting from installing 101 expectation light, LED adopts the second layout in core 460.In some embodiment according to the present invention, reserve part 465 by substrate 100 separates multiple LED with all the other electronic building bricks that are assembled to substrate 100, wherein other electronic building bricks are only assembled between the reserve part 465 and neighboring 470 of the substrate 100 in substrate 100.In some embodiment according to the present invention, other electronic building bricks are assembled in reserve part 465.
Still with reference to figure 4E, built according to example embodiment of the present invention, wherein the substrate 100 center that is centered close to of LED in core 460.Five XTE-HV LED that shown device uses the Cree company of North Carolina state Durham to produce, produce about 800 lumens at about 85 degrees Celsius.The about 16.1mm of diameter of the core 460 and size of whole plate is approximately 54mm × 54mm.The size of reserve part 465 has again 9.5mm outside core 460.The gross power providing to this device is about 13.9W, and wherein approximately 9.5W is consumed by COB LED, and the total power consumption of device 101 is 11.5W.
Fig. 5 A is plane graph, has shown the solid luminous device 101 in some embodiment according to the present invention, is included in LED serializer circuit 110 and the LED drive circuit 105 of assembling in substrate 100 and comprises capacitor.Should be appreciated that the LED drive circuit 105 shown in Fig. 5 can also comprise multiple shunt circuit described herein, and the current limiter circuit 305 of working together with capacitor 310, so that the operation of LED serializer circuit 110 described herein to be provided.Should further understand, capacitor 310 can be assemblied in substrate profile to reduce capacitor 310 may be incorporated into the possibility among the light that solid luminous device 101 sent shade.So capacitor 310 can be positioned near the neighboring of substrate 100.
The size of substrate 100 can depend on different factors, changes such as the size of chip on board of assembling on it and quantity.For example, in certain embodiments, substrate can be the rectangle of approximate 33mm × 46mm.In some embodiment according to the present invention, the height that in substrate, assembly can present approximates greatly the height of capacitor 310.In some embodiment according to the present invention, the height that in substrate, assembly can present approximates greatly 13.5mm.Also can use other sizes for substrate 100.
Fig. 5 B is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor.According to Fig. 5 B, on the lateral parts 560 of substrate 100, assemble the part of six LED(as serializer circuit 110).Just as shown in Figure 5 B, according to from installing the output of 101 expectation light, LED adopts the first layout in lateral parts 560, and in substrate 100, approaches outer rim place and assembled alternating-current voltage source input J1.In some embodiment according to the present invention, reserve part 565 by substrate 100 separates multiple LED with all the other electronic building bricks that are assembled to substrate 100, wherein other electronic building bricks are only assembled between the reserve part 565 and neighboring 570 of the substrate 100 in substrate 100.In some embodiment according to the present invention, other electronic building bricks are assembled in reserve part 565.
Still with reference to figure 5B, built according to example embodiment of the present invention, wherein in core 560 LED be centered close to top and the about 17.5mm of bottom margin from substrate 100, from the about 15.2mm of right hand edge.Six XTE-HV LED that shown device uses the Cree company of North Carolina state Durham to produce, produce about 2000 lumens at about 85 degrees Celsius.The about 21mm of diameter of the core 560 and size of whole plate is approximately 71.3mm × 35mm.The size of reserve part 565 has again 9.5mm outside core 560.The gross power providing to this device is about 31.4W, and wherein approximately 20.6W is consumed by LED, and the total power consumption of device 101 is 25.2W.
Fig. 5 C is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor.According to Fig. 5 C, on the lateral parts 560 of substrate 100, assemble the part of five LED(as serializer circuit 110).Just as shown in Figure 5 C, according to from installing the output of 101 expectation light, LED adopts the second layout in lateral parts 560, and in substrate 100, approaches outer rim place and assembled alternating-current voltage source input J1.In some embodiment according to the present invention, reserve part 565 by substrate 100 separates LED with all the other electronic building bricks that are assembled to substrate 100, wherein other electronic building bricks are only assembled between the reserve part 565 and neighboring 570 of the substrate 100 in substrate 100.In some embodiment according to the present invention, other electronic building bricks are assembled in reserve part 565.
Still with reference to figure 5C, built according to example embodiment of the present invention, wherein in core 560 LED be centered close to top and the about 16.2mm of bottom margin from substrate 100, from the about 12.827mm of right hand edge.Five XTE-HV LED that shown device uses the Cree company of North Carolina state Durham to produce, produce about 800 lumens at about 85 degrees Celsius.The about 16.1mm of diameter of the core 560 and size of whole plate is approximately 66.875mm × 32.4mm.The size of reserve part 565 has again 9.5mm outside core 560.The gross power providing to this device is about 13.9W, and wherein approximately 9.5W is consumed by LED, and the total power consumption of device 101 is 11.5W.
Fig. 5 D is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor.According to Fig. 5 D, on the lateral parts 560 of substrate 100, assemble single led (as a part for serializer circuit 110).According to from installing the output of 101 expectation light, single led being disposed in lateral parts 560, and in substrate 100, approach outer rim place and assembled alternating-current voltage source input J1.In some embodiment according to the present invention, reserve part 565 by substrate 100 separates LED with all the other electronic building bricks that are assembled to substrate 100, wherein other electronic building bricks are only assembled between the reserve part 565 and neighboring 570 of the substrate 100 in substrate 100.In some embodiment according to the present invention, other electronic building bricks are assembled in reserve part 565.
Consider the above description with reference to figure 4 to Fig. 5, should be appreciated that in some embodiment according to the present invention, by change LED(or according to the COB LED of specific embodiment) quantity, type and layout the light output of wide region can be provided.For example, use the electric current of 4 XTE-HVLED(and driving LED) can provide other embodiment to produce 600 lumens.In some embodiment according to the present invention, use 3 XTE-HV LED can produce 1000 lumens.Other combinations of the quantity of lumen and COB LED and type also can be for providing according to embodiments of the invention.
So, can provide relatively little substrate according to embodiments of the invention, they do not comprise the power supply of switch mode on plate, but launch the light of relative high brightness.For example, in some embodiment according to the present invention, substrate can occupy about 3240mm
2or less area is launched at least 2000 lumens simultaneously.In addition, in some embodiment according to the present invention, by LED(or COB LED) utilize base part can be about 1384mm
2or less.In some embodiment according to the present invention, LED(or COB LED) can utilize the whole area of substrate about 40% or still less.In some embodiment according to the present invention, with LED(or COB LED) utilize the adjacent reserve part of base part can be substrate maximum sized length (being length or width) about 16% or more.
In the further embodiment according to the present invention, substrate can occupy about 2900mm
2or less area is launched at least 800 lumens simultaneously.In addition, in some embodiment according to the present invention, by LED(or COB LED) utilize base part can be about 814mm
2or less.In some embodiment according to the present invention, LED(or COB LED) can utilize the whole area of substrate about 30% or still less.In some embodiment according to the present invention, with LED(or COB LED) utilize the adjacent reserve part of base part can be substrate maximum sized length (being length or width) about 18% or more.
In the further embodiment according to the present invention, substrate can occupy about 3240mm
2or less area is launched at least 2000 lumens simultaneously.In addition, in some embodiment according to the present invention, by LED(or COB LED) utilize base part can be about 1384mm
2or less.In some embodiment according to the present invention, LED(or COB LED) can utilize the whole area of substrate about 40% or still less.In some embodiment according to the present invention, with LED(or COB LED) utilize the adjacent reserve part of base part can be substrate maximum sized length (being length or width) about 13% or more.
In the further embodiment according to the present invention, substrate can occupy about 2144mm
2or less area is launched at least 800 lumens simultaneously.In addition, in some embodiment according to the present invention, by LED(or COB LED) utilize base part can be about 814mm
2or less.In some embodiment according to the present invention, LED(or COB LED) can utilize the whole area of substrate about 38% or still less.In some embodiment according to the present invention, with LED(or COB LED) utilize the adjacent reserve part of base part can be substrate maximum sized length (being length or width) about 14% or more.
Fig. 5 E is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor.According to Fig. 5 E, on the lateral parts 580 of substrate 100, assemble the part of six LED(as serializer circuit 110).LED device can be the LED that the Cree company of North Carolina state Durham produces, be described in 13/027 of for example submission on February 14th, 2011,13/178 of submission on July 8th, No. 006 1, submit in No. 791 and on May 20th, 2011 13/112, in No. 502 U.S. Patent applications, its disclosure is incorporated herein by reference.Shown in Fig. 5 E, according to the expectation light output from this device, in lateral parts 580, adopt the first layout, each of LED device comprises that time peace separately tears base station 581 and lens separately 582 open.LED device is by electric all the other electronic building bricks that are couple in substrate 100 of conductive lead wire 583.In some embodiment according to the present invention, by the reserve part of substrate 100, multiple LED devices are separated with all the other electronic building bricks, wherein other electronic building bricks are assembled in outside the reserve part of the substrate 100 in substrate 100.In some embodiment according to the present invention, other electronic building bricks are assembled in reserve part.
Fig. 5 F is in some embodiment according to the present invention, has the plane graph of the exemplary electrical circuit substrate of the approximate asymmetrical shape factor.According to Fig. 5 F, on the lateral parts 590 of substrate 100, assemble the part of five LED(as serializer circuit 110).LED device can be the LED that the Cree company of North Carolina state Durham produces, be described in 13/027 of for example submission on February 14th, 2011, on July 8th, No. 006 1 submit to 13/178, No. 791 and on May 20th, 2011 submit to 13/112, No. 502 U.S. Patent application in.Shown in Fig. 5 F, according to the expectation light output from this device, in lateral parts 590, each of LED device comprises that time peace separately tears base station 591 and lens separately 592 open.LED device is by electric all the other electronic building bricks that are couple in substrate 100 of conductive lead wire 593.In some embodiment according to the present invention, by the reserve part of substrate 100, LED device is separated with all the other electronic building bricks that are assembled to substrate 100, wherein other electronic building bricks are assembled in outside the reserve part of the substrate 100 in substrate 100.In some embodiment according to the present invention, other electronic building bricks are assembled in reserve part.Should further understand, concrete feature of showing in Fig. 5 E and Fig. 5 F, such as tearing base station, conductive lead wire and all the other electronic building bricks open for time peace of LED separately and also can be included in the embodiment of Fig. 4 to Fig. 5 D.
Fig. 6 to Fig. 8 is profile, has shown the method that forms solid luminous device in some embodiment according to the present invention.According to Fig. 6, the chip on board LED comprising at LED serializer circuit 110 is assembled in substrate 100.On chip LED, apply onboard encapsulating material 605.In some embodiment according to the present invention, encapsulating material 605 provides the pantostrat that covers the part between several adjacent LED in LED and substrate 100.So encapsulating material 605 can be applied to these chip on boards LED substantially simultaneously with each other.
Should be appreciated that encapsulating material 605 can be for forming lens on chip LED onboard.In some embodiment according to the present invention, encapsulating material 605 can comprise liquid silicone resin and/or liquid-state epoxy resin, and/or effumability solvent material, such as alcohol, water, acetone, methyl alcohol, ethanol, ketone, isopropyl, hydrocarbon solvent, hexane, ethene, ethylene glycol, methyl ethyl ketone with and combination.
In the further embodiment according to the present invention, the part that encapsulating material 605 extends between chip LED in several adjacent panel can be retained in substrate 100 after assembling process completes, and in some embodiment according to the present invention, removed encapsulating material 605 between two parties from substrate 100.According to other embodiments of the invention, encapsulating material 605 can comprise other materials, such as light conversion material, diffusion material etc.
According to Fig. 7, mold 710 is contacted with the encapsulating material 605 on chip on board LED.Mold 710 comprises recess 711 at its lower surface, will place chip on board LED4 part opposition in the position of this recess and substrate 100.Recess 711 has the shape that provides lens on chip LED onboard.
Even if should be appreciated that the encapsulating material 605 extending between chip LED in several adjacent panel can be depressed into the layer of relative thin in substrate 100, encapsulating material 605 also can be retained in substrate 100, although be not provided as the lens component of chip LED in specified panel.
According to Fig. 8, the each chip on board LED in substrate 100 has been equipped with the lens 815 that formed by encapsulating material after die casting 605.In some embodiment according to the present invention, can remove the encapsulating material 605 between chip LED in the several adjacent panel shown in Fig. 8.Should further understand, the extra play of encapsulating material 605 can be provided on lens 815, to provide additional optical signature to LED serializer circuit 110.After die casting lens 815, in substrate 100, can assemble additional discrete electronic component encapsulation.For example, in some embodiment according to the present invention, the discrete electronic component that forms LED drive circuit 105 can be mounted to substrate 100 after being encapsulated in and having formed lens 815 by encapsulating material 605.
Fig. 9 is profile, has shown in some embodiment according to the present invention, uses mold to form lens 815 and the method for formation solid luminous device 101.Exactly, mold 910 further comprises discrete electronic component encapsulation recess 911, be configured to hold the profile of the discrete electronic component encapsulation 905 of assembling in substrate 100, these discrete electronic component encapsulation 905 are positioned at LED serializer circuit 110 outsides with encapsulating material 605 thereon.So discrete electronic component encapsulation 905 can be assembled in substrate 100 with together with chip on board LED in serializer circuit 110.Then encapsulating material 605 can be applied to chip on board LED, can make mold 910 contact to form lens 815 with encapsulating material 605 thereupon, simultaneously by comprising that discrete electronic component encapsulates recess 911 and can avoid the damage to discrete electronic component encapsulation 905.
Figure 10 to Figure 12 is profile, has shown the method that forms solid luminous device 101 in some embodiment according to the present invention.According to Figure 10 A, chip on board LED is assembled in substrate 100 and at least in part and is surrounded by the sealant barrier 1005 in substrate 100.Should be appreciated that the upper surface of sealant barrier 1005 is lower than the upper surface of the chip on board LED being surrounded by sealant barrier 1005.
Sealant material 1015 is dispensed on chip on board LED.In some embodiment according to the present invention, use nozzle 1110 that sealant material 1015 is distributed on chip on board LED.The amount that sealant material 1015 is assigned with is enough to provide and on chip on board LED, is forming each lens separately 815 separately.In some embodiment according to the present invention, nozzle 1110 onboard chip LED top is mobile in order sealant material 1115 is assigned on each LED of chip on board separately.For example, nozzle 1110 can be arranged in the Far Left chip on board LED top of primary importance, to sealant material 1115 is assigned on the LED of chip on board separately being just positioned under nozzle 1110.
After having distributed sealant material 1115, nozzle 1110 is moved to the second place on the chip on board LED on the right side that is tightly positioned at Far Left chip on board LED next-door neighbour.This process can repeat, to sealant material 1115 is assigned on each chip on board LED that serializer circuit 110 comprises.According to other embodiments of the invention, the scheduled position of multiple nozzles 1110 is at least two chip on board LED places, and sealant material 1115 is assigned on each chip on board LED substantially simultaneously with each other thereupon.
In some embodiment according to the present invention, sealant barrier 1005 can make periodic or acyclic gap form therein, but still allows to form the lens 815 that have for the intended shape 1105 of chip on board LED.Although it is also understood that sealant barrier 1005 is shown as having substantial rectangular section, can use other forms of sealant barrier 1005.For example, sealant barrier 1005 can have semicircular in shape or enough capillary other geometries are provided, and facilitates shape 1105 when upper so that sealant material 1115 is assigned to chip on board LED.
In some embodiment according to the present invention, sealant barrier 1005 can have any shape that restriction sealant material 1015 flows.For example, in some embodiment according to the present invention, sealant barrier 1005 has the peripheral shape of square or rectangle to surround at least in part chip on board LED.Also can use other shapes.
Figure 12 is profile, has shown to form to have after the lens 815 of expecting profile 1105 chip LED 104 on slave plate and remove sealant barrier 1005 around.Exactly, the basis place of chip LED is from lens 815 outer rim etchings onboard for sealant barrier 1005, and the outer most edge that is in lens 815 on substrate 100 surfaces forms recess 1205.In some embodiment according to the present invention, sealant barrier 1005 is not removed from lens 815.
Figure 13 A is circuit theory diagrams, has shown in some embodiment according to the present invention, is couple to the LED drive circuit of LED serializer circuit.Device 101 comprise series connection LED group 110-1,110-2 ..., 110-N string 110.LED group 110-1,110-2 ..., 110-N each comprise at least one LED.For example, each group of these groups can comprise that single led and/or each group can comprise the multiple LED in multiple parallel connection and/or series arrangement.These LED groups can be arranged and can have multiple compensating circuits associated with it in many different modes, as the issued for approval U.S. Patent Application Serial Number 13/235,103 (agency's reel number: 5308-1459) for example jointly entrusting; Discussion in U.S. Patent Application Serial Number 13/235,127 (agency's reel number: 5308-1461).
The power supply that offers LED string 110 couples with AC power 10 and produces commutating voltage v from it from being configured to
rand current i
rrectifier circuit 105.It can be also a part that is couple to the separate units of device 101 that rectifier circuit 105 can be included in light-emitting device 101.
Device 101 further comprise be connected to string 110 node separately the 130-1 of current shunting circuit separately, 130-2 ..., 130-N.Current shunting circuit 130-1,130-2 ..., 130-N is configured to provide bypass LED group 110-1,110-2 ..., the current path of group separately of 110-N.Current shunting circuit 130-1,130-2 ..., 130-N each comprise the transistor Q1 that is configured to provide controlled current flow path, can be used for optionally bypass LED group 110-1,110-2 ..., 110-N.Transistor Q1 use transistor Q2, resistor R1, R2 ..., RN and diode D biasing.Transistor Q2 has been configured to diode action, and its base stage and collector terminal are connected to each other.The diode D of varying number current shunting circuit 130-1,130-2 ..., 130-N circuit separately in connect with transistor Q2, make current shunting circuit 130-1,130-2 separately ..., current path transistor Q1 in 130-N base terminal setover with different voltage levels.Resistor R1, R2 ..., RN is for the base current of Limited Current path transistor Q1.Separately current shunting circuit 130-1,130-2 ..., 130-N current path transistor Q1 will close at different emitter biass, this electric current by the resistor R0 of flowing through determine.So, current shunting circuit 130-1,130-2 ..., 130-N be configured to respond LED group 110-1,110-2 ..., 110-N is along with commutating voltage V
rrising and the bias state of reduction change and operate, make LED group 110-1,110-2 ..., 110-N is along with commutating voltage v
rrise and fall and incrementally activate and stop using.Current path transistor Q1 along with LED organize 110-1,110-2 ..., the bias state of 110-N and conducting and close.
Further show as Figure 13 A, the also coupled in series current limiter circuit of string 110 of the LED group of series connection, it is implemented as current mirror circuit 1420, although can use in an embodiment according to the present invention the current limiter circuit of any type.String 110 and current mirror circuit 1420 parallel connections that one or more holding capacitors 310 are organized with the LED connecting.It is the amount that is less than the rated current of supplying with serializer circuit 110 that current mirror circuit 1420 can be configured to the current limit of the string 110 of the LED group via series connection.
Further show as Figure 13 A, current mirror circuit 1420 is included in the first transistor Q1 that connects in current mirror configuration and transistor seconds Q2 and resistor R1, R2, R3.Current mirror circuit 1420 can provide approximate (V
lED-0.7)/(R1+R2) × current limit (R2/R3).Also can provide voltage limiter circuit 1460 as Zener diode, the voltage that restriction forms across one or more holding capacitors 310.By this way, one or more holding capacitors 310 can alternately charge via rectifier circuit 105 and discharge via the string 110 of series LED group, and illumination more uniformly can be provided like this.Current mirror circuit 1420 is coupled to LED group 1410, and it is included in the middle of multiple LED groups of serializer circuit 110.Should be appreciated that LED group 1410 can comprise the multiple LED that are connected in parallel to each other.
Figure 13 B to Figure 13 D is circuit theory diagrams, has shown the current shunting circuit in some embodiment according to the present invention.Exactly, the transistor Q2 showing as a part of current shunting circuit 130-1 to 130-N in Figure 13 A is replaced by the diode D in Figure 13 B to Figure 13 D, so that associated transistors Q1 enough biasings of base stage to be separately provided.In addition, the diode D of respective amount, the biasing providing to provide otherwise by transistor Q2 are all provided for every grade of current shunting circuit 130-1 to 130-N.For example, first order 130-1 comprises that two diodes are for biasing, and next stage 130-2 comprises that three diodes are for biasing.Moreover, every grade of 130-1 to the 130-N diode D that can both share prime is for biasing.
Figure 13 E is circuit theory diagrams, has shown in some embodiment according to the present invention, is couple to the LED drive circuit of LED serializer circuit.Figure 13 E has shown the current shunting circuit of Figure 13 B to Figure 13 D, for replacing current shunting circuit 130-1 to 130-N.According to Figure 13 E, in the first section, the base voltage of Q1 approximates greatly the voltage drop of (D1+D2).In the second section, the base voltage of Q2 approximates greatly the voltage drop of (D1+D2+D3).In N section, the base voltage of QN approximates greatly (D1+D2+ ... + DN) voltage drop.So in some embodiment according to the present invention, current shunting circuit can be made as diode array and triode piece.In some embodiment according to the present invention, diode array and transistor block can integrate also and can be separated from each other.
Although should be appreciated that herein and can use first, second grade of term to describe multiple elements, these elements should not be limited to these terms.These terms are only for distinguishing an element and another element.For example, the first element can be called as the second element, same, and the second element also can be called as the first element and not depart from the scope of theme of the present invention.As used herein, term "and/or" comprises one or more careless what combination of listing item that are associated.
Should be appreciated that when certain element is called as " connection " or " coupling " to another element, it can be directly connected or coupled to another element, also can exist element between two parties.On the contrary, when element is called as " directly connection " or " directly coupling " to another element, there is no element between two parties.
Should be appreciated that certain element or layer be called as another element or layer " on " time, this element or layer can be directly on another element or layer, also can exist element or layer between two parties.On the contrary, certain element is called as " directly " on another element or layer time, not have element between two parties or layer.As used herein, term "and/or" comprises one or more careless what combination of listing item that are associated.
Space relative terms, such as " lower than ", " ... under ", D score, " higher than ", " on " etc., can be used for easy description herein, so as the relationship description of an element or functional part and another element or functional part for as shown in accompanying drawing.Should be appreciated that space relative terms be intended to comprise use and operate in equipment except accompanying drawing describe towards difference towards.From start to finish, in accompanying drawing, similar Reference numeral represents similar element to this specification.
While describing the embodiment of theme of the present invention herein, show with reference to plane and perspective, they are that the signal of the idealized embodiment of theme of the present invention is shown.Therefore, as the result of for example manufacturing technology and/or tolerance, from the variation of temporary shape in expection.Therefore, theme of the present invention should not be interpreted as being limited to the concrete shape of the object of showing herein, but should comprise the deviation of the shape for example being caused by manufacture.Therefore, the object of showing in figure is in nature for signal, and their shape is not intended to the true form in the region of showing device, and is not intended to limit the scope of theme of the present invention.
Term used herein is not intended to limit theme of the present invention just to describing the object of specific embodiment.As used herein, " certain " of singulative and " described " are unless be intended to also comprise that plural form linguistic context clearly indicates in addition.Should further understand, use term " to comprise " herein and/or when " comprising ", specify the existence of institute's features set forth, integer, step, operation, element and/or assembly, but do not got rid of the existence of one or more other features, integer, step, operation, element, assembly and/or its combination or add.
Unless otherwise defined, all terms used herein (comprise technology with term science) all have the meaning identical with theme those of ordinary skill in the field's of the present invention common understanding.Should further understand, the meaning that term used herein should be interpreted as having is consistent with their meanings in the linguistic context of association area and this specification, explain and be not taken in Utopian or excessively formal meaning, unless so definition clearly herein.Use term " multiple " to refer to two or more referenced items herein.
Be to be understood that, as used herein, term led can comprise light-emitting diode, laser diode and/or comprise other semiconductor device of one or more semiconductor layers (can comprise silicon, carborundum, gallium nitride and/or other semi-conducting materials), substrate (can comprise Graphene, silicon, carborundum and/or other microelectronic substations) and one or more contact layer (can comprise metal and/or other conductive layers).
In drawing and description, the typical preferred embodiment of theme of the present invention is disclosed, although adopted specific term, they are only used under common and describing significance rather than in order to limit object, and the scope of theme of the present invention is set forth in following claims.
Claims (79)
1. a solid luminous device, comprising:
Rectifier circuit, is assembled on the surface that is contained in the substrate in described solid luminous device, is couple to the alternating-current voltage source that is configured to provide to described substrate rectified AC voltage;
Current source circuit, is assembled on the surface of described substrate, is couple to described rectifier circuit;
The string of light-emitting diode (LED) group, is assembled on the surface of described substrate, is one another in series and is couple to described current source circuit; And
Multiple current shunting circuits, are assembled on the surface of described substrate, and current shunting circuit is separately coupled to the node separately of described string, and are configured to change and operate in response to the bias state of organizing separately of described LED group.
2. according to the device of claim 1, wherein, at least described multiple current shunting circuits comprise that being assembled in described suprabasil discrete electronic component encapsulates.
3. according to the device of claim 1, wherein, the LED in described string is included in the chip on board LED assembling on the surface of described substrate.
4. according to the device of claim 1, wherein, described substrate comprises flexible circuit substrate, and described device further comprises:
Fin, is assembled in the contrast surface of described substrate, and heat is couple to the string of described LED group.
5. according to the device of claim 1, wherein, described substrate comprises metal base printed circuit board (MCPCB).
6. according to the device of claim 5, wherein, described MCPCB comprises metal level, separates and be configured to conduct heat from the string of described LED group with the surperficial of described substrate by insulating barrier.
7. according to the device of claim 5, wherein, described MCPCB comprises the insulating material between the first metal layer and the second metal level.
8. according to the device of claim 7, wherein, described the first metal layer comprises that circuit layer and described the second metal level are configured to conduct heat from the string of described LED group.
9. according to the device of claim 1, further comprise:
Current limiter circuit, on the surface of described substrate, connects with described current source circuit and LED group described at least one; And
At least one capacitor, on the surface of described substrate, couples across described at least one LED group and described current limiter circuit.
10. according to the device of claim 9, wherein, described current limiter circuit is configured to optionally from described current source circuit to described at least one LED group and provides electric current to described at least one capacitor.
11. according to the device of claim 1, further comprises:
Sealant layer, on the surface of described substrate, seals the string of described LED group.
12. according to the device of claim 11, and wherein, described sealant layer comprises silicones.
13. according to the device of claim 1, further comprises:
Sealant layer separately, seals the LED in the string of described LED group dividually.
14. according to the device of claim 11, and wherein, described rectifier circuit, described current source circuit and described multiple current shunting circuit are all included in single IC for both device package.
15. according to the device of claim 9, and wherein, described rectifier circuit, described current source circuit, described multiple current shunting circuits and described current limiter circuit are all integrated in application-specific integrated circuit (ASIC).
16. according to the device of claim 1, and wherein, described substrate comprises silicon base, gallium nitride substrates, silicon carbide substrate or the graphene-based end.
17. according to the device of claim 1, further comprises:
Sealant barrier, in described substrate, surrounds the LED in described group at least in part, is configured to reduce described sealant material during applying sealant material and leaves flowing of described LED, forms lens to impel on the string of described LED group.
18. according to the device of claim 17, and wherein, on described substrate, the height of described sealant barrier is less than the height of the upper surface of described LED.
19. 1 kinds of solid luminous devices, comprising:
Have the substrate of the first and second contrast surface, at least one contrast surface is configured to assembly ware thereon;
The string of chip on board light-emitting diode (LED) group, on the first surface of described substrate, is one another in series; And
Alternating-current voltage source input, from described solid luminous device outside, is couple to first surface or the second surface of described substrate.
20. according to the device of claim 19, further comprises:
Rectifier circuit, on the first surface or second surface of described substrate, is couple to described alternating-current voltage source and inputs to provide rectified AC voltage to described substrate;
Current source circuit, on the first surface or second surface of described substrate, is couple to described rectifier circuit; And
Multiple current shunting circuits, on the first surface or second surface of described substrate, current shunting circuit is separately coupled to the node separately of described string, and is configured to change and operate in response to the bias state of organizing separately of described LED group.
21. according to the device of claim 20, and wherein, at least described multiple current shunting circuits comprise the discrete electronic component encapsulation on the first surface that is assembled in described substrate.
22. according to the device of claim 20, and wherein, described substrate comprises flexible circuit substrate, and described device further comprises:
Heat in described substrate conduction filler rod, is positioned at the ad-hoc location opposing with the position of its upper string that will assemble described chip on board LED group.
23. according to the device of claim 20, further comprises:
Current limiter circuit, on the first surface or second surface of described substrate, connects with described current source circuit and LED group described at least one; And
At least one capacitor, on the first surface or second surface of described substrate, couples across described at least one LED group and described current limiter circuit.
24. according to the device of claim 19, and wherein, described substrate comprises flexible circuit substrate, and described device further comprises:
Fin, on second of described substrate, heat is couple to the string of described chip on board LED group.
25. according to the device of claim 19, and wherein, described substrate comprises metal base printed circuit board.
26. according to the device of claim 19, and wherein, the LED in the string of described chip on board LED group comprises the not encapsulation LED assembling in described substrate.
27. 1 kinds of solid luminous devices, comprising:
Rectifier circuit, is configured to be couple to alternating-current voltage source so that rectified AC voltage to be provided;
Current source circuit, is couple to described rectifier circuit;
The string of the LED group of series connection, is couple to the output of described current source circuit;
At least one capacitor, is couple to the output of described current source circuit;
Current limiter circuit, comprise current mirror circuit, being configured to the current limit of organizing through LED described at least one is to be less than the electric current being produced by described current source circuit, and in response to the rectified AC voltage of input that is applied to described current source circuit, make described at least one capacitor optionally via described current source circuit charging with via LED group electric discharge described at least one;
Multiple current shunting circuits, are couple to the node separately between LED in described string and are configured to and change and optionally enable and forbid in response to the bias state of LED group described in the changes in amplitude along with described rectified AC voltage.
28. according to the device of claim 27, and wherein, the each of described multiple current shunting circuits comprises:
Transistor, provides the controlled current path between the first node of described string and the terminal of described rectifier circuit; And
Shut-off circuit, is couple to the Section Point of described string and described transistorized control terminal and is configured to control in response to control inputs described current path.
29. according to the device of claim 27, further comprises:
Have the substrate of the first and second contrast surface, wherein, string, described multiple current shunting circuits, described rectifier circuit and the described current source circuit of the LED group of at least described series connection are all assemblied in described substrate.
30. according to the device of claim 29, and wherein, the LED in described string comprises the chip on board LED assembling in described substrate.
31. according to the device of claim 29, and wherein, described substrate comprises flexible PCB, and described device further comprises:
Fin, is assembled in described substrate, opposes and approaches with the string of described LED group.
32. according to the device of claim 29, and wherein, described substrate comprises metal base printed circuit board (MCPCB).
33. according to the device of claim 32, and wherein, described MCPCB comprises metal level, separates and be configured to conduct heat from the string of described LED group with the surperficial of described substrate by insulating barrier.
34. according to the device of claim 29, and wherein, described substrate comprises flexible printed circuit board.
35. according to the device of claim 29, and wherein, at least described multiple current shunting circuits are included in the discrete electronic component encapsulation of assembling in described substrate.
36. 1 kinds form the method for solid luminescent circuit, comprising:
With string configuration, multiple chip on board light-emitting diodes (LED) are placed on substrate surface;
Sealant material is applied on described multiple chip on board LED;
Described sealant material is formed as covering to the layer of described multiple chip on board LED, thinks that described multiple chip on board LED provides lens.
37. according to the method for claim 36, further comprises:
The multiple current shunting circuits that comprise discrete electronic component encapsulation are placed on the surface of described substrate.
38. according to the method for claim 36, wherein, applies sealant material and comprises and apply described sealant material to cover the surperficial part between described multiple chip on board LED and described multiple chip on board LED several.
39. according to the method for claim 38, wherein, described sealant material is formed as to layer to be comprised mold is contacted with described sealant material, form the layer that covers described multiple chip on board LED simultaneously, think that described multiple chip on board LED provides described lens, wherein said mold comprises chip on board LED recess, and described recess is arranged in the surface of the described mold opposing with described multiple chip on board LED.
40. according to the method for claim 39, further comprises:
Before applying described sealant material, the multiple current shunting circuits that comprise discrete electronic component encapsulation are placed on the surface of described substrate, wherein said mold further comprises discrete electronic component encapsulation recess, and this recess is arranged in the surface of the described mold opposing with described lip-deep described multiple current shunting circuits.
41. according to the method for claim 36, wherein, applies sealant material and comprises described sealant material is assigned on described multiple chip on board LED dividually.
42. according to the method for claim 36, wherein, applies sealant material and comprises described sealant material is assigned on described multiple chip on board LED simultaneously.
43. according to the method for claim 36, wherein, the layer that described sealant material is formed as covering to described multiple chip on board LED thinks that described multiple chip on board LED provides lens to comprise: each the mobile barrier of sealant separately that provides of described multiple chip on board LED is provided applying described sealant material during described sealant material, and each that think described multiple chip on board LED provides lens separately.
44. according to the method for claim 42, and wherein, described sealant barrier surrounds at least in part described LED and is configured to reduce described sealant material during applying sealant material and leaves flowing of described LED, to impel the formation of described lens.
45. according to the method for claim 43, further comprises:
Remove described sealant barrier from described lens.
46. 1 kinds of printed circuit board (PCB)s (PCB), comprising:
Substrate, be configured to be included in solid luminous device, described substrate has the first and second contrast surface, at least one contrast surface is configured to assemble multiple chip on board light-emitting diodes (LED) thereon, and described substrate is configured to be couple to the alternating-current voltage source input from described solid luminous device outside, and be configured to assemble multiple discrete electric diverting flow circuit devcies thereon, described current shunting circuit device is couple to the node separately between several described LED and is configured in response to changing and optionally enable and forbid along with offering the bias state of LED group described in the changes in amplitude of rectified AC voltage of described LED.
47. according to the PCB of claim 46, and wherein, described substrate comprises Metal Substrate PCB.
48. according to the PCB of claim 47, wherein, described first surface comprises order wire circuit patterned layer and described second surface comprises that thickness is greater than the foundation metal layer of described order wire circuit patterned layer, and described PCB is further included in the insulating barrier between described order wire circuit patterned layer and described foundation metal layer.
49. according to the PCB of claim 46, and wherein, described substrate comprises flexible PCB.
50. according to the PCB of claim 49, further comprises:
Heat in described substrate conduction filler rod, is positioned at the ad-hoc location opposing with the position of its upper string that will assemble described chip on board LED group.
51. according to the PCB of claim 46, further comprises:
Sealant barrier, protrude from described surface, surround at least in part the position that will assemble LED described at least one on described surface, be configured to reduce sealant material during applying sealant material and leave flowing of described LED, to promote the formation of the above lens of LED described at least one.
52. 1 kinds of solid luminous devices, comprising:
Have the substrate of the first and second contrast surface, at least one contrast surface is configured to assembly ware thereon, and described substrate comprises area of base;
The string of light-emitting diode (LED) group, on the first surface of described substrate, be one another in series and couple, and be disposed in the LED section of about 40% or described substrate still less that the LED area comprising is described area of base, the string of described LED group is configured to send and comprises about 2000 lumens or more light; And
Alternating-current voltage source input, from described solid luminous device outside, is couple to first surface or the second surface of described substrate.
53. 1 kinds of solid luminous devices, comprising:
Have the substrate of the first and second contrast surface, at least one contrast surface is configured to assembly ware thereon, and described substrate comprises area of base;
The string of light-emitting diode (LED) group, on the first surface of described substrate, be one another in series and couple, and be disposed in the LED section of about 30% or described substrate still less that the LED area comprising is described area of base, the string of described LED group is configured to send and comprises about 800 lumens or more light; And
Alternating-current voltage source input, from described solid luminous device outside, is couple to first surface or the second surface of described substrate.
54. 1 kinds of solid luminous devices, comprising:
Have the substrate of the first and second contrast surface, at least one contrast surface is configured to assembly ware thereon, and described substrate comprises area of base;
The string of light-emitting diode (LED) group, on the first surface of described substrate, be one another in series and couple, and be disposed in the LED section of about 38% or described substrate still less that the LED area comprising is described area of base, the string of described LED group is configured to send and comprises about 800 lumens or more light; And
Alternating-current voltage source input, from described solid luminous device outside, is couple to first surface or the second surface of described substrate.
55. according to the device of claim 1, and wherein, the string of described LED group at least comprises and be one another in series three groups that couple, and every group of described three groups all at least comprises two high-voltage LEDs that are connected in parallel to each other and couple.
56. according to the device of claim 1, and wherein, described alternating-current voltage source at least comprises about 110 volts of interchanges.
57. according to the device of claim 1, and wherein, the string of described LED group at least comprises and be one another in series three groups that couple, and every group of described three groups all at least comprises two high-voltage LEDs that are one another in series and couple.
58. according to the device of claim 1, and wherein, described alternating-current voltage source at least comprises about 220 volts of interchanges.
59. according to the device of claim 1, and wherein, at least one group of the string of described LED group at least comprises and being connected in parallel to each other or two high-voltage LEDs of coupled in series, and described alternating-current voltage source at least comprises that about 110 volts exchange or about 220 volts of interchanges.
60. according to the device of claim 19, and wherein, the string of described chip on board LED group at least comprises and be one another in series three groups that couple, and every group of described three groups all at least comprises two chip on board high-voltage LEDs that are connected in parallel to each other and couple.
61. according to the device of claim 19, and wherein, described alternating-current voltage source input at least comprises about 110 volts of interchanges.
62. according to the device of claim 19, and wherein, the string of described chip on board LED group at least comprises and be one another in series three groups that couple, and every group of described three groups all at least comprises chip LED on two hardboards that couple that are one another in series.
63. according to the device of claim 19, and wherein, described alternating-current voltage source input at least comprises about 220 volts of interchanges.
64. according to the device of claim 19, wherein, at least one group of the string of described chip on board LED group at least comprise be connected in parallel to each other or two hardboards of coupled in series on chip LED, and described alternating-current voltage source at least comprises that about 110 volts exchange or about 220 volts of interchanges.
65. according to the device of claim 27, and wherein, the string of described series LED group at least comprises and be one another in series three groups that couple, and every group of described three groups all at least comprises two chip on board high-voltage LEDs that are connected in parallel to each other and couple.
66. according to the device of claim 27, and wherein, described alternating-current voltage source input at least comprises about 110 volts of interchanges.
67. according to the device of claim 27, and wherein, the string of described series LED group at least comprises and be one another in series three groups that couple, and every group of described three groups all at least comprises chip LED on two hardboards that couple that are one another in series.
68. according to the device of claim 27, and wherein, described alternating-current voltage source input at least comprises about 220 volts of interchanges.
69. according to the device of claim 27, wherein, at least one group of the string of described series LED group at least comprise be connected in parallel to each other or two hardboards of coupled in series on chip LED, and described alternating-current voltage source at least comprises that about 110 volts exchange or about 220 volts of interchanges.
70. according to the method for claim 36, wherein, the configuration of described string comprises that the LED group of series connection and the LED of described series connection group at least comprise and is one another in series three groups that couple, and every group of described three groups all at least comprises two chip on board high-voltage LEDs that are connected in parallel to each other and couple.
71. according to the method for claim 36, and wherein, described string configuration is configured to be couple to and at least comprises about 110 volts of alternating-current voltage sources that exchange.
72. according to the method for claim 36, wherein, the configuration of described string comprises that the LED group of series connection and the LED of described series connection group at least comprise and is one another in series three groups that couple, and every group of described three groups all at least comprises chip LED on two hardboards that couple that are one another in series.
73. according to the method for claim 36, and wherein, described string configuration is configured to be couple to and at least comprises about 220 volts of alternating-current voltage sources that exchange.
74. according to the method for claim 36, wherein, the configuration of described string be configured to be couple at least one group of string that alternating-current voltage source and the configuration of described string comprise series LED group and described series LED group at least comprise be connected in parallel to each other or two hardboards of coupled in series on chip LED, and described alternating-current voltage source at least comprises that about 110 volts exchange or about 220 volts of interchanges.
75. according to the device of claim 54, and wherein, the string of described LED group at least comprises and be one another in series three groups that couple, and every group of described three groups all at least comprises two high-voltage LEDs that are connected in parallel to each other and couple.
76. according to the device of claim 54, and wherein, described alternating-current voltage source input at least comprises about 110 volts of interchanges.
77. according to the device of claim 54, and wherein, the string of described LED group at least comprises and be one another in series three groups that couple, and every group of described three groups all at least comprises two high-voltage LEDs that are one another in series and couple.
78. according to the device of claim 54, and wherein, described alternating-current voltage source input at least comprises about 220 volts of interchanges.
79. according to the device of claim 54, and wherein, at least one group of the string of described LED group at least comprises and being connected in parallel to each other or two high-voltage LEDs of coupled in series, and described alternating-current voltage source at least comprises that about 110 volts exchange or about 220 volts of interchanges.
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/192,755 US8742671B2 (en) | 2011-07-28 | 2011-07-28 | Solid state lighting apparatus and methods using integrated driver circuitry |
| US13/192,755 | 2011-07-28 | ||
| US13/235,127 US9277605B2 (en) | 2011-09-16 | 2011-09-16 | Solid-state lighting apparatus and methods using current diversion controlled by lighting device bias states |
| US13/235,103 | 2011-09-16 | ||
| US13/235,127 | 2011-09-16 | ||
| US13/235,103 US9131561B2 (en) | 2011-09-16 | 2011-09-16 | Solid-state lighting apparatus and methods using energy storage |
| US201161581923P | 2011-12-30 | 2011-12-30 | |
| US61/581,923 | 2011-12-30 | ||
| US13/360,145 US9510413B2 (en) | 2011-07-28 | 2012-01-27 | Solid state lighting apparatus and methods of forming |
| US13/360,145 | 2012-01-27 | ||
| PCT/US2012/047344 WO2013016122A1 (en) | 2011-07-28 | 2012-07-19 | Solid state lighting apparatus and methods of forming |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103907401A true CN103907401A (en) | 2014-07-02 |
| CN103907401B CN103907401B (en) | 2017-08-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280044036.9A Active CN103907401B (en) | 2011-07-28 | 2012-07-19 | Solid luminous device and forming method |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2737780A1 (en) |
| CN (1) | CN103907401B (en) |
| TW (1) | TW201311053A (en) |
| WO (1) | WO2013016122A1 (en) |
Cited By (1)
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|---|---|---|---|---|
| CN111800910A (en) * | 2019-04-05 | 2020-10-20 | 意法半导体股份有限公司 | Light assembly and method for operating the same |
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| US9653671B2 (en) * | 2014-02-13 | 2017-05-16 | Infineon Technologies Ag | Light emitting device and method for operating a plurality of light emitting arrangements |
| KR102192393B1 (en) * | 2019-12-09 | 2020-12-17 | 이경연 | Led system for vehicle lighting having high efficiency and high reliability |
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- 2012-07-19 EP EP12817399.4A patent/EP2737780A1/en not_active Withdrawn
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2013016122A1 (en) | 2013-01-31 |
| TW201311053A (en) | 2013-03-01 |
| EP2737780A1 (en) | 2014-06-04 |
| CN103907401B (en) | 2017-08-29 |
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