CN103907401B - Solid luminous device and forming method - Google Patents
Solid luminous device and forming method Download PDFInfo
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- CN103907401B CN103907401B CN201280044036.9A CN201280044036A CN103907401B CN 103907401 B CN103907401 B CN 103907401B CN 201280044036 A CN201280044036 A CN 201280044036A CN 103907401 B CN103907401 B CN 103907401B
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/44—Details of LED load circuits with an active control inside an LED matrix
- H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
A kind of solid luminous device can include the substrate with the first and second contrast surfaces, and wherein at least one contrast surface is configured as in assembly ware thereon.Chip on board light emitting diode（LED）The string of group can be located on the first surface of the substrate and be one another in series.Alternating-current voltage source input outside the solid luminous device can be couple to the first surface or second surface of the substrate.
Description
The cross reference of related application and priority claim
The U.S. Provisional Patent Application No.61/581 submitted this application claims on December 30th, 2011,923 priority,
And it is the entitled Solid State Lighting Apparatus and submitted the 28 days July in 2011 entrusted jointly
The Methods Using Integrated Driver Circuitry (agency of U.S. Patent Application Serial Number 13/192,755
Mechanism reel number:5308-1364), the entitled Solid State Lighting Apparatus that September in 2011 is submitted on the 16th
And Methods Using Energy Storage (the agency's reel number of U.S. Patent Application Serial Number 13/235,103:
5308-1459) and the entitled Solid State Lighting Apparatus and that submit for 16th of September in 2011
Methods Using Current Diversion Controlled By Lighting Device Bias States U.S.
(the agency's reel number of state's patent application serial number 13/235,127:Part continuation application 5308-1461), require its priority
And it is associated therewith, the entire disclosure is incorporated herein by reference.
Technical field
Subject of the present invention content is related to light-emitting device and method, more precisely, being related to solid luminous device and formation
Method.
Background technology
Solid state light emitting arrays are used for many luminous applications.E.g., including solid luminescent face of Sony ericsson mobile comm ab array
Plate is utilized as direct illumination source, such as in building and/or accent light.Sony ericsson mobile comm ab can include for example encapsulating
Luminescent device, including one or more light emitting diodes (LED), they can include inorganic LED, and the inorganic LED can be wrapped
Include the semiconductor layer to form p-n junction, and/or organic LED（OLED）, organic luminous layer can be included.
Solid state light emitting arrays are used for many luminous applications.E.g., including solid luminescent face of Sony ericsson mobile comm ab array
Plate is utilized as direct illumination source, such as in building and/or accent light.Sony ericsson mobile comm ab can include for example encapsulating
Luminescent device, including one or more light emitting diodes (LED).LED inorganic in typical case includes forming partly leading for p-n junction
Body layer.Organic LED including organic luminous layer（OLED）, it is another type of Sony ericsson mobile comm ab.In typical case, solid-state
Luminescent device produces light by recombining electron carrier, i.e. electronics and hole in luminescent layer or region.
Solid luminescent panel is often used as small-sized liquid crystal display（LCD）In the backlight of screen, such as portable electric appts
LCD display used.In addition, for bigger display such as LCD-TV display, solid luminescent panel is used as backlight
It has been subjected to more concerns.
Although it has proved that solid state light emitter has high color rendering index (CRI)（CRI）And/or high efficiency, but it is big in Application in Building
Scale is that the light fixture that business lighting system is used is designed to using exchange using a problem of such light source（ac）Electricity
The AN connector in source, can use house phase light modulator equipment house phase.In typical case, solid state light emitter is powered by power supply changeover device
Or be connected thereto, AC power is converted to dc source by power supply changeover device, and dc source is used to supply energy for light source.No
Cross, the cost of light source and/or overall facility may be improved using such power supply changeover device, and efficiency may be reduced.
The some trials powered to solid state light emitter have been directed to drive LED or LED string using the AC wave shape of rectification
Or group.But, because LED needs certain minimum forward voltage to turn on, LED may only rectification AC wave shape one
Partially ON, this may cause visible flicker, may undesirably reduce the power factor of system and/or may improve
Resistive loss in system.
Other trials that solid state light emitter to exchange driving is powered have been directed to LED to be placed in inverse parallel configuration, so
In the LED of every half-cycle driving half of AC wave shape.But, this mode needs twice of LED to produce and use rectification
AC signal identical luminous flux.
The content of the invention
Solid luminous device can include the substrate with the first and second contrast surfaces, opposition described in wherein at least one
Surface is configured as in assembly ware thereon.Chip on board（COB）Light emitting diode（LED）The string of group can be located at the substrate
First surface on and be one another in series.Alternating-current voltage source input outside the solid luminous device can be couple to described
The first surface or second surface of substrate.
According in certain embodiments of the present invention, solid luminous device can include rectifier circuit, the rectifier
Circuit is assembled on the surface for the substrate being contained in the solid luminous device, is couple to and is configured as carrying to the substrate
For the alternating-current voltage source of rectified AC voltage.Current source circuit can be assemblied on the surface of the substrate and be couple to described whole
Flow device circuit.Light emitting diode（LED）The string of group can be assemblied on the surface of the substrate, and is one another in series and is couple to
The current source circuit.Multiple current shunting circuits can be assemblied on the surface of the substrate, wherein respective current distributing
Circuit is coupled to the respective node of the string, and can be configured to respond to respective group of biasing shape of the LED groups
State changes and operated.
According in certain embodiments of the present invention, at least the multiple current shunting circuit includes that institute can be assembled in
State the discrete electronic component encapsulation in substrate.According in certain embodiments of the present invention, the LED in the string can be in institute
State the chip on board LED assembled on the surface of substrate.According in certain embodiments of the present invention, the substrate can be flexible
Circuit substrate, wherein described device may further include fin, and the fin can be assembled in pair of the substrate
On vertical surface, and it is thermally coupled to the string of the LED groups.According in certain embodiments of the present invention, the substrate can be
Metal base printed circuit board（MCPCB）.
According in certain embodiments of the present invention, solid luminous device can include rectifier circuit, the rectifier
Circuit can be configured to couple to AC power to provide rectified AC voltage.Current source circuit can be couple to the rectification
The device circuit and string of LED groups connected can be couple to the output of the current source circuit.At least one capacitor can be with coupling
It is connected to the output of the current source circuit.Current limiter circuit can include current mirror circuit, the current mirror circuit by with
It is, less than the electric current produced by the current source circuit, and to respond to be set to the current limit Jing Guo at least one LED group
In the rectified AC voltage for the input for being applied to the current source circuit, make at least one described capacitor optionally via institute
State current source circuit charging and discharged via LED groups at least one described.Multiple current shunting circuits can be couple to the string
Respective node between middle LED, and be configured to respond to LED groups described in the changes in amplitude of the rectified AC voltage
Bias state transformation and selectively enable and disable.
According in certain embodiments of the present invention, each of the multiple current shunting circuit can include crystal
Pipe, it can provide the controllable current path and coupling between the first node of the string and the terminal of the rectifier circuit
The closing circuit of the Section Point of the string and the control terminal of the transistor is connected to, and control can be configured to respond to
System inputs and controls the current path.
According in certain embodiments of the present invention, described device can also be included with the first and second contrast surfaces
Substrate, the going here and there of LED groups of wherein at least series connection, the multiple current shunting circuit, the rectifier circuit and the electric current
Source circuit is assembled on the substrate.According in certain embodiments of the present invention, the LED in the string can be the base
The chip on board LED assembled on bottom.
According in certain embodiments of the present invention, the substrate can be flexible PCB, and wherein described device can
Further comprise fin, the fin can oppose and closely assemble on the substrate with the string of the LED groups.
According in certain embodiments of the present invention, the substrate can be metal base printed circuit board（MCPCB）.
According in certain embodiments of the present invention, the method for formation solid luminescent circuit can be by being configured many with going here and there
Individual chip on board light emitting diode（LED）It is placed on substrate surface and provides.Sealant material can be applied to the multiple plate
On upper chip LED and the sealant material can be formed as covering the multiple chip on board LED layer, think described
Multiple chip on board LED provide lens.
According in certain embodiments of the present invention, methods described can also include multiple current shunting circuits, including
Discrete electronic component is encapsulated, on the surface for being placed in the substrate.According in certain embodiments of the present invention, sealed by applying
Agent material with cover the multiple chip on board LED and the multiple chip on board LED it is several between surface portion energy
Enough provide applies sealant material.
According in certain embodiments of the present invention, by making mold be contacted with the sealant material, to be formed simultaneously
The multiple chip on board LED layer is covered, to provide the lens for the multiple chip on board LED, using the teaching of the invention it is possible to provide institute
Sealant material forming layer is stated, wherein the mold includes chip on board LED recesses, the recess is located at and core on the multiple plate
In the surface of the mold of piece LED opposition.
According in certain embodiments of the present invention, methods described can further comprise apply sealant material it
Before, multiple current shunting circuits, including discrete electronic component are encapsulated, on the surface for being placed in the substrate.Wherein described mold
Further comprise that discrete electronic component encapsulates recess, the recess is located at and the multiple current shunting circuit pair on the surface
In the surface of the vertical mold.According in certain embodiments of the present invention, by the way that the sealant material is dividually divided
It is fitted on the multiple chip on board LED, using the teaching of the invention it is possible to provide apply sealant material.
According in certain embodiments of the present invention, by the way that the sealant material is assigned on the multiple plate simultaneously
On chip LED, using the teaching of the invention it is possible to provide apply sealant material.According in certain embodiments of the present invention, the sealant material
Be formed as covering the multiple chip on board LED layer, can be by right to provide lens for the multiple chip on board LED
The sealant material leaves the multiple chip on board LED flowing of each offer each during applying sealant material
Sealant barrier provide.
According in certain embodiments of the present invention, the sealant barrier at least partially around the LED and by with
It is set to and reduces the flowing that the sealant material during sealant material is applied leaves the LED, promotes the lens shaped
Into.According in certain embodiments of the present invention, methods described can further comprise removing the sealant from the lens
Barrier.
According in certain embodiments of the present invention, printed circuit board (PCB)（PCB）It can include being configured as including solid-state hair
The substrate of electro-optical device, wherein the substrate can have the first and second contrast surfaces, wherein at least one contrast surface by with
It is set to and multiple chip on board light emitting diodes is assembled thereon（LED）, and the substrate is configured to couple to from described
Alternating-current voltage source input outside solid luminous device, and be configured as assembling multiple discrete current shunting circuit devices thereon
Part, the current shunting circuit device is couple to the respective node between several LED and is configured to respond to being supplied to
The bias state of LED groups described in the changes in amplitude of the rectified AC voltage of the LED changes and selectively enabled and disabled.
According in certain embodiments of the present invention, the substrate can be Metal Substrate PCB.According to some of the present invention
In embodiment, the first surface can be order wire circuit patterned layer and the second surface can be thickness be more than the conduction
The foundation metal layer of circuit pattern layer, wherein the PCB can further comprise in the order wire circuit patterned layer and the base
Insulating barrier between plinth metal level.According in certain embodiments of the present invention, the substrate can be flexible PCB.
According in certain embodiments of the present invention, the PCB can further comprise being located at and it in the substrate
On to assemble the chip on board LED groups string position opposition ad-hoc location heat transfer filler rod.According to the present invention's
In some embodiments, the PCB can further comprise sealant barrier, and the sealant barrier protrudes from the surface, extremely
At least one LED position will be assembled by partially surrounding on the surface, be configured as reducing in application sealant material
The sealant material leaves the flowing of the LED during material, to promote the shape of the lens at least one LED
Into.
Brief description of the drawings
Fig. 1 is schematic block diagram, and illustrate is including light emitting diode according to certain embodiments of the present invention（LED）Driving
The solid luminous device of circuit and LED strip circuit；
Fig. 2 is schematic block diagram, and illustrating is including rectifier electricity as shown in Figure 1 according to certain embodiments of the present invention
The LED drive circuit of road and current shunting circuit and the LED strip circuit being attached thereto；
Fig. 3 is schematic block diagram, is illustrated in the LED drivings shown in Fig. 1 and Fig. 2 in certain embodiments of the present invention
Circuit, further comprises the current limiter circuit and capacitor for being couple to LED strip circuit；
Fig. 4 A are the plans in the exemplary electrical circuit substrate in certain embodiments of the present invention, including solid luminescent dress
Put rectifier circuit, LED strip circuit and other discrete electronic components encapsulation in substrate；
Fig. 4 B are the profiles of the exemplary electrical circuit substrate shown in Fig. 4 A according in certain embodiments of the present invention；
Fig. 4 C are the LED strips in the exemplary electrical circuit substrate shown in Fig. 4 A and Fig. 4 B in certain embodiments of the present invention
Circuit part includes the replacement profile of flexible circuit substrate；
Fig. 4 D be according in certain embodiments of the present invention, the exemplary electrical circuit substrate near symmetrical form factor
Plan；
Fig. 4 E be according in certain embodiments of the present invention, the exemplary electrical circuit substrate near symmetrical form factor
Plan；
Fig. 5 A are plans, and illustrating is including rectifier circuit according to certain embodiments of the present invention and be couple to electricity
The exemplary electrical circuit substrate of the LED strip circuit of container；
Fig. 5 B are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan；
Fig. 5 C are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan；
Fig. 5 D are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan；
Fig. 5 E are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan；
Fig. 5 F are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan；
Fig. 6 to Fig. 9 is profile, illustrates according in certain embodiments of the present invention, is included using mold thereon
The method that solid-state device is formed in the chip on board LED of assembling circuit substrate；
Figure 10 to Figure 12 is profile, illustrates according in certain embodiments of the present invention, is used in circuit substrate
The formation of sealant barrier includes the method for chip on board LED solid luminous device；
Figure 13 A are circuit theory diagrams, are illustrated according in certain embodiments of the present invention, being couple to LED strip circuit
LED drive circuit；
Figure 13 B to Figure 13 D are circuit theory diagrams, are illustrated in the current distributing electricity in certain embodiments of the present invention
Road；
Figure 13 E are circuit theory diagrams, are illustrated according in certain embodiments of the present invention, being couple to LED strip circuit
LED drive circuit；
Figure 14 is form, illustrates the performance number in the demonstration solid luminous device in certain embodiments of the present invention
According to；
Figure 15 is form, illustrates the performance number in the demonstration solid luminous device in certain embodiments of the present invention
According to；
Figure 16 is according to the demonstration solid luminous device in certain embodiments of the present invention, accommodated in illuminator.
Embodiment
It will be described more fully hereinafter with reference to the accompanying drawings hereinafter in the embodiment of present present subject matter, accompanying drawing and show master of the present invention
The embodiment of topic.But, present subject matter can be implemented in many different forms, so should not be considered limited to illustrate herein
These embodiments.On the contrary, these embodiments are provided so that the disclosure will be thorough and complete, and by present subject matter
Scope comprehensively conveys to those skilled in the art.Similar reference refers to similar element from beginning to end.
Phrase " light-emitting device " used herein is not limited to simply indicate that the device can light.It is, light-emitting device
Can be the device for illuminating certain region or space, such as building, swimming pool or bath center, room, warehouse, indicator, road,
Parking lot, vehicle, mark such as road sign, billboard, ship, toy, mirror, container, electronic device, ship, aircraft, physical culture
Field, computer, remote audio device, remote video device, cell phone, tree, window, LCD display, cave dwelling, tunnel, courtyard,
Lamppost or the device or device array for illuminating enclosure wall, or the device for side light or back lighting（Such as backlight sea
Report, mark, LCD display）, replacing bulb（Such as it is used to replace exchange incandescent lamp, low voltage lamps, fluorescent lamp）, for outdoor
The lamp of illumination, the lamp for emergency lighting, the lamp for being illuminated outside house（Wall is installed, roofbolt/column is installed）, ceiling lamp
Illumination, electric light under tool/sconce, closet（Floor and/or desk and/or desk）, Landscape Lighting, guide rail illumination, operation
Illumination, special illumination, Lamp with ceiling fan, archive office/art show illumination, high vibration/impact illumination, portable lamp etc., mirror/dressing table
Illumination and any other light-emitting device.
Subject of the present invention is further to the enclosure wall being illuminated（Can uniformly or non-uniformly it be illuminated in its space）,
At least one light-emitting device including closing space and according to the inventive subject matter, the wherein light-emitting device（Uniformly or non-uniformly
Ground）Illuminate at least a portion of the closing space.
Fig. 1 is schematic block diagram, is illustrated in the solid luminous device 101 in certain embodiments of the present invention.According to
Fig. 1, solid luminous device 101 includes light emitting diode（LED）Drive circuit 105, is coupled to LED strip circuit 110, both
On the surface for being assembled into substrate 100.LED drive circuit 105, which is couple to, to be included to LED strip circuit 110 and device 101
Other circuits electric current and voltage are provided, so as to the alternating voltage lighted from solid luminous device 101.
It should be appreciated that embodiments shown herein can（From external power source）Directly apply alternating voltage to device 101
Without including " on plate " switch mode.According in certain embodiments of the present invention, LED drive circuit 105 can be changed to
LED strip circuit 110 provides the alternating voltage after rectification, according to the ac voltage signal directly provided to solid luminous device 101
Acceptable light is provided from the device.It is further appreciated that can be any according to the solid luminous device 101 of the present invention
Used in the illuminator of form, such as the displaying in Figure 16.
LED drive circuit 105 can include carrying out the component of rectifier to alternating voltage, be provided to LED strip circuit 110
The component of current source, the component for current shunting circuit, the component for current-limiting circuit（Limitation is flowed through in LED strip circuit 110
At least one LED magnitude of current）And at least one energy storage device, such as capacitor.It will be further understood that in basis
In certain embodiments of the present invention, at least some of can be assemblied in substrate 100 of these components is sealed as discrete electronic component
Dress.Further, according in certain embodiments of the present invention, some of remaining circuit described herein can be integrated in
In the single IC for both encapsulation assembled in substrate 100.
LED strip circuit 110 can include multiple " chip on boards "（COB）LED groups, are coupled in series with each other, are assembled in
In substrate 100.So, chip on board LED can be assembled in without additional encapsulation in substrate 100, unless should at other
Use these LED to comprise additionally in additional encapsulation with middle, in other applications, torn open for example, LED is mounted to time peace
Base station（sub-mount）, intervening substrate or other chip carriers etc. for assembling LED.For example, in the issued for approval U.S. entrusted jointly
Patent application serial number 13/192,755（Agency reel number 5308-1364）In describe such other modes, wherein example
It is torn open as LED can be located at time peace on base station, to provide laminated construction in lower substrate.
It is also understood that according in certain embodiments of the present invention, LED strip circuit 110 can utilize the LED devices encapsulated
Part substitution COB LED.For example according in certain embodiments of the present invention, LED strip circuit 110 can include the North Carolina state
The XML-HV LED that Durham Cree companies produce.
So, device 101 can take the form of smaller form factor circuit board, and it is directly coupled to alternating voltage
Signal simultaneously provides the ac voltage signal after rectification to serializer circuit 110, and without using the power supply of switch mode on plate.In addition, string
Circuit 110 can be on circuit board COB LED or LED component constitute.
Substrate 100 can be with any smaller form factor（Symmetrically or non-symmetrically）There is provided, such as herein with reference to Fig. 4 D,
4E and 5A to 5C describe those.In addition, according in certain embodiments of the present invention, final minitype circuit board includes thereon
By directly applying ac voltage signal（Without the power supply of switch mode on plate）And the COB LED or LED component operated, energy
Compact package is enough provided, the performance that can having of efficiently exporting is listed in detail in form shown in such as Figure 14 and Figure 15 it is luminous
Device 101.
It should be appreciated that terms used herein " assembling " is included component（Such as chip on board LED）It is physically connected to
Substrate 100 is without using the such as above referenced U.S. Patent Application Serial Number 13/192,755 entrusted jointly（Proxy machine
Structure reel number 5308-1364）Described in those between two parties secondary peace tear the configurations of base station, substrate, carrier or other surfaces open.So, quilt
Be described as " assembling " component in substrate can be on the same surface of substrate, can also same substrate contrast surface
On.For example, can be described as " assembling " on this substrate in the component that period of assembly is placed in and welded on the same base.
It should be appreciated that being enough running gear according in certain embodiments of the present invention, ac voltage signal can have
101 any amplitude.For example according in certain embodiments of the present invention, ac voltage signal can be 90 volts of exchanges, 110 volts
Exchange, 220 volts of exchanges, 230 volts of exchanges, 277 volts of exchanges or any medium voltage.According in certain embodiments of the present invention,
Ac voltage signal is provided from single-phase AC voltage signal.But, according in certain embodiments of the present invention, alternating voltage is believed
Number can via two leads from three-phase alternating voltage signal voltage signal provide.So, ac voltage signal can
There is provided from the ac voltage signal of higher voltage, and it is unrelated with phase.For example, according in certain embodiments of the present invention, handing over
Flowing voltage signal can provide from the AC signal of 600 volts of three-phase.In the further embodiment according to the present invention, exchange
Voltage signal can be relative low voltage signal, such as 12 volts exchanges.
Fig. 2 is schematic block diagram, is illustrated according in certain embodiments of the present invention, the solid luminous device shown in Fig. 1
101.According to Fig. 2, LED drive circuit 105 includes rectifier circuit 205, is couple to current shunting circuit 210 and LED strip circuit
110, the latter includes the multiple LED strip groups for the coupling that is one another in series.As in Fig. 2 it further shows that the coupling of current shunting circuit 210
It is connected to the selected node between some LED groups in string 110.
Current shunting circuit 210 can be configured to respond to the inclined of these respective LED groups of the bridging of current shunting circuit 210
Configuration state changes and operated.So, according in certain embodiments of the present invention, the LED groups in string can be responded in group
The bias state of device and be incrementally activated and disable.For example, to LED strip circuit 110 apply rectified AC voltage when, electric current
The forward bias that some circuits of shunt circuit can respond LED groups is activated and disabled.If current shunting circuit can include
Dry transistor, these transistors are configured as some LED groups week between the selected node that current shunting circuit 210 is coupled
Enclose and each controllable current shunt path is provided.These transistors can beat opening/closing by the biasing transformation of LED groups, and LED groups can
Biasing for influenceing these transistors.For example in the issued for approval U.S. Patent Application Serial Number 13/235,127 entrusted jointly
（Agency reel number 5308-1461）In further describe together with LED strip group operate current shunting circuit.
As Fig. 2 is further shown, rectifier circuit 205, current shunting circuit 210 and LED strip circuit 110 can be filled
Fit in substrate 100 so that each of these components is provided on the single surface of substrate 100.According to the present invention
Other embodiment in, some circuits described herein are assembled on the first face of substrate 100, and remaining circuit is assembled in
In the opposite of substrate 100.But, according in certain embodiments of the present invention, circuit described herein is assembled in substrate
On 100, and base station, carrier or the lamination being used to provide for sometimes in conventional structure assembling class are torn open without using intervening substrate, secondary peace
The other kinds of surface of type.
According in certain embodiments of the present invention, base can be assembled in reference at least some of in the component that Fig. 2 is described
On bottom 100, encapsulated as discrete electronic component.Further, according in certain embodiments of the present invention, described with reference to Fig. 2
Some remaining circuits can be integrated into assembled in substrate 100 single IC for both encapsulation among.
Referring still to Fig. 2, the parameter according to shown in Figure 14 forms is built and operation demonstration solid luminous device 101.Really
Say with cutting, device 101 make use of the current shunting circuit for being couple to serializer circuit 110 as shown in figure 13, and without using shown in Figure 13
Current limiter circuit and capacitor.The device includes the COB LED of 12 knots of high voltage 16, each size be about 1.4mm ×
1.4mm×.170mm.Data display in Figure 14 form goes out, and exemplary electrical circuit plate is from about 71Lm/W to about 79Lm/W's
Efficiency（Lumen per watt）In the range of there is provided from about 704Lm to about 816Lm lumen（Lm）There is provided acceptable color for scope
Point and relatively high power factor.It being understood, however, that according in certain embodiments of the present invention, for example, by increasing circuit
COB LED quantity on plate or the current level by raising for driving COB LED, it is possible to achieve higher output.
Fig. 3 is schematic block diagram, illustrates solid luminous device 101, including LED drive circuit 105（Including rectifier circuit
205 and current shunting circuit 210）, the LED drive circuit 105 is couple to the current limiter circuit 305 in parallel with capacitor 310,
The two is all connected with LED strip circuit 110, and they can be assemblied on the surface of substrate 100.
It should be appreciated that current limiter circuit 305 and capacitor 310 can be used to reduce flicker, not so talk about, then may to
The alternating voltage that solid luminous device 101 is provided produces flicker.For example, capacitor 310 can be used for storage close to crest voltage
Energy, and when AC voltage magnitudes are less than in string 110 voltage required for LED positive configuration, use the energy of storage
Amount driving LED strip 110.Further, current limiter circuit 305 can be configured as electric current to guide to capacitor 310 so that energy
Amount, which is stored in wherein or be configured through LED strip 110, makes the charge discharge in capacitor 310.
Although Fig. 3 shows that capacitor 310 is used to storing and transmitting energy, but it is to be understood that any kind of electronics
Energy storage device can be used for the replacement or in connection of capacitor 310, such as inductor.It should be appreciated that for example altogether
With the issued for approval U.S. Patent Application Serial Number 13/235,103 of commission（Agency reel number 5308-1459）In, further retouch
Use of the current limiter circuit together with LED strip circuit is stated.
According in certain embodiments of the present invention, the component shown in Fig. 3 can be assembled in the same table of substrate 100
On face.In other embodiments in accordance with the invention, some of circuit shown in Fig. 3 can be assembled in the first of substrate 100
On surface, and remaining circuit is assembled in the second of substrate 100, contrast surface.According in certain embodiments of the present invention,
The LED included in LED strip circuit 110 can be chip on board LED, and they can be assembled in any surface of substrate 100
Above or torn open in the secondary peace for being couple to substrate 100 on base station or other substrates, as example in the issued for approval U.S. entrusted jointly
Patent application serial number 13/192,755（Agency reel number 5308-1364）In description.
Referring still to Fig. 3, demonstration solid luminous device 101 is constructed in order to provide data shown in Figure 15 form.
Exactly, device 101 make use of the current shunting circuit for being couple to serializer circuit 110 as shown in figure 13, be used together Figure 13 institutes
The current limiter circuit and capacitor shown.The device includes the COB LED of 12 knots of high voltage 16, and each size is about 1.4mm
×1.4mm×.170mm.Data display in Figure 14 form goes out, and exemplary electrical circuit plate is from about 69Lm/W to about 74Lm/W
Efficiency range in there is provided the Lm scopes from about 674Lm to about 785Lm, there is provided acceptable color dot and relatively high work(
Rate factor.It being understood, however, that according in certain embodiments of the present invention, for example, by increasing the COB LED on circuit board
Quantity or the current level by raising for driving COB LED, it is possible to achieve higher output.
Fig. 4 A are plans, illustrate and are filled in the solid luminescent for including substrate 100 according to certain embodiments of the present invention
101 are put, the substrate includes the LED drive circuit 105 and LED strip circuit 110 assembled in its surface.Fig. 4 B are according to this
The profile of a part for solid luminous device 101 shown in Fig. 4 A in some embodiments of invention.Fig. 4 C are according to the present invention
Some embodiments in, the replacement profile of a part for solid luminous device 101, wherein substrate 100 include being embedded
Heat transfer filler rod 417, opposes with LED strip circuit 110.
According to Fig. 4 A, according in certain embodiments of the present invention, substrate 100 can be printed circuit board (PCB)（PCB）.PCB
It can be formed by many different materials, can be arranged as providing desired electric insulation and high heat conductivity.Some
In embodiment, PCB can include insulator to provide desired electric insulation at least in part.In other according to the present invention
In embodiment, PCB can include ceramic material such as aluminum oxide, aluminium nitride, carborundum or polymeric material such as polyimides
With polyester etc..
The circuit board being made for such as polyimides and polyester material, these circuit boards can be flexible（Sometimes referred to as
For flexible printed circuit board）.This can allow for circuit board and takes on-plane surface or curved shape so that LED chip is also with on-plane surface
Form is arranged.According in certain embodiments of the present invention, the printed substrates such as Du Pont that circuit board can be flexible producesPolyimides.According in certain embodiments of the present invention, circuit board can be the FR-4PCB of standard.
This can aid in the circuit board for providing different luminous patterns, and molded non-planar allows the illuminated diagram of less directionality
Case.According in certain embodiments of the present invention, this layout can allow for more omnidirectional and light, such as with 0-180 ° of light emitting anger
Degree.According in certain embodiments of the present invention, PCB can include the strong material of reflective, such as reflecting ceramic or metal level
Such as silver, light is obtained to strengthen from component.
In certain embodiments, PCB can include insulating barrier 50 to provide electric insulation, while also including electrically neutral material
Material, to provide good heat conductivity.Different insulating materials can be used for insulating barrier, including epoxy radicals insulator, include difference
Electric neutral heat conducting material.Many different materials, including but not limited to aluminum oxide, aluminium nitride can be used（AlN）Nitrogen
Change boron, diamond etc..According to the present invention, different insulative layer can provide different grades of electric insulation, and some embodiments are provided
Electric insulation puncture in the range of 100 to 5000 volts.In certain embodiments, insulating barrier can be provided 1000 to 3000
Electric insulation in the range of volt.In other embodiments, insulating barrier can provide the electric insulation that approximate 2000 ambuscade is worn.In root
According in certain embodiments of the present invention, insulating barrier can provide different grades of heat conductivity, some to have 1-40w/m/k's
In the range of heat conductivity.In certain embodiments, insulating barrier can have the heat conductivity more than 10w/m/k.In other realities
Apply in example, insulating barrier there can be approximate 3.5w/m/k heat conductivity.
Insulating barrier can have many different thickness to provide desired electric insulation and heat conductivity feature, such as
10 to 100 microns（μm）In the range of.In other embodiments, insulating barrier can have 20 to 50（μm）In the range of thickness
Degree.In other embodiments, insulating barrier can have approximate 35（μm）Thickness.
According in certain embodiments of the present invention, substrate 100 can be Metal Substrate PCB, such as the Minnesota State
" Thermal-Clad " that Chanhassen Bergquist companies produce（T-Clad）Dielectric substrate materials.“Thermal-
Clad " substrates can more efficiently reduce thermal impedance than the circuit board of standard and conduct heat.MCPCB can also be wrapped on the insulating layer
Substrate is included, is opposed with LED strip circuit 110, and heat conducting material can be included and helps thermal diffusion.Substrate can include different
Material such as copper, aluminium or aluminium nitride.Substrate can have different thickness, such as in the range of 100 to 2000 μm, and other
Embodiment can have the thickness in 200 to 1000 μ ms.Some embodiments can have approximate 500 μm of thickness.
With thick film ceramic and directly cover copper arrange compared with, such substrate can be with mechanically robust.So, Metal Substrate printing electricity
Road plate can effectively pass out the LED included by LED strip circuit 110 the heat produced from solid luminous device 101.No
Cross, it will be appreciated that substrate 100 can be adapted for LED drive circuit 105 and LED strip circuit 110 to assemble any material thereon
Material, it provides and carries out sufficient heat transfer from LED strip circuit 110.
In certain embodiments, MCPCB includes solder assembling layer on the bottom surface of the substrate, and material is made and is adapted to directly
Tipping is fitted on fin, such as is flowed back by solder.These materials can include one or more layers different metal such as nickel, silver,
Gold, palladium.In certain embodiments, assembling layer can include nickel and silver layer, such as with the nickel in the μ m of thickness 2 to 3 and 0.1
Silver to 1.0 μ ms.In certain embodiments, assembling layer can include such as approximate 5 μm of other laminations electroless nickel plating,
Approximate 0.25 μm of electroless palladium plating and approximate 0.15 μm of leaching gold.MCPCB is welded direct to fin can be by increase by two
Thermocontact area between person strengthens the thermal diffusion from circuit board to fin.This can for vertically and horizontally heat transfer
Improve.According in certain embodiments of the present invention, MCPCB can be provided using approximate 0.4 DEG C/W to the performance that the back side is tied
Different grades of thermal characteristics.
The size of substrate 100 can depend on different factors, such as the chip on board LED assembled thereon size sum
Measure and change.For example in certain embodiments, substrate can be that every side is approximately 33mm.According to certain embodiments of the present invention
In, about 2.5mm height can be presented in component in substrate.Other sizes can also be used for substrate 100.
It should be appreciated that substrate 100 can be used in combination with being assembled to or being merged into respective intrabasement fin, to provide
Sufficient heat transfer is carried out from solid luminous device 101, as shown in Figure 4 C., can be with according in certain embodiments of the present invention
Use flexible thermal conduction band, such as the GRAFIHX of the GraphTech international corporations product of Ohio LakewoodTM, radiating
Piece is couple to substrate 100.Fin can make any high-efficiency heat conduction material of the abundant heat conduction of substrate 100.For example, fin can
To be metal, such as aluminium.According in certain embodiments of the present invention, fin is graphite.In some realities according to the present invention
Apply in example, fin includes improving the reflecting surface that light is obtained.
As Fig. 4 A are further shown, solid luminous device 101 includes the LED drive circuit 105 assembled in its surface,
Together with multiple chip on board LED of the multiple LED groups for the coupling that is arranged as being one another in series to provide LED strip circuit 110（Sometimes
Referred to as COB LED array）.According in certain embodiments of the present invention, the COB LED of string 110 can be according in substrate 100
The specific pattern arrangement of approximate center.It should be understood, however, that COB LED can be suitable for providing institute from solid luminous device 101
Any mode of desired light output arranges, for example, COB LED can with approximate circle array, rectangular array, random array or
Semi-random array arrangement.According in certain embodiments of the present invention, COB LED can be assembled in the substrate of single circuit
On 100, the dead space between COB LED is reduced, is divided in this size that can reduce solid luminous device 101 or device 101
The size of dispensing substrate 100.
In COB implementations, microchip or crystal block such as LED are mounted to its final circuit substrate and therewith electric interconnection,
Rather than by traditional assembling or it is encapsulated as single led encapsulation or integrated circuit.Conventional device is eliminated when being assembled using COB
Encapsulation, can simplify design and manufacture whole technique, space requirement can be reduced, cost can be reduced and as shorter
The result of interconnection path can improve performance.COB techniques can include three key steps：1) connection of LED crystal blocks or crystal block dress
Match somebody with somebody；2) lead is welded；And 3) crystal block and lead are encapsulated.These COB layouts can also provide more advantages, it is allowed to directly assemble
And with master device fin interface.
In some embodiment LED array embodiments, each chip in array can have be formed on from
Oneself lens, to promote light during first pass to obtain and launch.Light acquisition/transmitting of first pass refers to from specific LED core
The light of piece transmitting is by respective lens, and light is from LED chip to the first pass on main lens surface.That is, light does not have
It is reflected back, such as by total internal reflection（TIR）, some of which light is likely to be absorbed.This initial transmission can be by subtracting
The LED light being likely to be absorbed less strengthens the luminous efficiency of LED component.Some embodiments can include highdensity luminescence component
Light is set to obtain maximization simultaneously, this can improve the efficiency of respective solid luminous device.According to certain embodiments of the present invention energy
Enough it is arranged in the LED chip subgroup in array, there is each subgroup the main lens of their own to be used to improve light acquisition.At certain
In a little embodiments, lens can be hemispherical, and this can promote the photoemissive lens face of first pass come further by providing
Increase light to obtain.
According in certain embodiments of the present invention, LED array can include transmitting same color or different colours light
LED chip（Such as red, green and blue LED die or subgroup, White LED and red LED chips or subgroup etc.）.Develop
Produce white light from multiple discrete light sources to provide in the technology for expecting the expectations CRI at colour temperature, they using from difference from
The different tones in astigmatism source.Such technology is in entitled " Lighting Device and Lighting Method " U.S.
State patent No.7, described in 213,940, its content is incorporated herein by reference.
In certain embodiments, Secondary lens or optics can also be used in addition to main lens or optics, such as
The bigger secondary optics of the multigroup luminescent device with primary optics of covering.According to embodiments of the present invention, tool is utilized
Have the main lens of their own or each luminescent device of optics or luminescent device group can show bigger scalability with
The LED of bigger array is more easily provided.According in certain embodiments of the present invention, LED strip circuit 110 can include hundreds of
Individual COB LED.
In certain embodiments, LED array can be to fit into the COB of substrate 100, and the feature having provides improved fortune
OK.Substrate 100 can provide electric insulation feature, it is allowed to the electric insulation of circuit board level is realized to COB LED.While circuit board
Can having some properties, there is provided the efficient heat passage radiated from COB LED.COB LED high efficiency and heat radiation can cause LED core
The reliability of piece and the improvement of colour consistency.Substrate 100 can also be arranged as allowing efficiently assembling main fin.In root
According in certain embodiments of the present invention, the feature that substrate 100 includes allows readily and efficiently to assemble it using machine tool
To fin.In other embodiments, circuit board can include allowing it to be efficiently and reliably welded to fin, such as through
Reflux technique, material.
The present invention can provide scalable LED array layout so that some embodiments can be luminous with as little as three
Device, and other may have up to tens or hundreds of luminescent devices.
It will be further understood that some of LED drive circuit 105 component can be assembled in substrate 100 discrete
Electronic package, to provide the multiple current shunting circuits for example assembled on the surface of substrate 100.It will be further understood that
Other electronic packages can be provided in substrate 100, to provide the remaining circuit included in solid luminous device 101.
According to Fig. 4 B, substrate 100 can be Metal Substrate multi-layer PCB, including for providing electronic component on the surface of substrate 100
The upper metal level of interaction between encapsulation.Lower metal（Or base）Layer 415 can be used in promoting to transmit from LED strip circuit 110
Heat, and can be with relative thick compared with upper metal level 405.Upper metal level 405 and lower metal layer 415 are by heat transfer insulating barrier 410
Separate, the heat transfer insulating barrier 410 can make metal level 405 with the electric insulation of lower metal layer 415 while still providing from LED
Serializer circuit 110 arrives the heat passage of lower metal layer 415.
So, lower metal layer 415 can provide the fin radiated from LED strip circuit 110.Entering one again according to the present invention
In the embodiment of step, secondary heat spreader can be attached to the lower surface of lower metal layer 415, to provide from LED strip circuit 110
Supplement heat transfer.
According in certain embodiments of the present invention, lower metal layer 415 can be the metal of such as aluminium, copper or beryllium oxide.
According in certain embodiments of the present invention, heat transfer insulating barrier 410 can be used as welding medium and the heat of heat transfer is led to
Road, and the filling substrate synthetic of upper insulating barrier between metal level 405 and lower metal layer 415 is provided.According to the present invention
Some embodiments in, the pyroconductivity of heat transfer insulating barrier 410 can be more than routine FR4 insulators about 4 times to about 16
Times.
Although Fig. 4 B show individual layer（On i.e.）Metal level 405, but other implementations according to the present invention can be also provided
Example, wherein additional signal layer are provided as a Metal Substrate PCB part.For example, according in certain embodiments of the present invention, it is attached
It can be provided in plus metal level 405 within thicker heat transfer insulating barrier 410, to provide in some implementations according to the present invention
Two layers or more many base printed circuit boards of layer in example.According in the present invention further embodiment, parasitic conduction is exhausted
Edge layer can be provided in the lower section of lower metal layer 415 so that lower metal layer 415 within metal base printed circuit board, rather than
On its surface exposed.
Substrate 100 thereon is assembled as by LED strip circuit 110 there is provided flexible printed circuit board according to Fig. 4 C.Heat is passed
Leading filler rod 417 can be embedded within substrate 100, close to LED strip circuit 110, be radiated with providing from LED strip circuit 110.
According in certain embodiments of the present invention, heat transfer filler rod 417 can be the metal of such as copper, aluminium or beryllium oxide.It can also make
Use other heat conducting materials.
Fig. 4 D be according in certain embodiments of the present invention, the exemplary electrical circuit substrate near symmetrical form factor
Plan.According to Fig. 4 D, six LED are assembled with the core 460 of substrate 100（It is used as a part for serializer circuit 110）,
Alternating-current voltage source input J1 is assembled with close at outer rim in substrate 100.As shown in Figure 4 D, according to the expectation light from device 101
Output, LED is in core 460 using the first layout.According in certain embodiments of the present invention, by the guarantor of substrate 100
Stay part 465 that multiple LED are separated with being assembled to remaining electronic building brick of substrate 100, wherein other electronic building bricks are only filled
Between the member-retaining portion 465 and the neighboring 470 that fit over substrate 100 in substrate 100.According to certain embodiments of the present invention
In, other electronic building bricks are assembled in member-retaining portion 465.
Referring still to Fig. 4 D, the example embodiment according to the present invention, LED center wherein in core 460 are constructed
Positioned at the center of substrate 100.Six XTE-HV that shown device is produced using North Carolina state Durham Cree companies
LED, about 2000 lumens are produced at about 85 degrees Celsius.The size of the diameter of core 460 about 21mm and whole plate is big
About 54mm × 60mm.The size of member-retaining portion 465 has 9.5mm again outside core 460.The total work provided to the device
Rate is about 31.4W, wherein about 20.6W is consumed by LED, the total power consumption of device 101 is 25.2W.
Fig. 4 E are the exemplary electrical circuits with another near symmetrical form factor according in certain embodiments of the present invention
The plan of substrate.According to Fig. 4 E, five LED are assembled with the core 460 of substrate 100（It is used as the one of serializer circuit 110
Part）, alternating-current voltage source input J1 is assembled with close at outer rim in substrate 100.As shown in Figure 4 E, according to from device 101
Expect light output, LED is in core 460 using the second layout.According in certain embodiments of the present invention, by substrate
100 member-retaining portion 465 separates multiple LED with being assembled to remaining electronic building brick of substrate 100, and wherein other electronic building bricks are only
Between the member-retaining portion 465 for the substrate 100 being only assembled in substrate 100 and neighboring 470.In some realities according to the present invention
Apply in example, other electronic building bricks are assembled in member-retaining portion 465.
Referring still to Fig. 4 E, the example embodiment according to the present invention, LED center wherein in core 460 are constructed
Positioned at the center of substrate 100.Five XTE-HV that shown device is produced using North Carolina state Durham Cree companies
LED, about 800 lumens are produced at about 85 degrees Celsius.The size of the diameter of core 460 about 16.1mm and whole plate is big
About 54mm × 54mm.The size of member-retaining portion 465 has 9.5mm again outside core 460.The total work provided to the device
Rate is about 13.9W, wherein about 9.5W is consumed by COB LED, the total power consumption of device 101 is 11.5W.
Fig. 5 A are plans, illustrate in the solid luminous device 101 in certain embodiments of the present invention, are included in
The LED strip circuit 110 and LED drive circuit 105 that are assembled in substrate 100 and including capacitor.It should be appreciated that shown in Fig. 5
LED drive circuit 105 can also include multiple shunt circuits described herein, and together with the limit that capacitor 310 works
Device circuit 305 is flowed, to provide the operation of LED strip circuit 110 described herein.It will be further understood that capacitor 310 can be filled
Shade may be incorporated among the light that solid luminous device 101 is sent with the profile for reducing capacitor 310 by fitting in substrate
Possibility.So, capacitor 310 can be located near the neighboring of substrate 100.
The size of substrate 100 can depend on different factors, such as the size and number of the chip on board assembled thereon
And change.For example, in certain embodiments, substrate can be approximate 33mm × 46mm rectangle.According to some of the present invention
In embodiment, the height that component can be presented in substrate is approximately equal to the height of capacitor 310.In some realities according to the present invention
Apply in example, the height that component can be presented in substrate approximately equal to 13.5mm.Other sizes can also be used for substrate 100.
Fig. 5 B are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan.According to Fig. 5 B, six LED are assembled with the lateral parts 560 of substrate 100（It is used as a part for serializer circuit 110）.
Just as shown in Figure 5 B, according to the expectation light output from device 101, LED is laid out in lateral parts 560 using first, and
Alternating-current voltage source input J1 is assembled with substrate 100 close at outer rim.According in certain embodiments of the present invention, by substrate
100 member-retaining portion 565 separates multiple LED with being assembled to remaining electronic building brick of substrate 100, and wherein other electronic building bricks are only
Between the member-retaining portion 565 for the substrate 100 being only assembled in substrate 100 and neighboring 570.In some realities according to the present invention
Apply in example, other electronic building bricks are assembled in member-retaining portion 565.
Referring still to Fig. 5 B, the example embodiment according to the present invention, LED center wherein in core 560 are constructed
Positioned at the top and bottom edge about 17.5mm from substrate 100, from right hand edge about 15.2mm.Shown device uses northern Caro
Six XTE-HV LED that Lai Na states Durham Cree companies produce, about 2000 lumens are produced at about 85 degrees Celsius.In
Center portion divides 560 diameter about 21mm and entirely the size of plate is about 71.3mm × 35mm.The size of member-retaining portion 565 is in
There is 9.5mm again outside center portion point 560.The general power provided to the device is about 31.4W, wherein about 20.6W is disappeared by LED
Consumption, the total power consumption of device 101 is 25.2W.
Fig. 5 C are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan.According to Fig. 5 C, five LED are assembled with the lateral parts 560 of substrate 100（It is used as a part for serializer circuit 110）.
Just as shown in Figure 5 C, according to the expectation light output from device 101, LED is laid out in lateral parts 560 using second, and
Alternating-current voltage source input J1 is assembled with substrate 100 close at outer rim.According in certain embodiments of the present invention, by substrate
100 member-retaining portion 565 separates LED with being assembled to remaining electronic building brick of substrate 100, wherein other electronic building bricks only by
Between the member-retaining portion 565 for the substrate 100 being assemblied in substrate 100 and neighboring 570.According to certain embodiments of the present invention
In, other electronic building bricks are assembled in member-retaining portion 565.
Referring still to Fig. 5 C, the example embodiment according to the present invention, LED center wherein in core 560 are constructed
Positioned at the top and bottom edge about 16.2mm from substrate 100, from right hand edge about 12.827mm.Shown device is blocked using north
Five XTE-HV LED that Luo Laina states Durham Cree companies produce, about 800 lumens are produced at about 85 degrees Celsius.In
Center portion divides 560 diameter about 16.1mm and entirely the size of plate is about 66.875mm × 32.4mm.The chi of member-retaining portion 565
It is very little to have 9.5mm again outside core 560.The general power provided to the device is about 13.9W, wherein about 9.5W quilts
LED is consumed, and the total power consumption of device 101 is 11.5W.
Fig. 5 D are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan.According to Fig. 5 D, it is assembled with the lateral parts 560 of substrate 100 single led（It is used as a part for serializer circuit 110）.
It is single led to be disposed in lateral parts 560 according to the expectation light output from device 101, and close to outer in substrate 100
Alternating-current voltage source input J1 is assembled with edge.According in certain embodiments of the present invention, by the member-retaining portion 565 of substrate 100
LED is separated with being assembled to remaining electronic building brick of substrate 100, wherein other electronic building bricks are only assembled in substrate 100
Substrate 100 member-retaining portion 565 and neighboring 570 between.According in certain embodiments of the present invention, other electronic building bricks
It is assembled in member-retaining portion 565.
In view of the description above with reference to Fig. 4 to Fig. 5, it will be appreciated that according in certain embodiments of the present invention, pass through
Change LED（Or according to the COB LED of specific embodiment）Quantity, type and layout the light output of wide scope can be provided.Example
Such as, using 4 XTE-HVLED（And driving LED electric current）Other embodiment can be provided and produce 600 lumens.According to this
In some embodiments of invention, 1000 lumens can be produced using 3 XTE-HV LED.The quantity and class of lumen and COB LED
Other combinations of type can be used for providing embodiments in accordance with the present invention.
So, embodiments in accordance with the present invention can provide relatively small substrate, and they do not include switch mode on plate
Power supply, but the light of the relative high brightness of transmitting.For example, according in certain embodiments of the present invention, substrate can be occupied about
3240mm2Or smaller area launches at least 2000 lumens simultaneously.In addition, according in certain embodiments of the present invention, by LED
（Or COB LED）The base part utilized can be about 1384mm2Or it is smaller.According in certain embodiments of the present invention,
LED（Or COB LED）About 40% or less of the whole area of substrate can be utilized.According in certain embodiments of the present invention,
With LED（Or COB LED）The adjacent member-retaining portion of the base part that utilizes can be the maximum sized length of substrate（That is length
Or width）About 16% or more.
According in further embodiment of the present invention, substrate can occupy about 2900mm2Or smaller area is simultaneously
Launch at least 800 lumens.In addition, according in certain embodiments of the present invention, by LED（Or COB LED）The basal part utilized
It can be about 814mm to divide2Or it is smaller.According in certain embodiments of the present invention, LED（Or COB LED）Base can be utilized
About 30% or less of the whole area in bottom.According in certain embodiments of the present invention, with LED（Or COB LED）The base utilized
Split-phase adjacent member-retaining portion in bottom can be the maximum sized length of substrate（That is length or width）About 18% or more.
According in further embodiment of the present invention, substrate can occupy about 3240mm2Or smaller area is simultaneously
Launch at least 2000 lumens.In addition, according in certain embodiments of the present invention, by LED（Or COB LED）The basal part utilized
It can be about 1384mm to divide2Or it is smaller.According in certain embodiments of the present invention, LED（Or COB LED）Base can be utilized
About 40% or less of the whole area in bottom.According in certain embodiments of the present invention, with LED（Or COB LED）The base utilized
Split-phase adjacent member-retaining portion in bottom can be the maximum sized length of substrate（That is length or width）About 13% or more.
According in further embodiment of the present invention, substrate can occupy about 2144mm2Or smaller area is simultaneously
Launch at least 800 lumens.In addition, according in certain embodiments of the present invention, by LED（Or COB LED）The basal part utilized
It can be about 814mm to divide2Or it is smaller.According in certain embodiments of the present invention, LED（Or COB LED）Base can be utilized
About 38% or less of the whole area in bottom.According in certain embodiments of the present invention, with LED（Or COB LED）The base utilized
Split-phase adjacent member-retaining portion in bottom can be the maximum sized length of substrate（That is length or width）About 14% or more.
Fig. 5 E are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan.According to Fig. 5 E, six LED are assembled with the lateral parts 580 of substrate 100（It is used as a part for serializer circuit 110）.
LED component can be the LED of North Carolina state Durham Cree companies product, be described in such as on 2 14th, 2011
No. 13/027,006, on the July 8th, 2011 No. 13/178,791 submitted and submit on May 20th, 2011 13/ submitted
In 112, No. 502 U.S. Patent applications, the disclosure of which is incorporated herein by reference.Just as shown in fig. 5e, according to from the device
Expectation light output, using the first layout in lateral parts 580, each of LED component includes respective time peace and tears base open
Platform 581 and respective lens 582.LED component is electrically coupled to remaining electronic building brick in substrate 100 by conductive lead wire 583.
According in certain embodiments of the present invention, multiple LED components are separated with remaining electronic building brick by the member-retaining portion of substrate 100,
Wherein other electronic building bricks are assembled in outside the member-retaining portion of the substrate 100 in substrate 100.In some realities according to the present invention
Apply in example, other electronic building bricks are assembled in member-retaining portion.
Fig. 5 F are the exemplary electrical circuit substrates with the approximate asymmetrical shape factor according in certain embodiments of the present invention
Plan.According to Fig. 5 F, five LED are assembled with the lateral parts 590 of substrate 100（It is used as a part for serializer circuit 110）.
LED component can be the LED of North Carolina state Durham Cree companies product, be described in such as on 2 14th, 2011
No. 13/027,006, on the July 8th, 2011 No. 13/178,791 submitted and submit on May 20th, 2011 13/ submitted
In No. 112,502 U.S. Patent applications.Just as illustrated in figure 5f, according to the expectation light output from the device, in lateral parts 590
In, each of LED component tears base station 591 and respective lens 592 open including respective peace.LED component is by conductive lead wire
593 are electrically coupled to remaining electronic building brick in substrate 100.According in certain embodiments of the present invention, by the guarantor of substrate 100
Stay part that LED component is separated with being assembled to remaining electronic building brick of substrate 100, wherein other electronic building bricks are assembled in substrate
Outside the member-retaining portion of substrate 100 on 100.According in certain embodiments of the present invention, other electronic building bricks are assembled in
In member-retaining portion.It will be further understood that the feature specifically shown in Fig. 5 E and Fig. 5 F, such as the secondary peace for respective LED
Tearing base station, conductive lead wire and remaining electronic building brick open can also be included in Fig. 4 to Fig. 5 D embodiment.
Fig. 6 to Fig. 8 is profile, is illustrated according to the side that solid luminous device is formed in certain embodiments of the present invention
Method.It is assembled according to Fig. 6, the chip on board LED included in LED strip circuit 110 in substrate 100.Onboard chip LED it
On be applied with encapsulating material 605.According in certain embodiments of the present invention, encapsulating material 605 provides covering LED and substrate
The pantostrat of part on 100 between several adjacent LEDs.So, encapsulating material 605 substantially can be applied to simultaneously with each other
These chip on boards LED.
It should be appreciated that encapsulating material 605 can be used on onboard chip LED forming lens.In certain according to the present invention
In a little embodiments, encapsulating material 605 can be molten including liquid silicone resin and/or liquid-state epoxy resin, and/or effumability
Agent material, such as alcohol, water, acetone, methanol, ethanol, ketone, isopropyl, hydrocarbon solvent, hexane, ethene, ethylene glycol, Methylethyl
Ketone with and combinations thereof.
According in further embodiment of the present invention, encapsulating material 605 extends in several adjacent panels between chip LED
Part can be retained in substrate 100 after the completion of assembling process, and according in certain embodiments of the present invention, from substrate
100 eliminate encapsulating material 605 between two parties.In other embodiments in accordance with the invention, encapsulating material 605 can include other
Material, such as light conversion material, diffusion material etc..
According to Fig. 7, mold 710 is set to be contacted with the encapsulating material 605 on chip on board LED.Mold 710 is in its lower surface
Including recess 711, the position of the recess is with that will place chip on board LED4 part opposition in substrate 100.Recess 711 has will be
The shape of lens is provided on chip on board LED.
Mold 710 can be adapted for selected encapsulating material 605（Such as silicones）Mold as conformal or other profiles
Any material of layer.According in certain embodiments of the present invention, mold 710 can be metal, such as aluminium.According to the present invention
Some embodiments in, mold 710 can be silicon or carborundum.Other materials is also used as mold 710.
Mold 710 can have the releasable material applied to it.Exactly, releasable material can be sprayed or with other
Mode is applied to the surface of mold 710, and substrate and chip on board LED are separated from the surface.Releasable material can will promote plate
Any material that upper chip LED and substrate are removed from mold 710.According in certain embodiments of the present invention, releasable material can
To be the delivery formulations of silicon resin base.
It should be appreciated that the encapsulating material 605 extended in substrate 100 in several adjacent panels between chip LED can be with
Relatively thin layer is depressed into, encapsulating material 605 can be also retained in substrate 100, although being not provided with as specific chip on board
LED lens component.
According to Fig. 8, each chip on board LED in substrate 100 be provided with by molding post package material 605 formed it is saturating
Mirror 815.According to the envelope between chip LED in the several adjacent panels that in certain embodiments of the present invention, can be removed shown in Fig. 8
Package material 605.It will be further understood that the extra play of encapsulating material 605 can be provided on lens 815, with to LED strip circuit
110 provide additional optical signature.After cast lens 815, additional discrete electronic component can be assembled in substrate 100
Encapsulation.For example the discrete electronic component for according in certain embodiments of the present invention, constituting LED drive circuit 105 be encapsulated in by
Encapsulating material 605 can be mounted to substrate 100 after foring lens 815.
Fig. 9 is profile, is illustrated according in certain embodiments of the present invention, and lens 815 are constituted and shape using mold
Into the method for solid luminous device 101.Exactly, mold 910 further comprises that discrete electronic component encapsulates recess 911, quilt
It is configured to accommodate the profile for the discrete electronic component encapsulation 905 assembled in substrate 100, these discrete electronic components encapsulate 905
Have in thereon outside the LED strip circuit 110 of encapsulating material 605.So, discrete electronic component encapsulation 905 can be with string electricity
Chip on board LED in road 110 is assembled in substrate 100 together.Then encapsulating material 605 can be applied to chip on board
LED, can be such that mold 910 is contacted with encapsulating material 605 to form lens 815 therewith, while by including discrete electronic component
Encapsulation recess 911 can avoid encapsulating discrete electronic component 905 damage.
Figure 10 to Figure 12 is profile, is illustrated according to forming solid luminous device in certain embodiments of the present invention
101 method.According to Figure 10 A, chip on board LED is assembled in substrate 100 and close in substrate 100 at least in part
Envelope agent barrier 1005 is surrounded.It should be appreciated that the upper surface of sealant barrier 1005 is less than the plate surrounded by sealant barrier 1005
The upper surface of upper chip LED.
Sealant material 1015 is dispensed on chip on board LED.According in certain embodiments of the present invention, spray is used
Mouth 1110 distributes sealant material 1015 on onboard chip LED.The allocated amount of sealant material 1015 is enough to provide
Each each lens 815 are formed on respective chip on board LED.According in certain embodiments of the present invention, nozzle 1110 is in plate
Move in sequence to be assigned on each respective chip on board LED sealant material 1115 above upper chip LED.Example
Such as, nozzle 1110 can be located above the Far Left chip on board LED in first position, so as to which sealant material 1115 is distributed
To being located exactly on the respective chip on board LED under nozzle 1110.
After sealant material 1115 is assigned with, nozzle 1110 is moved to tightly tight positioned at Far Left chip on board LED
The second place on the chip on board LED on adjacent right side.This process can be repeated, so as to which sealant material 1115 is distributed
On each chip on board LED included to serializer circuit 110.In other embodiments in accordance with the invention, multiple nozzles 1110
Scheduled position is at least two chip on board LED, and sealant material 1115 is substantially assigned to often simultaneously with each other therewith
On individual chip on board LED.
Sealant barrier 1005 is configured as limitation sealant material 1115 and is flowed on respective chip on board LED, so as to
Allow the lens 815 to be formed that there is intended shape 1105.It should be appreciated that as shown in Figure 10 B, for example sealant barrier 1005 is at least
Each respective chip on board LED can partly be surrounded.For example according in certain embodiments of the present invention, sealant barrier
1005 can surround respective chip on board LED completely.In other embodiments in accordance with the invention, sealant barrier 1005 can be with
Only partially surround chip on board LED.
According in certain embodiments of the present invention, sealant barrier 1005 can make periodic or acyclic
Gap is formed wherein, but still allows for forming the lens 815 with the intended shape 1105 for chip on board LED.Should also
Work as understanding, although sealant barrier 1005 is shown with substantial rectangular section, the close of other forms can be used
Seal agent barrier 1005.For example, sealant barrier 1005 can have semicircular in shape or provide enough surface tension other are several
What shape, facilitates shape 1105 when being assigned to so as to sealant material 1115 on chip on board LED.
According in certain embodiments of the present invention, sealant barrier 1005 can have limitation sealant material 1015 to flow
Dynamic any shape.For example, according in certain embodiments of the present invention, sealant barrier 1005 has square or rectangle week
Side shape is with least partially around chip on board LED.Also other shapes can be used.
Figure 12 is profile, it is shown that form the lens 815 with expectation profile 1105 afterwards from chip on board LED104
Surrounding removes sealant barrier 1005.Exactly, sealant barrier 1005 is capable of the basic place of onboard chip LED from lens
815 outer rims are etched, in the outer most edge formation recess 1205 of lens 815 at the surface of substrate 100.In some realities according to the present invention
Apply in example, sealant barrier 1005 is not removed from lens 815.
Figure 13 A are circuit theory diagrams, are illustrated according in certain embodiments of the present invention, being couple to LED strip circuit
LED drive circuit.Device 101 include series connection LED groups 110-1,110-2 ..., 110-N string 110.LED groups 110-1,110-
2nd ..., each of 110-N includes at least one LED.For example, these group each groups can include it is single led and/or
Each group can include multiple LED in a variety of in parallel and/or series arrangements.These LED groups can cloth in a number of different ways
Put and there can be multiple compensation circuits associated there, as in the issued for approval U.S. Patent application sequence for example entrusted jointly
(the agency's reel number of row number 13/235,103:5308-1459)；(the agency of U.S. Patent Application Serial Number 13/235,127
Reel number:Discussion in 5308-1461).
It is supplied to the power supply of LED strip 110 to come to be configured as coupling with AC power 10 and produce commutating voltage v from itR
With electric current iRRectifier circuit 105.Rectifier circuit 105 can be included in light-emitting device 101 and can also be coupled to
A part for the separate units of device 101.
Device 101 further comprises respective current shunting circuit 130-1, the 130- for being connected to the respective node of string 110
2、…、130-N.Current shunting circuit 130-1,130-2 ..., 130-N is configured to supply bypass LED groups 110-1,110-
2 ..., 110-N respective group of current path.Current shunting circuit 130-1,130-2 ..., 130-N each include quilt
Be configured to provide for the transistor Q1 of controlled current flow path, available for optionally bypass LED groups 110-1,110-2 ..., 110-N.
Transistor Q1 using transistor Q2, resistor R1, R2 ..., RN and diode D biasing.Transistor Q2 has been configured as diode
Effect, its base stage and collector terminal are connected to each other.The diode D of varying number is in current shunting circuit 130-1,130-
2nd ..., connected in 130-N respective circuit with transistor Q2 so that respective current shunting circuit 130-1,130-2 ...,
The base terminal of current path transistor Q1 in 130-N is biased with different voltage levels.Resistor R1, R2 ..., RN be used for limit
Current path transistor Q1 processed base current.Respective current shunting circuit 130-1,130-2 ..., 130-N current path it is brilliant
Body pipe Q1 is by different emitter bias closings, and this is determined by the electric current for flowing through resistor R0.So, current shunting circuit
130-1,130-2 ..., 130-N be configured to respond to LED groups 110-1,110-2 ..., 110-N is with commutating voltage VRRise
Operated with the transformation of the bias state of reduction so that LED groups 110-1,110-2 ..., 110-N is with commutating voltage vRRise and fall
And incrementally activate and disable.Current path transistor Q1 with LED groups 110-1,110-2 ..., 110-N bias state and
It is turned on and off.
As Figure 13 A are further shown, the strings 110 of the LED groups of series connection also coupled in series current limiter circuit, it is implemented as
Current mirror circuit 1420, although any kind of current limiter circuit can be used in an embodiment according to the present invention.One
Or multiple storages 310 and the strings 110 of LED groups and current mirror circuit 1420 connected it is in parallel.Current mirror circuit
1420 can be configured as the current limit of the string 110 of the LED groups via series connection being less than the specified electricity of supply serializer circuit 110
The amount of stream.
As Figure 13 A are further shown, it is brilliant that current mirror circuit 1420 is included in first connected in current mirror configuration
Body pipe Q1 and second transistor Q2 and resistor R1, R2, R3.Current mirror circuit 1420 can be provided approximately（VLED-0.7）/
(R1+R2) × (R2/R3) current limit.Such as Zener diode of voltage limiter circuit 1460 can also be provided, limited across one
Or the voltage that multiple storages 310 are formed.By this way, one or more storages 310 can be alternately
Charge and discharged via the string 110 of series LED group via rectifier circuit 105, illumination evenly can be so provided.Electric current
Mirror image circuit 1420 is coupled to LED groups 1410, and it is included among multiple LED groups of serializer circuit 110.It should be appreciated that LED
Group 1410 can include the multiple LED being connected in parallel to each other.
Figure 13 B to Figure 13 D are circuit theory diagrams, are illustrated in the current distributing electricity in certain embodiments of the present invention
Road.Exactly, the transistor Q2 shown in Figure 13 A as current shunting circuit 130-1 to a 130-N part is by Figure 13 B
Diode D substitutions into Figure 13 D, to provide enough biasings of the respective base stages of associated transistors Q1.In addition, current distributing is electric
Every grade of road 130-1 to 130-N all includes the diode D of respective amount, to provide the biasing otherwise provided by transistor Q2.Example
Such as, first order 130-1, which includes two diodes, is used to bias, and next stage 130-2 includes three diodes and is used to bias.Not only
In this way, every grade of 130-1 to the 130-N diode D that can share prime is used to bias.
Figure 13 E are circuit theory diagrams, are illustrated according in certain embodiments of the present invention, being couple to LED strip circuit
LED drive circuit.Figure 13 E show Figure 13 B to Figure 13 D current shunting circuit, for replacing current shunting circuit 130-1 extremely
130-N.According to Figure 13 E, in the first section, Q1 base voltage is approximately equal to the voltage drop of (D1+D2).In the second section
In, Q2 base voltage is approximately equal to the voltage drop of (D1+D2+D3).In N sections, QN base voltage is approximately equal to (D1
+ D2+ ...+DN) voltage drop.So, according in certain embodiments of the present invention, current shunting circuit can be made as two
Pole pipe array and triode block.According in certain embodiments of the present invention, diode array and transistor block can be integrated in
It can also be separated from each other together.
It will be appreciated that though the grade of term first, second can be used to describe multiple element herein, but these elements should not
When being limited to these terms.These terms are used only for distinguishing an element and another element.For example, the first element can be claimed
For the second element, equally, the second element can also be referred to as scope of first element without departing from present subject matter.As herein
Used, term "and/or" includes the one or more associated whichever for listing item combinations.
It should be appreciated that certain element is referred to as " connecting " or during " coupled " to another element, it can be directly connected to or coupling
Another element is connected to, element between two parties can be also there is.Arrived on the contrary, element is referred to as " being directly connected to " or " directly coupling "
During another element, then without element between two parties.
It should be appreciated that certain element or layer be referred to as another element or layer " on " when, the element or layer can directly exist
On another element or layer, element or layer between two parties can also be there is.On the contrary, certain element is referred to as " direct " in another yuan
When on part or layer, then without element or layer between two parties.As utilized herein, term "and/or" includes one or more associated
List item whichever combination.
Space relative terms, such as " being less than ", " ... under ", " under ", " being higher than ", " on " etc., herein available for easy
Description, so as to which the relationship description of an element or functional part and another element or functional part is shown in such as accompanying drawing.
It should be appreciated that space relative terms are intended to including the use of the different directions with equipment in operation in addition to the direction that accompanying drawing is described.
From beginning to end, similar reference represents similar element to this specification in accompanying drawing.
Plane is with reference to when the embodiment of present subject matter is described herein and perspective shows that they are the reasons of present subject matter
The signal displaying of wanting embodiment.Therefore, as the result of such as manufacturing technology and/or tolerance, exist from the change of temporary shape
It is expected that in.Therefore, present subject matter should not be considered limited to the concrete shape of the object shown herein, but should include example
Such as the deviation of the shape as caused by manufacture.Therefore, object shown in figure is in nature signal, and their shape is not
It is intended to show the true form in the region of device, and is not intended to limit the scope of present subject matter.
The purpose of terms used herein specific embodiment for illustration only and be not intended to limit present subject matter.Just
As used herein, " certain " of singulative and " described " is intended to also include plural form unless linguistic context is clearly dictated otherwise.Should
When further understanding, when herein using term " comprising " and/or "comprising", specify institute's features set forth, integer, step, operation,
The presence of element and/or component, but be not excluded for other one or more features, integer, step, operation, element, component and/
Or the presence or addition of its combination.
Unless otherwise defined, all terms used herein（Including technology and science term）All have with
Present subject matter those of ordinary skill in the art's is generally understood that identical meaning.It will be further understood that used herein
The meaning that should be interpreted as having of term it is consistent with their meanings in the linguistic context of association area and this specification, without
It should be explained in Utopian or excessively formal meaning, unless be clearly so defined herein.It is " many using term herein
It is individual " refer to two or more referenced items.
It should be appreciated that as utilized herein, term led can include light emitting diode, laser diode and/
Or including one or more semiconductor layers（Silicon, carborundum, gallium nitride and/or other semi-conducting materials can be included）, substrate（Energy
Enough include graphene, silicon, carborundum and/or other microelectronic substations）With one or more contact layers（Can include metal and/
Or other conductive layers）Other semiconductor devices.
In the accompanying drawings and the description, the typically preferred embodiment of present subject matter is had been disclosed for, it is special despite the use of
Fixed term, but they solely be used under common and describing significance rather than in order to limit purpose, the scope of present subject matter
Illustrated in following claims.
Claims (42)
1. a kind of solid luminous device, including：
On rectifier circuit, the surface for being assembled in the substrate being contained in the solid luminous device, it is couple to and is configured as
The alternating-current voltage source of rectified AC voltage is provided to the substrate；
On the string of LED group, the surface for being assembled in the substrate, it is one another in series and is couple to rectifier electricity
Power supply of the road without coupling switch mode between the rectifier circuit and the string of the LED groups, wherein the LED groups
String is disposed in the LED section of the substrate, and the LED section includes occupying the LED of the area of base 40% or less
Area, the string of the LED groups, which is configured as transmitting, includes the light of 800 lumens or more；And
On multiple current shunting circuits, the surface for being assembled in the substrate, respective current shunting circuit is coupled to described
The respective node of string, and be configured to respond to respective group of the bias state transformation of the LED groups and operate.
2. device according to claim 1, wherein, at least the multiple current shunting circuit includes being assembled on the substrate
Discrete electronic component encapsulation.
3. device according to claim 1, wherein, the LED in the string is included on the plate assembled on the surface of the substrate
Chip LED.
4. device according to claim 1, wherein, the substrate includes flexible circuit substrate, and described device further comprises：
In fin, the contrast surface for being assembled in the substrate, the string of the LED groups is thermally coupled to.
5. device according to claim 1, wherein, the substrate includes metal base printed circuit board MCPCB.
6. device according to claim 5, wherein, the MCPCB includes metal level, passes through insulating barrier and the surface of the substrate
The string for separating and being configured as from the LED groups transfers out heat.
7. device according to claim 5, wherein, the MCPCB includes the insulation between the first metal layer and second metal layer
Material.
8. device according to claim 7, wherein, the first metal layer include circuit layer and the second metal layer by with
The string being set to from the LED groups transfers out heat.
9. device according to claim 1, further comprises：
Current limiter circuit, on the surface of the substrate, connects with the rectifier circuit and at least one described LED group；With
And
At least one capacitor, on the surface of the substrate, across at least one described LED group and the current limiter circuit coupling
Connect.
10. device according to claim 9, wherein, the current limiter circuit is configured as optionally from rectifier electricity
Road is at least one described LED group and at least one described capacitor providing current.
11. device according to claim 1, further comprises：
Sealant layer, on the surface of the substrate, seals the string of the LED groups.
12. device according to claim 11, wherein, the sealant layer includes silicones.
13. device according to claim 1, further comprises：
Separated sealant layer, dividually seals the LED in the string of the LED groups.
14. device according to claim 1, wherein, the rectifier circuit and the multiple current shunting circuit all include
In the encapsulation of single IC for both device.
15. device according to claim 9, wherein, the rectifier circuit, the multiple current shunting circuit and the limit
Stream device circuit is all integrated in application specific integrated circuit.
16. device according to claim 1, wherein, the substrate includes silicon base, gallium nitride substrates, silicon carbide substrate or stone
Mertenyl bottom.
17. device according to claim 1, further comprises：
Sealant barrier, on the substrate, at least partially around the LED in described group, is configured as reduction and is applying close
The sealant material leaves the flowing of the LED during envelope agent material, to promote to form lens on the string of the LED groups.
18. device according to claim 17, wherein, the height of the sealant barrier is less than the LED on the substrate
Upper surface height.
19. device according to claim 1, wherein, the string of the LED groups at least includes three groups coupled in series with each other, institute
State every group of three groups two high-voltage LEDs for all at least including coupling parallel to each other.
20. device according to claim 1, wherein, the alternating-current voltage source at least includes 110 volts of exchanges.
21. device according to claim 1, wherein, the string of the LED groups at least includes three groups coupled in series with each other, institute
State every group of three groups two high-voltage LEDs for all at least including coupling in series with each other.
22. device according to claim 1, wherein, the alternating-current voltage source at least includes 220 volts of exchanges.
23. device according to claim 1, wherein, at least one set of of the string of the LED groups at least includes being connected in parallel to each other or connecting
Two high-voltage LEDs of coupling, and the alternating-current voltage source at least include 110 volts of exchanges or 220 volts of exchanges.
24. a kind of solid luminous device, including：
Rectifier circuit, is configured to couple to alternating-current voltage source to provide rectified AC voltage；
The string of the LED groups of series connection, be couple to the output of the rectifier circuit without the output in the rectifier circuit and
The power supply of switch mode is coupled between the string of the LED groups of the series connection；
At least one capacitor, is couple to the output of the rectifier circuit；
Current limiter circuit, including current mirror circuit, it is small to be configured as the current limit Jing Guo at least one LED group
In the electric current produced by the rectifier circuit, and in response to the rectification alternating current for the input for being applied to the rectifier circuit
Pressure, makes at least one described capacitor optionally be charged and via LED groups at least one described via the rectifier circuit
Electric discharge；
Multiple current shunting circuits, the respective node being couple in the string between LED and are configured to respond to institute
State the bias state transformation of LED groups described in the changes in amplitude of rectified AC voltage and selectively enable and disable；And
Substrate, with the first and second contrast surfaces, wherein, the going here and there of the LED groups of at least described series connection, the multiple current distributing
Circuit, the current limiter circuit and the rectifier circuit are assembled into the first or second contrast surface,
Wherein, the string of the LED groups of the series connection is disposed in the LED section of the described first or second contrast surface, the LED
Part includes occupying the LED area of the described first or second contrast surface 40% or less, the LED groups of the plurality of series connection
String be configured as transmitting include the light of 800 lumens or more.
25. device according to claim 24, wherein, the multiple current shunting circuit is each included：
There is provided the controllable current path between the terminal of the first node of the string and the rectifier circuit for transistor；With
And
Circuit is closed, the Section Point of the string and the control terminal of the transistor is couple to and is configured to respond to control
System inputs and controls the current path.
26. device according to claim 24, wherein, the LED in the string includes the chip on board assembled in the substrate
LED。
27. device according to claim 24, wherein, the substrate includes flexible PCB, and described device further comprises：
Fin, is assembled on the substrate, opposes and approach with the string of the LED groups.
28. device according to claim 24, wherein, the substrate includes metal base printed circuit board MCPCB.
29. device according to claim 28, wherein, the MCPCB includes metal level, passes through insulating barrier and the table of the substrate
The string that face separates and is configured as from the LED groups transfers out heat.
30. device according to claim 24, wherein, the substrate includes flexible printed circuit board.
31. device according to claim 24, wherein, at least the multiple current shunting circuit includes assembling on the substrate
Discrete electronic component encapsulation.
32. device according to claim 24, wherein, the string of the series LED group at least includes couple in series with each other three
Group, every group of described three groups all at least includes the two chip on board high-voltage LEDs coupled parallel to each other.
33. device according to claim 24, wherein, the alternating-current voltage source input at least includes 110 volts of exchanges.
34. device according to claim 24, wherein, the string of the series LED group at least includes couple in series with each other three
Group, every group of described three groups all at least includes chip LED on two hardboards coupling in series with each other.
35. device according to claim 24, wherein, the alternating-current voltage source input at least includes 220 volts of exchanges.
36. device according to claim 24, wherein, at least one set of of the string of the series LED group at least includes being connected in parallel to each other
Or chip LED on two hardboards of coupled in series, and the alternating-current voltage source at least includes 110 volts of exchanges or 220 volts are handed over
Stream.
37. a kind of printing board PCB, including：
Substrate, is configured as being included in solid luminescent housing, and the substrate has the first and second contrast surfaces, at least one
Contrast surface is configured as assembling multiple chip on board LEDs thereon, and the substrate is configured as coupling
To the alternating-current voltage source input from the solid luminescent hull outside without being inputted and described many in the alternating-current voltage source
The power supply of switch mode is coupled between individual chip on board LED, and is configured as assembling multiple discrete current shunting circuits thereon
Device, the current shunting circuit device be couple to the respective node between several LED and be configured to respond to
Be supplied to the LED rectified AC voltage changes in amplitude described in LED groups bias state transformation and be selectively enabled and
Disabling, wherein the multiple chip on board LED is disposed in the LED section of the first or second contrast surface of the substrate,
The LED section includes occupying the LED area of the described first or second contrast surface 40% or less, wherein on the multiple plate
Chip LED, which is configured as transmitting, includes the light of 800 lumens or more.
38. according to the PCB of claim 37, wherein, the substrate includes Metal Substrate PCB.
39. according to the PCB of claim 38, wherein, first contrast surface is described second including order wire circuit patterned layer
Contrast surface includes the foundation metal layer that thickness is more than the order wire circuit patterned layer, and the PCB further comprises passing described
Insulating barrier between conductive path patterned layer and the foundation metal layer.
40. according to the PCB of claim 37, wherein, the substrate includes flexible PCB.
41. according to the PCB of claim 40, further comprise：
Heat transfer filler rod in the substrate, opposes positioned at the position of the string with to assemble the chip on board LED groups thereon
Ad-hoc location.
42. according to the PCB of claim 37, further comprise：
Sealant barrier, from surface protrusion, at least partially around assembling at least one LED's on the surface
Position, is configured as reducing the flowing that the sealant material during sealant material is applied leaves the LED, to promote at least
The formation of lens on one LED.
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/192,755 | 2011-07-28 | ||
| US13/192,755 US8742671B2 (en) | 2011-07-28 | 2011-07-28 | Solid state lighting apparatus and methods using integrated driver circuitry |
| US13/235,127 | 2011-09-16 | ||
| US13/235,127 US9277605B2 (en) | 2011-09-16 | 2011-09-16 | Solid-state lighting apparatus and methods using current diversion controlled by lighting device bias states |
| US13/235,103 | 2011-09-16 | ||
| US13/235,103 US9131561B2 (en) | 2011-09-16 | 2011-09-16 | Solid-state lighting apparatus and methods using energy storage |
| US201161581923P | 2011-12-30 | 2011-12-30 | |
| US61/581,923 | 2011-12-30 | ||
| US13/360,145 | 2012-01-27 | ||
| US13/360,145 US9510413B2 (en) | 2011-07-28 | 2012-01-27 | Solid state lighting apparatus and methods of forming |
| PCT/US2012/047344 WO2013016122A1 (en) | 2011-07-28 | 2012-07-19 | Solid state lighting apparatus and methods of forming |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103907401A CN103907401A (en) | 2014-07-02 |
| CN103907401B true CN103907401B (en) | 2017-08-29 |
Family
ID=48482184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280044036.9A Active CN103907401B (en) | 2011-07-28 | 2012-07-19 | Solid luminous device and forming method |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2737780A1 (en) |
| CN (1) | CN103907401B (en) |
| TW (1) | TW201311053A (en) |
| WO (1) | WO2013016122A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9653671B2 (en) * | 2014-02-13 | 2017-05-16 | Infineon Technologies Ag | Light emitting device and method for operating a plurality of light emitting arrangements |
| IT201900005242A1 (en) * | 2019-04-05 | 2020-10-05 | St Microelectronics Srl | LIGHT EMISSION UNIT WITH FEATURES FOR THE PREVENTION OF FADING, AND METHOD FOR PREVENTING FADING |
| KR102192393B1 (en) * | 2019-12-09 | 2020-12-17 | 이경연 | Led system for vehicle lighting having high efficiency and high reliability |
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| JP2006040669A (en) * | 2004-07-26 | 2006-02-09 | Chichibu Fuji Co Ltd | Light source lighting circuit and light-emitting device equipped with the same |
| CN1943276A (en) * | 2004-02-25 | 2007-04-04 | 迈克尔·米斯金 | AC light emitting diode and AC led drive methods and apparatus |
| CN201396582Y (en) * | 2009-03-20 | 2010-02-03 | 凹凸电子（武汉）有限公司 | Portable illumination device |
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|---|---|---|---|---|
| US7482638B2 (en) * | 2003-08-29 | 2009-01-27 | Philips Lumileds Lighting Company, Llc | Package for a semiconductor light emitting device |
| US20100109537A1 (en) * | 2006-10-25 | 2010-05-06 | Panasonic Electric Works Co., Ltd. | Led lighting circuit and illuminating apparatus using the same |
| JP2008108564A (en) * | 2006-10-25 | 2008-05-08 | Matsushita Electric Works Ltd | Led lighting circuit, and luminaire using it |
| US8324642B2 (en) * | 2009-02-13 | 2012-12-04 | Once Innovations, Inc. | Light emitting diode assembly and methods |
| WO2011053708A1 (en) * | 2009-10-28 | 2011-05-05 | Once Innovations, Inc. | Architecture for high power factor and low harmonic distortion led lighting |
-
2012
- 2012-07-19 EP EP12817399.4A patent/EP2737780A1/en not_active Withdrawn
- 2012-07-19 WO PCT/US2012/047344 patent/WO2013016122A1/en active Application Filing
- 2012-07-19 CN CN201280044036.9A patent/CN103907401B/en active Active
- 2012-07-27 TW TW101127345A patent/TW201311053A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1943276A (en) * | 2004-02-25 | 2007-04-04 | 迈克尔·米斯金 | AC light emitting diode and AC led drive methods and apparatus |
| JP2006040669A (en) * | 2004-07-26 | 2006-02-09 | Chichibu Fuji Co Ltd | Light source lighting circuit and light-emitting device equipped with the same |
| CN201396582Y (en) * | 2009-03-20 | 2010-02-03 | 凹凸电子（武汉）有限公司 | Portable illumination device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103907401A (en) | 2014-07-02 |
| TW201311053A (en) | 2013-03-01 |
| WO2013016122A1 (en) | 2013-01-31 |
| EP2737780A1 (en) | 2014-06-04 |
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