CN105588958A - Rapid multifunctional electronic component temperature characteristic measuring instrument and testing cavity - Google Patents
Rapid multifunctional electronic component temperature characteristic measuring instrument and testing cavity Download PDFInfo
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- CN105588958A CN105588958A CN201610044767.3A CN201610044767A CN105588958A CN 105588958 A CN105588958 A CN 105588958A CN 201610044767 A CN201610044767 A CN 201610044767A CN 105588958 A CN105588958 A CN 105588958A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2605—Measuring capacitance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2611—Measuring inductance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2617—Measuring dielectric properties, e.g. constants
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2688—Measuring quality factor or dielectric loss, e.g. loss angle, or power factor
- G01R27/2694—Measuring dielectric loss, e.g. loss angle, loss factor or power factor
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention provides a rapid multifunctional electronic component temperature characteristic measuring device and instrument, and a testing cavity. Temperature characteristic curves of parameters such as capacitance, inductance, resistance, dielectric coefficients, dielectric loss, voltage-current curves and spontaneous polarization of a plurality of electronic components and material samples can be measured. The rapid multifunctional electronic component temperature characteristic measuring device and instrument and the testing cavity is small in size, light in weight, high in speed, high in automatic degree, multi-functional, high in precision and low in cost. The device, instrument and the testing cavity can be applied by an enterprise to rapidly detect temperature characteristics of electronic components, can also be used by scientific research laboratories to research temperature characteristics of specific parameters of the devices and the material samples, and can further be used in the aspect such as experiment demonstration and class teaching.
Description
Technical field
The present invention relates to electronic technology field, is a kind of quick multifunctional electronic devices and components temperature characteristic measuring instrument and surveyExamination cavity.
Background technology
Temperature, as important ambient parameter, directly affects the service behaviour of electronic devices and components, and most electronic equipments lost efficacyBecause excess Temperature causes, therefore the control of temperature and, the temperature drift characteristic of electronic devices and components parameter is called for short " temperature spyProperty " research very crucial for the reliability of system. For semiconductor element, temperature rise will make under transistorized maximum power dissipationFall, junction temperature raises, and can make P-N junction breakdown damage. The change of temperature can cause the inductance value of inductance and quality factor to change; LeadThe parameter such as capacity and dielectric loss angle of sending a telegraph appearance changes; Also can cause resistance to depart from nominal value. These often changeCause univers parameter and the performance of circuit and equipment that great change occurs, must give sufficient consideration in the design phase. MakeBefore element, also need to understand rapidly and accurately the temperature characterisitic of element, could effectively improve the reliability of equipment. In addition,Dielectric coefficient and the loss of the magnetic induction intensity of temperature to the polarization intensity such as ferroelectric material, ferromagnetic material, dielectric material are equalThere is significant impact.
Understanding and the affect rule of research temperature on electronic devices and components parameter, is most of Electronic Components Manufacturing and useEnterprise, an indispensable job of scientific research institutions, therefore, relevant equipment has also caused people's extensive concern.
REF01: patent of invention " dielectric material and components and parts new testing device for temperature properties " CN85102036A discloses oneDevice, can measuring media material and equiva lent impedance, capacitance, inductance value, loss angle tangent, the equivalent series resistance of components and partsDeng the temperature characterisitic of electrical parameter. This device is by thermode, test chamber and can in Range of measuring temp, keep impedance constantTest transmission line composition. Wherein, thermode adopts the temperature control method of resistance heated and liquid nitrogen refrigerating; Test chamber by adopt everyHot material, stops cross-ventilation and reduces and leak heat, and cavity volume is reduced, Energy Intensity Reduction, laying temperature probe in test chamberFor measuring and control cavity temperature; Adopt the wire that temperature coefficient is very little that the upper/lower electrode of article to be measured is connected to outside surveyExamination equipment by changing cavity temperature, uses external test facility to measure the relevant parameter of article within the walls simultaneously, has realized being situated betweenThe temperature characteristic measuring of the relevant parameter of material and components and parts.
REF02: use new patent " a kind of electronic material electrical property new testing device for temperature properties " (CN203688602U)Disclose a kind of electronic material electrical property new testing device for temperature properties, comprised specimen holder device, power supply and test controller, adoptedLiquid nitrogen refrigerating mode and resistance-type mode of heating, realize the temperature control scope of-190 ~ 280 DEG C; Design Novel specimen clamping apparatus,By spring, sample can be pressed on sample bench, guarantee to patch well, and can adapt to the sample of different size. AdoptWith single-chip microcomputer, realize heated for controlling temperature by the make-and-break time of controlling solenoid control heater strip; Utilize the AD conversion merit of single-chip microcomputerCan, read the voltage signal that temperature information and electronic material sample produce, measurement result is presented on LCDs.
REF03: patent of invention " a kind of resistance temperature characteristic test device " CN104698281A discloses a kind of resistance temperatureDegree characteristic test device, comprises attemperator, power constant current source, controller and testing sensor. Adopt vacuum chamber heat preserving mode;Adopting power constant current source is directly heating of sample itself, by sensor measurement temperature, by measuring sample both end voltage and warpThe resistance of the Current calculation sample of crossing, realizes the measurement to sample resistance under specified temp, by measuring different temperature spotsAnd the measurement of realization to resistance-temperature characteristic.
REF04: patent of invention " structure of test MOS device temperature characterisitic and method " CN102841300B discloses oneThe structure of test MOS device temperature characterisitic and method. Be MOS device and the PN junction heating for proofreading and correct by heating arrangement, logicalCross PN junction electric current and calibrate, by changing voltage or the Current Control temperature at heating arrangement two ends, simultaneously at each temperature spotGrid, drain electrode, substrate and source electrode to MOS device applies voltage and measures corresponding electric current, thereby obtains the temperature of MOS deviceCharacteristic.
In addition, also have multiple patents to disclose the temperature of the components and parts such as gaging pressure sensor, thermistor and tunerCharacteristic.
But the equal Shortcomings part of above-mentioned technical scheme, is described below:
The invention of describing in 1.REF01, the amount that can measure is relatively many, but can not measure such as triode, metal-oxide-semiconductor and ICEtc. the temperature characterisitic of the parameter of many pins device; Be liquid nitrogen refrigerating due to what adopt, Whole Equipment volume is larger, and portability is notGood; Be limited to the technical merit in epoch of living in, the temperature characterisitic of the parameter of surveying, all need to be manual under each design temperature pointMeasure, fail automatically to complete data collection record.
The described invention of 2.REF02, only relates to both-end element, and due to the restriction of Chip Microcomputer A/D converter, measuresFunction and accuracy rating are all more limited, adopt solenoid control mode of heating, have determined that the response speed of heating, refrigeration can compareSlower, the liquid nitrogen cooling adopting and resistance heated mode, also determined that the volume of equipment is larger, not portable. In addition, this inventionThere is no the extensibility of embodiment device.
The described invention of 3.REF03 is only measured for resistance-temperature characteristic, and heater element is testing resistance itself, savesHeating mechanism, but also there is larger limitation simultaneously, such as for the higher resistance of impedance, the output electricity of its constant-current sourcePressing can be very high, and power output is limited, and its heating-up temperature scope also can be restricted; Its type of cooling is that nature is cooling, causesSystem response time can be very slow. This invention only limits to measure the temperature characterisitic of the lower resistive element of impedance.
The described invention of 4.REF04 is to design for measuring MOS device specially, and itself does not possess extensibility,Do not consider refrigeration mechanism.
Existing majority, about measuring the invention of components and parts temperature characterisitic and the document of delivering, all concentrates on and considers to measure certainPlant the temperature characterisitic of certain special parameter of particular element, in the extensibility of function and the expanding of certainty of measurement of equipmentProperty aspect, does not have too much consideration.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of this invention is to provide a kind of quick multifunctional electronic devices and components temperatureCharacteristic test cavity.
In order to overcome the deficiencies in the prior art, another object of the present invention is to provide the first device of a kind of quick multifunctional electronicsPart temperature property test instrument.
The technical solution adopted in the present invention is:
A kind of quick multifunctional electronic devices and components temperature property test cavity, the enclosed construction that described test cavity is a hollow is establishedBe equipped with separable chamber top cover, described test cavity comprises:
Radiator, is used to the heat radiation of temperature control structure;
Temperature control structure, for controlling test cavity internal temperature;
Element under test support, for connecting corresponding element under test;
Quick terminal, for connecting and fixing element under test support, is connected to inner parameter by element under test pin and measuresModule;
Insulating, for isolated cavity surrounding and chamber top cover and extraneous exchange heat;
Two temperature sensors of high precision, are respectively used to measure upper surface and the underlaying surface temperature of element under test;
Two single line temperature sensors, for measuring spreader surface temperature and environment temperature;
Compactor, for compressing element under test in element under test support;
Described radiator is arranged on the lower end of test cavity, and described temperature control structure is arranged at the upper end of radiator, described fastPrompt binding post and element under test support are arranged on temperature control structure upper end, and quick terminal and element under test support are mutualConnect, described insulating is arranged on the upper end of radiator, and around being arranged in test cavity inside side walls and can dividingFrom chamber top cover inner side, setly state that temperature sensor is separately positioned on temperature control structure and compactor props up near element under testOn frame one end.
Preferably, described temperature control structure comprises: the semiconductor cooler that sets gradually from the bottom to top, be arranged on partly and leadRed copper heat-conducting layer, the thermal insulation layer of body refrigerator upper end, temperature control structure bottom is closely connected with radiator, describedly partly leadsBody refrigerator is single or multiple lift structure.
Preferably, described quick terminal, comprises and the built-in terminal of one group of 3 pin adopts built-in connection connection,Element under test pin is connected to inner inner parameter measurement module.
Preferably, also comprise external equipment connecting interface, be positioned at chamber outer wall, comprise 3 bnc interfaces and one 12 mouthfulsIDC socket, is connected with the quick of testing sample pin for realizing external equipment.
Preferably, described quick terminal, also comprises the external terminal of one group of 3 pin, adopts outside connecingMethod, is connected to element under test pin the external equipment connecting interface of chamber outer wall, thereby can be connected to external measurement devicesOn; The external interface of one group of 12 pin is for component pin being connected to the external test interface of 12 pin of chamber outer wall, logicalCrossing this joint is connected with external test facility.
Preferably, described test chamber body sidewall is respectively arranged with air inlet and gas outlet on relative two ends, air inlet andGas outlet is all with valve switch.
Preferably, described test chamber body sidewall is provided with humidity sensor, for humidity and humidity in Real-Time Monitoring chamberControl.
Preferably, described elastic compression device, one end is fixed on the top cover of chamber by screw, when placing after testing sample, pressesThe other end of tight device applies a flexible thrust to testing sample and specimen holder, makes it to be close to temperature control structure.
A kind of quick multifunctional electronic devices and components temperature property test instrument, comprises controller, and arbitrary institute in above-mentionedThe test cavity of stating;
Described controller comprises: single-chip microcomputer, H bridge power control module, single line temperature sensor, four line temperature measurement modules, inner ginsengNumber measurement module, memory module and communication interface; The control end of H bridge power model is connected with single-chip microcomputer pin, H bridge power modelOutput is connected with described temperature control structure, for refrigeration being provided or heating required electric current; Single line temperature sensorFPDP is directly connected with single-chip microcomputer, for measuring the temperature of environment temperature and radiator in cavity; Two four line thermometric mouldsThe input of piece is connected with described two temperature sensors of high precision, and output is connected with single-chip microcomputer pin; Inner parameter is measured3 inputs of module are connected with three interior connecting terminals in the quick terminal in cavity, output and single-chip microcomputer pinBe connected, memory module is connected with single-chip microcomputer, for storing data; Described communication interface is serial ports and USB interface, for calculatingMachine carries out exchanges data.
Preferably, the control end of described H bridge power model is connected with single-chip microcomputer pin, by two pwm pulses of single-chip microcomputerSignal output pin determines heating or refrigeration.
Compared with prior art, the invention has the advantages that: multi-functional, can measure the multiple ginseng of Various Components and sampleThe temperature spy of number (as capacitance, inductance value, resistance value, dielectric coefficient, dielectric loss, voltage-to-current curve, spontaneous polarization etc.)Property; Equipment volume is little, owing to adopting semiconductor refrigerating technology, equipment volume is greatly reduced than liquid nitrogen cooling, conveniently takesBand, demonstration; Strong adaptability, by adopting suitable testing sample support, can meet different large small samples, different number of pinsMeasurement requirement; Use cost is low, and reaction fast; Extensibility is strong, can work alone, and also can combine multiple special equipmentCollaborative work, adapts to multiple measurement demand and required precision; Automaticity is high, sets according to user, can automatically surveyAmount and data acquisition; Intelligence, can carry out correct measurement operation according to environment temperature and humidity prompting user.
Brief description of the drawings
Fig. 1 is test chamber body structure schematic diagram of the present invention;
Fig. 2 is the connection diagram of main body combined calculation machine of the present invention and the collaborative work of external testing instrument;
Fig. 3 connects with controller the resistance temperature characteristics that thermometric cavity is measured in the present invention.
Fig. 4 is the temperature characteristics that adopts computer control external measurement devices testing capacitor in the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation. Should be appreciated that this placeDescribe specific embodiment only for explaining invention, and be not used in limit invention.
As shown in Figure 1, 2, the application provides a kind of quick multifunctional electronic devices and components temperature property test cavity and instrument,Comprise test cavity and controller 22, the enclosed construction that described test cavity is a hollow is provided with separable chamber top cover 9, instituteStating test cavity comprises:
Radiator 1, is used to the heat radiation of temperature control structure;
Temperature control structure, comprises semiconductor cooler 2, and red copper heat-conducting layer 4 and thermal insulation layer 6, for controlling test cavityInternal temperature;
Element under test support 13, for connecting corresponding element under test;
Quick terminal (10,14), for connecting and fixing element under test support 13, is connected to inside by element under test pinParameter measurement module;
Insulating (3,8), for isolated cavity surrounding and separable chamber top cover 9 and extraneous exchange heat;
Two temperature sensors of high precision (5,12), are respectively used to measure upper surface and the underlaying surface temperature of element under test;
In two single line temperature sensor figure, there is not sign, for measuring radiator 1 surface temperature and environment temperature;
Compactor 11, for compressing element under test in element under test support 13;
Described radiator 1 is arranged on the lower end of test cavity, and described temperature control structure is arranged at the upper end of radiator 1, described inQuick terminal 10 and element under test support 13 are arranged on temperature control structure upper end, quick terminal 10 and element under testSupport 13 interconnects, and described insulating 3 is arranged on the upper end of radiator 1, and around be arranged on test cavity inside sideTop cover 9 inner sides, on wall and separable chamber, the set temperature sensor 5 of stating is separately positioned on temperature control structure and compactorOn element under test support one end.
Described controller 22 comprises: single-chip microcomputer, and H bridge power control module, single line temperature sensor, four line temperature measurement modules,Inner parameter measurement module, memory module and communication interface; The control end of H bridge power model is connected with single-chip microcomputer pin, H bridge meritRate module output is connected with described temperature control structure, for refrigeration being provided or heating required electric current; Single line temperature passesThe FPDP of sensor is directly connected with single-chip microcomputer, for measuring the temperature of environment temperature and radiator in cavity; Two four linesThe input of temperature measurement module is connected with described two temperature sensors of high precision 5, and output is connected with single-chip microcomputer pin; Inner ginseng3 inputs of number measurement modules are connected with three interior connecting terminals in the quick terminal in cavity, output and monolithicPower traction pin is connected, and memory module is connected with single-chip microcomputer, for storing data; Described communication interface is serial ports and USB interface, forCarry out exchanges data with computer.
Controller also disposes: keyboard, and LCD display, keyboard is directly connected with single-chip microcomputer input and output pin with LCD,User inputs corresponding instruction and data from keyboard, and relevant parameter is presented on LCD.
Radiator 1 comprises fan and fin composition, in fan provide drive current by controller 22, and control it and turnSpeed, the while is by the temperature on single line temperature sensor monitors radiator 1 surface in controller 22. Temperature control structure is by controllerH bridge power model in 22 drives, and H bridge power model can provide forward current refrigeration and reversing the current for temperature control structureHeating, controlling party, to depending on the single-chip microcomputer in controller 22 with power output, is 8-16 position by single-chip microcomputer output accuracy, adjustableThe square-wave pulse of width, guarantees that 2 provide the temperature range of-50 DEG C-150 DEG C for testing cavity; Insulating 3 is by outside stainless steelThe good inner lining material of wall and heat-proof quality and ductility composition, forms firm test chamber outer wall and supports, simultaneously isolated withExtraneous exchange heat, the power consumption of reduction temperature control structure, the stability of guarantee cavity temperature; Described temperature control structure bagDraw together: the semiconductor cooler 2 setting gradually from the bottom to top, semiconductor cooler 2, according to refrigeration requirement, can adopt individual layer and manyLayer structure; Be arranged on red copper heat-conducting layer 4, the thermal insulation layer 6 of semiconductor cooler 2 upper ends, half of temperature control structure bottomConductor refrigerator 2 is closely connected with radiator. Red copper heat-conducting layer 4 is by the heat Quick uniformization on temperature control structure surface biographyLead inside cavity; PT100 temperature sensors of high precision 5 is buried in thermal insulation layer 6, approaches testing sample, connects and controlsFour line thermometric moulds of device 22, accurately measure the underlaying surface temperature of sample; Thermal insulation layer 6 be one insulation and heat conductivility is goodThin layer, be mainly used in fixing temperature sensors of high precision 5, isolated measuring-signal is to temperature sensors of high precision 5 and heat insulation guarantorImpact between temperature layer 3, does not affect the transmission of heat simultaneously; Gas atmosphere inlet 7 is dry for input in the test chamber to airtightDry non-oxidizing gas (as nitrogen, argon gas etc.) by heating cavity, makes the gas that enters cavity pass through protective gas simultaneouslyOutlet 17 is discharged, and takes away oxygen and moisture in cavity simultaneously, and to realize better measurement effect, gas access 7 and gas go outMouth 17 is all furnished with hand switch, when not enabling, is defaulted as and closes; Insulating 8 is the good material of heat-insulating property, withSeparable chamber top cover 9 is combined as a whole, the place of being combined with test chamber edge, and design adds a heat insulation silica gel close to guaranteeFeng Xing, separable chamber top cover 9 is made up of stainless steel material, can realize with cavity insulating 3 by compactor 15Rapid sealing combination; Quick terminal 10 and quick terminal 14 comprise three groups of binding posts, and the first is by 3 contact setsBecome (1+2, goes up in (10) for one, and two on (14)), be connected to the inner parameter measurement module of controller 22 inside; Second groupBy 3 contacts form (2+1, two on quick terminal 10, one on quick terminal 14), be connected to outside cavity3 BNC connectors in the external equipment connecting interface 18 of wall; The 3rd group is made up of 12 contacts that (5+7, two in quick wiringOn terminal 10, one misplugs preventing on quick terminal 14), be connected to 12 in external equipment connecting interface 18On pin external interface, for expanding measurement, joint and connecting line all adopt the minimum material of temperature coefficient, avoid test resultImpact, for the high measurement occasion of required precision, automatically test result is entered according to the temperature drift data of connecting lineThe corresponding compensation of row, with the accuracy of guaranteeing to measure; Element under test support element under test support 13 is for placing and fixing variousElement under test, type and measurement requirement, arrange multiple different survey element bracket 13 per sample. By selecting element under test to prop upFrame 13 and installation method thereof, can set sample parameters and be tested by parameter-embedded measurement module, or be established by externally measuredStandby 20 test. In the time that sample pin exceedes 3, adopt with the survey element bracket 13 of 12 needle interfaces and by externally measuredEquipment 20 is measured. Heat conductive insulating compactor 11 tops with spring are connected with top cover, are embedded with PT100 high accuracy at its endTemperature sensor 12, built-in spring, can compress testing sample by spring, simultaneously in the situation that compressing, high-precision temperatureSensor 12 is close to the upper surface of element under test, upper surface temperature that can Measurement accuracy element under test; User can be according to needWant, select to control cavity temperature by temperature sensors of high precision 5 or temperature sensors of high precision 12 as feedback signal, withTime the measuring process also temperature of recording element upper and lower surface automatically. Humidity sensor 16 is measured the humidity in chamber, surveysBefore amount, if detect that humidity is excessive, carry out dehumidification operation by LCD interface reminding user, user is by opening 7 and 17Valve, passes into dry nitrogen to 7, and enters dehumidification mode by keyboard to set up, and controller 22 can be controlled temperature control structuresCarry out heating and dehumidification to humidity and reach requirement, finish dehumidification operation by LCD reminding user.
Element under test support 13 quick terminal computers 19 are for management and the control of whole measuring system, computerBe connected with the controller 22 of apparatus of the present invention by RS232 interface or USB interface, by GPIB or USB interface and externalTesting equipment external test facility 20 connects. External test facility 20 comprises and is not limited only to source table, electric impedance analyzer, semiconductorThe equipment such as characteristic analysis system, ferroelectric analyzer, logic analyser, mainly meet two requirements: (a) can enter by computerRow is controlled and data acquisition, (b) can be wired to element under test or the sample in test chamber and measure its certain seed ginsengNumber, and this parameter is to responsive to temperature; Selecting connected mode be external in the situation that, described external test facility 22 passes through instituteThe external equipment connecting interface 18 of the test cavity of stating, is connected in the respective pins of element under test, synchronously controls by computerMake the temperature of described test cavity, enable the corresponding test function of external test facility simultaneously, realize at different temperature conditionsUnder, certain parameter (as electric capacity, resistance etc.) to element under test is measured, thereby forms the temperature characteristics of this parameter.Can obtain probe temperature and this element measured parameter value at this temperature at computer terminal, show by graphic interface,And can export as text document. ; Test cavity 21 is the cavity shown in Fig. 1; The control system that controller 22 is apparatus of the present inventionSystem, comprises single-chip microcomputer, keyboard, and LCD, H bridge power control module, switch power module, single line temperature sensor, four lines are surveyedTemperature module and inner parameter measurement module etc.
Embodiment mono-: controller 22 connecting test cavitys 21 are measured
Testing sample pin is less than at 4 o'clock, and user, according to testing sample or component size size, selects suitable element under test support13, be arranged on element under test support 13, element under test support 13 is inserted into the quick terminals in test cavity 21Son (10,14) is upper, builds separable chamber top cover 9 and detains compactor 15, confirms that by LCD equipment is in normal operating conditions,If it is excessive to detect humidity, reminding user carries out dehumidification operation. User inputs by keyboard, selects to need the parameter of measurement,Design temperature parameter, sets test signal parameter etc., then opens and measures. The temperature control that controller 22 can be set according to userThe temperature of test cavity 21, and open parameter-embedded measurement module on the temperature spot of setting, to the relevant ginseng of element under testNumber is measured, and last measurement result is kept in the memory module of controller 22. Fig. 3 is in this situation, measures nominal resistanceBe respectively 1k ohm, the resistance that precision is ± 1% and 6.25k ohm, the temperature characterisitic of the resistance of the resistance that precision is ± 0.01%Curve.
Embodiment bis-: computer 19 connects controller 22 connecting test cavitys 21 and measures
Testing sample pin is less than at 4 o'clock, and user, according to testing sample or component size size, selects suitable specimen holder unit to be measuredPart support 13, is arranged on element under test support 13, and element under test support 13 is inserted into fast in test cavity (21)Prompt binding post (10,14) is upper, builds the separable chamber of top cover top cover 9 and buckles well compactor 15, special by computerControl program, confirms that controller 22 and test cavity 21 are in normal operating conditions, if it is excessive to detect humidity, and reminding userCarry out dehumidification operation. User, by computer program interface, selects to need the parameter of measurement, and design temperature parameter is set testSignal parameters etc., then open and measure. The temperature of the temperature control test cavity 21 that controller 22 can be set according to user, andOn the temperature spot of setting, open parameter-embedded measurement module, the relevant parameter of element under test is measured, measurement result is realTime be transferred to computer, computer, according to the test result data getting, draws " temperature-measured parameter " in graphic interfaceCurve, can save as text by data simultaneously.
Embodiment tri-: computer 19, external measurement devices 20 are carried out combined measurement with controller 22 and test cavity 21
Testing sample pin is less than at 4 o'clock, and user, according to testing sample or component size size, selects suitable specimen holder unit to be measuredPart support 13, is arranged on element under test support 13, and element under test support 13 is installed to fast in test cavity (21)Prompt binding post (10,14) is upper, selects the external mode of " 2+1 " recited above when installation, is connected to the outside of chamber outer wallOn three bnc interfaces on equipment connection interface; Testing sample pin is greater than 3, is less than at 13 o'clock, and user is according to testing sample or unitPart size, the specimen holder element under test support 13 of selecting support 12 pins to connect, is arranged on element under test support 13,Element under test support 13 is installed on the quick terminal (10,14) in test cavity (21), builds top, separable chamberLid 9 is also buckled well compactor 15. External measurement devices 20 is connected with computer by USB mouth, serial ports or GPIB mouth, 20 testInput port be less than at 4 o'clock with the BNC pin to be measured in the external equipment connecting interface of test on cavity 21 or 12 needle interfaces to be measuredPin is greater than 3 and is less than at 13 o'clock. The external testing that the special control program of user on computer 19 selects confirmation to connect is establishedStandby, then computer 19 confirms that external measurement devices is in normal operating conditions, then confirms controller 22 and test cavity 21 placesIn normal operating conditions, more then detect humidity, if humidity is excessive, reminding user carries out dehumidification operation. User is by meterCalculation machine program interface, selection needs the parameter of measuring, and design temperature parameter is set test signal parameter etc., then opens measurement.The temperature of the temperature control test cavity 21 that controller 22 can be set according to user is passed temperature data back computer 19 simultaneously,Computer 19 sends instruction to external test facility 20 on the temperature spot of setting, and opens the measurement function of setting, to unit to be measuredThe relevant parameter of part is measured, and measurement result is returned to computer 19 in real time, and computer 19 is according to the test gettingResult data draws " temperature-measured parameter " curve in graphic interface, data can be saved as to text simultaneously.
Fig. 4, for adopting computer (19) to control external measurement devices (20) (HP4284 electric impedance analyzer), tests cavity(21) and controller (22) combined measurement nominal value be the temperature characteristics of the electric capacity of 8.2nF and 10pF.
Claims (10)
1. a quick multifunctional electronic devices and components temperature property test cavity, is characterized in that, described test cavity is in oneEmpty enclosed construction is provided with separable chamber top cover, and described test cavity comprises:
Radiator, is used to the heat radiation of temperature control structure;
Temperature control structure, for controlling test cavity internal temperature;
Element under test support, for connecting corresponding element under test;
Quick terminal, for connecting and fixing element under test support, and transmits the detecting information of element under test;
Insulating, for isolated cavity surrounding and chamber top cover and extraneous exchange heat;
Two temperature sensors of high precision, are respectively used to measure upper surface and the underlaying surface temperature of element under test;
Two single line temperature sensors, for measuring spreader surface temperature and environment temperature;
Compactor, for compressing element under test in element under test support;
Described radiator is arranged on the lower end of test cavity, and described temperature control structure is arranged at the upper end of radiator, described fastPrompt binding post and element under test support are arranged on temperature control structure upper end, and quick terminal and element under test support are mutualConnect, described insulating is arranged on the upper end of radiator, and around being arranged in test cavity inside side walls and can dividingFrom chamber top cover inner side, setly state that temperature sensor is separately positioned on temperature control structure and compactor props up near element under testOn frame one end.
2. quick multifunctional electronic devices and components temperature property test cavity according to claim 1, is characterized in that, described inTemperature control structure comprises: the semiconductor cooler setting gradually from the bottom to top, the red copper that is arranged on semiconductor cooler upper endHeat-conducting layer, thermal insulation layer, temperature control structure bottom is closely connected with radiator, and described semiconductor cooler is individual layer or manyLayer structure.
3. quick multifunctional electronic devices and components temperature property test cavity according to claim 1, is characterized in that, described inQuick terminal, comprise and the built-in terminal of one group of 3 pin adopt built-in connection connection, be located at inside cavity, for connectingComponent pin and output data are surveyed in reception.
4. quick multifunctional electronic devices and components temperature property test cavity according to claim 3, is characterized in that, also bagDraw together external equipment connecting interface, be positioned at chamber outer wall, the IDC socket that comprises 3 bnc interfaces and 12 mouthfuls, outside realizingPortion's equipment is connected with the quick of testing sample pin.
5. quick multifunctional electronic devices and components temperature property test cavity according to claim 4, is characterized in that, described inQuick terminal, also comprise the external terminal of one group of 3 pin, adopt the outside connection that connects, element under test pin is connectedReceive the external equipment connecting interface of chamber outer wall; The external interface of one group of 12 pin, for being connected to chamber by component pinThe external equipment connecting interface of external wall.
6. quick multifunctional electronic devices and components temperature property test cavity according to claim 1, is characterized in that, described inTest chamber body sidewall is respectively arranged with air inlet and gas outlet on relative two ends, and all open with valve air inlet and gas outletClose.
7. quick multifunctional electronic devices and components temperature property test cavity according to claim 1, is characterized in that, described inTest chamber body sidewall is provided with humidity sensor, for humidity in Real-Time Monitoring chamber and humidity control.
8. quick multifunctional electronic devices and components temperature property test cavity according to claim 1, is characterized in that, described inCompactor, one end is fixed on the top cover of separable chamber by screw, and when placing after testing sample, the other end of compactor is treatedTest sample product and specimen holder apply a flexible thrust, make it to be close to temperature control structure.
9. a quick multifunctional electronic devices and components temperature property test instrument, is characterized in that, comprises controller, and rightRequire the arbitrary described test cavity of 1-8;
Described controller comprises: single-chip microcomputer, H bridge power control module, single line temperature sensor, four line temperature measurement modules, inner ginsengNumber measurement module, memory module and communication interface; The control end of H bridge power model is connected with single-chip microcomputer pin, H bridge power modelOutput is connected with described temperature control structure, for refrigeration being provided or heating required electric current; Single line temperature sensorFPDP is directly connected with single-chip microcomputer, for measuring the temperature of environment temperature and radiator in cavity; Two four line thermometric mouldsThe input of piece is connected with described two temperature sensors of high precision, and output is connected with single-chip microcomputer pin; Inner parameter is measured3 inputs of module are connected with three interior connecting terminals in the quick terminal in cavity, output and single-chip microcomputer pinBe connected, memory module is connected with single-chip microcomputer, for storing data; Described communication interface is serial ports and USB interface, for calculatingMachine carries out exchanges data.
10. a kind of quick multifunctional electronic devices and components temperature property test instrument according to claim 9, its feature existsIn, the control end of described H bridge power model is connected with single-chip microcomputer pin, by two pwm pulse signal output pins of single-chip microcomputerDetermine heating or refrigeration.
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| CN109164846A (en) * | 2018-10-06 | 2019-01-08 | 烟台大学 | The temperature regulating device and temperature control method measured for SAW resonance, anti-resonance frequency |
| CN109557374A (en) * | 2019-01-22 | 2019-04-02 | 云南中烟工业有限责任公司 | The test device and method of small resistive element temperature-coefficient of electrical resistance |
| CN112285452A (en) * | 2020-09-10 | 2021-01-29 | 河北工业大学 | Device and method for measuring low-temperature characteristics of electrical parameters |
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| CN112763805A (en) * | 2019-11-06 | 2021-05-07 | 中强光电股份有限公司 | Heat dissipation device and detection method thereof |
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