CN105578760A - 电路板组件 - Google Patents

电路板组件 Download PDF

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Publication number
CN105578760A
CN105578760A CN201610004536.XA CN201610004536A CN105578760A CN 105578760 A CN105578760 A CN 105578760A CN 201610004536 A CN201610004536 A CN 201610004536A CN 105578760 A CN105578760 A CN 105578760A
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circuit board
bus
conductive metal
metal sheet
board assemblies
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徐继彭
田光召
赖阳球
沙祥彪
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Inventec Pudong Technology Corp
Inventec Corp
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Inventec Pudong Technology Corp
Inventec Corp
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Priority to CN201610004536.XA priority Critical patent/CN105578760A/zh
Priority to US14/996,855 priority patent/US9954293B2/en
Publication of CN105578760A publication Critical patent/CN105578760A/zh
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7005Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011Locking or fixing a connector to a PCB
    • H01R12/7047Locking or fixing a connector to a PCB with a fastener through a screw hole in the coupling device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7088Arrangements for power supply
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10272Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1031Surface mounted metallic connector elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10409Screws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10962Component not directly connected to the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路板组件,包含一电路板、至少一导电金属板、至少一总线以及至少一固定件。电路板具有至少一电性连接区;导电金属板焊接连接于该电性连接区,并具有至少一金属板开孔;总线具有一连接部,该连接部对应于该导电金属板,且该总线具有至少一固定螺孔,该固定螺孔对应于该金属板开孔;固定件经由该金属板开孔与该固定螺孔锁固连接该导电金属板与该总线,用于使该导电金属板电性连接于该总线。

Description

电路板组件
技术领域
本发明关于一种电路板组件,尤指一种利用导电金属板电性连接总线与电路板的电路板组件。
背景技术
一般来说,在一个完整的电机系统中,用来连接电源的电路板组件是必须的构件,而现有的电路板组件主要是在电路板上设有端口供电源的总线插接,然而此方式不仅在接触上的紧密性不足,且导通的能力也有限,尤其是运用在服务器或储存装置时,会因为需要大量的电力供应而更容易发生问题。
请参阅图1,图1显示现有技术的电路板组件的立体示意图。如图所示,一电路板组件PA100包含一电路板PA1与二总线PA2(图中仅标示一个),而电路板PA1设有二插接埠PA12(图中仅标示一个),二总线PA2是分别插设于二插接埠PA12,用于电性连接至电路板PA1的电路。
承上所述,由于现有的电路板PA1仅是设置插接端口PA12来供总线PA2插接,因此总线PA2与插接埠PA12之间的接触仅能通过插接埠PA12内的金属弹片接触,因此若金属弹片的弹性疲乏时,很容易会有接触不良的情形发生,
发明内容
有鉴于现有的电路板组件是直接在电路板上设有插接端口来供总线插接,因此常常会有接触不良的情形发生,进而造成危险或使电力传输的功效不彰;缘此,本案发明人发明了一种电路板组件,其是通过导电金属板焊接连接于电路板上,再将总线锁固于电路板与导电金属板上,进而通过锁固的方式使总线紧密接触连性连接于电路板的导电金属板。
本发明为解决先前技术的问题,所采用的必要技术手段是提供一种电路板组件,包含一电路板、至少一导电金属板、至少一总线以及至少一固定件。电路板具有至少一电性连接区;导电金属板焊接连接于该电性连接区,并具有至少一金属板开孔;总线具有一连接部,该连接部对应于该导电金属板,且该总线具有至少一固定螺孔,该固定螺孔对应于该金属板开孔;固定件经由该金属板开孔与该固定螺孔锁固连接该导电金属板与该总线,用于使该导电金属板电性连接于该总线。
由上述必要技术手段所衍生的一附属技术手段为,该固定件以介于20kgf.cm至40kgf.cm间的一旋转扭力将该总线锁固于该电路板,用于降低该总线与该电路板间的一阻抗值。
由上述必要技术手段所衍生的一附属技术手段为,该旋转扭力的范围内,当该旋转扭力递增时,该阻抗值相对地递减。
由上述必要技术手段所衍生的一附属技术手段为,该电路板具有至少一对应于该金属板开孔的电路板锁孔,该固定件通过该电路板锁孔将该导电金属板与该总线锁固于该电路板。
由上述必要技术手段所衍生的一附属技术手段为,该电路板还具有至少一定位孔,该定位孔邻近于该电性连接区,且该导电金属板具有至少一定位部,该定位部卡接于该定位孔。
由上述必要技术手段所衍生的一附属技术手段为,该定位孔与该定位部皆为多个,该些定位孔对称地设置于该电性连接区的周围,该些定位部分别对应地卡设于该些定位孔。
由上述必要技术手段所衍生的一附属技术手段为,该导电金属板为铜板。
由上述必要技术手段所衍生的一附属技术手段为,该总线为铜片。
由上述必要技术手段所衍生的一附属技术手段为,该总线还包含一总线本体,该连接部自该总线本体一体成型地弯折延伸出。
由上述必要技术手段所衍生的一附属技术手段为,该连接部的延伸方向垂直于该总线本体的延伸方向。
如上所述,相较于先前技术的电路板组件是设有插接端口供总线直接插设,本发明通过导电金属板电性连接电路板与总线,可以有效的使总线稳固地电性连接于电路板,增加总线电性连接于电路板的稳定性。
附图说明
图1显示先前技术的电路板组件的立体示意图;
图2显示本发明较佳实施例所提供的电路板组件的立体示意图;
图3显示本发明较佳实施例所提供的电路板组件另一视角的立体示意图;
图4显示本发明较佳实施例所提供的电路板组件的立体分解示意图;
图5显示本发明较佳实施例所提供的电路板组件另一视角的立体分解示意图;
图6显示在本发明较佳实施例中,导电金属板焊接于电路板的立体示意图;
图7显示在本发明较佳实施例中,总线设置于导电金属板并利用固定件进行固定的立体示意图;以及
图8显示本发明较佳实施例所提供的电路板组件应用于电子装置的立体示意图。
组件标号说明:
PA100电路板组件
PA1电路板
PA2总线
PA12插接埠
100电路板组件
1电路板
11总线设置面
111、112电性连接区
1111、1121电路板锁孔
113、114定位孔
12固定件锁固面
2、3导电金属板
21、31金属板开孔
22、32定位部
4、5总线
41、51总线本体
42、52连接部
421、521固定螺孔
6固定件
200电子设备
L1第一延伸方向
L2第二延伸方向
具体实施方式
请参阅图2至图5,图2显示本发明较佳实施例所提供的电路板组件的立体示意图;图3显示本发明较佳实施例所提供的电路板组件另一视角的立体示意图;图4显示本发明较佳实施例所提供的电路板组件的立体分解示意图;图5显示本发明较佳实施例所提供的电路板组件另一视角的立体分解示意图。
如图所示,一种电路板组件100包含一电路板1、二导电金属板2、3、二总线4、5以及八个固定件6(图中仅标示一个)。
电路板1沿一第一延伸方向L1延伸,并具有相对设置的一总线设置面11与一固定件锁固面12。总线设置面11具有二电性连接区111与112,且电性连接区111开设有四个电路板锁孔1111(图中仅标示一个),而电性连接区112开设有四个电路板锁孔1121(图中仅标示一个)。此外,总线设置面11更开设有二定位孔113(图中仅标示一个)以及二定位孔114(图中仅标示一个)。
二定位孔113是邻近于电性连接区1111,并对称地设置于电性连接区111的两侧。二定位孔114是邻近于电性连接区1121,并对称地设置于电性连接区112的两侧。
导电金属板2是焊接连接于电性连接区111,并开设有四个金属板开孔21(图中仅标示一个),且导电金属板2更具有二定位部22(图中仅标示一个),二定位部22是分别对应地卡接于二定位孔113。
导电金属板3是焊接连接于电性连接区112,并开设有四个金属板开孔31(图中仅标示一个),且导电金属板3更具有二定位部32(图中仅标示一个),二定位部32是分别对应地卡接于二定位孔114。其中,导电金属板2与3在本实施例中为铜板,但不限于此,在其他实施例中亦可是其他导电金属。
此外,在实务运用上,导电金属板2与3焊接于电性连接区111与112的一面更设有多段凸起结构,而电性连接区111与112则相对地设有多段凹陷结构,藉此,当导电金属板2与3焊接于电性连接区111与112,更可利用凸起结构与凹陷结构的配合而使焊接更加紧密,意即可在焊锡时有效的增加吃锡的面积。
总线4包含一总线本体41与一连接部42,总线本体41是沿一与第一延伸方向L1垂直的第二延伸方向L2延伸,而连接部42是一体成型地自总线本体41沿第一延伸方向L1延伸,并对应于导电金属板2,且连接部42开设有四个对应于金属板开孔21的固定螺孔421。
总线5包含一总线本体51与一连接部52,总线本体51是沿一与第一延伸方向L1垂直的第二延伸方向L2延伸,而连接部52是一体成型地自总线本体51沿第一延伸方向L1延伸,并对应于导电金属板2,且连接部52开设有四个对应于金属板开孔21的固定螺孔521。其中,总线4与5在本实施例中皆为一铜片,但不限于此,在其他实施例中亦可为其他导电金属。
此外,总线4与5实际上皆设有一绝缘保护套(图未标示)。
八个固定件6其中的四者是先穿过电路板锁孔1111,再穿过金属板开孔21,然后再锁固于固定螺孔421,用于使导电金属板2与总线4锁固于电路板1上;而八个固定件6其中的另四者是先穿过电路板锁孔1121,再穿过金属板开孔31,然后再锁固于固定螺孔521,用于使导电金属板3与总线5锁固于电路板1上。其中,利用固定件6的螺帽卡设于电路板1,并锁固于总线4,使总线4紧密地贴合于导电金属板2,进而使总线4电性连接于导电金属板2,而在实务运用上,导电金属板2是利用焊接连接于电路板1的电路,藉此,总线4会通过导电金属板2电性连接于电路板1的电路;相似地,总线5同样是通过固定件6的锁固而紧密贴合并电性连接于导电金属板3,以通过导电金属板3电性连接至电路板1的电路。
此外,在本实施例中,固定件6是以介于20kgf.cm至40kgf.cm间的一旋转扭力将总线4、5锁固于电路板1与导电金属板2、3,用于降低总线4、5与电路板1间的一阻抗值;其中,当固定件6为M5规格的螺丝时,其旋转扭力与总线4、5电性连接于电路板1之间的电路损失对照如下表一所示:
表一:旋转扭力与电力损失的对照表。
如上表所示,在20~40kgf.cm的旋转扭力范围内,当旋转扭力递增时,阻抗值会相对地递减。
请参阅图6至图7,图6显示在本发明较佳实施例中,导电金属板焊接于电路板的立体示意图;图7显示在本发明较佳实施例中,总线设置于导电金属板并利用固定件进行固定的立体示意图。如图所示,在实际操作上,首先是将导电金属板2、3分别焊接于电性连接区111、112,然后再将总线4、5分别设置于导电金属板2、3上,最后再利用固定件6将总线4、5锁固于电路板1上。
请参阅图8,图8显示本发明较佳实施例所提供的电路板组件应用于电子装置的立体示意图。如图所示,本发明的电路板组件100是设置于一电子设备200上,而总线4、5会由电子设备200穿出,并用以电性连接至一电源(图未示)。
综上所述,相较于先前技术的电路板组件是设有插接端口供总线直接插设,本发明通过导电金属板电性连接电路板与总线,可以有效的使总线稳固地电性连接于电路板,增加总线电性连接于电路板的稳定性。此外,使用者更可利用本发明的固件组件的旋转扭力的增加来减少总线与电路板之间的阻抗值。
利用以上较佳具体实施例的详述,希望能更加清楚描述本发明的特征与精神,而并非以上述所揭露的较佳具体实施例来对本发明的范畴加以限制。相反地,其目的是希望能涵盖各种改变及具相等性的安排于本发明所欲申请的权利要求的范畴内。

Claims (10)

1.一种电路板组件,其特征为,该电路板组件包含:
一电路板,具有至少一电性连接区;
至少一导电金属板,焊接连接于该电性连接区,并具有至少一金属板开孔;
至少一总线,具有一连接部,该连接部系对应于该导电金属板,且该总线具有至少一固定螺孔,该固定螺孔对应于该金属板开孔;以及
至少一固定件,经由该金属板开孔与该固定螺孔锁固连接该导电金属板与该总线,用于使该导电金属板电性连接于该总线。
2.如权利要求1所述的电路板组件,其特征为,该固定件以介于20kgf.cm至40kgf.cm间的一旋转扭力将该总线锁固于该电路板,用于降低该总线与该电路板间的一阻抗值。
3.如权利要求2所述的电路板组件,其特征为,在该旋转扭力的范围内,当该旋转扭力递增时,该阻抗值相对地递减。
4.如权利要求1所述的电路板组件,其特征为,该电路板具有至少一对应于该金属板开孔的电路板锁孔,该固定件通过该电路板锁孔将该导电金属板与该总线锁固于该电路板。
5.如权利要求1所述的电路板组件,其特征为,该电路板还具有至少一定位孔,该定位孔邻近于该电性连接区,且该导电金属板具有至少一定位部,该定位部卡接于该定位孔。
6.如权利要求5所述的电路板组件,其特征为,该定位孔与该定位部皆为多个,该些定位孔对称地设置于该电性连接区的周围,该些定位部分别对应地卡设于该些定位孔。
7.如权利要求1所述的电路板组件,其特征为,该导电金属板为铜板。
8.如权利要求1所述的电路板组件,其特征为,该总线为铜片。
9.如权利要求1所述的电路板组件,其特征为,该总线还包含一总线本体,该连接部自该总线本体一体成型地弯折延伸出。
10.如权利要求9所述的电路板组件,其特征为,该连接部的延伸方向垂直于该总线本体的延伸方向。
CN201610004536.XA 2016-01-05 2016-01-05 电路板组件 Pending CN105578760A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109638492A (zh) * 2018-12-04 2019-04-16 英业达科技有限公司 印刷电路板的电流传输方法与电流传输结构

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6252872B2 (ja) * 2015-02-24 2017-12-27 株式会社オートネットワーク技術研究所 電気接続箱及び接続端子部品
TWI637255B (zh) * 2017-09-01 2018-10-01 台達電子工業股份有限公司 多輸入電源分配器及其匯流排組
TWM624652U (zh) * 2021-06-07 2022-03-21 台達電子工業股份有限公司 匯流排組

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010040049A1 (en) * 1998-10-09 2001-11-15 Tatsuya Sumida Lattice-shaped circuit board
CN101916933A (zh) * 2010-06-29 2010-12-15 深圳市龙岗区龙岗龙东云成塑胶五金制品厂 一种电源插头
CN103378504A (zh) * 2012-04-24 2013-10-30 亚旭电子科技(江苏)有限公司 具有插座与插头的电源扩充结构及电源扩充装置
CN104466501A (zh) * 2014-12-24 2015-03-25 常熟市斯佳登电器有限公司 新型电源插头

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4867696A (en) * 1988-07-15 1989-09-19 Amp Incorporated Laminated bus bar with power tabs
JP2010104135A (ja) * 2008-10-23 2010-05-06 Hitachi Ltd 電力変換装置及び車載用電機システム
CN103222143B (zh) * 2010-11-26 2016-09-07 三菱电机株式会社 电连接器、列车信息收发系统、以及电连接器的连接方法
FR2990795B1 (fr) * 2012-05-16 2015-12-11 Sagem Defense Securite Agencement de module electronique de puissance

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010040049A1 (en) * 1998-10-09 2001-11-15 Tatsuya Sumida Lattice-shaped circuit board
CN101916933A (zh) * 2010-06-29 2010-12-15 深圳市龙岗区龙岗龙东云成塑胶五金制品厂 一种电源插头
CN103378504A (zh) * 2012-04-24 2013-10-30 亚旭电子科技(江苏)有限公司 具有插座与插头的电源扩充结构及电源扩充装置
CN104466501A (zh) * 2014-12-24 2015-03-25 常熟市斯佳登电器有限公司 新型电源插头

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109638492A (zh) * 2018-12-04 2019-04-16 英业达科技有限公司 印刷电路板的电流传输方法与电流传输结构

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