CN105514255A - Sunk-plate heat-dissipating LED support - Google Patents
Sunk-plate heat-dissipating LED support Download PDFInfo
- Publication number
- CN105514255A CN105514255A CN201511015809.2A CN201511015809A CN105514255A CN 105514255 A CN105514255 A CN 105514255A CN 201511015809 A CN201511015809 A CN 201511015809A CN 105514255 A CN105514255 A CN 105514255A
- Authority
- CN
- China
- Prior art keywords
- width
- main body
- plastic cement
- cement main
- led support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004568 cement Substances 0.000 claims description 53
- 238000005452 bending Methods 0.000 claims description 22
- 206010058109 Hangnail Diseases 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 230000000717 retained effect Effects 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract 7
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Road Signs Or Road Markings (AREA)
- Toys (AREA)
Abstract
The invention discloses a sunk-plate heat-dissipating LED support comprising a plastic body, a positive terminal and a negative terminal. A reflection cup is downwardly recessed from the top of the plastic body. Each of the positive terminal and the negative terminal is equipped with a die bonding portion, a clamping portion, and a soldering pin portion. Each die bonding portion and the corresponding clamping portion are located in the same horizontal plane. The die bonding portions are exposed from the bottom of the reflection cup. The clamping portions and the plastic body are fixed together. The bottom surfaces of the die bonding portions and the bottom surfaces of the clamping portions are flush with the bottom surface of the plastic body. Each soldering pin portion is upwardly bent from the corresponding clamping portion to be located in a vertical plane. The soldering pin portions are arranged on both sides of the plastic body respectively. The tops of the soldering pin portions are not higher than the top surface of the plastic body. Accordingly, the soldering pin portions are upwardly bent so as to be higher than the bottom surface of the insulated plastic body. Thus, the soldering pin portions are higher than the bottom surface of the plastic body so as to enable the LED support to have a sunk-plate structure. Soldering can be performed under a PCB so that a finished product is thinner and better in heat dissipation.
Description
Technical field
The present invention relates to LED field technology, refer in particular to a kind of heavy plate type radiator LED support.
Background technology
LED is a kind of can be the semiconductor of visible ray by electric energy conversion, it is high that it has efficiency, photochromic pure, light quality is high, energy consumption is little, life-span is long, the advantages such as luminous element points of proximity light source, and operating voltage is low, emission response time is extremely short, operating temperature range is wide, sound construction, the series of characteristics such as stable and reliable for performance, the extremely favor of people, and, green illumination is the Eco-Design target that the whole world is followed, LED is as a kind of energy-efficient light source, mercury need not be filled, energy resource consumption can be reduced and reduce the greenhouse gas and other pollutants that discharge in air, also LED and solar cell can be combined and use, so, it is one of light source of most environmental protection, it is the novel green light source of the 21 century of generally acknowledging in the world.
Traditional LED lamp has a radiating seat, this radiating seat adopts insulating material to make, LED chip is installed in this radiating seat, because insulating material heat conductivility is poor, the heat that LED chip sends can not distribute in time, have a strong impact on the useful life of LED, and also there is the defect of not easily encapsulation and light efficiency difference in the type LED.Therefore, tackle the type LED heat radiation seat structure to improve, to address the aforementioned drawbacks.
Summary of the invention
In view of this, the present invention is directed to the disappearance of prior art existence, its main purpose is to provide a kind of heavy plate type radiator LED support, and heavy board-like Welding Structure can save welding space, makes finished product more lightening and thermal diffusivity is better.
For achieving the above object, the present invention adopts following technical scheme:
A kind of heavy plate type radiator LED support, comprise plastic cement main body and two conducting terminals, this two conducting terminal is made up of a positive terminal and a negative terminal, two conducting terminals and this plastic cement main body one produced by insert molding, recessed in the top of plastic cement main body have a reflector, described positive pole and negative terminal all have die bond portion, holding section and leg portion, this die bond portion and this fastening part are in same level, die bond portion exposes at the bottom of this reflector, holding section and plastic cement main body are retained in together, and die bond portion is concordant with the bottom surface of plastic cement main body with the bottom surface of holding section, this leg portion by this holding section upwards bending be positioned at perpendicular, leg portion is positioned at the both sides of plastic cement main body, the tip height in leg portion does not exceed the end face of plastic cement main body.
As a kind of preferred version, described plastic cement main body is rectangular shape, and its length, width and height size is respectively 0.18mm*0.08mm*0.05mm; Described reflector is run-track shaped, and the bottom surface length and width size of this reflector is respectively 0.1mm*0.04mm, and the length and width size of reflector end face is respectively 0.12mm*0.05mm, and the reflector degree of depth is 0.04mm, and the angle that reflector left and right sidewall is formed is 25 °.
As a kind of preferred version, the width in described die bond portion is more than or equal to the width at the bottom of this reflector, and is less than the bottom width of plastic cement main body; The width of described holding section is greater than the bottom width of plastic cement main body, and the both sides of holding section have the section of stretching out and expose to outside the both sides of this plastic cement main body.
As a kind of preferred version, the width in described die bond portion is 0.04mm, and the width of described holding section is 0.09mm.
As a kind of preferred version, described leg portion makes LED support form heavy plank frame higher than the bottom surface of plastic cement main body, and this leg portion comprises the vertical bending section, upwards extension and the expanding reach that are connected according to cold time; The width of this vertical bending section is identical with the width of upwards extension, and it is all less than the width of holding section; The width of this expanding reach is greater than the width of this upwards extension, makes leg portion present wide lower narrow structure.
As a kind of preferred version, the width of described vertical bending section, upwards extension is 0.03mm, and the width of described expanding reach is 0.49mm, and the height of expanding reach is 0.02mm.
As a kind of preferred version, have one inside described vertical bending section and thin shaping broken line groove.
As a kind of preferred version, the week in described die bond portion is along being provided with the first concave station, to form epirelief concave configuration, and described die bond portion has installed the second concave station near fastening part, this second concave station is along this first concave station inverted ladder-type structure of recessed formation step by step, and this first and second concave station is imbedded in plastic cement main body.
As a kind of preferred version, the surface of described holding section is provided with " V " shape draw-in groove, should " V " shape draw-in groove clamping plastic cement main body.
As a kind of preferred version, the multiple zigzag hangnail of lateral projections in described die bond portion, this hangnail is imbedded in plastic cement main body.
The present invention compared with prior art has obvious advantage and beneficial effect, specifically, as shown from the above technical solution, the leg portion of tradition LED support is all bottom surfaces that downward bending is accommodated in plastic cement main body, and the present invention is by the upwards bending of leg portion, makes it higher than the bottom surface of insulating body, like this, leg portion makes LED support form heavy plank frame higher than the bottom surface of plastic cement main body, can along below pcb board, thus make finished product making more thin during welding.In addition, the bottom of LED support, below pcb board, can contact lower air, is conducive to heat radiation.
For more clearly setting forth architectural feature of the present invention and effect, below in conjunction with accompanying drawing and specific embodiment, the present invention is described in detail.
Accompanying drawing explanation
Fig. 1 is the vertical view of the embodiment of the present invention;
Fig. 2 is the transverse sectional view of the embodiment of the present invention;
Fig. 3 is the ground plan of the embodiment of the present invention;
Fig. 4 is the left view of the embodiment of the present invention;
Fig. 5 is the longitudinal sectional view of the embodiment of the present invention;
Fig. 6 is the profile at A-A place in Fig. 5;
Fig. 7 is the installation diagram being sunken to pcb board under LED support.
Accompanying drawing identifier declaration:
10, plastic cement main body 11, reflector
12, slip-off preventing groove 20, conducting terminal
201, positive terminal 202, negative terminal
21, die bond portion 211, first concave station
212, the second concave station 213, hangnail
22, holding section 221, the section of stretching out
222, " V " shape draw-in groove 23, leg portion
231, vertical bending section 232, upwards extension
233, expanding reach 234, broken line groove
30, pcb board 31, scolding tin hole.
Embodiment
Please refer to shown in Fig. 1 to Fig. 7, that show the concrete structure of the preferred embodiment of the present invention, it is a kind of heavy plate type radiator LED support, comprise plastic cement main body 10 and two conducting terminals 20, this two conducting terminal 20 is made up of a positive terminal 201 and a negative terminal 202, two conducting terminals 20 and this plastic cement main body 10 one produced by insert molding.
Wherein, described plastic cement main body 10 is in rectangular shape, and its length, width and height size is respectively 0.18mm*0.08mm*0.05mm.The top of plastic cement main body 10 is recessed a reflector 11, described reflector 11 is in run-track shaped, the bottom surface length and width size of this reflector 11 is respectively 0.1mm*0.04mm, the length and width size of reflector 11 end face is respectively 0.12mm*0.05mm, reflector 11 degree of depth is 0.04mm, and the angle that reflector about 11 sidewall is formed is 25 °.Such size design, makes that the plastic cement main body 10 of fixed size has more large-area reflector 11, can install great power LED wafer, strengthens illumination effect.Further, the both sides of described plastic cement main body 10 are provided with slip-off preventing groove 12, and when after the blanking of copper coin support stamping-out, slip-off preventing groove 12 can be stuck on the hook (non-diagram) of material strip, drops dispersedly when being unlikely to blanking.
As shown in Figure 3, the length of described positive terminal 201 is 0.1mm, and the length of negative terminal 202 is 0.05mm.Described positive pole and negative terminal 201,202 all have die bond portion 21, holding section 22 and leg portion 23, this die bond portion 21 is positioned at same level with this holding section 22, this reflector 11 end, is exposed in die bond portion 21, holding section 22 and plastic cement main body 10 are retained in together, and die bond portion 21 is concordant with the bottom surface of plastic cement main body 10 with the bottom surface of holding section 22, this leg portion 23 by this holding section 22 upwards bending be positioned at perpendicular, leg portion 23 is positioned at the both sides of plastic cement main body 10, and the tip height in leg portion 23 does not exceed the end face of plastic cement main body 10.
In the present embodiment, the width in described die bond portion 21 is more than or equal to the width at this reflector 11 end, and is less than the bottom width of plastic cement main body 10; The width of described holding section 22 is greater than the bottom width of plastic cement main body 10, and the both sides of holding section 22 have the section of stretching out 221 and expose to outside the both sides of this plastic cement main body 10.Concrete, the width in described die bond portion 21 is 0.04mm, and the width of described holding section 22 is 0.09mm.Like this, effective increasing heat radiation area, strengthens effect thermal effect, is conducive to the life-span extending LED.
As shown in Figure 2, described leg portion 23 makes LED support form heavy plank frame higher than the bottom surface of plastic cement main body 10, can along (see figure 7) below pcb board 30, thus make finished product making more thin during welding.This leg portion 23 comprises the vertical bending section 231, upwards extension 232 and the expanding reach 233 that are connected according to cold time; The width of this vertical bending section 231 is identical with the width of upwards extension 232, and it is all less than the width of holding section 22; The width of this expanding reach 233 is greater than the width of this upwards extension 232, makes leg portion 23 present wide lower narrow structure.Concrete, see Fig. 4, described vertical bending section 231, the upwards width of extension 232 are 0.03mm, and the width of described expanding reach 233 is 0.49mm, and the height of expanding reach 233 is 0.02mm.This design can utilize narrower upwards extension 232 to hang on the scolding tin hole 31 of pcb board 30, and the wider expanding reach 233 in upper end is stuck in the top of pcb board 30, not easily falls down (see figure 7).Further, have one inside described vertical bending section 231 and thin shaping broken line groove 234(and see Fig. 2), be easier to make bending realize, do not produce interference.
As shown in Figure 5, the week in described die bond portion 21 is along being provided with the first concave station 211, to form epirelief concave configuration.And as shown in Figure 3, described die bond portion 21 is provided with the second concave station 212 near position, holding section 22, this second concave station 212 is along this first concave station 211 inverted ladder-type structure of recessed formation step by step, and this first and second concave station 211,212 is imbedded in plastic cement main body 10.Further, the surface of described holding section 22 is provided with " V " shape draw-in groove 222, should clamp plastic cement main body 10 by " V " shape draw-in groove 222.Further, as shown in Figure 6, the multiple zigzag hangnail 213 of lateral projections in described die bond portion 21, this hangnail 213 is imbedded in plastic cement main body 10.Like this, the first concave station 211 makes conducting terminal 20 and plastic cement main body 10 realize one heavily to fix; Second concave station 212 realizes double fixing; " V " shape draw-in groove 222 realizes triple fixing; Hangnail 213 realizes quadruple and fixes, and can guarantee that follow-up bending can not pull LED support internal structure, ensures red ink test percent of pass.
In sum, design focal point of the present invention is, the leg portion 23 of traditional LED support is all bottom surfaces that downward bending is accommodated in plastic cement main body 10, and the present invention is by leg portion 23 upwards bending, make it higher than the bottom surface of insulating body, like this, leg portion 23 makes LED support form heavy plank frame higher than the bottom surface of plastic cement main body 10, can along below pcb board during welding, thus it is more thin to make finished product make, in addition, the bottom of LED support is below pcb board, can lower air be contacted, be conducive to heat radiation.
The above, it is only preferred embodiment of the present invention, not technical scope of the present invention is imposed any restrictions, thus every above embodiment is done according to technical spirit of the present invention any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. a heavy plate type radiator LED support, comprise plastic cement main body (10) and two conducting terminals (20), this two conducting terminal is made up of a positive terminal (201) and a negative terminal (202), two conducting terminals and this plastic cement main body one produced by insert molding, recessed in the top of plastic cement main body have a reflector (11), it is characterized in that: described positive pole and negative terminal (201, 202) all there is die bond portion (21), holding section (22) and leg portion (23), this die bond portion (21) and this holding section (22) are positioned at same level, this reflector (11) end, is exposed in die bond portion (21), holding section (22) and plastic cement main body (10) are retained in together, and die bond portion (21) are concordant with the bottom surface of plastic cement main body (10) with the bottom surface of holding section (22), this leg portion (23) by this holding section (22) upwards bending be positioned at perpendicular, leg portion (23) is positioned at the both sides of plastic cement main body (10), the tip height in leg portion (23) does not exceed the end face of plastic cement main body (10).
2. heavy plate type radiator LED support according to claim 1, is characterized in that: described plastic cement main body (10) is in rectangular shape, and its length, width and height size is respectively 0.18mm*0.08mm*0.05mm; Described reflector (11) is in run-track shaped, the bottom surface length and width size of this reflector (11) is respectively 0.1mm*0.04mm, the length and width size of reflector (11) end face is respectively 0.12mm*0.05mm, reflector (11) degree of depth is 0.04mm, and the angle that reflector (11) left and right sidewall is formed is 25 °.
3. heavy plate type radiator LED support according to claim 1, is characterized in that: the width of described die bond portion (21) is more than or equal to the width of this reflector (11) bottom surface, and is less than the bottom width of plastic cement main body (10); The width of described holding section (22) is greater than the bottom width of plastic cement main body (10), and the both sides of holding section (22) have the section of stretching out (221) and expose to outside the both sides of this plastic cement main body (10).
4. heavy plate type radiator LED support according to claim 3, is characterized in that: the width of described die bond portion (21) is 0.04mm, and the width of described holding section (22) is 0.09mm.
5. heavy plate type radiator LED support according to claim 1, it is characterized in that: described leg portion (23) makes LED support form heavy plank frame higher than the bottom surface of plastic cement main body (10), this leg portion (23) comprises the vertical bending section (231), upwards extension (232) and the expanding reach (233) that are connected according to cold time; The width of this vertical bending section (231) is identical with the width of upwards extension (232), and it is all less than the width of holding section (22); The width of this expanding reach (233) is greater than the width of these upwards extension (232), makes leg portion (23) present wide lower narrow structure.
6. heavy plate type radiator LED support according to claim 5, it is characterized in that: described vertical bending section (231), the upwards width of extension (232) are 0.03mm, the width of described expanding reach (233) is 0.49mm, and the height of expanding reach (233) is 0.02mm.
7. heavy plate type radiator LED support according to claim 1, is characterized in that: described vertical bending section (231) inner side has one and thins shaping broken line groove (234).
8. heavy plate type radiator LED support according to claim 1, it is characterized in that: the week of described die bond portion (21) is along being provided with the first concave station (211), to form epirelief concave configuration, and described die bond portion (21) is provided with the second concave station (212) near holding section (22) position, this second concave station (212) is along this first concave station (211) terraced vertical shape structure of recessed formation step by step, and this first and second concave station (211,212) is imbedded in plastic cement main body (10).
9. heavy plate type radiator LED support according to claim 1, it is characterized in that: the surface of described holding section (22) is provided with " V " shape draw-in groove (222), should " V " shape draw-in groove (222) clamping plastic cement main body (10).
10. heavy plate type radiator LED support according to claim 1, it is characterized in that: the multiple zigzag hangnail (213) of lateral projections of described die bond portion (21), this hangnail (213) is imbedded in plastic cement main body (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511015809.2A CN105514255B (en) | 2015-12-31 | 2015-12-31 | Heavy plate type radiator LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511015809.2A CN105514255B (en) | 2015-12-31 | 2015-12-31 | Heavy plate type radiator LED support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105514255A true CN105514255A (en) | 2016-04-20 |
| CN105514255B CN105514255B (en) | 2018-04-17 |
Family
ID=55722082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511015809.2A Active CN105514255B (en) | 2015-12-31 | 2015-12-31 | Heavy plate type radiator LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105514255B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527989A (en) * | 2017-09-12 | 2017-12-29 | 深圳市毅宁亮照明有限公司 | A kind of side-emitting LED lamp bead connector |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1630113A (en) * | 2003-12-17 | 2005-06-22 | 夏普株式会社 | Semiconductor light emitting device |
| CN102185086A (en) * | 2011-05-05 | 2011-09-14 | 深圳市聚飞光电股份有限公司 | Light emitting diode (LED) bracket and LED with same |
| CN102214647A (en) * | 2010-04-12 | 2011-10-12 | 惠州科锐光电有限公司 | Surface mount device thin package |
| CN102714267A (en) * | 2009-11-19 | 2012-10-03 | 住友化学株式会社 | Package for semiconductor, and heat dissipating lead frame |
| CN203932106U (en) * | 2014-06-26 | 2014-11-05 | 深圳市迈克光电子科技有限公司 | The tin cream eutectic structure of flip-chip |
-
2015
- 2015-12-31 CN CN201511015809.2A patent/CN105514255B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1630113A (en) * | 2003-12-17 | 2005-06-22 | 夏普株式会社 | Semiconductor light emitting device |
| CN102714267A (en) * | 2009-11-19 | 2012-10-03 | 住友化学株式会社 | Package for semiconductor, and heat dissipating lead frame |
| CN102214647A (en) * | 2010-04-12 | 2011-10-12 | 惠州科锐光电有限公司 | Surface mount device thin package |
| CN102185086A (en) * | 2011-05-05 | 2011-09-14 | 深圳市聚飞光电股份有限公司 | Light emitting diode (LED) bracket and LED with same |
| CN203932106U (en) * | 2014-06-26 | 2014-11-05 | 深圳市迈克光电子科技有限公司 | The tin cream eutectic structure of flip-chip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527989A (en) * | 2017-09-12 | 2017-12-29 | 深圳市毅宁亮照明有限公司 | A kind of side-emitting LED lamp bead connector |
| CN107527989B (en) * | 2017-09-12 | 2024-06-07 | 深圳市毅宁亮照明有限公司 | Side-emitting LED lamp bead connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105514255B (en) | 2018-04-17 |
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