CN107527989B - Side-emitting LED lamp bead connector - Google Patents
Side-emitting LED lamp bead connector Download PDFInfo
- Publication number
- CN107527989B CN107527989B CN201710815487.2A CN201710815487A CN107527989B CN 107527989 B CN107527989 B CN 107527989B CN 201710815487 A CN201710815487 A CN 201710815487A CN 107527989 B CN107527989 B CN 107527989B
- Authority
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- China
- Prior art keywords
- metal plate
- positive electrode
- negative electrode
- pin
- electrode metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011324 bead Substances 0.000 title claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 61
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The side-emitting LED lamp bead connector comprises an anode metal plate and a cathode metal plate, wherein an anode pin and a cathode pin are vertically bent at the tail ends of the anode metal plate and the cathode metal plate in the length direction, the anode pin and the cathode pin are vertically bent at the tail ends of the anode metal plate in the width direction to form an anode bonding pad and a cathode bonding pad, the bending directions of the anode bonding pad and the cathode bonding pad are opposite and close, the anode metal plate is shorter than the cathode metal plate, a gap is reserved between the anode metal plate and the cathode metal plate, and through holes are formed in the surfaces of the anode metal plate and the cathode metal plate; the side light of the LED lamp can be realized, so that the heat generated by light emission is more efficiently dissipated, and the service life of the LED lamp is prolonged.
Description
Technical Field
The invention relates to the technical field of LED photoelectricity, in particular to a side-emitting LED lamp bead connector.
Background
Along with the development of LED lamp pearl technique, along with the continuous enhancement of LED application, along with product structure to miniaturized direction development, the demand to small LED lamp pearl increases. When the miniaturized equipment needs to realize side light emission, the side of the PCB board is placed by utilizing the existing forward light emitting LED in product design to realize side light emission, so that the product cost is greatly increased.
The LED chip is arranged on the LED lamp bead connector, and the LED lamp bead connector is fixed on the plastic lamp body to form the LED lamp bead. The LED lamp bead connector is welded on the PCB to electrify and emit light for the LED chip, and heat generated by the light emission can be conducted and dissipated through the LED lamp bead connector; the existing side-emitting LED lamp bead connector is poor in heat dissipation performance, so that heat is not easy to dissipate, and the service life of an LED lamp is prolonged.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the side-emitting LED lamp bead connector which can realize side-emitting of an LED lamp, so that heat generated by the emitting is more efficiently dissipated, and the service life of the LED lamp is prolonged.
The technical aim of the invention is realized by the following technical scheme: the utility model provides a side luminous LED lamp pearl connector, has positive pole pin and negative pole pin including positive pole metal sheet and negative pole metal sheet, buckle perpendicularly at the length direction end of positive pole metal sheet and negative pole metal sheet, and positive pole pin and negative pole pin buckle perpendicularly into positive electrode pad and negative pole pad at width direction end, the direction of buckling of positive electrode pad and negative pole pad is close to in opposite directions, positive pole metal sheet is shorter than negative pole metal sheet, interval 0.3 millimeter between positive pole metal sheet and the negative pole metal sheet, the through-hole has been seted up on positive pole metal sheet and the negative pole metal sheet surface.
Through adopting above-mentioned technical scheme, anodal pad and negative pole pad welding make the light emitting area perpendicular to PCB board of light emitting chip on anodal pin and negative pole pin on, anodal pin and negative pole pin connect anodal pad and negative pole pad respectively to make the light emitting chip circular telegram luminous, just can realize the side luminous of LED when PCB board is installed according to conventional mode level like this, and anodal dish and negative pole dish are close to each other and buckle, make length direction structure compacter, through-hole on anodal metal sheet and the negative pole metal sheet surface does benefit to the heat dissipation.
The invention is further provided with: wave-shaped teeth are arranged along the two edges of the positive electrode metal plate and the negative electrode metal plate in the length direction.
By adopting the technical scheme, the positive electrode metal plate and the negative electrode metal plate are clamped and embedded in the plastic lamp body.
The invention is further provided with: the two opposite sides of the positive electrode pin and the negative electrode pin are exposed to the outside when the LED lamp bead is assembled.
Through adopting above-mentioned technical scheme, the heat that anodal pin and negative pole pin follow luminescence chip and upload and export is directly dispersed in the air, avoids the overheated LED lamp body.
The invention is further provided with: the holes are close to the sides of the positive and negative pins and are square in shape.
By adopting the technical scheme, the square holes are favorable for heat dissipation.
The invention is further provided with: the anode pin and the cathode pin are made of red copper alloy.
By adopting the technical scheme, the red copper alloy is not easy to oxidize and has longer service life.
In summary, the invention has the following beneficial effects:
1. The luminous chip is connected with the PCB to realize a side luminous function;
2. the LED lamp has excellent heat dissipation performance and prolonged service life.
Drawings
Fig. 1 is a schematic structural view of the present embodiment;
Fig. 2 is a front view of the present embodiment.
In the figure: 1. a positive electrode metal plate; 2. a negative electrode metal plate; 3. a positive electrode pin; 4. a negative electrode pin; 5. a positive electrode pad; 6. a negative electrode pad; 7. a gap; 8. a through hole; 9. wave-shaped teeth.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
As shown in fig. 1, a side-emitting LED bead connector includes a positive electrode metal plate 1 and a negative electrode metal plate 2, wherein the longer side direction of the positive electrode metal plate 1 and the negative electrode metal plate 2 shown in fig. 1 is the length direction of the connector, the shorter side direction is the width direction, and the plate thickness direction is the height direction.
As shown in fig. 1 and 2, the positive electrode pin 3 and the negative electrode pin 4 are vertically bent at the ends of the positive electrode metal plate 1 and the negative electrode metal plate 2 in the length direction, the positive electrode pin 3 and the negative electrode pin 4 are vertically bent at the ends of the width direction to form a positive electrode bonding pad 5 and a negative electrode bonding pad 6, the bending directions of the positive electrode bonding pad 5 and the negative electrode bonding pad 6 are close to each other, the positive electrode metal plate 1 is shorter than the negative electrode metal, a gap 7 is reserved between the positive electrode metal plate 1 and the negative electrode metal plate 2, the interval distance is 0.3 millimeter, through holes 8 are formed in the surfaces of the positive electrode metal plate 1 and the negative electrode metal plate 2, the through holes 8 are close to the sides of the positive electrode pin 3 and the negative electrode pin 4, the shapes of the through holes are square, and the square holes are favorable for heat dissipation.
The positive electrode bonding pad 5 and the negative electrode bonding pad 6 are welded on the welding position of the PCB, the luminous surface of the luminous chip is perpendicular to the PCB, the luminous chip is connected to the positive electrode pin 3 and the negative electrode pin 4, the positive electrode pin 3 and the negative electrode pin 4 are respectively connected with the positive electrode bonding pad 5 and the negative electrode bonding pad 6, so that the luminous chip is electrified to emit light, the side surface of the LED can emit light when the PCB is horizontally installed in a conventional mode, the positive electrode plate and the negative electrode plate are mutually close to each other and bent, the length direction structure is more compact, and the through holes 8 on the surfaces of the positive electrode metal plate 1 and the negative electrode metal plate 2 are beneficial to heat dissipation.
The wavy teeth 9 are arranged along the two edges of the positive electrode metal plate 1 and the negative electrode metal plate 2 in the length direction, which is beneficial to enabling the positive electrode metal plate 1 and the negative electrode metal plate 2 to be clamped and embedded in the plastic lamp body, so that the connection is firmer;
When the side-emitting LED lamp bead connector is installed on the plastic lamp body, the positive electrode pin 3 and the negative electrode pin 4 are exposed to the outer side of the plastic lamp body from opposite sides, and heat conducted out from the light emitting chip by the positive electrode pin 3 and the negative electrode pin 4 is directly dissipated in the air, so that the LED lamp body is prevented from being overheated. The anode pin 3 and the cathode pin 4 are made of red copper alloy, and the red copper alloy is not easy to oxidize, so that the service life of the LED lamp bead is longer.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be within the scope of the present invention.
Claims (5)
1. The utility model provides a side luminous LED lamp pearl connector which characterized in that: the connector comprises a positive electrode metal plate (1) and a negative electrode metal plate (2), wherein the longer side direction of the positive electrode metal plate (1) and the negative electrode metal plate (2) is the length direction of the connector, the shorter side direction is the width direction, and the plate thickness direction is the height direction; positive electrode pin (3) and negative electrode pin (4) have been buckled perpendicularly in the length direction end of positive electrode metal sheet (1) and negative electrode metal sheet (2), positive electrode pin (3) and negative electrode pin (4) buckle perpendicularly into positive electrode pad (5) and negative electrode pad (6) at width direction end, the direction of buckling of positive electrode pad (5) and negative electrode pad (6) is being close to in opposite directions, positive electrode metal sheet (1) is shorter than negative electrode metal sheet (2), interval 0.3 millimeter between positive electrode metal sheet (1) and negative electrode metal sheet (2), through-hole (8) have been seted up on positive electrode metal sheet (1) and negative electrode metal sheet (2) surface.
2. The side-emitting LED bead connector of claim 1, wherein: wave-shaped teeth (9) are arranged along the two edges of the positive electrode metal plate (1) and the negative electrode metal plate (2) in the length direction.
3. The side-emitting LED bead connector of claim 1, wherein: the two opposite sides of the positive electrode pin (3) and the negative electrode pin (4) are exposed to the outside when the LED lamp bead is assembled.
4. A side-emitting LED bead connector according to claim 1, characterized in that the through hole (8) is square in shape near the positive (3) and negative (4) leads.
5. The side-emitting LED bead connector of claim 1, wherein: the anode pin (3) and the cathode pin (4) are made of red copper alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710815487.2A CN107527989B (en) | 2017-09-12 | 2017-09-12 | Side-emitting LED lamp bead connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710815487.2A CN107527989B (en) | 2017-09-12 | 2017-09-12 | Side-emitting LED lamp bead connector |
Publications (2)
Publication Number | Publication Date |
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CN107527989A CN107527989A (en) | 2017-12-29 |
CN107527989B true CN107527989B (en) | 2024-06-07 |
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Family Applications (1)
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CN201710815487.2A Active CN107527989B (en) | 2017-09-12 | 2017-09-12 | Side-emitting LED lamp bead connector |
Country Status (1)
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CN (1) | CN107527989B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114743944B (en) * | 2022-06-08 | 2022-09-02 | 江苏泽润新材料有限公司 | Module diode and manufacturing method thereof |
Citations (14)
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---|---|---|---|---|
JP2007096240A (en) * | 2005-09-30 | 2007-04-12 | Toyoda Gosei Co Ltd | Led lighting device |
KR100747642B1 (en) * | 2006-06-27 | 2007-08-08 | 서울반도체 주식회사 | Side view type led package |
JP2008218762A (en) * | 2007-03-06 | 2008-09-18 | Toyoda Gosei Co Ltd | Light-emitting device |
JP2008258233A (en) * | 2007-04-02 | 2008-10-23 | Toyoda Gosei Co Ltd | Light-emitting device |
JP2009129928A (en) * | 2007-11-19 | 2009-06-11 | Toyoda Gosei Co Ltd | Led lamp |
KR20110012985A (en) * | 2009-07-31 | 2011-02-09 | 엘지이노텍 주식회사 | Light emitting apparatus |
CN102110761A (en) * | 2009-11-10 | 2011-06-29 | 日本航空电子工业株式会社 | Connector |
CN202034412U (en) * | 2011-04-22 | 2011-11-09 | 深圳市聚飞光电股份有限公司 | Side-lighting LED and side-lighting LED support |
CN102628554A (en) * | 2012-03-22 | 2012-08-08 | 浙江英特来光电科技有限公司 | Three-channel electrode-sharing light-emitting diode (LED) lamp of lens structure |
CN204029799U (en) * | 2014-08-19 | 2014-12-17 | 东莞市港照照明科技有限公司 | Octal bonded LED lamp |
CN105470375A (en) * | 2014-08-26 | 2016-04-06 | 鸿富锦精密工业(深圳)有限公司 | LED package structure |
CN105514255A (en) * | 2015-12-31 | 2016-04-20 | 东莞市翔光光电科技有限公司 | Sunk-plate heat-dissipating LED support |
CN206207034U (en) * | 2016-10-08 | 2017-05-31 | 瑞斯康达科技发展股份有限公司 | LED component and LED component group |
CN207265099U (en) * | 2017-09-12 | 2018-04-20 | 深圳市毅宁亮照明有限公司 | A kind of side-emitting LED lamp bead connector |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006108333A (en) * | 2004-10-04 | 2006-04-20 | Toyoda Gosei Co Ltd | Lamp |
JP6459949B2 (en) * | 2015-12-21 | 2019-01-30 | 日亜化学工業株式会社 | Light emitting device |
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2017
- 2017-09-12 CN CN201710815487.2A patent/CN107527989B/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007096240A (en) * | 2005-09-30 | 2007-04-12 | Toyoda Gosei Co Ltd | Led lighting device |
KR100747642B1 (en) * | 2006-06-27 | 2007-08-08 | 서울반도체 주식회사 | Side view type led package |
JP2008218762A (en) * | 2007-03-06 | 2008-09-18 | Toyoda Gosei Co Ltd | Light-emitting device |
JP2008258233A (en) * | 2007-04-02 | 2008-10-23 | Toyoda Gosei Co Ltd | Light-emitting device |
JP2009129928A (en) * | 2007-11-19 | 2009-06-11 | Toyoda Gosei Co Ltd | Led lamp |
KR20110012985A (en) * | 2009-07-31 | 2011-02-09 | 엘지이노텍 주식회사 | Light emitting apparatus |
CN102110761A (en) * | 2009-11-10 | 2011-06-29 | 日本航空电子工业株式会社 | Connector |
CN202034412U (en) * | 2011-04-22 | 2011-11-09 | 深圳市聚飞光电股份有限公司 | Side-lighting LED and side-lighting LED support |
CN102628554A (en) * | 2012-03-22 | 2012-08-08 | 浙江英特来光电科技有限公司 | Three-channel electrode-sharing light-emitting diode (LED) lamp of lens structure |
CN204029799U (en) * | 2014-08-19 | 2014-12-17 | 东莞市港照照明科技有限公司 | Octal bonded LED lamp |
CN105470375A (en) * | 2014-08-26 | 2016-04-06 | 鸿富锦精密工业(深圳)有限公司 | LED package structure |
CN105514255A (en) * | 2015-12-31 | 2016-04-20 | 东莞市翔光光电科技有限公司 | Sunk-plate heat-dissipating LED support |
CN206207034U (en) * | 2016-10-08 | 2017-05-31 | 瑞斯康达科技发展股份有限公司 | LED component and LED component group |
CN207265099U (en) * | 2017-09-12 | 2018-04-20 | 深圳市毅宁亮照明有限公司 | A kind of side-emitting LED lamp bead connector |
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Publication number | Publication date |
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CN107527989A (en) | 2017-12-29 |
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