CN105514098A - Optical chip integrated structure - Google Patents
Optical chip integrated structure Download PDFInfo
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- CN105514098A CN105514098A CN201610004551.4A CN201610004551A CN105514098A CN 105514098 A CN105514098 A CN 105514098A CN 201610004551 A CN201610004551 A CN 201610004551A CN 105514098 A CN105514098 A CN 105514098A
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- led chip
- integrated morphology
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- 230000003287 optical effect Effects 0.000 title claims abstract description 116
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000002346 layers by function Substances 0.000 claims description 57
- 238000007639 printing Methods 0.000 claims description 27
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000002210 silicon-based material Substances 0.000 claims description 4
- 238000005259 measurement Methods 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 15
- 230000005540 biological transmission Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention discloses an optical chip integrated structure. An LED chip comprises a substrate arranged on an optical sensor; the substrate is provided with a first surface and a second surface located on different planes, and a plurality of inclined planes obliquely extending to the second surface from the first surface. The plurality of inclined planes are provided with function layers used as the luminous zones of the LED chip. According to the invention, the LED chip can give out light through the function layers on the plurality of inclined planes, thereby realizing the multi-direction luminous function of a single chip. The LED chip and the optical sensor are integrated, thereby meeting requirements of measuring fields utilizing an approaching light principle for detection; in addition, the LED chip and the optical sensor are distributed in a vertical direction, thereby substantially reducing the size of a whole integrated structure, and improving the stability and precision of optical chip measurement.
Description
Technical field
The present invention relates to optical pickocff field, more specifically, the present invention relates to a kind of integrated morphology of optical chip, particularly relate to a kind of close to light sensor chip.
Background technology
Along with the development of smart machine, for realizing its intelligentized function, increasing transducer is introduced in smart machine, and optical pickocff is no exception.At some close in optical sensor, the function of gesture identification is realized by certain algorithm, this multiple LED chips generally comprising the optical pickocff in the middle part of being positioned at close to optical sensor and be positioned at around optical pickocff, optical pickocff, LED chip are independently encapsulated on circuit substrate.Due to the restriction of LED chip structure in prior art, make must reserve certain distance between above-mentioned multiple LED chip and optical pickocff, optical pickocff just can be made to sense the light signal that LED chip sends; If the distance between LED chip and optical pickocff is too little, gesture None-identified can be caused or identify insensitive.
In intelligent wearable device, also can utilize close to optical sensor to measure the sign information of some human body, such as, measure heart rate etc.Tradition be used for measuring human body physical sign information close to optical sensor, because its light path is asymmetric, make in the process worn, need guarantee equipment together with human body skin close contact, otherwise the erroneous judgement of detection signal can be caused.
Summary of the invention
An object of the present invention is to provide a kind of new solution of integrated morphology of optical chip.
According to a first aspect of the invention, provide a kind of integrated morphology of optical chip, comprise substrate, have the optical pickocff of optical region, described optical pickocff is arranged on substrate; Also comprise LED chip, described LED chip comprises setting substrate on the optical sensor, and described substrate has the first surface, the second surface that are positioned at Different Plane, and extends to the multiple inclined planes second surface from first surface edge tilt; Described the plurality of inclined plane is provided with the functional layer as LED chip luminous zone; Also be provided with the through through hole to optical pickocff optical region over the substrate; Also comprise the printing opacity plastic-sealed body got up to major general's LED chip functional layer and optical pickocff optical region plastic packaging.
Preferably, described first surface is circular, and described multiple inclined plane extends to second surface from the circumferential edges of first surface; Described first surface, inclined plane, second surface define frustum cone structure; The through hole of described through optical pickocff optical region is positioned at the middle part of frustum cone structure.
Preferably, described first surface is rectangle, and described inclined plane is provided with four, extends to second surface respectively from the edge of first surface; Described first surface, inclined plane, second surface define truncated rectangular pyramids structure, described in be positioned at the light signal that functional layer on inclined plane sends and transmit towards the lateral direction of truncated rectangular pyramids structure; The through hole of described through optical pickocff optical region is positioned at the middle part of truncated rectangular pyramids structure.
Preferably, be also provided with reflecting part, described reflecting part is configured to: reflected towards the opposite side direction of truncated rectangular pyramids structure by the truncated rectangular pyramids structure light signal that wherein side functional layer launches.
Preferably, described inclined plane is provided with four, extends to second surface respectively from the edge of first surface, described first surface, inclined plane, second surface define one with the trapezoid groove structure of the truncated rectangular pyramids form fit of standing upside down; Describedly be positioned at the light signal that functional layer on inclined plane sends and transmit towards the direction, inner side of trapezoid groove structure; The through hole of described through optical pickocff optical region is positioned at the middle part of trapezoid groove structure.
Preferably, be also provided with reflecting part, described reflecting part is configured to: reflected towards the opposite side direction of trapezoid groove structure by the trapezoid groove structure light signal that wherein side functional layer transmits.
Preferably, the position on described substrate between inclined plane and through hole is also provided with light shielding part.
Preferably, described substrate is the single crystal silicon material with <100> crystal orientation, and described inclined plane is obtained by the anisotropic etch of monocrystalline silicon.
Preferably, be arranged on described in that multiple functional layers on multiple inclined plane are isolated from one another to be opened.
Preferably, described functional layer extends at least part of first surface, second surface from inclined plane; The pad of conducting functional layer is provided with in the position of described first surface or second surface.
Integrated morphology of the present invention, the substrate of LED chip is provided with multiple inclined plane be positioned on different directions, the plurality of inclined plane is arranged respectively and is used for luminous functional layer, make described LED chip carry out luminescence by the functional layer on the plurality of inclined plane, achieve the multi-direction lighting function of single chips.After this LED chip and optical pickocff integrate, go for utilizing and carry out in the multiple fields of measurement detected close to light principle; And LED chip can distribute in vertical direction with optical pickocff, greatly can reduce the size of whole integrated morphology thus, and stability and the precision of optical chip measurement can be improved.
The present inventor finds, in the prior art, LED chip can only send the light signal of single direction, and this has limited to the integrated of LED chip and optical pickocff greatly; Also increase the area of whole package dimension simultaneously.Therefore, the technical assignment that the present invention will realize or technical problem to be solved are that those skilled in the art never expect or do not anticipate, therefore the present invention is a kind of new technical scheme.
By referring to the detailed description of accompanying drawing to exemplary embodiment of the present invention, further feature of the present invention and advantage thereof will become clear.
Accompanying drawing explanation
In the description combined and the accompanying drawing forming a part for specification shows embodiments of the invention, and illustrate that one is used from and explains principle of the present invention together with it.
Fig. 1 is the generalized section of integrated morphology of the present invention.
Fig. 2 is the structural representation removing printing opacity plastic-sealed body in Fig. 1.
Fig. 3 is the optic path schematic diagram of integrated morphology in Fig. 1.
Fig. 4 is the generalized section of another execution mode of integrated morphology of the present invention.
Fig. 5 is the generalized section of the third execution mode of integrated morphology of the present invention.
Fig. 6 is the structural representation removing printing opacity plastic-sealed body in Fig. 5.
Fig. 7 is the optic path schematic diagram of integrated morphology in Fig. 5.
Embodiment
Various exemplary embodiment of the present invention is described in detail now with reference to accompanying drawing.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit the scope of the invention.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the present invention and application or use.
May not discuss in detail for the known technology of person of ordinary skill in the relevant, method and apparatus, but in the appropriate case, described technology, method and apparatus should be regarded as a part for specification.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
With reference to figure 1, Fig. 2, the invention provides a kind of integrated morphology of optical chip, it comprises substrate 11 and fixing optical pickocff 12 on the substrate 11, described optical pickocff 12 has optical region 12a, extraneous light signal is responded to by this optical region 12a, thus make optical pickocff 12 can send different responses according to different light signals, such as optical pickocff 12 can be made to send different control signals etc. according to the power of light, the structure of this optical pickocff and principle thereof all belong to the common practise of those skilled in the art, no longer illustrate at this.
Optical pickocff such as can be fixing on the substrate 11 by the mode of attachment, and described optical pickocff 12 is also provided with LED chip, and described LED chip and optical pickocff 12 distribute in vertical direction.Particularly, described LED chip comprises the substrate 1 be arranged on optical pickocff 12, and as the functional layer 9 of LED chip luminous zone, described substrate 1 is provided with the through through hole 10 to optical pickocff 12 optical region 12a, come out by the optical region 12a of this through hole 10 by optical pickocff 12, make it can respond to extraneous light signal.
Described substrate 1 has the first surface 5, the second surface 6 that are positioned at Different Plane, and extends to the multiple inclined plane 7 second surface 6 from first surface 5 edge tilt, and the plurality of inclined plane 7 is positioned on different directions.Wherein, the functional layer 9 of described LED chip is arranged on the inclined plane 7 of the plurality of different directions.Integrated morphology of the present invention, also comprises the printing opacity plastic-sealed body 13 got up to major general's LED chip functional layer 9 and optical pickocff 12 optical region 12a plastic packaging.This printing opacity plastic-sealed body 13 can play the effect of protection to the optical region 12a of the functional layer 9 of LED chip and optical pickocff 12, can not affect the function of LED chip, optical pickocff 12 simultaneously.Printing opacity plastic-sealed body 13 adopts the material of printing opacity to make, and this belongs to the common practise of those skilled in the art, no longer illustrates at this.Preferably, printing opacity plastic-sealed body 13 by whole LED chip, optical pickocff 12 plastic packaging on the substrate 11, defines the encapsulating housing of integrated morphology of the present invention in the present invention.When injection moulding, this printing opacity plastic-sealed body 13 can be filled in the through hole 10 of substrate 1 simultaneously, is covered by the optical region 12a of optical pickocff 12.
With reference to the view direction of figure 2, first surface 5, second surface 6 can be the horizontal planes be parallel to each other, and second surface 6 is positioned at the below of first surface 5, and inclined plane 7 tilts to extend downward second surface 6 from the marginal position of first surface 5; This inclined plane 7 can be the plane of an inclination, also can be the curved surface tilting to extend to second surface 6 from first surface 5.
In the execution mode that the present invention one is concrete, described first surface 5 can be circular, now the plurality of inclined plane 7 extends to second surface 6 from the circumferential edges of first surface 5, make described multiple inclined plane 7 surround the taper surface of a tubular, described first surface 5, inclined plane 7, second surface 6 define the frustum cone structure that upper end is little, lower end is large jointly; Described through hole 10 is positioned at the middle part of frustum cone structure.
In another concrete execution mode of the present invention, described first surface 5 is rectangle, and now, described inclined plane 7 is provided with four, and these four inclined planes 7 extend inclination respectively and extend downward second surface 6 from the edge of first surface 5; That is, these four inclined planes 7 intersect a rectangular configuration on second surface 6; Described first surface 5, inclined plane 7, second surface 6 is made to define the truncated rectangular pyramids structure that upper end is little, lower end is large, with reference to figure 1, Fig. 2.Can certainly regard as, this substrate 1 have a truncated rectangular pyramids structure, four inclined planes are positioned on the outside side wall of this truncated rectangular pyramids structure, and this just makes the light signal that on each inclined plane 7, functional layer 9 sends transmit towards the lateral direction of truncated rectangular pyramids structure.Described through hole 10 is positioned at the middle part of this truncated rectangular pyramids structure, makes four of this truncated rectangular pyramids structure inclined planes 7 symmetrical relative to described through hole 10.
In this embodiment, substrate 1 can adopt the single crystal silicon material with <100> crystal orientation, anisotropic etch by monocrystalline silicon obtains above-mentioned four inclined planes 7, wherein, the angle that inclined plane tilts is 54.74 °, the method that this monocrystalline silicon to <100> crystal orientation carries out anisotropic etch belongs to the common practise of those skilled in the art, no longer illustrates at this.
LED chip of the present invention, the functional layer 9 of its luminous zone comprises p type semiconductor layer 3, n type semiconductor layer 4, and this p type semiconductor layer 3, n type semiconductor layer 4 can adopt GaN material.P type semiconductor layer 3, n type semiconductor layer 4 can be arranged on inclined plane 7 by the mode deposited successively; Such as can first deposit p type semiconductor layer 3, then deposited n-type semiconductor layer 4 on p type semiconductor layer 3; Can certainly be, first deposited n-type semiconductor layer 4 on inclined plane 7, then on n type semiconductor layer 4, deposit p type semiconductor layer 3, the PN junction of LED chip be formed on inclined plane 7 the most at last.The method of above-mentioned each layer deposition all belongs to the common practise of those skilled in the art, no longer illustrates at this.
Fig. 3 shows the light path schematic diagram of integrated morphology of the present invention, this integrated morphology can be applied to gesture identification field, with reference to the view direction of figure 3, when the functional layer 9 of LED chip on left side face 7 sends towards upper left light signal, this light signal transmits in printing opacity plastic-sealed body 13, when arriving the upper end position of printing opacity plastic-sealed body 13, there is refraction and continue transmission in atmosphere; When the finger of human body is when primary importance starts to slide, this light signal can by the finger obscures of human body, and reflexed on printing opacity plastic-sealed body 13 by finger, enter in the through hole 10 of substrate 1 through superrefraction afterwards, and sensed by the optical region 12a of optical pickocff 12, make optical pickocff 12 send the first response; When the functional layer 9 of LED chip on inclined plane, right side 7 sends towards top-right light signal, this light signal transmits in printing opacity plastic-sealed body 13, when arriving the upper end position of printing opacity plastic-sealed body 13, refraction occurs and continues transmission in atmosphere; When the finger sliding of human body is to the right second place, this light signal can by the finger obscures of human body, and reflexed on printing opacity plastic-sealed body 13 by finger, enter in the through hole 10 of substrate 1 through superrefraction afterwards, and sensed by the optical region 12a of optical pickocff 12, make optical pickocff 12 send the second response; By the first response, second response of this optical pickocff 12, thus can judge that the direction of now human body gesture is moved in the second place by primary importance.
Above-mentioned light signal is when human body reflects and passes through in through hole 10, have some optical signal transmission on the sidewall of through hole 10, in order to make optical pickocff 12 optical region 12a can sense more light signal, the sidewall of described through hole 10 can also arrange one deck reflector; Light signal is transferred to after the sidewall of through hole 10 from the external world, through reflective layer reflects on the optical region 12a of optical pickocff 12.Reflector of the present invention can be the materials well-known to those skilled in the art such as metallic aluminium, no longer illustrates at this.
In the above-described embodiments, the light signal that functional layer 9 sends is refracted in air through the upper end of printing opacity plastic-sealed body 13, certainly can also according to the transmission path needing to come selective light signal of actual design, such as in the present invention one preferred embodiment, select suitable printing opacity plastic-sealed body 13 shape, when the optical signal transmission that LED chip functional layer 9 is sent is to the sidewall locations of printing opacity plastic-sealed body 13, there is refraction and continue transmission in atmosphere, with reference to figure 4.
The integrated morphology of above-mentioned optical chip, the light transmission path caused by its structure, makes it can use as the transducer of identification gesture.When changing the transmission path of light by structural design, such optical chip also can be applied in other field of optical measurements.Such as in the present invention one preferred embodiment, the light path that goes out that can be arranged in each functional layer 9 of LED chip on printing opacity plastic-sealed body 13 arranges reflecting part, is reflexed on the opposite side direction of truncated rectangular pyramids structure by the truncated rectangular pyramids structure light signal that wherein side functional layer 9 emits by this reflecting part.Such as with reference to the view direction of figure 3, when the functional layer 9 of LED chip on left side face 7 sends towards upper left light signal, this light signal transmits in printing opacity plastic-sealed body 13, when this light signal runs into reflecting part, this light signal is reflected towards the upper right side of truncated rectangular pyramids structure.The optical chip of this kind of structure such as can be used as heart rate sensor and is applied in wearable device, thus can the sign information such as heart rate of human body.
In above-mentioned LED chip, described first surface 5, inclined plane 7, second surface 6 define the truncated rectangular pyramids structure that upper end is little, lower end is large; In another concrete execution mode of the present invention, described first surface 5, inclined plane 7, second surface 6 define trapezoid groove structure, and the truncated rectangular pyramids mating shapes of this trapezoid groove structure and handstand, with reference to figure 5, Fig. 6.Can certainly regard as, substrate 1 have a trapezoid groove structure, four inclined planes 7 are positioned in the inside side walls of this trapezoid groove structure, make to be positioned at the light signal that on inclined plane 7, functional layer 9 sends and transmit towards the direction, inner side of trapezoid groove structure.Now, the through hole 10 of described through optical pickocff 12 optical region 12a is positioned at the middle part of trapezoid groove structure, makes four of this trapezoid groove structure inclined planes 7 symmetrical relative to described through hole 10.
In this embodiment, substrate 1 can adopt the single crystal silicon material with <100> crystal orientation, anisotropic etch by monocrystalline silicon obtains above-mentioned four inclined planes 7, wherein, the angle that inclined plane tilts is 54.74 °, the method that this monocrystalline silicon to <100> crystal orientation carries out anisotropic etch belongs to the common practise of those skilled in the art, no longer illustrates at this.
Fig. 7 shows the light path schematic diagram of this integrated morphology, the integrated morphology of this optical chip can be applied to the wearable device field measuring human body physical sign information, with reference to the view direction of figure 7, when the functional layer 9 of LED chip on left side face 7 sends towards top-right light signal, this light signal transmits in printing opacity plastic-sealed body 13, when arriving the upper end of printing opacity plastic-sealed body 13, there is refraction and continue transmission in atmosphere, the light signal of this transmission is after human body skin, reflex to the upper end of printing opacity plastic-sealed body 13, refraction through printing opacity plastic-sealed body 13 enters in the through hole 10 of substrate 1, and sensed by the optical region 12a of optical pickocff 12.By LED chip of the present invention, make all have the light signal for detecting to send in a different direction, thus improve the precision of detection; And, due to the optical path full symmetric of each optical signal transmission, make such wearable device not be vulnerable to extraneous motor message or wear affect improperly.
The integrated morphology of this optical chip, the light signal sent due to functional layer 9 on inclined plane 7 transmits towards the direction, inner side of trapezoid groove structure, this just makes the light signal transmitted likely directly be sensed by the optical region 12a of optical pickocff 12, thus has influence on the precision of detection.In order to address this problem, one light shielding part 14 can be set the position on substrate 1 between inclined plane 7 and through hole 10, with reference to figure 5, Fig. 6.The light signal that can prevent functional layer 9 from sending by this light shielding part 14 is directly sensed by the optical region 12a of optical pickocff 12, thus ensure that the accuracy of optical chip.This light shielding part 14 can be arranged on second surface 6, and such as it can extend vertically upward from second surface 6.
The integrated morphology of above-mentioned optical chip, the light transmission path caused by its structure, makes it can use as the transducer of human body sign; When changing the transmission path of light by structural design, such optical chip also can be applied in other field of optical measurements.Such as in the present invention one preferred embodiment, on printing opacity plastic-sealed body 13, reflecting part can being set for LED chip each going out in light path of functional layer 9, being reflexed to being positioned at the trapezoid groove structure light signal that wherein side functional layer 9 launches on the opposite side direction of trapezoid groove structure by this reflecting part.Such as with reference to the view direction of figure 7, when the functional layer 9 of LED chip on left side face 7 sends towards top-right light signal, this light signal transmits in printing opacity plastic-sealed body 13, when this light signal runs into reflecting part, this light signal is reflected towards the upper left side of trapezoid groove structure.The optical chip of this kind of structure can be applied to above-mentioned gesture identification field.
Integrated morphology of the present invention, the substrate of LED chip is provided with multiple inclined plane be positioned on different directions, the plurality of inclined plane is arranged respectively and is used for luminous functional layer, make described LED chip carry out luminescence by the functional layer on the plurality of inclined plane, achieve the multi-direction lighting function of single chips.After this LED chip and optical pickocff integrate, go for utilizing and carry out in the multiple fields of measurement detected close to light principle; And LED chip can distribute in vertical direction with optical pickocff, greatly can reduce the size of whole integrated morphology thus, and stability and the precision of optical chip measurement can be improved.
In the present invention one preferred embodiment, the functional layer 9 of described LED chip extends at least part of first surface 5, second surface 6 from inclined plane 7, and this functional layer 9 can be combined with inclined plane 7 better.Also the terminals of LED chip can be set in the position of first surface 5, second surface 6 simultaneously.Particularly, on described first surface 5 or the position of second surface 6 be provided with the pad 8 of respectively conducting p type semiconductor layer 3, n type semiconductor layer 4.Pad 8 is arranged on the position of first surface 5 or second surface 6, and conducting semiconductor layer separately, pad 8 can not be affected be positioned at the functional layer 9 of position, inclined plane 7 to work.
LED chip of the present invention, together with the lattice of the functional layer 9 with substrate 1 that make LED chip mates better, at first surface 5, second surface 6, is also provided with resilient coating 2 between inclined plane 7 and functional layer 9.When manufacture, first on the first surface 5 of substrate 1, second surface 6, inclined plane 7, deposit one deck resilient coating 2, then on this resilient coating 2, form functional layer 9.The material of resilient coating 2 is selected according to the material of substrate 1 and functional layer 9, and this belongs to the common practise of those skilled in the art, no longer illustrates at this.
In the present invention one preferred embodiment, the described functional layer 9 be arranged on multiple inclined plane 7 is connected together, and that is, the functional layer 9 on multiple inclined plane 7 is one, carry out conducting by single pad, make whole functional layer 9 simultaneously luminous.Another preferred embodiment in, the described functional layer 9 be arranged on multiple inclined plane 7 is isolated from one another to be opened, make each functional layer 9 can be luminous separately, now need to arrange independently pad 8 in each functional layer 9, carry out the corresponding functional layer 9 of conducting by respective pad 8, thus each functional layer 9 can be controlled work alone.
Although be described in detail specific embodiments more of the present invention by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit the scope of the invention.It should be appreciated by those skilled in the art, can without departing from the scope and spirit of the present invention, above embodiment be modified.Scope of the present invention is limited by claims.
Claims (10)
1. the integrated morphology of an optical chip, it is characterized in that: comprise substrate (11), have the optical pickocff (12) of optical region (12a), described optical pickocff (12) is arranged on substrate (11); Also comprise LED chip, described LED chip comprises the substrate (1) be arranged on optical pickocff (12), described substrate (1) has the first surface (5), the second surface (6) that are positioned at Different Plane, and extends to the multiple inclined planes (7) second surface (6) from first surface (5) edge tilt; Described the plurality of inclined plane (7) is provided with the functional layer (9) as LED chip luminous zone; Described substrate (1) is also provided with the through through hole (10) to optical pickocff (12) optical region (12a); Also comprise the printing opacity plastic-sealed body (13) got up to major general's LED chip functional layer (9) and optical pickocff (12) optical region (12a) plastic packaging.
2. integrated morphology according to claim 1, it is characterized in that: described first surface (5) is for circular, and described multiple inclined plane (7) extends to second surface (6) from the circumferential edges of first surface (5); Described first surface (5), inclined plane (7), second surface (6) define frustum cone structure; The through hole (10) of described through optical pickocff (12) optical region (12a) is positioned at the middle part of frustum cone structure.
3. integrated morphology according to claim 1, it is characterized in that: described first surface (5) is rectangle, described inclined plane (7) is provided with four, extends to second surface (6) respectively from the edge of first surface (5); Described first surface (5), inclined plane (7), second surface (6) define truncated rectangular pyramids structure, described in be positioned at the light signal that the upper functional layer (9) in inclined plane (7) sends and transmit towards the lateral direction of truncated rectangular pyramids structure; The through hole (10) of described through optical pickocff (12) optical region (12a) is positioned at the middle part of truncated rectangular pyramids structure.
4. integrated morphology according to claim 3, is characterized in that: be also provided with reflecting part, and described reflecting part is configured to: reflected towards the opposite side direction of truncated rectangular pyramids structure by the truncated rectangular pyramids structure light signal that wherein side functional layer (9) launches.
5. integrated morphology according to claim 1, it is characterized in that: described inclined plane (7) are provided with four, extend to second surface (6) from the edge of first surface (5) respectively, described first surface (5), inclined plane (7), second surface (6) define one with the trapezoid groove structure of the truncated rectangular pyramids form fit of standing upside down; Described inclined plane (7) light signal that above functional layer (9) sends that is positioned at transmits towards the direction, inner side of trapezoid groove structure; The through hole (10) of described through optical pickocff (12) optical region (12a) is positioned at the middle part of trapezoid groove structure.
6. integrated morphology according to claim 5, is characterized in that: be also provided with reflecting part, and described reflecting part is configured to: reflected towards the opposite side direction of trapezoid groove structure by the trapezoid groove structure light signal that wherein side functional layer (9) transmits.
7. integrated morphology according to claim 5, is characterized in that: the position described substrate (1) is positioned between inclined plane (7) and through hole (10) is also provided with light shielding part (14).
8. the integrated morphology according to any one of claim 3 to 7, it is characterized in that: described substrate (1) is for having the single crystal silicon material in <100> crystal orientation, and described inclined plane (7) are obtained by the anisotropic etch of monocrystalline silicon.
9. the integrated morphology according to any one of claim 1 to 7, is characterized in that: described in be arranged on that multiple functional layers (9) on multiple inclined plane (7) are isolated from one another to be opened.
10. integrated morphology according to claim 9, is characterized in that: described functional layer (9) extends at least part of first surface (5), second surface (6) from inclined plane (7); The pad (8) of conducting functional layer (9) is provided with in the position of described first surface (5) or second surface (6).
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| CN109040362A (en) * | 2018-08-09 | 2018-12-18 | Oppo广东移动通信有限公司 | The assemble method of electronic device and electronic device |
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Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |