CN106206917A - The integrated morphology of a kind of optical chip and manufacture method thereof - Google Patents
The integrated morphology of a kind of optical chip and manufacture method thereof Download PDFInfo
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- CN106206917A CN106206917A CN201610790988.5A CN201610790988A CN106206917A CN 106206917 A CN106206917 A CN 106206917A CN 201610790988 A CN201610790988 A CN 201610790988A CN 106206917 A CN106206917 A CN 106206917A
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- sealed body
- plastic
- printing opacity
- substrate
- led chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
The invention discloses integrated morphology and the manufacture method thereof of a kind of optical chip, the optical sensor chip that including substrate and is arranged on substrate, at least one LED chip, it is additionally provided with the first printing opacity plastic-sealed body, at least one second printing opacity plastic-sealed body optical sensor chip, at least one LED chip being encapsulated respectively on the substrate, and for by light tight plastic-sealed body optically isolated to optical sensor chip, LED chip between the first printing opacity plastic-sealed body, the second printing opacity plastic-sealed body；Wherein, described second printing opacity plastic-sealed body is inclined-plane with the face that light tight plastic-sealed body is combined, and described inclined-plane tilts to the second printing opacity plastic-sealed body upper surface towards the edge direction of substrate from substrate end-face.The integrated morphology of the present invention, can be substantially reduced the size of whole integrated morphology.
Description
Technical field
The present invention relates to optical pickocff field, more particularly it relates to an the integrated morphology of optical chip；This
Invention further relates to the manufacture method of a kind of integrated morphology.
Background technology
Along with the development of smart machine, for realizing its intelligentized function, increasing sensor is introduced in intelligence
In equipment, optical pickocff is no exception.At some close in optical sensor, gesture identification can be realized by certain algorithm
Function, this generally comprise close to optical sensor be positioned at middle part optical pickocff and be positioned at around optical pickocff many
Individual LED chip, optical pickocff, LED chip are independently encapsulated on circuit substrate.Due to LED chip knot in prior art
The restriction of structure so that a certain distance must be reserved between above-mentioned multiple LED chip and optical pickocff, just can make optical sensing
Device senses the optical signal that LED chip sends；If the distance between LED chip and optical pickocff is the least, gesture can be caused
None-identified or identify insensitive.
Summary of the invention
It is an object of the present invention to provide the new solution of the integrated morphology of a kind of optical chip.
According to the first aspect of the invention, it is provided that the integrated morphology of a kind of optical chip, including substrate and be arranged on
Optical sensor chip on substrate, at least one LED chip, be additionally provided with on the substrate respectively by optical pickocff core
The first printing opacity plastic-sealed body that sheet, at least one LED chip are encapsulated, at least one second printing opacity plastic-sealed body, and it is positioned at
For by light tight plastic packaging optically isolated to optical sensor chip, LED chip between one printing opacity plastic-sealed body, the second printing opacity plastic-sealed body
Body；Wherein, described second printing opacity plastic-sealed body is inclined-plane with the face that light tight plastic-sealed body is combined, and described inclined-plane from substrate end-face to
Second printing opacity plastic-sealed body upper surface tilts towards the edge direction of substrate.
Optionally, it is additionally provided with and surrounds the light tight housing of outer enclosure with described substrate.
Optionally, described light tight housing is the pre-plastic package body being molded in advance on substrate.
Optionally, described second printing opacity plastic-sealed body is inclined-plane with the face that pre-plastic package body is combined, by described pre-plastic package body, no
The cross section parallelogram of the second printing opacity plastic-sealed body that printing opacity plastic-sealed body, substrate are surrounded.
Optionally, described first printing opacity plastic-sealed body is vertical face with the face that light tight plastic-sealed body is combined, or is oblique
Face.
Optionally, described LED chip is provided with two, and these two LED chip are distributed in the two of optical sensor chip
Side；Or, described LED chip is provided with four, and these four LED chip are distributed in the surrounding of optical sensor chip.
Optionally, at described first printing opacity plastic-sealed body or/and the upper surface of the second printing opacity plastic-sealed body is also formed with optics
Lens arrangement.
According to a further aspect in the invention, additionally provide the manufacture method of a kind of above-mentioned integrated morphology, comprise the following steps:
A) optical sensor chip, at least one LED chip are arranged on substrate, and carry out routing, so that optics is passed
Sensor chip, the pin of at least one LED chip are connected in the circuit of substrate；
B) on substrate, optical sensor chip, at least one LED chip are carried out plastic packaging, formed and be covered each by described light
Learn sensor chip, the first printing opacity plastic-sealed body of LED chip, at least one second printing opacity plastic-sealed body；And described second printing opacity moulds
Envelope body be inclined-plane near the face of the first printing opacity plastic-sealed body side, and described inclined-plane from substrate end-face to the second printing opacity plastic-sealed body upper end
Edge direction facing to substrate tilts；
C) between described first printing opacity plastic-sealed body, at least one second printing opacity plastic-sealed body, described optics is passed by injection formation
The light tight plastic-sealed body that sensor chip, LED chip are optically isolated, the inclined-plane knot of described light tight plastic-sealed body and the second printing opacity plastic-sealed body
It is combined.
Optionally, before step a), it is additionally included on substrate the step being molded and being formed pre-plastic package body, described preformed
Feng Tiyu substrate defines outer enclosure.
Optionally, in described step c), it is molded light-proof material in the whole upper surface of integrated morphology, and impermeable to this
Luminescent material carries out reduction processing, thus the first printing opacity plastic-sealed body, the second printing opacity plastic-sealed body is exposed, and forms that to be positioned at first saturating
Light tight plastic-sealed body between light plastic-sealed body, the second printing opacity plastic-sealed body.
The integrated morphology of the present invention, forms going out of LED chip by light tight plastic-sealed body and the second printing opacity plastic-sealed body
Light path, this allows for optical signal that LED chip the sends bearing of trend only along the second printing opacity plastic-sealed body towards away from optics
The direction of sensor chip is launched；Use this frame mode, even if the distance between LED chip and optical sensor chip is very
Little, optical sensor chip also can receive the optical signal sent by LED chip after reflection；From another one angle
Speech, can be greatly shortened the distance between LED chip and optical sensor chip, thus can be substantially reduced whole integrated morphology
Size.After this LED chip and optical pickocff integrate, go for utilizing close to light principle carry out detecting multiple
In fields of measurement；Enter miniaturized electronics for gesture identification and feasibility is provided.
It was found by the inventors of the present invention that conventionally, as the restriction of LED chip structure so that above-mentioned multiple LED
A certain distance must be reserved between chip and optical pickocff, optical pickocff just can be made to sense the light that LED chip sends
Signal；If the distance between LED chip and optical pickocff is the least, gesture None-identified can be caused or identify insensitive.
Therefore, the present invention is to be realized technical assignment or the those skilled in the art of technical problem is that to be solved never expect
Or it is not expected that, therefore the present invention is a kind of new technical scheme.
By detailed description to the exemplary embodiment of the present invention referring to the drawings, the further feature of the present invention and
Advantage will be made apparent from.
Accompanying drawing explanation
Combined in the description and the accompanying drawing of the part that constitutes description shows embodiments of the invention, and even
With its explanation together for explaining the principle of the present invention.
Fig. 1 is the schematic diagram of integrated morphology of the present invention.
Fig. 2 is the structural representation of another embodiment of integrated morphology of the present invention.
Fig. 3 to Fig. 5 is the artwork of integrated morphology manufacture method of the present invention.
Detailed description of the invention
The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.It should also be noted that unless additionally have
Body illustrates, the parts illustrated the most in these embodiments and positioned opposite, the numerical expression of step and numerical value are not intended to this
The scope of invention.
Description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And any restriction applied or use.
May be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of when, described technology, method and apparatus should be considered a part for description.
It is shown here that any occurrence should be construed as merely exemplary with in all examples discussed, and not
It is as restriction.Therefore, other example of exemplary embodiment can have different values.
It should also be noted that similar label and letter represent similar terms, therefore, the most a certain Xiang Yi in following accompanying drawing
Individual accompanying drawing is defined, then need not it is further discussed in accompanying drawing subsequently.
With reference to Fig. 1, the invention provides the integrated morphology of a kind of optical chip, including substrate 1 and arrange on substrate 1
Optical sensor chip 3, at least one LED chip 2, described optical sensor chip 3, LED chip 2 are respectively provided with light school district
Territory, optical sensor chip 3 senses the optical signal in the external world by its optical region, so that optical sensor chip 3 is permissible
Send different responses according to different optical signals, such as, optical sensor chip 3 can be made to send not according to the power of light
Same control signal etc.；LED chip 2 can outwards launch optical signal by its optical region；The structure of this optical chip
And principle belongs to the common knowledge of those skilled in the art, no longer illustrate at this.
Optical sensor chip 3 and LED chip 2 such as can be fixed on substrate 1 by the way of attachment, and can lead to
The pin of two optical chips is connected in the circuit layout of substrate 1 by the mode crossing routing；Certainly, for the technology of this area
For personnel, it is also possible to use the mode planting stannum ball to be directly welded on the pad of substrate 1 by above-mentioned optical chip, to realize
The mechanical connection of optical chip and substrate 1 and electrically connecting.The LED chip 2 of the present invention can be provided with one, two or more
Multiple.When LED chip 2 is provided with two, these two LED chip 2 can be distributed in the both sides of optical sensor chip 3；When
When LED chip 2 is provided with four, these four LED chip 2 can be distributed in the surrounding of optical sensor chip 3.
The integrated morphology of the present invention, described substrate 1 is additionally provided with respectively by optical sensor chip 3, at least one
The first printing opacity plastic-sealed body 6 that LED chip 2 is encapsulated, at least one second printing opacity plastic-sealed body 5, at base by the way of injection
Concurrently form first printing opacity plastic-sealed body the 6, second printing opacity plastic-sealed body 5 on plate 1, such that it is able to respectively by optical sensor chip 3,
LED chip 2 is encapsulated, to protect optical sensor chip 3, LED chip 2 without damage；Simultaneously the first printing opacity plastic-sealed body 6,
Second printing opacity plastic-sealed body 5 uses the material of printing opacity, thus does not interferes with the normal work of optical sensor chip 3, LED chip 2.
The integrated morphology of the present invention, also include between first printing opacity plastic-sealed body the 6, second printing opacity plastic-sealed body 5 is impermeable
Light plastic-sealed body 7, by the way of injection, between first printing opacity plastic-sealed body the 6, second printing opacity plastic-sealed body 5, injection forms light tight moulding
Envelope body 7, such that it is able to by optical sensor chip 3, LED chip 2 is optically isolated opens, with the light directly quilt preventing LED chip 2 from sending
Optical sensor chip 3 receives.
Wherein, described second printing opacity plastic-sealed body 5 is inclined-plane with the face that light tight plastic-sealed body 7 is combined, and described inclined-plane is from base
Plate 1 end face tilts to the second printing opacity plastic-sealed body 5 upper surface towards the edge direction of substrate 1, with reference to Fig. 1.It is to say, described tiltedly
Face tilts towards the direction away from optical sensor chip 3 from bottom to up.
The integrated morphology of the present invention, limits going out of LED chip by light tight plastic-sealed body and the second printing opacity plastic-sealed body
Light path, this allows for optical signal that LED chip the sends bearing of trend only along the second printing opacity plastic-sealed body towards away from optics
The direction of sensor chip is launched；Use this frame mode, even if the distance between LED chip and optical sensor chip is very
Little, optical sensor chip also can receive the optical signal sent by LED chip after reflection；From another one angle
Speech, can be greatly shortened the distance between LED chip and optical sensor chip, thus can be substantially reduced whole integrated morphology
Size.After this LED chip and optical pickocff integrate, go for utilizing close to light principle carry out detecting multiple
In fields of measurement, enter miniaturized electronics for gesture identification and feasibility is provided.
In one preferred embodiment of the invention, it is additionally provided with and surrounds the light tight of outer enclosure with described substrate 1
Housing 4, this light tight housing 4 can combine with the outside of the second printing opacity plastic-sealed body 5 so that this light tight housing 4 is permissible
Limit the outside exiting surface of the second printing opacity plastic-sealed body 5.Described light tight housing 4 can be moulding, it is further preferred that, institute
Stating light tight housing 4 is the pre-plastic package body being molded the most in advance.Described second printing opacity plastic-sealed body 5 and pre-plastic package body
In conjunction with face be preferably inclined-plane.Described light tight housing 4 and light tight plastic-sealed body 7, substrate 1 have jointly crossed the second printing opacity and have moulded
The exiting surface of envelope body 5, the cross section parallelogram of the second printing opacity plastic-sealed body 5 preferably crossed, with reference to Fig. 1 so that described LED
The direction that the optical signal that chip 2 sends is directed away from optical sensor chip 3 only along the second printing opacity plastic-sealed body 5 tilts to penetrate
Go out.
The integrated morphology of the present invention, described first printing opacity plastic-sealed body 6 can be vertical with the face that light tight plastic-sealed body 7 is combined
Face, it is also possible to for inclined-plane, do not limit at this.It is also formed with optical lens in the upper surface of described first printing opacity plastic-sealed body 6
Structure 8, with reference to Fig. 2.This optical lens structure 8 thus can improve optical signal as the optical lens of optical signal incidence
Incident intensity, thus improve sensitivity and the resolution of optical sensor chip.Certainly, for those skilled in the art
For, it is also possible to optical lens structure 8 is set in the upper surface of the second printing opacity plastic-sealed body 5, improves optical signal outgoing with this
Intensity, it is also possible to change the angle of optical signal outgoing.
Present invention also offers the manufacture method of the integrated morphology of a kind of optical chip, it comprises the following steps:
A) optical sensor chip 3, at least one LED chip 2 are installed on substrate 1, and carry out routing, with by optics
Sensor chip 3, the pin of at least one LED chip 2 are connected in the circuit of substrate 1, with reference to Fig. 3；As described above, can adopt
By mounting method well-known to those skilled in the art, optical sensor chip 3, LED chip 2 are installed on substrate 1, go forward side by side
Row routing, to realize optical sensor chip 3, LED chip 2 and the electrical connection of substrate 1；
B) on substrate 1 optical sensor chip 3, at least one LED chip 2 are carried out plastic packaging, formed and be covered each by institute
State optical sensor chip 3, the first printing opacity plastic-sealed body 6 of LED chip 2, at least one second printing opacity plastic-sealed body 5；First printing opacity
Plastic-sealed body 6, at least one second printing opacity plastic-sealed body 5 use light transmissive material well-known to those skilled in the art, by injection
Mode, utilizes mould to form the first printing opacity plastic packaging being covered each by described optical sensor chip 3, LED chip 2 on substrate 1
Body the 6, second printing opacity plastic-sealed body 5, to complete the protection of chip；
And described second printing opacity plastic-sealed body 5 is inclined-plane near the face of the first printing opacity plastic-sealed body 6 side, and described inclined-plane is from base
Plate 1 end face, to the second printing opacity plastic-sealed body 5 upper surface, tilts towards the edge direction of substrate 1；
C) between described first printing opacity plastic-sealed body 6, at least one second printing opacity plastic-sealed body 5, injection is formed described optics
The light tight plastic-sealed body 7 that sensor chip 3, LED chip 2 are optically isolated, described light tight plastic-sealed body 7 uses those skilled in the art
Known light-proof material, for example with the injection molding material of black, can will be located in its both sides by this light tight plastic-sealed body 7
Optical sensor chip 3 is the most optically isolated with LED chip 2 to be opened, and prevents the optical signal that LED chip 2 sends directly by optical sensing
Device chip 3 senses；
Described light tight plastic-sealed body 7 combines with the inclined-plane of the second printing opacity plastic-sealed body 5, thus light tight is moulded by this
Envelope body 7 can change light exit path in the second printing opacity plastic-sealed body 5, say, that so that the light that LED chip 2 sends
Signal only along the second printing opacity plastic-sealed body 5 towards the direction outgoing away from optical sensor chip 3.
Currently preferred, before step a), it is additionally included on substrate 1 step being molded and being formed pre-plastic package body,
Described pre-plastic package body and substrate 1 define the outer enclosure of integrated morphology jointly.Described second printing opacity plastic-sealed body 5 and pre-plastic package body
In conjunction with face be preferably inclined-plane, described light tight housing 4 and light tight plastic-sealed body 7, substrate 1 have jointly crossed the second printing opacity and have moulded
The exiting surface of envelope body 5.
Currently preferred, in described step c, it is molded light-proof material in the whole upper surface of integrated morphology, and right
This light-proof material carries out reduction processing, thus is exposed by first printing opacity plastic-sealed body the 6, second printing opacity plastic-sealed body 5, and forms position
Light tight plastic-sealed body 7 between first printing opacity plastic-sealed body the 6, second printing opacity plastic-sealed body 5, with reference to Fig. 5.In order to be molded conveniently,
The upper surface injection light-proof material of total, afterwards by thinning, the means such as grinding remove unnecessary light-proof material, protect
Demonstrate,prove the unimpeded of light path.
Although by example, some specific embodiments of the present invention have been described in detail, but the skill of this area
Art personnel are it should be understood that example above is merely to illustrate rather than in order to limit the scope of the present invention.The skill of this area
Art personnel are it should be understood that can modify to above example without departing from the scope and spirit of the present invention.This
Bright scope is defined by the following claims.
Claims (10)
1. the integrated morphology of an optical chip, it is characterised in that: include substrate (1) and be arranged on the optics on substrate (1)
Sensor chip (3), at least one LED chip (2), be additionally provided with respectively by optical sensor chip on described substrate (1)
(3), at least one LED chip (2) be encapsulated the first printing opacity plastic-sealed body (6), at least one second printing opacity plastic-sealed body (5),
And be positioned between the first printing opacity plastic-sealed body (6), the second printing opacity plastic-sealed body (5) for by optical sensor chip (3), LED core
The light tight plastic-sealed body (7) that sheet (2) is optically isolated；Wherein, described second printing opacity plastic-sealed body (5) combines with light tight plastic-sealed body (7)
Face be inclined-plane, and described inclined-plane from substrate (1) end face to the second printing opacity plastic-sealed body (5) upper surface towards the edge of substrate (1)
Direction tilts.
Integrated morphology the most according to claim 1, it is characterised in that: it is additionally provided with and surrounds outside envelope with described substrate (1)
The light tight housing (4) of dress.
Integrated morphology the most according to claim 2, it is characterised in that: described light tight housing (4) is enterprising at substrate (1)
The pre-plastic package body that row is molded in advance.
Integrated morphology the most according to claim 3, it is characterised in that: described second printing opacity plastic-sealed body (5) and pre-plastic package body
In conjunction with face be inclined-plane, described pre-plastic package body, light tight plastic-sealed body (7), substrate (1) the second printing opacity plastic-sealed body surrounded
(5) cross section parallelogram.
Integrated morphology the most according to claim 1, it is characterised in that: described first printing opacity plastic-sealed body (6) is moulded with light tight
The face that envelope body (7) combines is vertical face, or is inclined-plane.
Integrated morphology the most according to claim 1, it is characterised in that: described LED chip (2) is provided with two, these two
LED chip (2) is distributed in the both sides of optical sensor chip (3)；Or, described LED chip (2) is provided with four, and these are four years old
Individual LED chip (2) is distributed in the surrounding of optical sensor chip (3).
Integrated morphology the most according to claim 1, it is characterised in that: at described first printing opacity plastic-sealed body (6) or/and second
The upper surface of printing opacity plastic-sealed body (5) is also formed with optical lens structure (8).
8. the manufacture method of integrated morphology as described in any one of claim 1 to 7, it is characterised in that comprise the following steps:
A) optical sensor chip (3), at least one LED chip (2) are arranged on substrate (1), and carry out routing, with by light
Learn sensor chip (3), the pin of at least one LED chip (2) is connected in the circuit of substrate (1)；
B) on substrate (1), optical sensor chip (3), at least one LED chip (2) being carried out plastic packaging, formation is covered each by
Described optical sensor chip (3), the first printing opacity plastic-sealed body (6) of LED chip (2), at least one second printing opacity plastic-sealed body
(5)；And described second printing opacity plastic-sealed body (5) is inclined-plane near the face of the first printing opacity plastic-sealed body (6) side, and described inclined-plane is from base
Plate (1) end face tilts to the second printing opacity plastic-sealed body (5) upper surface towards the edge direction of substrate (1)；
C) between described first printing opacity plastic-sealed body (6), at least one second printing opacity plastic-sealed body (5), injection is formed described optics
The light tight plastic-sealed body (7) that sensor chip (3), LED chip (2) are optically isolated, described light tight plastic-sealed body (7) and the second printing opacity
The inclined-plane of plastic-sealed body (5) combines.
Manufacture method the most according to claim 8, it is characterised in that: before step a), it is additionally included in the upper note of substrate (1)
Moulding and formed the step of pre-plastic package body, described pre-plastic package body and substrate (1) define outer enclosure.
Manufacture method the most according to claim 8, it is characterised in that: in described step c), integrated morphology whole on
End face injection light-proof material, and carries out reduction processing to this light-proof material, thus by the first printing opacity plastic-sealed body (6), second
Printing opacity plastic-sealed body (5) exposes, and formed be positioned between the first printing opacity plastic-sealed body (6), the second printing opacity plastic-sealed body (5) light tight
Plastic-sealed body (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790988.5A CN106206917A (en) | 2016-08-31 | 2016-08-31 | The integrated morphology of a kind of optical chip and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790988.5A CN106206917A (en) | 2016-08-31 | 2016-08-31 | The integrated morphology of a kind of optical chip and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106206917A true CN106206917A (en) | 2016-12-07 |
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ID=58087287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610790988.5A Pending CN106206917A (en) | 2016-08-31 | 2016-08-31 | The integrated morphology of a kind of optical chip and manufacture method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106206917A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107256401A (en) * | 2017-07-12 | 2017-10-17 | 昆山丘钛微电子科技有限公司 | Optical finger print chip-packaging structure |
| CN107845627A (en) * | 2017-09-29 | 2018-03-27 | 深圳奥比中光科技有限公司 | More proximity detection optical sensors |
-
2016
- 2016-08-31 CN CN201610790988.5A patent/CN106206917A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107256401A (en) * | 2017-07-12 | 2017-10-17 | 昆山丘钛微电子科技有限公司 | Optical finger print chip-packaging structure |
| CN107845627A (en) * | 2017-09-29 | 2018-03-27 | 深圳奥比中光科技有限公司 | More proximity detection optical sensors |
| CN107845627B (en) * | 2017-09-29 | 2020-02-18 | 深圳奥比中光科技有限公司 | Multiple proximity detection light sensor |
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Application publication date: 20161207 |
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