CN205752136U - A kind of optical sensor package structure and circuit board thereof - Google Patents
A kind of optical sensor package structure and circuit board thereof Download PDFInfo
- Publication number
- CN205752136U CN205752136U CN201620457123.2U CN201620457123U CN205752136U CN 205752136 U CN205752136 U CN 205752136U CN 201620457123 U CN201620457123 U CN 201620457123U CN 205752136 U CN205752136 U CN 205752136U
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- Prior art keywords
- light
- optical sensor
- cavity volume
- passing board
- package structure
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- 230000003287 optical effect Effects 0.000 title claims abstract description 108
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 125000006850 spacer group Chemical group 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 13
- 238000004220 aggregation Methods 0.000 claims description 8
- 230000002776 aggregation Effects 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000008280 blood Substances 0.000 description 2
- 210000004369 blood Anatomy 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
The utility model discloses a kind of optical sensor package structure and circuit board thereof, including substrate and be arranged on substrate and separated by compartment the first cavity volume, the second cavity volume, in described first cavity volume, the second cavity volume, be respectively arranged with optical sensor chip, LED chip；Also include covering the first light-passing board in the first cavity volume upper end, and cover the second light-passing board in the second cavity volume upper end；The side that described spacer portion upper end is positioned at the first cavity volume is provided with the first step for carrying the first light-passing board, and the side that described spacer portion upper end is positioned at the second cavity volume is provided with the second step for carrying the second light-passing board.Encapsulating structure of the present utility model, effectively prevent the light that LED chip sends and is directly sensed by optical sensor chip, efficiently solve the problem of optical crosstalk between chip, improve the accuracy of detection of optical pickocff.
Description
Technical field
This utility model relates to the encapsulating structure of a kind of chip, more specifically, this utility model relates to one
Plant the encapsulating structure of optical pickocff；This utility model further relates to a kind of optical sensor package structure
Circuit board.
Background technology
At present, optical pickocff is more and more extensive in the application of consumer electronics, such as mobile phone, intelligence hands
Table, Intelligent bracelet etc..Utilize optical pickocff, it is possible to achieve close to light detection, ambient light detection,
Heart rate detection, the detection of blood oxygen, gesture identification etc..Its ultimate principle is that LED chip sends specific wavelength
Light, this light arrives after object under test, can return a branch of light relevant to object under test, arrive
Reach optics and receive the optics reception area of chip.
In general, being packaged when, first by chip attachment on pcb board, by drawing
Electrode on chip is linked together by line with the pin on pcb board, then is passed by optics with light transmissive material
Sensor, LED chip carry out plastic packaging, to protect chip, complete encapsulation.Above-mentioned encapsulating structure, LED
The light that chip sends, a part of light likely can be through multiple reflections inside light transmissive material, then
Directly received by optical chip, thus produce the crosstalk of signal.
Utility model content
A purpose of the present utility model is to provide the new technique side of a kind of optical sensor package structure
Case.
According to first aspect of the present utility model, it is provided that a kind of optical sensor package structure, including
Lighttight encapsulating package, described encapsulating package includes substrate and is arranged on substrate and by spacer portion
The first cavity volume of separating, the second cavity volume, be respectively arranged with in described first cavity volume, the second cavity volume
Optical sensor chip, LED chip；Also include covering the first light-passing board in the first cavity volume upper end,
And cover the second light-passing board in the second cavity volume upper end；Described spacer portion upper end is positioned at the first cavity volume
Side is provided with the first step for carrying the first light-passing board, and described spacer portion upper end is positioned at the second cavity volume
Side be provided with the second step for carrying the second light-passing board.
Optionally, the height of described first step is equal to or more than the thickness of the first light-passing board；Described
The height of second step is equal to or more than the thickness of the second light-passing board.
Optionally, described first light-passing board, the second light-passing board are glass plate.
Optionally, described encapsulating package is ceramic cartridge, or for molding the moulding of injection mo(u)lding.
Optionally, it is additionally provided with light tight covering in described first light-passing board, the upper end of the second light-passing board
Layer, is provided with the first light corresponding to optical sensor chip optical region on described light tight coating
Learn window, and the second optical window corresponding to LED chip optical region.
Optionally, described light tight coating and the first optical window being positioned on light tight coating,
Second optical window is obtained by silk screen printing.
Optionally, described light tight coating is light tight ink material.
Optionally, the bottom at described substrate is additionally provided with the external pad for accessing external circuit.
Optionally, described optical sensor chip, LED chip are by planting the side of stannum ball or lead-in wire
Formula is connected electrically in the respective pad being arranged at substrate.
According to another aspect of the present utility model, additionally provide the collection of a kind of optical sensor package structure
Become plate, it is characterised in that include encapsulating package aggregation, described encapsulating package aggregation is formed
There is multiple above-mentioned optical sensor package structure.
Encapsulating structure of the present utility model, between being carried on respectively due to the first light-passing board, the second light-passing board
In the first step, second step in portion, this allows for optical signal that LED chip sends will not be from
One light-passing board is directly passed to the second light-passing board, it is achieved thereby that two optical chips is the most optically isolated.
The light that can effectively prevent LED chip from sending directly is sensed by optical sensor chip, efficiently solves
Between chip, the problem of optical crosstalk, improves the accuracy of detection of optical pickocff.
Inventor of the present utility model finds, in the prior art, the light that LED chip sends, one
Light splitter likely the most directly can be connect by optical chip through multiple reflections inside light transmissive material
Receive, thus produce the crosstalk of signal.Therefore, this utility model is to be realized technical assignment or institute
Solve the technical problem that be that those skilled in the art never expect or it is not expected that, therefore this
Utility model is a kind of new technical scheme.
By detailed description to exemplary embodiment of the present utility model referring to the drawings, this practicality
Novel further feature and advantage thereof will be made apparent from.
Accompanying drawing explanation
Combined in the description and the accompanying drawing of the part that constitutes description shows this utility model
Embodiment, and be used for explaining principle of the present utility model together with its explanation.
Fig. 1 is the schematic diagram of this utility model encapsulating structure.
Fig. 2 is the structural representation of encapsulating package in Fig. 1.
Fig. 3 is the schematic diagram of this utility model another embodiment of encapsulating structure.
Fig. 4 is the structural representation of this utility model circuit board.
Detailed description of the invention
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that
Arrive: unless specifically stated otherwise, the relative cloth of the parts illustrated the most in these embodiments and step
Put, numerical expression and numerical value are not intended to scope of the present utility model.
Description only actually at least one exemplary embodiment is illustrative below, never makees
For to this utility model and application thereof or any restriction of use.
May not beg in detail for technology, method and apparatus known to person of ordinary skill in the relevant
Opinion, but in the appropriate case, described technology, method and apparatus should be considered a part for description.
Shown here with in all examples discussed, any occurrence should be construed as merely example
Property rather than as limit.Therefore, other example of exemplary embodiment can have different
Value.
It should also be noted that similar label and letter represent similar terms, therefore, one in following accompanying drawing
A certain Xiang Yi the accompanying drawing of denier is defined, then need not it is carried out further in accompanying drawing subsequently
Discuss.
With reference to Fig. 1, Fig. 2, this utility model provides a kind of optical sensor package structure, including
Lighttight encapsulating package, described encapsulating package includes substrate 1, is provided with on described substrate 1
One cavity volume the 3, second cavity volume 4, described first cavity volume the 3, second cavity volume 4 is isolated from one another, in this practicality
In a novel specific embodiment, described first cavity volume the 3, second cavity volume 4 is by spacer portion 2 points
Separate.Substrate 1 of the present utility model can use material well-known to those skilled in the art, such as
This substrate 1 can be board structure of circuit etc..First cavity volume the 3, second cavity volume 4 can pass through this area skill
Mode known to art personnel is formed on substrate 1.When substrate 1 uses injection molding material, can be by note
The mode moulded forms substrate 1 and first cavity volume the 3, second cavity volume 4 being positioned on substrate 1, spacer portion
2；When substrate 1 uses PCB or metal framework class material, can by the way of injection on substrate 1
Form described first cavity volume the 3, second cavity volume 4, spacer portion 2.In one preferred reality of this utility model
Execute in mode, the shell of encapsulating package Ceramics material.
Encapsulating structure of the present utility model, also includes optical sensor chip 5, LED chip 6；Wherein,
Optical sensor chip 5 has optical region 11, and optical sensor chip 5 is by its optical region 11
Receive the optical signal in the external world so that the unlike signal that can receive according to optical sensor chip 5
Send corresponding control signal.LED chip 6 has optical region, and LED chip 6 is by its optics
Region sends out optical signal.LED chip 6 is combined together with optical sensor chip 5, permissible
Realizing close to light detection, ambient light detection, heart rate detection, the detection of blood oxygen, gesture identification etc., this belongs to
In the common knowledge of those skilled in the art, no longer illustrate at this.
Described optical sensor chip 5 is arranged in the first cavity volume 3, and described LED chip 6 is arranged on
In second cavity volume 4；This allows for realize optical sensor chip 5 and LED by spacer portion 2
Chip 6 optically isolated.Optical sensor chip 5, LED chip 6 all can mount on substrate 1, this
The attachment process planting chip belongs to the common knowledge of those skilled in the art, no longer illustrates at this.
Wherein, in order to the signal of telecommunication of optical sensor chip 5, LED chip 6 is drawn, can be by routing
The pin of two chips is electrically connected in the respective pad 9 arranged on substrate 1 by mode.Certainly, right
For those skilled in the art, it is also possible to use and plant the mode of stannum ball by straight for the pin of two chips
Connect and be welded on corresponding pad 9.It is additionally provided with external pad 10 in the bottom of described substrate 1, logical
Cross this external pad 10 and can connect the circuit of outside, thus optical sensor package structure can be connected
In the circuit board of terminal.
In order to first cavity volume the 3, second cavity volume 4 is encapsulated, in the upper end of described first cavity volume 3
It is additionally provided with the first light-passing board 7 covering described first cavity volume 3, in the upper end of described second cavity volume 4
It is provided with the second light-passing board 8 covering described second cavity volume 4.Described first light-passing board the 7, second printing opacity
Plate 8 can use glass plate, it would however also be possible to employ other printing opacity material well-known to those skilled in the art
Material.First light-passing board the 7, second light-passing board 8 is used to be encapsulated by first cavity volume the 3, second cavity volume 4 respectively
After getting up, the optical sensor chip 5 in the first cavity volume 3 can be pointed to, and be pointed to second
LED chip 6 in cavity volume 4 is well protected, and does not the most also interfere with optical sensor chip
5, LED chip 6 receives, sends optical signal.
First light-passing board the 7, second light-passing board 8 is separately positioned on first cavity volume the 3, second cavity volume 4
Upper end, owing to this first cavity volume 3, second cavity volume 4 is separated by spacer portion 2, therefore, the first printing opacity
The portion of plate the 7, second light-passing board 8 can be mounted in spacer portion 2.Described spacer portion 2 upper end
The side being positioned at the first cavity volume 3 is provided with first step 13, and its side being positioned at the second cavity volume 4 is provided with
Two steps 14, this first step 13, the position of second step 14, shape so that between
Position form protruding 12 structures, with reference to Fig. 2.Can certainly regard as, in spacer portion 2 upper end
Medium position one projection 12 is set, this projection 12 form respectively with the both sides of spacer portion 2 upper end
First step 13, second step 14, and the height of this projection 12 is first step 13, second
The height on rank 14.Encapsulation when, the portion of the first light-passing board 7 can be carried on this First
In rank 13, the portion of the second light-passing board 8 can be carried in described second step 14 so that the
Between one light-passing board the 7, second light-passing board 8 spaced apart by this projection 12.
Encapsulating structure of the present utility model, between being carried on respectively due to the first light-passing board, the second light-passing board
In the first step, second step in portion, this allows for optical signal that LED chip sends will not be from
One light-passing board is directly passed to the second light-passing board, it is achieved thereby that two optical chips is the most optically isolated.
The light that can effectively prevent LED chip from sending directly is sensed by optical sensor chip, efficiently solves
Between chip, the problem of optical crosstalk, improves the accuracy of detection of optical pickocff.
This utility model one preferred embodiment in, the height of described first step 13 is equal to
Or the thickness more than the first light-passing board 7；The height of described second step 14 equals to or more than the second printing opacity
The thickness of plate 8.This ensures that first light-passing board 7 upper surface without departing from first step 13,
Second light-passing board 8 is also without departing from the upper surface of second step 14.
This utility model one preferred embodiment in, for improve optical signal guidance quality, in institute
The upper end stating first light-passing board the 7, second light-passing board 8 is additionally provided with light tight coating 15, with reference to Fig. 3.
Described light tight coating 15 is provided with corresponding to optical sensor chip 5 optical region 11
One optical window 16, and the second optical window 17 corresponding to LED chip 6 optical region.First
Optical window 16 is correspondingly arranged on light tight coating 15 corresponding optical sensor chip 5 optical region
The position of 11, the second optical window 17 is correspondingly arranged on light tight coating 15 corresponding LED chip 6
The position of optical region 11；This allows for optical signal that LED chip 6 sends can be through the second printing opacity
Plate the 8, second optical window 17 is transferred to the external world, after this optical signal runs into testee, and can be through
One optical window the 16, first light-passing board 7 enters in the first cavity volume 3, and by optical sensor chip
The optical region 11 of 5 senses.
Described light tight coating 15 can use the platy structure being made up of light-proof material, such as may be used
The light tight coating 15 of tabular is formed by the way of injection.Can also be the first light-passing board 7,
Deposit one layer of light tight coating 15 on two light-passing boards 8, afterwards this light tight coating 15 performed etching,
Thus obtain described first optical window the 16, second optical window 17.The most excellent at this utility model
In the embodiment of choosing, described light tight coating 15 uses lighttight ink material, such as black oil
Ink.Use ink material so that can be at the first light-passing board 7, second by the way of silk screen printing
The upper end of light-passing board 8 forms light tight coating 15, and can be by the control to printed patterns, shape simultaneously
Becoming first optical window the 16, second optical window 17, this improves the efficiency of technique.
In order to improve the manufacture efficiency of optical sensor package structure, this utility model additionally provides one
The circuit board of optical sensor package structure, it includes encapsulating package aggregation 19, at described package tube
Multiple above-mentioned optical sensor package structure is formed on shell aggregation 19.At this utility model one tool
In the embodiment of body, with reference to Fig. 4, such as, in encapsulating package aggregation 19, mount multiple LED simultaneously
Chip 6, optical sensor chip 5, and first is mounted in the relevant position of encapsulating package aggregation 19
Light-passing board, the second light-passing board, thus constitute multiple optical sensor package structure, these optics passes
Sensor encapsulating structure can be arranged in arrays, can obtain multiple independent optical pickocff by cutting
Encapsulating structure.
As a example by the first optical sensor package structure a, the second optical sensor package structure b, profit
With cutter 18 cut the first optical sensor package structure a and the second optical sensor package structure b it
Between position, thus by the first optical sensor package structure a, the second optical sensor package structure b
Separate, it is achieved that the continuous batch of optical sensor package structure produces.
Although specific embodiments more of the present utility model being described in detail by example,
But it should be appreciated by those skilled in the art, example above is merely to illustrate rather than be
Restriction scope of the present utility model.It should be appreciated by those skilled in the art, can be without departing from this reality
In the case of novel scope and spirit, above example is modified.Model of the present utility model
Enclose and be defined by the following claims.
Claims (10)
1. an optical sensor package structure, it is characterised in that: include lighttight encapsulating package,
Described encapsulating package includes substrate (1) and is arranged on substrate (1) and is separated by spacer portion (2)
The first cavity volume (3) of opening, the second cavity volume (4), at described first cavity volume (3), the second cavity volume (4)
In be respectively arranged with optical sensor chip (5), LED chip (6)；Also include covering first
First light-passing board (7) of cavity volume (3) upper end, and cover in the second of the second cavity volume (4) upper end
Light-passing board (8)；Described spacer portion (2) upper end is positioned at the side of the first cavity volume (3) and is provided with for holding
Carrying the first step (13) of the first light-passing board (7), described spacer portion (2) upper end is positioned at the second appearance
The side in chamber (4) is provided with the second step (14) for carrying the second light-passing board (8).
Optical sensor package structure the most according to claim 1, it is characterised in that: described
The height of first step (13) is equal to or more than the thickness of the first light-passing board (7)；Described second step
(14) height is equal to or more than the thickness of the second light-passing board (8).
Optical sensor package structure the most according to claim 1, it is characterised in that: described
First light-passing board (7), the second light-passing board (8) are glass plate.
Optical sensor package structure the most according to claim 1, it is characterised in that: described
Encapsulating package is ceramic cartridge, or for molding the moulding of injection mo(u)lding.
Optical sensor package structure the most according to claim 1, it is characterised in that: in institute
State the first light-passing board (7), the upper end of the second light-passing board (8) is additionally provided with light tight coating (15),
Described light tight coating (15) is provided with corresponding to optical sensor chip (5) optical region (11)
The first optical window (16), and corresponding to the second optical window of LED chip (6) optical region
Mouth (17).
Optical sensor package structure the most according to claim 5, it is characterised in that: described
Light tight coating (15) and the first optical window (16) being positioned on light tight coating (15),
Second optical window (17) is obtained by silk screen printing.
Optical sensor package structure the most according to claim 6, it is characterised in that: described
Light tight coating (15) is light tight ink material.
Optical sensor package structure the most according to claim 1, it is characterised in that: in institute
The bottom stating substrate (1) is additionally provided with the external pad (10) for accessing external circuit.
Optical sensor package structure the most according to claim 1, it is characterised in that: described
Optical sensor chip (5), LED chip (6) electrically connect by the way of planting stannum ball or lead-in wire
In the respective pad (9) being arranged at substrate (1).
10. the circuit board of an optical sensor package structure, it is characterised in that include encapsulating package
Aggregation (19), is formed multiple such as claim 1 on described encapsulating package aggregation (19)
To the optical sensor package structure described in 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620457123.2U CN205752136U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure and circuit board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620457123.2U CN205752136U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure and circuit board thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752136U true CN205752136U (en) | 2016-11-30 |
Family
ID=57365279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620457123.2U Active CN205752136U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure and circuit board thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752136U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870070A (en) * | 2016-05-17 | 2016-08-17 | 歌尔声学股份有限公司 | Optical sensor packaging structure and integrated plate thereof |
| WO2021088648A1 (en) * | 2019-11-07 | 2021-05-14 | 上海禾赛科技股份有限公司 | Receiving module and laser radar comprising same |
-
2016
- 2016-05-17 CN CN201620457123.2U patent/CN205752136U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870070A (en) * | 2016-05-17 | 2016-08-17 | 歌尔声学股份有限公司 | Optical sensor packaging structure and integrated plate thereof |
| WO2021088648A1 (en) * | 2019-11-07 | 2021-05-14 | 上海禾赛科技股份有限公司 | Receiving module and laser radar comprising same |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |