CN105514074A - 智能卡芯片封装结构及其制造方法 - Google Patents

智能卡芯片封装结构及其制造方法 Download PDF

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CN105514074A
CN105514074A CN201510858788.4A CN201510858788A CN105514074A CN 105514074 A CN105514074 A CN 105514074A CN 201510858788 A CN201510858788 A CN 201510858788A CN 105514074 A CN105514074 A CN 105514074A
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lead wire
metal
intelligent card
pad
card chip
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高洪涛
栾旭峰
陆美华
刘玉宝
汤正兴
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Lianxin Shanghai Microelectronics Technology Co ltd
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SHANGHAI ETERNAL INFORMATION TECHNOLOGY Co Ltd
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Abstract

本发明提供一种智能卡芯片封装结构及其制造方法，所述封装结构包括一设置有芯片的基岛及围绕所述基岛设置的至少一个引脚，所述芯片上设置有至少一个金属焊垫，每一所述金属焊垫通过金属引线与一引脚电连接，还包括一加固层，所述加固层包围所述金属焊垫与所述金属引线的焊接层，以增强所述金属焊垫与所述金属引线焊接牢固性。本发明的优点在于，加固层包围所述金属焊垫与所述金属引线的焊接层，能够保护焊接界面，防止焊接界面断裂或被封装材料腐蚀，提高可靠度。

Description

智能卡芯片封装结构及其制造方法
技术领域
本发明涉及智能卡领域，尤其涉及一种智能卡芯片封装结构及其制造方法。
背景技术
当前，智能卡的应用越来越普遍，不仅仅是通讯、交通，而且已深入到了企业、银行、学校、税务、公安、医疗、饮食、酒店和娱乐、科研、图书、博物馆、旅游、海关等各个方面，因此，对智能卡的需求量也呈逐年上涨趋势。
智能卡芯片在封装前需要将智能卡芯片上的金属焊垫通过金属引线与引线框架上的金属焊垫连接，以实现智能卡芯片与外界的电连接。但是，由于智能卡芯片的金属焊垫较薄，与金属引线键合后，由于金属引线的拉扯等作用，会造成可靠性问题。另外，封装所用的材料也可能会腐蚀金属引线与智能卡芯片的金属焊垫键合界面，也会造成可靠性的问题。
因此，亟需一种可靠性高的智能卡封装结构。
发明内容
本发明所要解决的技术问题是，提供一种智能卡芯片封装结构及其制造方法，其能够保护焊接界面，提高智能卡的可靠度。
为了解决上述问题，本发明提供了一种智能卡芯片封装结构，包括一设置有芯片的基岛及围绕所述基岛设置的至少一个引脚，所述芯片上设置有至少一个金属焊垫，每一所述金属焊垫通过金属引线与一引脚电连接，还包括一加固层，所述加固层包围所述金属焊垫与所述金属引线的焊接层，以增强所述金属焊垫与所述金属引线焊接牢固性。
进一步，所述加固层为金属层。
进一步，所述金属为金、钯、镍中的一种或几种的混合。
进一步，所述加固层为无卤素高分子化合物。
进一步，所述无卤素高分子化合物为改性环氧树脂或者酚醛树脂。
进一步，所述加固层覆盖部分金属引线及部分金属焊垫。
本发明还提供一种智能卡芯片封装结构的制造方法，包括如下步骤：打线步骤，将芯片上的金属焊垫与引线框架的引脚之间通过金属引线电连接，所述金属焊垫与所述金属引线之间形成焊接层；加固步骤，在所述金属焊垫与所述金属引线的焊接层周围植入加固层材料；加热所述加固层材料，使加固层材料扩散，形成包围所述金属焊垫与所述金属引线的焊接层的加固层。
进一步，所述加固层材料为金属或无卤素高分子化合物。
进一步，所述金属为金、钯、镍中的一种或几种的混合。
进一步，所述加固层覆盖部分金属引线及部分金属焊垫。
本发明的优点在于，加固层包围所述金属焊垫与所述金属引线的焊接层，能够保护焊接界面，防止焊接界面断裂或被封装材料腐蚀，提高可靠度。
附图说明
图1是本发明智能卡芯片封装结构的一个实施例的俯视图；
图2是本发明智能卡芯片封装结构的一个实施例的剖视示意图；
图3是本发明智能卡芯片封装结构制造方法的步骤示意图；
图4A~图4C是本发明智能卡芯片封装结构制造方法的工艺流程图。
标号说明：
10：芯片；11：基岛；12：引脚、13、43：金属焊垫；14、44：金属引线；15、45：焊接层；16、46：加固层；20：塑封体；47：加固层材料；S30、S31、S32：方法序号。
具体实施方式
下面结合附图对本发明提供的智能卡芯片封装结构及其制造方法的具体实施方式做详细说明。
参见图1及图2，本发明一种智能卡芯片封装结构包括一设置有芯片10的基岛11及围绕所述基岛11设置的至少一个引脚12。在本具体实施方式中，列举六个引脚12，六个引脚12两两相对排列在基岛11的两侧。所述芯片10为智能卡常用的芯片，本文不进行限制。所述芯片10通过本领域技术人员常用的方式与所述基岛11结合。例如，通过导电胶粘结在基岛11表面。一塑封体20塑封所属芯片10、基岛11及引脚12，在图1中才有虚线标示。
所述芯片10上设置有至少一个金属焊垫13，每一所述金属焊垫13通过金属引线14与一引脚12电连接。在本具体实施方式中，设置有六个金属焊垫13，六个金属焊垫13两两相对排列在芯片10的两侧，每一金属焊垫13对应一引脚12。所述金属焊垫13的材料为本领域技术人员常用的材料，例如，铝。所述金属引线14的材料为本领域技术人员常用的材料，例如，铜。
金属引线14与所述金属焊垫13焊接，形成焊接层15。若所述金属引线14为铜线，所述金属焊垫13为铝，则所述焊接层15的材质为AlxCuy。为了清楚明了解释本发明的技术方案，在本发明附图中，夸大了焊接层15的厚度，所述焊接层15是金属引线14与金属焊垫13焊接后自然形成的一层，其并没有明确的界限。
本发明智能卡芯片封装结构还包括一加固层16。所述加固层16包围所述金属焊垫13与所述金属引线14的焊接层15，以增强所述金属焊垫13与所述金属引线14焊接的牢固性。所述加固层16包围所述焊接层15是指所述加固层16完全覆盖在所述焊接层15裸露表面，甚至所述加固层16覆盖部分金属引线14及部分金属焊垫13，以完全包围所述焊接层15，进一步增强所述焊接层15的可靠性，避免焊接层15断裂或者封装材料腐蚀所述焊接层15。
为了清楚明了解释本发明的技术方案，在本发明附图中，所述加固层16为规则形状，在实务操作中，所述加固层16的边缘可以为不规则边缘，本发明对其形状并没有限制，只要能实现本发明的目的即可。
进一步，所述加固层16为金属层或无卤素高分子化合物，所述金属可以为金、钯、镍中的一种或几种的混合。所述无卤素高分子化合物可以为改性环氧树脂或者酚醛树脂。
本发明还提供上述智能卡芯片封装结构的制造方法，参见图3，所述制造方法包括如下步骤：步骤S30、打线步骤，将芯片上的金属焊垫与引线框架的引脚之间通过金属引线电连接，所述金属焊垫与所述金属引线之间形成焊接层；步骤S31、加固步骤，在所述金属焊垫与所述金属引线的焊接层周围植入加固层材料；步骤S32、加热所述加固层材料，使加固层材料扩散，形成包围所述金属焊垫与所述金属引线的焊接层的加固层。
图4A~图4C是本发明智能卡芯片封装结构的制造方法的工艺流程图。
参见步骤S30及图4A，打线步骤，将芯片40上的金属焊垫43与引线框架的引脚之间通过金属引线44电连接，所述金属焊垫43与所述金属引线44之间形成焊接层45。该步骤为现有技术中的常规步骤。
若所述金属引线44为铜线，所述金属焊垫43为铝，则所述焊接层45的材质为AlxCuy。为了清楚明了解释本发明的技术方案，在本发明附图中，夸大了焊接层45的厚度，所述焊接层45是金属引线44与金属焊垫43焊接后自然形成的一层，其并没有明确的界限。
参见步骤S31及图4B，加固步骤，在所述金属焊垫43与所述金属引线44的焊接层45周围植入加固层材料47，所述植入的方法如溅射、点涂、电镀、化学镀等。所述加固层材料47为金属或无卤素高分子化合物，所述金属可以为金、钯、镍中的一种或几种的混合。所述无卤素高分子化合物可以为改性环氧树脂或者酚醛树脂。。
参见步骤S32及图4C，加热所述加固层材料47，所述加热可以为，温度从室温开始，加热到100-300摄氏度，保温，然后降低至室温。使加固层材料47扩散，形成包围所述金属焊垫43与所述金属引线44的焊接层45的加固层46。由于加热作用，使得加固层材料47熔化而自热扩散，从而形成加固层46。由于加固层材料47为自然扩散，所以加固层46可能具有不规则的边缘。
形成加固层46之后，可再进行后续的封装的其他步骤。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

1.一种智能卡芯片封装结构，包括一设置有芯片的基岛及围绕所述基岛设置的至少一个引脚，所述芯片上设置有至少一个金属焊垫，每一所述金属焊垫通过金属引线与一引脚电连接，其特征在于，还包括一加固层，所述加固层包围所述金属焊垫与所述金属引线的焊接层，以增强所述金属焊垫与所述金属引线焊接牢固性。
2.根据权利要求1所述的智能卡芯片封装结构，其特征在于，所述加固层为金属层。
3.根据权利要求1所述的智能卡芯片封装结构，其特征在于，所述金属为金、钯、镍中的一种或几种的混合。
4.根据权利要求1所述的智能卡芯片封装结构，其特征在于，所述加固层为无卤素高分子化合物。
5.根据权利要求4所述的智能卡芯片封装结构，其特征在于，所述无卤素高分子化合物为改性环氧树脂或者酚醛树脂。
6.根据权利要求1所述的智能卡芯片封装结构，其特征在于，所述加固层覆盖部分金属引线及部分金属焊垫。
7.一种智能卡芯片封装结构的制造方法，其特征在于，包括如下步骤：打线步骤，将芯片上的金属焊垫与引线框架的引脚之间通过金属引线电连接，所述金属焊垫与所述金属引线之间形成焊接层；加固步骤，在所述金属焊垫与所述金属引线的焊接层周围植入加固层材料；加热所述加固层材料，使加固层材料扩散，形成包围所述金属焊垫与所述金属引线的焊接层的加固层。
8.根据权利要求7所述的制造方法，其特征在于，所述加固层材料为金属或无卤素高分子化合物。
9.根据权利要求7所述的制造方法，其特征在于，所述金属为金、钯、镍中的一种或几种的混合。
10.根据权利要求7所述的制造方法，其特征在于，所述加固层覆盖部分金属引线及部分金属焊垫。
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