CN105514065A - 一种导热胶/石墨烯复合多层散热膜及其制备方法 - Google Patents
一种导热胶/石墨烯复合多层散热膜及其制备方法 Download PDFInfo
- Publication number
- CN105514065A CN105514065A CN201511023546.XA CN201511023546A CN105514065A CN 105514065 A CN105514065 A CN 105514065A CN 201511023546 A CN201511023546 A CN 201511023546A CN 105514065 A CN105514065 A CN 105514065A
- Authority
- CN
- China
- Prior art keywords
- layer
- graphene
- heat
- heat dissipation
- dissipation film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 134
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 89
- 239000002131 composite material Substances 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000003292 glue Substances 0.000 title claims 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 51
- 239000002041 carbon nanotube Substances 0.000 claims description 21
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 21
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 239000000243 solution Substances 0.000 claims description 12
- 239000002390 adhesive tape Substances 0.000 claims description 11
- 230000035484 reaction time Effects 0.000 claims description 10
- 239000007853 buffer solution Substances 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000001962 electrophoresis Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 238000005868 electrolysis reaction Methods 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 37
- 239000012790 adhesive layer Substances 0.000 abstract description 19
- 239000000853 adhesive Substances 0.000 abstract description 14
- 230000001070 adhesive effect Effects 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 10
- 239000002344 surface layer Substances 0.000 abstract description 3
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 6
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000001132 ultrasonic dispersion Methods 0.000 description 4
- 238000003490 calendering Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511023546.XA CN105514065B (zh) | 2015-12-29 | 2015-12-29 | 一种导热胶/石墨烯复合多层散热膜的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511023546.XA CN105514065B (zh) | 2015-12-29 | 2015-12-29 | 一种导热胶/石墨烯复合多层散热膜的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105514065A true CN105514065A (zh) | 2016-04-20 |
CN105514065B CN105514065B (zh) | 2017-12-15 |
Family
ID=55721937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201511023546.XA Expired - Fee Related CN105514065B (zh) | 2015-12-29 | 2015-12-29 | 一种导热胶/石墨烯复合多层散热膜的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105514065B (zh) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106378984A (zh) * | 2016-08-29 | 2017-02-08 | 上海复合材料科技有限公司 | 轻质柔性高导热纳米碳复合膜及其制备方法 |
CN107502254A (zh) * | 2017-08-14 | 2017-12-22 | 苏州格优碳素新材料有限公司 | 一种导热不干胶、导热膜及其制备方法和应用 |
CN108189515A (zh) * | 2018-02-11 | 2018-06-22 | 东莞市明骏智能科技有限公司 | 一种石墨烯-碳纳米管薄膜基导热垫片及其制备方法 |
CN109318564A (zh) * | 2018-09-10 | 2019-02-12 | 成都紫苑华光新材料科技有限公司 | 一种自组装超声喷涂制备石墨烯导热膜的方法 |
CN109707138A (zh) * | 2019-02-28 | 2019-05-03 | 周志茹 | 一种多层结构防静电环保型环氧树脂地坪及其制备方法 |
CN110157345A (zh) * | 2018-03-01 | 2019-08-23 | 济南开发区星火科学技术研究院 | 一种基于石墨烯散的散热膜及其制备方法 |
CN111392722A (zh) * | 2020-06-04 | 2020-07-10 | 山东海科创新研究院有限公司 | 高导热耐高温石墨烯散热膜及其制备方法 |
CN111518483A (zh) * | 2020-03-11 | 2020-08-11 | 苏州天煜新材料科技有限公司 | 一种单面石墨烯散热膜及制备方法 |
CN111526695A (zh) * | 2020-03-11 | 2020-08-11 | 苏州天煜新材料科技有限公司 | 一种双面石墨烯散热膜及制备方法 |
CN111696934A (zh) * | 2019-03-12 | 2020-09-22 | 环球晶圆股份有限公司 | 半导体元件及其制造方法 |
CN113773760A (zh) * | 2021-09-28 | 2021-12-10 | 惠州市昌达胶粘制品有限公司 | 一种多功能导电导热复合胶带 |
CN115151113A (zh) * | 2022-07-27 | 2022-10-04 | 中国航空无线电电子研究所 | 一种复合石墨烯高效散热的机载航电机箱 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU118015U1 (ru) * | 2011-06-02 | 2012-07-10 | Михаил Алексеевич Попов | Многослойная труба |
CN102651961A (zh) * | 2012-05-29 | 2012-08-29 | 邱璟 | 一种导热散热界面材料及其制造方法 |
KR20140005512A (ko) * | 2012-07-04 | 2014-01-15 | 동우 화인켐 주식회사 | 방열수지 조성물 및 이를 이용한 금속 베이스 회로 기판 |
CN203537732U (zh) * | 2013-11-06 | 2014-04-09 | 中国科学院宁波材料技术与工程研究所 | 石墨烯散热膜 |
KR20140061613A (ko) * | 2012-11-13 | 2014-05-22 | 주식회사 지앤씨 | 엘이디 조명장치용 액상 폴리머 구조의 방열액 및 엘이디 조명장치 |
CN104085143A (zh) * | 2014-05-29 | 2014-10-08 | 深圳市铭晶科技有限公司 | 石墨烯复合导热膜的制备方法和产品 |
CN104519723A (zh) * | 2014-12-24 | 2015-04-15 | 无锡格菲电子薄膜科技有限公司 | 一种石墨烯基导热片 |
CN104810336A (zh) * | 2015-05-11 | 2015-07-29 | 苏州捷迪纳米科技有限公司 | 一种散热用碳纳米管复合石墨膜 |
-
2015
- 2015-12-29 CN CN201511023546.XA patent/CN105514065B/zh not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU118015U1 (ru) * | 2011-06-02 | 2012-07-10 | Михаил Алексеевич Попов | Многослойная труба |
CN102651961A (zh) * | 2012-05-29 | 2012-08-29 | 邱璟 | 一种导热散热界面材料及其制造方法 |
KR20140005512A (ko) * | 2012-07-04 | 2014-01-15 | 동우 화인켐 주식회사 | 방열수지 조성물 및 이를 이용한 금속 베이스 회로 기판 |
KR20140061613A (ko) * | 2012-11-13 | 2014-05-22 | 주식회사 지앤씨 | 엘이디 조명장치용 액상 폴리머 구조의 방열액 및 엘이디 조명장치 |
CN203537732U (zh) * | 2013-11-06 | 2014-04-09 | 中国科学院宁波材料技术与工程研究所 | 石墨烯散热膜 |
CN104085143A (zh) * | 2014-05-29 | 2014-10-08 | 深圳市铭晶科技有限公司 | 石墨烯复合导热膜的制备方法和产品 |
CN104519723A (zh) * | 2014-12-24 | 2015-04-15 | 无锡格菲电子薄膜科技有限公司 | 一种石墨烯基导热片 |
CN104810336A (zh) * | 2015-05-11 | 2015-07-29 | 苏州捷迪纳米科技有限公司 | 一种散热用碳纳米管复合石墨膜 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11712859B2 (en) | 2016-08-29 | 2023-08-01 | Shanghai Composites Science & Technology Co., Ltd | Light-weight flexible high-thermal-conductivity nano-carbon composite film and method for preparing same |
CN106378984A (zh) * | 2016-08-29 | 2017-02-08 | 上海复合材料科技有限公司 | 轻质柔性高导热纳米碳复合膜及其制备方法 |
CN107502254A (zh) * | 2017-08-14 | 2017-12-22 | 苏州格优碳素新材料有限公司 | 一种导热不干胶、导热膜及其制备方法和应用 |
CN108189515A (zh) * | 2018-02-11 | 2018-06-22 | 东莞市明骏智能科技有限公司 | 一种石墨烯-碳纳米管薄膜基导热垫片及其制备方法 |
CN110157345A (zh) * | 2018-03-01 | 2019-08-23 | 济南开发区星火科学技术研究院 | 一种基于石墨烯散的散热膜及其制备方法 |
CN109318564A (zh) * | 2018-09-10 | 2019-02-12 | 成都紫苑华光新材料科技有限公司 | 一种自组装超声喷涂制备石墨烯导热膜的方法 |
CN109707138A (zh) * | 2019-02-28 | 2019-05-03 | 周志茹 | 一种多层结构防静电环保型环氧树脂地坪及其制备方法 |
CN109707138B (zh) * | 2019-02-28 | 2024-04-05 | 周志茹 | 一种多层结构防静电环保型环氧树脂地坪及其制备方法 |
US11211308B2 (en) | 2019-03-12 | 2021-12-28 | Globalwafers Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN111696934A (zh) * | 2019-03-12 | 2020-09-22 | 环球晶圆股份有限公司 | 半导体元件及其制造方法 |
CN111526695A (zh) * | 2020-03-11 | 2020-08-11 | 苏州天煜新材料科技有限公司 | 一种双面石墨烯散热膜及制备方法 |
CN111518483A (zh) * | 2020-03-11 | 2020-08-11 | 苏州天煜新材料科技有限公司 | 一种单面石墨烯散热膜及制备方法 |
CN111518483B (zh) * | 2020-03-11 | 2023-08-22 | 苏州天煜新材料科技有限公司 | 一种单面石墨烯散热膜及制备方法 |
CN111526695B (zh) * | 2020-03-11 | 2024-05-24 | 苏州天煜新材料科技有限公司 | 一种双面石墨烯散热膜及制备方法 |
CN111392722A (zh) * | 2020-06-04 | 2020-07-10 | 山东海科创新研究院有限公司 | 高导热耐高温石墨烯散热膜及其制备方法 |
CN113773760A (zh) * | 2021-09-28 | 2021-12-10 | 惠州市昌达胶粘制品有限公司 | 一种多功能导电导热复合胶带 |
CN115151113A (zh) * | 2022-07-27 | 2022-10-04 | 中国航空无线电电子研究所 | 一种复合石墨烯高效散热的机载航电机箱 |
Also Published As
Publication number | Publication date |
---|---|
CN105514065B (zh) | 2017-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105514065B (zh) | 一种导热胶/石墨烯复合多层散热膜的制备方法 | |
CN104030275B (zh) | 一种还原氧化石墨烯导热薄膜的制备方法 | |
CN105624747A (zh) | 一种铜/石墨烯复合多层散热膜 | |
WO2018205924A1 (zh) | 一种热界面材料及其制备和应用 | |
CN103466603B (zh) | 石墨烯分散液以及石墨烯薄膜的制备方法 | |
Qiu et al. | Multifunctional cellular materials based on 2D nanomaterials: prospects and challenges | |
Niu et al. | Electrophoretic Build‐Up of Alternately Multilayered Films and Micropatterns Based on Graphene Sheets and Nanoparticles and their Applications in Flexible Supercapacitors | |
CN105752965B (zh) | Cvd方法制备石墨烯中直接形成多层石墨烯薄膜的刻蚀方法 | |
CN203675528U (zh) | 一种具有褶皱结构的石墨膜导热散热片 | |
CN105271204B (zh) | 一种石墨烯/石墨烯纳米带复合水凝胶及其制备方法 | |
CN110387215B (zh) | 具有疏导式热防护结构的石墨烯泡沫相变复合材料及其制备方法 | |
Tang et al. | Three-dimensional graphene monolith-based composite: superiority in properties and applications | |
CN106079693B (zh) | 一种石墨烯‑金属复合片材及其制备方法 | |
CN109181654A (zh) | 一种石墨烯基复合导热膜及其制备方法及其应用 | |
CN106976887A (zh) | 一种利用液相超声大量制备二维纳米云母片的方法 | |
Li et al. | Electricity generation from ionic solution flowing through packed three-dimensional graphene powders | |
Wang et al. | A review of the high-concentration processing, densification, and applications of graphene oxide and graphene | |
CN105592578A (zh) | 一种柔性贴合式纳米电热发热薄膜 | |
JP2012096937A (ja) | 熱伝導シート及びその製造方法 | |
CN105810449B (zh) | 一种石墨烯基薄膜柔性超级电容器的构建方法 | |
CN105810448B (zh) | 一种柔性超级电容器的构建方法 | |
Yu et al. | Modified graphene papers with alkaline earth metal ions endowed with high heat transfer properties | |
CN206558492U (zh) | 石墨烯高效导热散热板 | |
CN206947325U (zh) | 一种石墨铜箔复合散热片 | |
KR20140092104A (ko) | 금속 백시트를 구비하여 열전도율을 높인 방열시트 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171113 Address after: 523000, Guangdong, Dongcheng District, the main mountain in the Middle East Road, South Road, No. 81, brilliant business building, floor A03, one of the Applicant after: DONGGUAN GUANXIN ENTERPRISE MANAGEMENT CONSULTING CO.,LTD. Address before: 523000, Dongguan, Dongcheng District, the main mountain in the Middle East Road, South Road, No. 81 brilliant business building, floor C10, 6, Applicant before: DONGGUAN QINGMAITIAN DIGITAL TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181019 Address after: 523000 Room 301, 6B International Finance Innovation Park, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong Patentee after: DONGGUAN GUANGXIN INTELLECTUAL PROPERTY SERVICES Co.,Ltd. Address before: 523000 A03, one of the 8 floors of brilliant business building, 81 South Central Road, Dongcheng District, Dongguan, Guangdong. Patentee before: DONGGUAN GUANXIN ENTERPRISE MANAGEMENT CONSULTING CO.,LTD. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190619 Address after: 529100 Jute Hill, Baimiao Village, Siqian Town, Xinhui District, Jiangmen City, Guangdong Province Patentee after: Xinhui District, Jiangmen City Chun Jun chemical products Co.,Ltd. Address before: 523000 Room 301, 6B International Finance Innovation Park, Songshan Lake high tech Industrial Development Zone, Dongguan, Guangdong Patentee before: DONGGUAN GUANGXIN INTELLECTUAL PROPERTY SERVICES Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 529100 Jute Hill, Baimiao Village, Siqian Town, Xinhui District, Jiangmen City, Guangdong Province Patentee after: Guangdong Xianjun New Material Technology Co.,Ltd. Address before: 529100 Jute Hill, Baimiao Village, Siqian Town, Xinhui District, Jiangmen City, Guangdong Province Patentee before: Xinhui District, Jiangmen City Chun Jun chemical products Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171215 |