CN105505290A - Sealant special for high-performance electronic components - Google Patents

Sealant special for high-performance electronic components Download PDF

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Publication number
CN105505290A
CN105505290A CN201511007100.8A CN201511007100A CN105505290A CN 105505290 A CN105505290 A CN 105505290A CN 201511007100 A CN201511007100 A CN 201511007100A CN 105505290 A CN105505290 A CN 105505290A
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CN
China
Prior art keywords
parts
electronic components
performance
superior
performance electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201511007100.8A
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Chinese (zh)
Inventor
李栋军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201511007100.8A priority Critical patent/CN105505290A/en
Publication of CN105505290A publication Critical patent/CN105505290A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)

Abstract

The invention discloses sealant special for high-performance electronic components. The sealant is prepared from the following raw material in parts by weight: 15-21 parts of terminated solydimethyl siloxane, 12-16 parts of montmorillonoid powder, 10-15 parts of crosslinking agent, 7-12 parts of phenyl silicone oil, 6-14 parts of isocyanate, 4-7 parts of p-phthalic acid alkyl ester, 3-6 parts of butyl glycidyl ether, 0.4-0.8 part of methylsilicone oil, 8-13 parts of organic solvent, 6-15 parts of epoxy-silicone resin, 2-3 parts of gas-phase white carbon black, 2-4 parts of fumed silica, 12-20 parts of room-temperature-vulcanized methyl silicone rubber, 15-22 parts of basic filler and 1.2-3.5 parts of silane coupling agent. The sealant special for high-performance electronic components has the beneficial effects of superior insulating effect, superior moisture-proof effect, superior shock resisting effect, high sealing performance, superior material performance, and low cost.

Description

A kind of high-performance electronic components and parts special seal gum
Technical field
The present invention relates to a kind of high-performance electronic components and parts special seal gum.
Background technology
Along with the development of social economy and science, seal gum is more and more extensive in the application in the fields such as construction work, communications and transportation, telecommunications.In life, the use of electronic product gets more and more; big and small electronic product is all combined by all kinds of components and parts; and components and parts seal gum is an indispensable part in components and parts assembling process, the development of components and parts seal gum also simply assists fixed function to expand to present sealing, fixing, bonding, protection, insulation, fire-retardant from.Along with electronics is to microminiaturization, heavy body and high performance future development, highly integrated and ultrathinization of electronic devices and components becomes trend, to the requirement of seal gum also only just good airproof performance, and needing that there are good insulativity, flame retardant resistance and preservative property, the seal gum strengthened in the market meets user demand.
Summary of the invention
For the deficiencies in the prior art, the problem to be solved in the present invention is, provides a kind of high-performance electronic components and parts special seal gum, have effect of excellent insulation, protection against the tide, antidetonation, good seal performance, excellent material performance, and cost is not high.
For solving the problems of the technologies described above, technical scheme of the present invention is, a kind of high-performance electronic components and parts special seal gum, and it is made up of the raw material of following parts by weight:
End-blocking polydimethylsiloxane 15-21 part, polynite powder 12-16 part, linking agent 10-15 part, phenyl silicone oil 7-12 part, isocyanic ester 6-14 part, alkyl phthalates 4-7 part, butylglycidyl ether 3-6 part, methyl-silicone oil 0.4-0.8 part, organic solvent 8-13 part, epoxy silicone resin 6-15 part, gas-phase silica 2-3 part, aerosil 2-4 part, methyl silicone rubber at room temperature cure 12-20 part, basis filler 15-22 part, silane coupling agent 1.2-3.5 part.
Optimize, a kind of high-performance electronic components and parts special seal gum, it is made up of the raw material of following parts by weight:
End-blocking polydimethylsiloxane 18 parts, 14 parts, polynite powder, linking agent 13 parts, phenyl silicone oil 9 parts, isocyanic ester 10 parts, alkyl phthalates 5.5 parts, butylglycidyl ether 4.5 parts, methyl-silicone oil 0.6 part, organic solvent 10 parts, epoxy silicone resin 11 parts, gas-phase silica 2.5 parts, aerosil 3 parts, methyl silicone rubber at room temperature cure 16 parts, basis filler 19 parts, silane coupling agent 2.4 parts.
The invention has the beneficial effects as follows, high-performance electronic components and parts special seal gum of the present invention, there is effect of excellent insulation, protection against the tide, antidetonation, good seal performance, excellent material performance, and cost is not high.
Embodiment
embodiment 1
A kind of high-performance electronic components and parts special seal gum, it is made up of the raw material of following parts by weight:
End-blocking polydimethylsiloxane 15 parts, 12 parts, polynite powder, linking agent 10 parts, phenyl silicone oil 7 parts, isocyanic ester 6 parts, alkyl phthalates 4 parts, butylglycidyl ether 3 parts, methyl-silicone oil 0.4 part, organic solvent 8 parts, epoxy silicone resin 6 parts, gas-phase silica 2 parts, aerosil 2 parts, methyl silicone rubber at room temperature cure 12 parts, basis filler 15 parts, silane coupling agent 1.2 parts.
embodiment 2
A kind of high-performance electronic components and parts special seal gum, it is made up of the raw material of following parts by weight:
End-blocking polydimethylsiloxane 21 parts, 16 parts, polynite powder, linking agent 15 parts, phenyl silicone oil 12 parts, isocyanic ester 14 parts, alkyl phthalates 7 parts, butylglycidyl ether 6 parts, methyl-silicone oil 0.8 part, organic solvent 13 parts, epoxy silicone resin 15 parts, gas-phase silica 3 parts, aerosil 4 parts, methyl silicone rubber at room temperature cure 20 parts, basis filler 22 parts, silane coupling agent 3.5 parts.
embodiment 3
A kind of high-performance electronic components and parts special seal gum, it is made up of the raw material of following parts by weight:
End-blocking polydimethylsiloxane 18 parts, 14 parts, polynite powder, linking agent 13 parts, phenyl silicone oil 9 parts, isocyanic ester 10 parts, alkyl phthalates 5.5 parts, butylglycidyl ether 4.5 parts, methyl-silicone oil 0.6 part, organic solvent 10 parts, epoxy silicone resin 11 parts, gas-phase silica 2.5 parts, aerosil 3 parts, methyl silicone rubber at room temperature cure 16 parts, basis filler 19 parts, silane coupling agent 2.4 parts.

Claims (2)

1. a high-performance electronic components and parts special seal gum, is characterized in that: it is made up of the raw material of following parts by weight:
End-blocking polydimethylsiloxane 15-21 part, polynite powder 12-16 part, linking agent 10-15 part, phenyl silicone oil 7-12 part, isocyanic ester 6-14 part, alkyl phthalates 4-7 part, butylglycidyl ether 3-6 part, methyl-silicone oil 0.4-0.8 part, organic solvent 8-13 part, epoxy silicone resin 6-15 part, gas-phase silica 2-3 part, aerosil 2-4 part, methyl silicone rubber at room temperature cure 12-20 part, basis filler 15-22 part, silane coupling agent 1.2-3.5 part.
2. high-performance electronic components and parts special seal gum according to claim 1, is characterized in that: it is made up of the raw material of following parts by weight:
End-blocking polydimethylsiloxane 18 parts, 14 parts, polynite powder, linking agent 13 parts, phenyl silicone oil 9 parts, isocyanic ester 10 parts, alkyl phthalates 5.5 parts, butylglycidyl ether 4.5 parts, methyl-silicone oil 0.6 part, organic solvent 10 parts, epoxy silicone resin 11 parts, gas-phase silica 2.5 parts, aerosil 3 parts, methyl silicone rubber at room temperature cure 16 parts, basis filler 19 parts, silane coupling agent 2.4 parts.
CN201511007100.8A 2015-12-30 2015-12-30 Sealant special for high-performance electronic components Pending CN105505290A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201511007100.8A CN105505290A (en) 2015-12-30 2015-12-30 Sealant special for high-performance electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201511007100.8A CN105505290A (en) 2015-12-30 2015-12-30 Sealant special for high-performance electronic components

Publications (1)

Publication Number Publication Date
CN105505290A true CN105505290A (en) 2016-04-20

Family

ID=55713603

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201511007100.8A Pending CN105505290A (en) 2015-12-30 2015-12-30 Sealant special for high-performance electronic components

Country Status (1)

Country Link
CN (1) CN105505290A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106146958A (en) * 2016-07-05 2016-11-23 安徽三彩工贸有限责任公司 A kind of additive of silica gel special on mouse pad
CN108059942A (en) * 2017-12-27 2018-05-22 成都新柯力化工科技有限公司 It is a kind of for compound inslation binding agent of electrical equipment and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104610903A (en) * 2015-01-23 2015-05-13 朱小英 Moisture-proof seal gum for electronic device
CN104610904A (en) * 2015-01-23 2015-05-13 朱小英 Preparation method of moisture-proof seal gum for electronic device
CN104762057A (en) * 2015-04-03 2015-07-08 肇庆皓明有机硅材料有限公司 Organic silicon electronic packaging material and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104610903A (en) * 2015-01-23 2015-05-13 朱小英 Moisture-proof seal gum for electronic device
CN104610904A (en) * 2015-01-23 2015-05-13 朱小英 Preparation method of moisture-proof seal gum for electronic device
CN104762057A (en) * 2015-04-03 2015-07-08 肇庆皓明有机硅材料有限公司 Organic silicon electronic packaging material and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106146958A (en) * 2016-07-05 2016-11-23 安徽三彩工贸有限责任公司 A kind of additive of silica gel special on mouse pad
CN108059942A (en) * 2017-12-27 2018-05-22 成都新柯力化工科技有限公司 It is a kind of for compound inslation binding agent of electrical equipment and preparation method thereof

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PB01 Publication
C10 Entry into substantive examination
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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160420

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