CN104910658A - Curable epoxy resin composition - Google Patents
Curable epoxy resin composition Download PDFInfo
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- CN104910658A CN104910658A CN201510340252.3A CN201510340252A CN104910658A CN 104910658 A CN104910658 A CN 104910658A CN 201510340252 A CN201510340252 A CN 201510340252A CN 104910658 A CN104910658 A CN 104910658A
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Abstract
The invention discloses a curable epoxy resin composition. The curable epoxy resin composition is characterized by comprising the following components in parts by weight: 20 to 30 parts of epoxy resin, 15 to 25 parts of 3-allyl isocyanate, 4 to 12 parts of a curing agent, 2 to 8 parts of a curing accelerator, 3 to 9 parts of epoxy phosphate, 1 to 5 parts of benzimidazole, 3 to 10 parts of titanium dioxide, 5 to 15 parts of an inorganic filler, 2 to 7 parts of a coupling agent, 1 to 6 parts of a dispersing agent, 2 to 9 parts of a thickening agent and 25 to 35 parts of deionized water. According to the curable epoxy resin composition provided by the invention, water serves as a dispersing medium and the content of an inorganic/organic solvent or a volatile organic compound is low, so environmental pollution is avoided. Coating has the advantages of high curing speed, high permeability, corrosion resistance and high adhesion property, and is applicable to the industries such as printing, electron, coating and printing ink.
Description
Technical field
The present invention relates to a kind of curable epoxy resin composition.
Background technology
Epoxy resin is the important thermosetting resin of a class, it is most widely used matrix resin in polymer composites, epoxy resin cured product has excellent adhesiveproperties, wear resisting property, mechanical property, electrical insulation capability, chemical stability, high and low temperature resistance, and low, the easy machine-shaping of shrinking percentage and the advantage such as with low cost, be used widely in fields such as tackiness agent, light industry, coating, electric insulating material.
But conventional epoxy resin has low solid content, wherein containing a large amount of organic solvents, in use easily cause organic solvent to volatilize, and these organic solvents comprise the material to environment and human hazard such as toluene.Meanwhile, because epoxy-resin systems viscosity and surface tension are large, be more difficultly diffused into base material inside, be difficult to there is larger bonding force with base material.
Summary of the invention
The object of the invention is to the deficiency overcoming the existence of above-mentioned prior art, the curable epoxy resin composition that a kind of environment-protecting asepsis, strong adhesion, curing speed are fast is provided.
For achieving the above object, the present invention is achieved by the following technical solutions:
A kind of curable epoxy resin composition, it is characterized in that, meter comprises following component by weight: epoxy resin 20 ~ 30 parts, 3-isocyanic acid propylene 15 ~ 25 parts, 4 ~ 12 parts, solidifying agent, curing catalyst 2 ~ 8 parts, epoxy phosphate ester 3 ~ 9 parts, benzoglyoxaline 1 ~ 5 part, titanium dioxide 3 ~ 10 parts, mineral filler 5 ~ 15 parts, coupling agent 2 ~ 7 parts, dispersion agent 1 ~ 6 part, thickening material 2 ~ 9 parts, deionized water 25 ~ 35 parts.
Preferably, described solidifying agent is any one in polyamide-based solidifying agent, fatty amine curing agent, pnenolic aldehyde amine hardener.
Preferably, described mineral filler is any one in calcium carbonate, wilkinite, mica powder.
Preferably, described coupling agent is any one in silane coupling agent, aluminate coupling agent, titanate coupling agent.
Preferably, any one in described dispersion agent Sodium dodecylbenzene sulfonate, cetyl benzenesulfonic acid sodium, quaternary ammonium compound.
Preferably, described thickening material is any one in polyacrylamide, polyvinyl alcohol, polyvinylpyrrolidone.
Beneficial effect of the present invention:
Curable epoxy resin composition prepared by the present invention, using water as dispersion medium, organic solvent-free or content of volatile organic compound low, free from environmental pollution.Coating has that curing speed is fast, good penetrability, the corrosion-resistant advantage good with adhesion property, is applicable to the industries such as printing, electronics, coating and ink.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art and understand the present invention further, but not limit the present invention in any form.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, some distortion and improvement can also be made.These all belong to protection scope of the present invention.
A kind of curable epoxy resin composition, it is characterized in that, meter comprises following component by weight: epoxy resin 20 ~ 30 parts, 3-isocyanic acid propylene 15 ~ 25 parts, 4 ~ 12 parts, solidifying agent, curing catalyst 2 ~ 8 parts, epoxy phosphate ester 3 ~ 9 parts, benzoglyoxaline 1 ~ 5 part, titanium dioxide 3 ~ 10 parts, mineral filler 5 ~ 15 parts, coupling agent 2 ~ 7 parts, dispersion agent 1 ~ 6 part, thickening material 2 ~ 9 parts, deionized water 25 ~ 35 parts.
Curable epoxy resin composition prepared by the present invention, has the advantages such as environment-protecting asepsis, strong adhesion, curing speed be fast.
Embodiment 1
Curable epoxy resin composition of the present invention, meter comprises following component by weight: epoxy resin 20 parts, 3-isocyanic acid propylene 25 parts, 4 parts, polyamide-based solidifying agent, curing catalyst 8 parts, epoxy phosphate ester 3 parts, benzoglyoxaline 5 parts, titanium dioxide 3 parts, 15 parts, calcium carbonate, silane coupling agent 7 parts, Sodium dodecylbenzene sulfonate 1 part, polyacrylamide 9 parts, deionized water 35 parts.
Embodiment 2
Curable epoxy resin composition of the present invention, meter comprises following component by weight: epoxy resin 30 parts, 3-isocyanic acid propylene 15 parts, fatty amine curing agent 12 parts, curing catalyst 2 parts, epoxy phosphate ester 9 parts, benzoglyoxaline 1 part, titanium dioxide 10 parts, wilkinite 5 parts, aluminate coupling agent 2 parts, 6 parts, cetyl benzenesulfonic acid sodium, polyvinyl alcohol 2 parts, deionized water 25 parts.
Embodiment 3
Curable epoxy resin composition of the present invention, meter comprises following component by weight: epoxy resin 25 parts, 3-isocyanic acid propylene 20 parts, pnenolic aldehyde amine hardener 8 parts, curing catalyst 5 parts, epoxy phosphate ester 6 parts, benzoglyoxaline 3 parts, titanium dioxide 7 parts, mica powder 10 parts, titanate coupling agent 4 parts, quaternary ammonium compound 3 parts, polyvinylpyrrolidone 6 parts, deionized water 30 parts.
Embodiment 4
Curable epoxy resin composition of the present invention, meter comprises following component by weight: epoxy resin 22 parts, 3-isocyanic acid propylene 17 parts, fatty amine curing agent 6 parts, curing catalyst 3 parts, epoxy phosphate ester 4 parts, benzoglyoxaline 2 parts, titanium dioxide 5 parts, wilkinite 7 parts, aluminate coupling agent 3 parts, 2 parts, cetyl benzenesulfonic acid sodium, polyvinyl alcohol 4 parts, deionized water 27 parts.
Embodiment 5
Curable epoxy resin composition of the present invention, meter comprises following component by weight: epoxy resin 28 parts, 3-isocyanic acid propylene 22 parts, pnenolic aldehyde amine hardener 10 parts, curing catalyst 7 parts, epoxy phosphate ester 7 parts, benzoglyoxaline 4 parts, titanium dioxide 8 parts, mica powder 13 parts, titanate coupling agent 6 parts, quaternary ammonium compound 5 parts, polyvinylpyrrolidone 7 parts, deionized water 32 parts.
Embodiment 6
Curable epoxy resin composition of the present invention, meter comprises following component by weight: epoxy resin 20 parts, 3-isocyanic acid propylene 18 parts, 9 parts, polyamide-based solidifying agent, curing catalyst 8 parts, epoxy phosphate ester 5 parts, benzoglyoxaline 2 parts, titanium dioxide 3 parts, 6 parts, calcium carbonate, silane coupling agent 4 parts, Sodium dodecylbenzene sulfonate 2 parts, polyacrylamide 9 parts, deionized water 35 parts.
Performance test
Basic mechanical design feature of the present invention is as shown in table 1:
Table 1
As seen from Table 1, curable epoxy resin composition prepared by the present invention, has the advantages such as environment-protecting asepsis, strong adhesion, curing speed be fast.
Above specific embodiments of the invention are described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (6)
1. a curable epoxy resin composition, it is characterized in that, meter comprises following component by weight: epoxy resin 20 ~ 30 parts, 3-isocyanic acid propylene 15 ~ 25 parts, 4 ~ 12 parts, solidifying agent, curing catalyst 2 ~ 8 parts, epoxy phosphate ester 3 ~ 9 parts, benzoglyoxaline 1 ~ 5 part, titanium dioxide 3 ~ 10 parts, mineral filler 5 ~ 15 parts, coupling agent 2 ~ 7 parts, dispersion agent 1 ~ 6 part, thickening material 2 ~ 9 parts, deionized water 25 ~ 35 parts.
2. composition epoxy resin according to claim 1, is characterized in that: described solidifying agent is any one in polyamide-based solidifying agent, fatty amine curing agent, pnenolic aldehyde amine hardener.
3. composition epoxy resin according to claim 1, is characterized in that: described mineral filler is any one in calcium carbonate, wilkinite, mica powder.
4. composition epoxy resin according to claim 1, is characterized in that: described coupling agent is any one in silane coupling agent, aluminate coupling agent, titanate coupling agent.
5. composition epoxy resin according to claim 1, is characterized in that: any one in described dispersion agent Sodium dodecylbenzene sulfonate, cetyl benzenesulfonic acid sodium, quaternary ammonium compound.
6. composition epoxy resin according to claim 1, is characterized in that: described thickening material is any one in polyacrylamide, polyvinyl alcohol, polyvinylpyrrolidone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510340252.3A CN104910658A (en) | 2015-06-18 | 2015-06-18 | Curable epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510340252.3A CN104910658A (en) | 2015-06-18 | 2015-06-18 | Curable epoxy resin composition |
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| Publication Number | Publication Date |
|---|---|
| CN104910658A true CN104910658A (en) | 2015-09-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510340252.3A Pending CN104910658A (en) | 2015-06-18 | 2015-06-18 | Curable epoxy resin composition |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105647350A (en) * | 2016-01-27 | 2016-06-08 | 中山永辉化工股份有限公司 | Glasses frame coating and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1752162A (en) * | 2004-09-22 | 2006-03-29 | 沈阳中科防腐蚀工程技术有限公司 | Ocean heavy corrosion-proof coating and preparing process thereof |
| CN1766019A (en) * | 2005-09-22 | 2006-05-03 | 长江水利委员会长江科学院 | Nano composite aqueous epoxide resin coating material and preparation method |
| CN104151896A (en) * | 2014-08-28 | 2014-11-19 | 苏州洛特兰新材料科技有限公司 | Radiation curing epoxy resin powder coating used for ceramic |
-
2015
- 2015-06-18 CN CN201510340252.3A patent/CN104910658A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1752162A (en) * | 2004-09-22 | 2006-03-29 | 沈阳中科防腐蚀工程技术有限公司 | Ocean heavy corrosion-proof coating and preparing process thereof |
| CN1766019A (en) * | 2005-09-22 | 2006-05-03 | 长江水利委员会长江科学院 | Nano composite aqueous epoxide resin coating material and preparation method |
| CN104151896A (en) * | 2014-08-28 | 2014-11-19 | 苏州洛特兰新材料科技有限公司 | Radiation curing epoxy resin powder coating used for ceramic |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105647350A (en) * | 2016-01-27 | 2016-06-08 | 中山永辉化工股份有限公司 | Glasses frame coating and preparation method thereof |
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Application publication date: 20150916 |