CN104610904A - Preparation method of moisture-proof seal gum for electronic device - Google Patents
Preparation method of moisture-proof seal gum for electronic device Download PDFInfo
- Publication number
- CN104610904A CN104610904A CN201510036488.8A CN201510036488A CN104610904A CN 104610904 A CN104610904 A CN 104610904A CN 201510036488 A CN201510036488 A CN 201510036488A CN 104610904 A CN104610904 A CN 104610904A
- Authority
- CN
- China
- Prior art keywords
- component
- preparation
- parts
- powder
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 33
- 239000000843 powder Substances 0.000 claims abstract description 45
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 22
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims abstract description 22
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 15
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 15
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 15
- 229960000892 attapulgite Drugs 0.000 claims abstract description 11
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 11
- 229910052625 palygorskite Inorganic materials 0.000 claims abstract description 11
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004014 plasticizer Substances 0.000 claims abstract description 8
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 13
- 229920002545 silicone oil Polymers 0.000 claims description 12
- 239000004902 Softening Agent Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 10
- 239000011863 silicon-based powder Substances 0.000 claims description 10
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 6
- XQSFXFQDJCDXDT-UHFFFAOYSA-N hydroxysilicon Chemical compound [Si]O XQSFXFQDJCDXDT-UHFFFAOYSA-N 0.000 claims description 6
- 239000003921 oil Substances 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- APWQGZRMFPWDFZ-UHFFFAOYSA-N 3-phenylprop-2-enoic acid;tin Chemical compound [Sn].OC(=O)C=CC1=CC=CC=C1 APWQGZRMFPWDFZ-UHFFFAOYSA-N 0.000 claims description 4
- SFDHDZRMZDCJIN-UHFFFAOYSA-N [Sn].C(CCC)C=1C(=C(C(=O)O)C=CC1)CCCC Chemical compound [Sn].C(CCC)C=1C(=C(C(=O)O)C=CC1)CCCC SFDHDZRMZDCJIN-UHFFFAOYSA-N 0.000 claims description 4
- JJLKTTCRRLHVGL-UHFFFAOYSA-L [acetyloxy(dibutyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.CCCC[Sn+2]CCCC JJLKTTCRRLHVGL-UHFFFAOYSA-L 0.000 claims description 4
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 claims description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 4
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 claims description 4
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- MLOKHANBEXWBKS-UHFFFAOYSA-N 3-triacetyloxysilylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OC(C)=O)(OC(C)=O)OC(C)=O MLOKHANBEXWBKS-UHFFFAOYSA-N 0.000 claims description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical group CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 claims description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 claims description 2
- 238000004898 kneading Methods 0.000 abstract 2
- 239000004971 Cross linker Substances 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052901 montmorillonite Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004513 sizing Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000004590 silicone sealant Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a preparation method of moisture-proof seal gum for an electronic device. The seal gum comprises a component A and a component B. The preparation method comprises the following steps: (1) the preparation of the component A, wherein 44-46 parts of terminated polydimethylsiloxane, 15-17 parts of a plasticizer A, 6-8 parts of light calcium carbonate powder, 28-30 parts of montmorillonite powder, 12-16 parts of attapulgite powder, 4-6 parts of titanium dioxide powder and 8-10 parts of barium sulfate are put into a in a vacuum kneading machine to be dehydrated and co-mixed for about 2-2.5 hours under the condition that the kneading temperature is controlled to be about 180-185 DEG C and the vacuum degree is controlled to be about 0.01-0.03 MPa, and after co-mixing is finished, the mixture is transferred to a reaction kettle, stirred at a speed of 980-1,020 r/min and cooled to a room temperature, and the component A is obtained; (2) the preparation of the component B, wherein 44-48 parts of a plasticizer B, 18-20 parts of silica micro-powder, 14-16 parts of a crosslinker, 9-10 parts of a tackifier and 0.6-0.8 parts of a catalyst are put into the reaction kettle to be stirred and mixed for about 20-25 minutes at a speed of 850-950 r/min under the condition that the vacuum degree of about 0.01-0.03 MPa is kept, and after mixing is finished, the component B is obtained.
Description
Technical field
The present invention relates to chemistry painting industry field, particularly a kind of preparation method of anti-steam electronic component encapsulation glue.
Background technology
Along with the fast development of electronic industry, electronics is to microminiaturization, heavy body and high performance future development, and highly integrated and ultrathinization of electronic devices and components becomes trend, adopts technique for sticking to replace traditional technology imperative for this reason.Meanwhile, due to vapor in the atmosphere can to precision element cause corrosion and because of electronic apparatus high pressure occasion shelf depreciation and sparking initiation fire; Therefore more and more higher to the requirement of the water vapor through performance of electronic apparatus tackiness agent, flame retardant resistance, cementability and electrical property thereof.The stuctures and properties of the water vapor through performance of tackiness agent, flame retardant resistance and electrical property and sizing material is closely related, by carrying out to the base-material of sizing material the water vapor through performance that modification can promote tackiness agent significantly, such as, in sizing material, add the flame retardant resistance that fire retardant can promote tackiness agent.A kind of flame-proof silicone sealant for electronics and manufacture method thereof is disclosed in Chinese invention patent application publication number CN 1865383A, it has set forth the advantage using magnesium hydroxide and aluminium hydroxide to replace halogen flame, but this patent application scheme do not relate to water vapour through problem.Applicant also retrieved other relevant patent documentation, such as, in the expansion flame-proof organosilicon fluid sealant provided in flameproofing silicone structure sealant disclosed in CN1687288A and manufacture method thereof and CN101368080A and manufacture method thereof, all technology enlightenment is not provided to the water vapor through performance promoting silicone sealant.
Summary of the invention
For the deficiencies in the prior art, an object of the present invention is the preparation method providing a kind of anti-steam electronic component encapsulation glue, the seal gum adopting the method to prepare makes the seal gum prepared not only possess the performance of good obstruct steam by the selection of component and the determination of content, also makes the traditional performance of seal gum be improved.
For achieving the above object, the technical solution used in the present invention is as follows:
A kind of preparation method of anti-steam electronic component encapsulation glue, described seal gum comprises component A and B component, wherein component A is made up of the following raw materials according with parts by weight: end-blocking polydimethylsiloxane 44-46 part, plasticizer A 15-17 part, light calcium carbonate powder 6-8 part, polynite powder 28-30 part, attapulgite powder 12-16 part, titanium dioxide powder 4-6 part, barium sulfate 8-10 part; Described B component is made up of the raw material of following weight part ratio: softening agent B44-48 part, silicon powder 18-20 part, linking agent 14-16 part, tackifier 9-10 part and catalyzer 0.6-0.8 part, and described preparation method is:
1) component A preparation method: according to aforementioned proportion, blended by dewatering in end-blocking polydimethylsiloxane, softening agent, light calcium carbonate powder, polynite powder, attapulgite powder, titanium dioxide powder, barium sulfate input vacuum kneader, control to mediate temperature and be about 180-185 DEG C, vacuum tightness is about 0.01-0.03MPa, blended about 2-2.5 hour, proceed to after blended end in reactor to stir and be cooled to room temperature, mixing speed is 980-1020 rev/min, obtains component A;
2) B component preparation method: according to the above ratio, softening agent, silicon powder, linking agent, tackifier and catalyzer are put in reactor and is uniformly mixed, vacuum tightness is about 0.01-0.03MPa, mixing speed is 850-950 rev/min in maintenance, be uniformly mixed about 20-25 minute, after mixing terminates, obtain B component.
Wherein, described end-blocking polydimethylsiloxane is by the polydimethylsiloxane of any one end-blocking in trimethoxy siloxy, dimethoxy-methyl siloxy, dimethyl methoxyl group siloxy, triethoxy silica base, ethyl dimethoxy siloxy, diethyl methoxyl group siloxy.
Wherein, described plasticizer A and softening agent B are any one in methyl-silicone oil, phenyl silicone oil, hydroxy silicon oil, and plasticizer A and softening agent B different.
Wherein, described linking agent is any one or more than one the combination in methyltrimethoxy silane, ethyl trimethoxy silane, Union carbide A-162, ethyl triethoxysilane, vinyltrimethoxy silane, vinyltriethoxysilane.
Wherein, described tackifier are any one or more than one the combination in γ-aminopropyl triethoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane, N-(β-amine ethyl)-γ-aminopropyl-methyl dimethoxysilane, γ-methacryloxy Trimethoxy silane, aminopropyl triethoxysilane, γ-methyl-prop monomethacryloxypropyl-triacetoxysilane.
Wherein, described catalyzer is any one or more than one the combination in dibutyl tin laurate, dioctyl tin cinnamic acid tin, dibutyl tin acetate, dibutyl phenylformic acid tin.
The present invention has following beneficial effect:
Adopt two component sealing gum, on the basis of great many of experiments, determine material choice and the content proportioning of the filler in seal gum, and with other component rational proportion, it is made to reach collaborative technique effect, and then pass through the temperature of optimized fabrication process, the processing parameters such as time, make the excellent performance of the seal gum prepared: water vapor transmittance 1.1g/m
2.d-1.4g/m
2.d, 100% tensile elongation modulus is 0.8-0.9MPa, elongation at break 550-650%, can play desirable water vapor rejection effect.
Embodiment
Embodiment one
A kind of preparation method of anti-steam electronic component encapsulation glue, described seal gum comprises component A and B component, wherein component A is made up of the following raw materials according with parts by weight: dimethoxy-methyl siloxy end-blocking polydimethylsiloxane 44 parts, methyl-silicone oil 15 parts, 6 parts, light calcium carbonate powder, 28 parts, polynite powder, attapulgite powder 12 parts, titanium dioxide powder 4 parts, 8 parts, barium sulfate; Described B component is made up of the raw material of following weight part ratio: phenyl silicone oil 44 parts, silicon powder 18 parts, ethyl triethoxysilane 14 parts, γ-methacryloxy Trimethoxy silane 9 parts and 0.6 part, dibutyl phenylformic acid tin, and described preparation method is:
1) component A preparation method: according to aforementioned proportion, by dimethoxy-methyl siloxy end-blocking polydimethylsiloxane, methyl-silicone oil, light calcium carbonate powder, polynite powder, attapulgite powder, titanium dioxide powder, dewater in barium sulfate input vacuum kneader blended, control to mediate temperature and be about 180 DEG C, vacuum tightness is about 0.01MPa, blended about 2 hours, proceed to after blended end in reactor to stir and be cooled to room temperature, mixing speed is 980 revs/min, obtains component A;
2) B component preparation method: according to the above ratio, by phenyl silicone oil, silicon powder, ethyl triethoxysilane, γ-methacryloxy Trimethoxy silane and dibutyl phenylformic acid tin are put in reactor and are uniformly mixed, maintenance vacuum tightness is about 0.01MPa, mixing speed is 850 revs/min, be uniformly mixed about 20 minutes, after mixing terminates, obtain B component.
The performance of seal gum prepared by embodiment one is: water vapor transmittance 1.3g/m
2.d, 100% tensile elongation modulus is 0.8MPa, elongation at break 560%, can play desirable water vapor rejection effect.
Embodiment two
A kind of preparation method of anti-steam electronic component encapsulation glue, described seal gum comprises component A and B component, wherein component A is made up of the following raw materials according with parts by weight: dimethoxy-methyl siloxy end-blocking polydimethylsiloxane 46 parts, hydroxy silicon oil 17 parts, 8 parts, light calcium carbonate powder, 30 parts, polynite powder, attapulgite powder 16 parts, titanium dioxide powder 6 parts, 10 parts, barium sulfate; Described B component is made up of the raw material of following weight part ratio: methyl-silicone oil 48 parts, silicon powder 20 parts, vinyltrimethoxy silane 16 parts, γ-glycidyl ether oxygen propyl trimethoxy silicane 10 parts and 0.8 part, dioctyl tin cinnamic acid tin, described preparation method is:
1) component A preparation method: according to aforementioned proportion, by dimethoxy-methyl siloxy end-blocking polydimethylsiloxane, hydroxy silicon oil, light calcium carbonate powder, polynite powder, attapulgite powder, titanium dioxide powder, dewater in barium sulfate input vacuum kneader blended, control to mediate temperature and be about 185 DEG C, vacuum tightness is about 0.03MPa, blended about 2.5 hours, proceed to after blended end in reactor to stir and be cooled to room temperature, mixing speed is 1020 revs/min, obtains component A;
2) B component preparation method: according to the above ratio, by methyl-silicone oil, silicon powder, vinyltrimethoxy silane, γ mono-glycidyl ether oxygen propyl trimethoxy silicane and dioctyl tin cinnamic acid tin are put in reactor and are uniformly mixed, maintenance vacuum tightness is about 0.03MPa, mixing speed is 950 revs/min, be uniformly mixed about 25 minutes, after mixing terminates, obtain B component.
The performance of seal gum prepared by embodiment two is: water vapor transmittance 1.4g/m
2.d, 100% tensile elongation modulus is 0.85MPa, elongation at break 630%, can play desirable water vapor rejection effect.
Embodiment three
A kind of preparation method of anti-steam electronic component encapsulation glue, described seal gum comprises component A and B component, wherein component A is made up of the following raw materials according with parts by weight: triethoxy silica base end-blocking polydimethylsiloxane 45 parts, hydroxy silicon oil 16 parts, 7 parts, light calcium carbonate powder, 29 parts, polynite powder, attapulgite powder 14 parts, titanium dioxide powder 5 parts, 9 parts, barium sulfate; Described B component is made up of the raw material of following weight part ratio: phenyl silicone oil 46 parts, silicon powder 19 parts, Union carbide A-162 15 parts, aminopropyl triethoxysilane 8 parts and dibutyl tin acetate 0.7 part, and described preparation method is:
1) component A preparation method: according to aforementioned proportion, by triethoxy silica base end-blocking polydimethylsiloxane, hydroxy silicon oil, light calcium carbonate powder, polynite powder, attapulgite powder, titanium dioxide powder, dewater in barium sulfate input vacuum kneader blended, control to mediate temperature and be about 183 DEG C, vacuum tightness is about 0.02MPa, blended about 2.2 hours, proceed to after blended end in reactor to stir and be cooled to room temperature, mixing speed is 1000 revs/min, obtains component A;
2) B component preparation method: according to the above ratio, by phenyl silicone oil, silicon powder, Union carbide A-162, aminopropyl triethoxysilane and dibutyl tin acetate are put in reactor and are uniformly mixed, maintenance vacuum tightness is about 0.02MPa, mixing speed is 900 revs/min, be uniformly mixed about 23 minutes, after mixing terminates, obtain B component.
The performance of seal gum prepared by embodiment three is: water vapor transmittance 1.1g/m
2.d, 100% tensile elongation modulus is 0.9MPa, elongation at break 650%, can play desirable water vapor rejection effect.
Claims (6)
1. the preparation method of an anti-steam electronic component encapsulation glue, it is characterized in that, described seal gum comprises component A and B component, wherein component A is made up of the following raw materials according with parts by weight: end-blocking polydimethylsiloxane 44-46 part, plasticizer A 15-17 part, light calcium carbonate powder 6-8 part, polynite powder 28-30 part, attapulgite powder 12-16 part, titanium dioxide powder 4-6 part, barium sulfate 8-10 part; Described B component is made up of the raw material of following weight part ratio: softening agent B44-48 part, silicon powder 18-20 part, linking agent 14-16 part, tackifier 9-10 part and catalyzer 0.6-0.8 part, and described preparation method is:
1) component A preparation method: according to aforementioned proportion, blended by dewatering in end-blocking polydimethylsiloxane, softening agent, light calcium carbonate powder, polynite powder, attapulgite powder, titanium dioxide powder, barium sulfate input vacuum kneader, control to mediate temperature and be about 180-185 DEG C, vacuum tightness is about 0.01-0.03MPa, blended about 2-2.5 hour, proceed to after blended end in reactor to stir and be cooled to room temperature, mixing speed is 980-1020 rev/min, obtains component A;
2) B component preparation method: according to the above ratio, softening agent, silicon powder, linking agent, tackifier and catalyzer are put in reactor and is uniformly mixed, vacuum tightness is about 0.01-0.03MPa, mixing speed is 850-950 rev/min in maintenance, be uniformly mixed about 20-25 minute, after mixing terminates, obtain B component.
2. the preparation method of described anti-steam electronic component encapsulation glue as claimed in claim 1, it is characterized in that, end-blocking polydimethylsiloxane is by the polydimethylsiloxane of any one end-blocking in trimethoxy siloxy, dimethoxy-methyl siloxy, dimethyl methoxyl group siloxy, triethoxy silica base, ethyl dimethoxy siloxy, diethyl methoxyl group siloxy.
3. the preparation method of described anti-steam electronic component encapsulation glue as claimed in claim 1, it is characterized in that, described plasticizer A and softening agent B are any one in methyl-silicone oil, phenyl silicone oil, hydroxy silicon oil, and plasticizer A and softening agent B different.
4. the preparation method of described anti-steam electronic component encapsulation glue as claimed in claim 1, it is characterized in that, described linking agent is any one or more than one the combination in methyltrimethoxy silane, ethyl trimethoxy silane, Union carbide A-162, ethyl triethoxysilane, vinyltrimethoxy silane, vinyltriethoxysilane.
5. the preparation method of described anti-steam electronic component encapsulation glue as claimed in claim 1, it is characterized in that, described tackifier are any one or more than one the combination in γ-aminopropyl triethoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane, N-(β-amine ethyl)-γ-aminopropyl-methyl dimethoxysilane, γ-methacryloxy Trimethoxy silane, aminopropyl triethoxysilane, γ-methyl-prop monomethacryloxypropyl-triacetoxysilane.
6. the preparation method of described anti-steam electronic component encapsulation glue as claimed in claim 1, it is characterized in that, described catalyzer is dibutyl tin laurate, any one or more than one combination in dioctyl tin cinnamic acid tin, dibutyl tin acetate, dibutyl phenylformic acid tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510036488.8A CN104610904B (en) | 2015-01-23 | 2015-01-23 | A kind of preparation method of anti-steam electronic component encapsulation glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510036488.8A CN104610904B (en) | 2015-01-23 | 2015-01-23 | A kind of preparation method of anti-steam electronic component encapsulation glue |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104610904A true CN104610904A (en) | 2015-05-13 |
| CN104610904B CN104610904B (en) | 2017-11-17 |
Family
ID=53145559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510036488.8A Expired - Fee Related CN104610904B (en) | 2015-01-23 | 2015-01-23 | A kind of preparation method of anti-steam electronic component encapsulation glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104610904B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105505290A (en) * | 2015-12-30 | 2016-04-20 | 李栋军 | Sealant special for high-performance electronic components |
| CN105567154A (en) * | 2015-12-30 | 2016-05-11 | 李栋军 | Environmental-protection type oil-resistant sealant |
| CN108380152A (en) * | 2018-05-23 | 2018-08-10 | 杭州之江新材料有限公司 | A kind of device and method that organosilicon sealant is quickly cooled down |
| CN116042174A (en) * | 2023-02-25 | 2023-05-02 | 常熟市江南粘合剂有限公司 | Oil-resistant silicone sealant and preparation method and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101831271A (en) * | 2010-03-18 | 2010-09-15 | 常熟市恒信粘胶有限公司 | Hollow glass bi-component organosilicone sealant and preparation method and application thereof |
| CN104232013A (en) * | 2014-10-14 | 2014-12-24 | 泸州北方化学工业有限公司 | Silicone sealant and preparation method thereof |
-
2015
- 2015-01-23 CN CN201510036488.8A patent/CN104610904B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101831271A (en) * | 2010-03-18 | 2010-09-15 | 常熟市恒信粘胶有限公司 | Hollow glass bi-component organosilicone sealant and preparation method and application thereof |
| CN104232013A (en) * | 2014-10-14 | 2014-12-24 | 泸州北方化学工业有限公司 | Silicone sealant and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105505290A (en) * | 2015-12-30 | 2016-04-20 | 李栋军 | Sealant special for high-performance electronic components |
| CN105567154A (en) * | 2015-12-30 | 2016-05-11 | 李栋军 | Environmental-protection type oil-resistant sealant |
| CN108380152A (en) * | 2018-05-23 | 2018-08-10 | 杭州之江新材料有限公司 | A kind of device and method that organosilicon sealant is quickly cooled down |
| CN116042174A (en) * | 2023-02-25 | 2023-05-02 | 常熟市江南粘合剂有限公司 | Oil-resistant silicone sealant and preparation method and application thereof |
| CN116042174B (en) * | 2023-02-25 | 2023-12-05 | 常熟市江南粘合剂有限公司 | Oil-resistant silicone sealant and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104610904B (en) | 2017-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104610903A (en) | Moisture-proof seal gum for electronic device | |
| CN110003842B (en) | Single-component dealcoholized room temperature vulcanized organopolysiloxane composition | |
| CN104610904A (en) | Preparation method of moisture-proof seal gum for electronic device | |
| CN103436216B (en) | Dealcoholized organosilicone sealant with low modulus and high elongation percentage and preparation method thereof | |
| CN103396757B (en) | Single-component dealcoholization-type flame-retardant room temperature vulcanized (RTV) silicone rubber sealant and preparation method thereof | |
| CN104031389B (en) | Moisture-proof heat type room temperature silicon sulfide rubber composition | |
| CN105038694B (en) | A kind of dual composition addition type organosilicon bonding casting glue and its application method | |
| CN110845980A (en) | COB packaging adhesive and preparation method thereof | |
| CN109666446A (en) | A kind of flame-retardant modified silicone sealant and preparation method thereof | |
| CN102040840A (en) | Single-component room temperature vulcanized silicone rubber and preparation method thereof | |
| CN111057520B (en) | Double-component addition type pouring sealant and preparation method and application thereof | |
| CN104109504A (en) | Deeply-cured ketoxime type single-component room-temperature vulcanized silicon rubber and preparation method thereof | |
| CN107267112A (en) | A kind of photovoltaic single-component silicon structure sealant and preparation method thereof | |
| CN108611048A (en) | Dry-type transformer dealcoholized type organic silicon potting adhesive and preparation method thereof | |
| CN103865474A (en) | Preparation method of transparent pasty alcohol type organosilicone sealant | |
| CN107699188A (en) | A kind of transparent high temperature resistant flame-proof silicone sealant and preparation method | |
| CN106967381A (en) | Neutral silicone prefabricated buildings special seal gum | |
| CN109306258A (en) | A kind of food-grade Self-leveling heatproof sealant and preparation method thereof | |
| CN107325781A (en) | Silicone sealant compositions, organosilicon sealant and preparation method thereof | |
| CN106244091A (en) | A kind of high intensity dealcoholized type double component room temperature vulcanization silicon rubber building sealant and preparation method thereof | |
| CN110041871A (en) | A kind of silane modified polyether seal glue and preparation method thereof | |
| CN101787260A (en) | Water vapor permeance resistant silicone sealant and manufacture method thereof | |
| CN109628059A (en) | A kind of stainless steel silicone sealant and preparation method thereof | |
| CN106753202A (en) | A kind of photovoltaic back repairs glue composition and preparation method thereof | |
| CN110257002A (en) | A kind of Projecting Lamp two-component silicone sealant |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 315153 Zhejiang Province, Ningbo city Haishu District Shiqi Street Shiqi Road No. 18 Applicant after: Zhu Xiaoying Address before: Yinzhou District Heng Jie Heng Jie Zhen Road 315181 No. 50 Zhejiang city of Ningbo Province Applicant before: Zhu Xiaoying |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180612 Address after: 510000 two of South staircase, Fu Lung Industrial Zone (A2 hostel), Fuyong village, Shawan Town, Panyu District, Guangzhou, Guangdong. Patentee after: Guangzhou Dehui Chemical Technology Co., Ltd. Address before: 315153 Shiqiao North Road, Shijie street, Haishu District, Ningbo, Zhejiang, 18 Patentee before: Zhu Xiaoying |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171117 Termination date: 20190123 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |