CN104610904B - A kind of preparation method of anti-steam electronic component encapsulation glue - Google Patents
A kind of preparation method of anti-steam electronic component encapsulation glue Download PDFInfo
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- CN104610904B CN104610904B CN201510036488.8A CN201510036488A CN104610904B CN 104610904 B CN104610904 B CN 104610904B CN 201510036488 A CN201510036488 A CN 201510036488A CN 104610904 B CN104610904 B CN 104610904B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 34
- 238000005538 encapsulation Methods 0.000 title claims abstract description 14
- 239000003292 glue Substances 0.000 title claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 44
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims abstract description 22
- 239000000565 sealant Substances 0.000 claims abstract description 18
- 239000012530 fluid Substances 0.000 claims abstract description 17
- 239000004014 plasticizer Substances 0.000 claims abstract description 17
- 238000002156 mixing Methods 0.000 claims abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 14
- 229920005573 silicon-containing polymer Polymers 0.000 claims abstract description 14
- 229960000892 attapulgite Drugs 0.000 claims abstract description 11
- 229910052625 palygorskite Inorganic materials 0.000 claims abstract description 11
- 239000011863 silicon-based powder Substances 0.000 claims abstract description 11
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 10
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052901 montmorillonite Inorganic materials 0.000 claims abstract description 10
- 229940088417 precipitated calcium carbonate Drugs 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims abstract description 7
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 229920002545 silicone oil Polymers 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 11
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 5
- XQSFXFQDJCDXDT-UHFFFAOYSA-N hydroxysilicon Chemical compound [Si]O XQSFXFQDJCDXDT-UHFFFAOYSA-N 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 5
- APWQGZRMFPWDFZ-UHFFFAOYSA-N 3-phenylprop-2-enoic acid;tin Chemical compound [Sn].OC(=O)C=CC1=CC=CC=C1 APWQGZRMFPWDFZ-UHFFFAOYSA-N 0.000 claims description 4
- SFDHDZRMZDCJIN-UHFFFAOYSA-N [Sn].C(CCC)C=1C(=C(C(=O)O)C=CC1)CCCC Chemical compound [Sn].C(CCC)C=1C(=C(C(=O)O)C=CC1)CCCC SFDHDZRMZDCJIN-UHFFFAOYSA-N 0.000 claims description 4
- JJLKTTCRRLHVGL-UHFFFAOYSA-L [acetyloxy(dibutyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.CCCC[Sn+2]CCCC JJLKTTCRRLHVGL-UHFFFAOYSA-L 0.000 claims description 4
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 claims description 4
- 239000003921 oil Substances 0.000 claims description 4
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 claims description 4
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 4
- 238000002454 metastable transfer emission spectrometry Methods 0.000 claims description 3
- MLOKHANBEXWBKS-UHFFFAOYSA-N 3-triacetyloxysilylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OC(C)=O)(OC(C)=O)OC(C)=O MLOKHANBEXWBKS-UHFFFAOYSA-N 0.000 claims description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 1
- 238000004898 kneading Methods 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 230000001404 mediated effect Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004513 sizing Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 239000004590 silicone sealant Substances 0.000 description 2
- ZDWQSEWVPQWLFV-UHFFFAOYSA-N C(CC)[Si](OC)(OC)OC.[O] Chemical compound C(CC)[Si](OC)(OC)OC.[O] ZDWQSEWVPQWLFV-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 102100039845 Guanine nucleotide-binding protein G(I)/G(S)/G(O) subunit gamma-8 Human genes 0.000 description 1
- 101710112841 Guanine nucleotide-binding protein G(I)/G(S)/G(O) subunit gamma-8 Proteins 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- -1 methyl methoxy Chemical group 0.000 description 1
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- HLOLETUOZGAKMT-UHFFFAOYSA-N trimethoxysilyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)OC(=O)C(C)=C HLOLETUOZGAKMT-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of preparation method of anti-steam electronic component encapsulation glue, the fluid sealant includes A and B component, and the preparation method is：1) component A preparation method：Block 44 46 parts of dimethyl silicone polymer, 15 17 parts of plasticizer A, 68 parts of precipitated calcium carbonate powder, 28 30 parts of montmorillonite powder, 12 16 parts of attapulgite powder, 46 parts of titanium dioxide powder, 8 10 parts of barium sulfate put into and blending are dehydrated in vacuum kneaders, and it is about 180 185 DEG C that temperature is mediated in control, vacuum is about 0.01 0.03MPa, blending about 2 2.5 hours, blending are transferred to stirring in reactor and are cooled to room temperature after terminating, speed of agitator is 980 1020 revs/min；Obtain component A；2) B component preparation method：By 48 parts of plasticizer B44,18 20 parts of silicon powder, 0.6 0.8 parts of 14 16 parts of crosslinking agent, 9 10 parts of tackifier and catalyst are put into reactor and are stirred, holding vacuum is about 0.01 0.03MPa, speed of agitator is 850 950 revs/min, it is stirred about 20 25 minutes, after mixing terminates, B component is obtained.
Description
Technical field
The present invention relates to chemistry painting industry field, more particularly to a kind of preparation method of anti-steam electronic component encapsulation glue.
Background technology
With the fast development of electronics industry, electronic equipment develops to miniaturization, high power capacity and high performance direction, electronics
Highly integrated and ultrathinization of component turns into trend, replaces traditional handicraft imperative using technique for sticking for this.
Simultaneously as vapor in the atmosphere can cause corrosion to precision element and because electronic apparatus high pressure occasion shelf depreciation and beating
Fire triggers fire；Therefore the water vapor through performance of electronic apparatus adhesive, anti-flammability, cementability and its electrical property are wanted
Seek more and more higher.Water vapor through performance, anti-flammability and the electrical property of adhesive and the structure and performance of sizing material are closely related,
The water vapor through performance of adhesive can be obviously improved by being modified to the base-material of sizing material, such as is added in sizing material
Fire retardant is added to lift the anti-flammability of adhesive.A kind of electricity is disclosed in Chinese invention patent application publication number CN 1865383A
Sub- flame-proof silicone sealant and its manufacture method, it elaborates to replace the excellent of halogen flame using magnesium hydroxide and aluminium hydroxide
Point, but the patent application scheme is not directed to the problem of vapor passes through.Applicant also retrieved other related patent documents, example
The expansion provided such as the flameproofing silicone structure sealant disclosed in CN1687288A and its manufacture method and CN101368080A
In flame-proof organosilicon fluid sealant and its manufacture method, technology is not provided to the water vapor through performance for lifting silicone sealant
Enlightenment.
The content of the invention
In view of the shortcomings of the prior art, an object of the present invention is to provide a kind of anti-steam electronic component encapsulation glue
Preparation method, the fluid sealant prepared using fluid sealant prepared by this method by the selection of component and the determination of content is not only
Possess the performance of good barrier steam, also the traditional performance of fluid sealant is improved.
To achieve the above object, the technical solution adopted by the present invention is as follows：
A kind of preparation method of anti-steam electronic component encapsulation glue, the fluid sealant include component A and B component, wherein A groups
Divide and be made up of following raw materials according in parts by weight：Block dimethyl silicone polymer 44-46 parts, plasticizer A 15-17 parts, lightweight carbon
Sour calcium powder 6-8 parts, montmorillonite powder 28-30 parts, attapulgite powder 12-16 parts, titanium dioxide powder 4-6 parts, barium sulfate 8-10 parts；Institute
B component is stated to be made up of the raw material of following weight part ratio：Plasticizer B44-48 parts, silicon powder 18-20 parts, crosslinking agent 14-16 parts,
Tackifier 9-10 parts and catalyst 0.6-0.8 parts, the preparation method are：
1) component A preparation method：According to aforementioned proportion, by end-blocking dimethyl silicone polymer, plasticizer, precipitated calcium carbonate
Blending is dehydrated in powder, montmorillonite powder, attapulgite powder, titanium dioxide powder, barium sulfate input vacuum kneader, temperature is mediated in control
About 180-185 DEG C, vacuum is about 0.01-0.03MPa, and about 2-2.5 hours are blended, and blending is transferred in reactor after terminating and stirred
Mix and be cooled to room temperature, speed of agitator is 980-1020 revs/min, obtains component A；
2) B component preparation method：According to the above ratio, plasticizer, silicon powder, crosslinking agent, tackifier and catalyst are put into
It is stirred into reactor, holding vacuum is about 0.01-0.03MPa, speed of agitator is 850-950 revs/min, is stirred
About 20-25 minutes, after mixing terminates, obtain B component.
Wherein, described end-blocking dimethyl silicone polymer is by trimethoxy siloxy, dimethoxy-methyl siloxy, two
It is any in methyl methoxy base siloxy, triethoxy siloxy, ethyl dimethoxy siloxy, diethyl ylmethoxy siloxy
A kind of dimethyl silicone polymer of end-blocking.
Wherein, described plasticizer A and plasticizer B are any one in methyl-silicone oil, phenyl silicone oil, hydroxy silicon oil,
And plasticizer A and plasticizer B are different.
Wherein, described crosslinking agent is MTMS, ethyl trimethoxy silane, methyltriethoxy silane
Any one in alkane, ethyl triethoxysilane, vinyltrimethoxy silane, VTES or one kind
Combination above.
Wherein, described tackifier are gamma-aminopropyl-triethoxy-silane, γ-glycidyl ether oxygen propyl trimethoxy
Silane, N- (β-amine ethyl)-γ-aminopropyl-methyl dimethoxysilane, γ-methacryloxy trimethoxy silane, ammonia
Any one in propyl-triethoxysilicane, γ-methyl-prop monomethacryloxypropyl-triacetoxysilane or more than one group
Close.
Wherein, described catalyst be dibutyl tin laurate, dioctyl tin cinnamic acid tin, dibutyl tin acetate,
Any one in dibutyl benzoic acid tin or more than one combination.
The present invention has the advantages that：
Using two-component fluid sealant, on the basis of many experiments, it is determined that the selection of the raw material of the filler in fluid sealant and
Content matches, and with other component rational proportions, reach the technique effect of collaboration, and then by optimizing the temperature of preparation process
The technological parameters such as degree, time so that the excellent performance of the fluid sealant of preparation：Water vapor transmittance 1.1g/m2.d-1.4g/m2.d,
100% tensile elongation modulus is 0.8-0.9MPa, elongation at break 550-650%, can play preferable water vapor rejection effect.
Embodiment
Embodiment one
A kind of preparation method of anti-steam electronic component encapsulation glue, the fluid sealant include component A and B component, wherein A groups
Divide and be made up of following raw materials according in parts by weight：44 parts of dimethyl silicone polymer of dimethoxy-methyl siloxy end-blocking, methyl silicon
Oily 15 parts, 6 parts of precipitated calcium carbonate powder, 28 parts of montmorillonite powder, 12 parts of attapulgite powder, 4 parts of titanium dioxide powder, 8 parts of barium sulfate；Institute
B component is stated to be made up of the raw material of following weight part ratio：44 parts of phenyl silicone oil, 18 parts of silicon powder, ethyl triethoxysilane 14
Part, γ -9 parts of methacryloxy trimethoxy silane and 0.6 part of dibutyl benzoic acid tin, the preparation method are：
1) component A preparation method：According to aforementioned proportion, by dimethoxy-methyl siloxy block dimethyl silicone polymer,
Methyl-silicone oil, precipitated calcium carbonate powder, montmorillonite powder, attapulgite powder, titanium dioxide powder, barium sulfate, which is put into vacuum kneader, to be taken off
Water is blended, and it is about 180 DEG C that temperature is mediated in control, and vacuum is about 0.01MPa, is blended about 2 hours, and blending is transferred to anti-after terminating
Stirring in kettle is answered to be cooled to room temperature, speed of agitator is 980 revs/min, obtains component A；
2) B component preparation method：According to the above ratio, by phenyl silicone oil, silicon powder, ethyl triethoxysilane, γ-methyl
Acryloxy trimethoxy silane and dibutyl benzoic acid tin are put into reactor and are stirred, and holding vacuum is about
0.01MPa, speed of agitator are 850 revs/min, are stirred about 20 minutes, after mixing terminates, obtain B component.
The performance of fluid sealant prepared by embodiment one is：Water vapor transmittance 1.3g/m2.d, 100% tensile elongation modulus is
0.8MPa, elongation at break 560%, preferable water vapor rejection effect can be played.
Embodiment two
A kind of preparation method of anti-steam electronic component encapsulation glue, the fluid sealant include component A and B component, wherein A groups
Divide and be made up of following raw materials according in parts by weight：46 parts of dimethyl silicone polymer of dimethoxy-methyl siloxy end-blocking, hydroxyl silicon
Oily 17 parts, 8 parts of precipitated calcium carbonate powder, 30 parts of montmorillonite powder, 16 parts of attapulgite powder, 6 parts of titanium dioxide powder, 10 parts of barium sulfate；
The B component is made up of the raw material of following weight part ratio：48 parts of methyl-silicone oil, 20 parts of silicon powder, vinyl trimethoxy silicon
0.8 part of 16 parts of alkane, 10 parts of γ-glycidyl ether oxygen propyl trimethoxy silicane and dioctyl tin cinnamic acid tin, the preparation side
Method is：
1) component A preparation method：According to aforementioned proportion, by dimethoxy-methyl siloxy block dimethyl silicone polymer,
Hydroxy silicon oil, precipitated calcium carbonate powder, montmorillonite powder, attapulgite powder, titanium dioxide powder, barium sulfate, which is put into vacuum kneader, to be taken off
Water is blended, and it is about 185 DEG C that temperature is mediated in control, and vacuum is about 0.03MPa, is blended about 2.5 hours, and blending is transferred to anti-after terminating
Stirring in kettle is answered to be cooled to room temperature, speed of agitator is 1020 revs/min, obtains component A；
2) B component preparation method：According to the above ratio, by methyl-silicone oil, silicon powder, vinyltrimethoxy silane, γ mono-
Glycidyl ether oxygen propyl trimethoxy silicane and dioctyl tin cinnamic acid tin are put into reactor and are stirred, and keep true
Reciprocal of duty cycle is about 0.03MPa, speed of agitator is 950 revs/min, is stirred about 25 minutes, after mixing terminates, obtains B component.
The performance of fluid sealant prepared by embodiment two is：Water vapor transmittance 1.4g/m2.d, 100% tensile elongation modulus is
0.85MPa, elongation at break 630%, preferable water vapor rejection effect can be played.
Embodiment three
A kind of preparation method of anti-steam electronic component encapsulation glue, the fluid sealant include component A and B component, wherein A groups
Divide and be made up of following raw materials according in parts by weight：45 parts of dimethyl silicone polymer of triethoxy siloxy end-blocking, hydroxy silicon oil 16
Part, 7 parts of precipitated calcium carbonate powder, 29 parts of montmorillonite powder, 14 parts of attapulgite powder, 5 parts of titanium dioxide powder, 9 parts of barium sulfate；The B
Component is made up of the raw material of following weight part ratio：46 parts of phenyl silicone oil, 19 parts of silicon powder, 15 parts of MTES,
0.7 part of 8 parts of aminopropyl triethoxysilane and dibutyl tin acetate, the preparation method are：
1) component A preparation method：According to aforementioned proportion, triethoxy siloxy is blocked into dimethyl silicone polymer, hydroxyl
Silicone oil, precipitated calcium carbonate powder, montmorillonite powder, attapulgite powder, titanium dioxide powder, barium sulfate put into vacuum kneader and are dehydrated altogether
Mixed, it is about 183 DEG C that temperature is mediated in control, and vacuum is about 0.02MPa, is blended about 2.2 hours, and blending is transferred to reactor after terminating
Middle stirring is cooled to room temperature, and speed of agitator is 1000 revs/min, obtains component A；
2) B component preparation method：According to the above ratio, by phenyl silicone oil, silicon powder, MTES, aminopropyl
Triethoxysilane and dibutyl tin acetate, which are put into reactor, to be stirred, and keeps vacuum to be about 0.02MPa, stir
Rotating speed is 900 revs/min, is stirred about 23 minutes, after mixing terminates, obtains B component.
The performance of fluid sealant prepared by embodiment three is：Water vapor transmittance 1.1g/m2.d, 100% tensile elongation modulus is
0.9MPa, elongation at break 650%, preferable water vapor rejection effect can be played.
Claims (5)
1. a kind of preparation method of anti-steam electronic component encapsulation glue, it is characterised in that the fluid sealant includes component A and B groups
Point, wherein component A is made up of following raw materials according in parts by weight：Block dimethyl silicone polymer 44-46 parts, plasticizer A 15-17
Part, precipitated calcium carbonate powder 6-8 parts, montmorillonite powder 28-30 parts, attapulgite powder 12-16 parts, titanium dioxide powder 4-6 parts, barium sulfate
8-10 parts；The B component is made up of the raw material of following weight part ratio：Plasticizer B44-48 parts, silicon powder 18-20 parts, crosslinking
Agent 14-16 parts, tackifier 9-10 parts and catalyst 0.6-0.8 parts, the preparation method are：
1) component A preparation method：According to aforementioned proportion, by end-blocking dimethyl silicone polymer, plasticizer, precipitated calcium carbonate powder, illiteracy
Take off native powder, attapulgite powder, titanium dioxide powder, barium sulfate input vacuum kneader in be dehydrated blending, control kneading temperature be
180-185 DEG C, vacuum 0.01-0.03MPa, 2-2.5 hours are blended, blending is transferred to stirring in reactor and is cooled to after terminating
Room temperature, speed of agitator are 980-1020 revs/min, obtain component A；
2) B component preparation method：According to the above ratio, plasticizer, silicon powder, crosslinking agent, tackifier and catalyst are put into instead
Answer in kettle and be stirred, holding vacuum is 0.01-0.03MPa, speed of agitator is 850-950 revs/min, is stirred 20-25
Minute, after mixing terminates, obtain B component；
Wherein, described plasticizer A and plasticizer B are any one in methyl-silicone oil, phenyl silicone oil, hydroxy silicon oil, and are increased
It is different to mould agent A and plasticizer B；
Prepared fluid sealant possesses following performance：Water vapor transmittance 1.1g/m2.d-1.4g/m2.d, 100% tensile elongation modulus
For 0.8-0.9MPa, elongation at break 550-650%.
2. the preparation method of anti-steam electronic component encapsulation glue as claimed in claim 1, it is characterised in that end-blocking poly dimethyl
Siloxanes is by trimethoxy siloxy, dimethoxy-methyl siloxy, dimethyl methyl epoxide siloxy, triethoxy silica
The dimethyl silicone polymer of any one end-blocking in base, ethyl dimethoxy siloxy, diethyl ylmethoxy siloxy.
3. the preparation method of anti-steam electronic component encapsulation glue as claimed in claim 1, it is characterised in that described crosslinking agent
For MTMS, ethyl trimethoxy silane, MTES, ethyl triethoxysilane, vinyl
Any one in trimethoxy silane, VTES or more than one combination.
4. the preparation method of anti-steam electronic component encapsulation glue as claimed in claim 1, it is characterised in that described tackifier
For gamma-aminopropyl-triethoxy-silane, γ-glycidyl ether oxygen propyl trimethoxy silicane, N- (β-amine ethyl)-γ-ammonia third
Base-methyl dimethoxysilane, γ-methacryloxy trimethoxy silane, aminopropyl triethoxysilane, γ-methyl
Any one in third monomethacryloxypropyl-triacetoxysilane or more than one combination.
5. the preparation method of anti-steam electronic component encapsulation glue as claimed in claim 1, it is characterised in that described catalyst
For any one in dibutyl tin laurate, dioctyl tin cinnamic acid tin, dibutyl tin acetate, dibutyl benzoic acid tin
Or more than one combination.
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| CN201510036488.8A CN104610904B (en) | 2015-01-23 | 2015-01-23 | A kind of preparation method of anti-steam electronic component encapsulation glue |
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| CN201510036488.8A CN104610904B (en) | 2015-01-23 | 2015-01-23 | A kind of preparation method of anti-steam electronic component encapsulation glue |
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| CN105567154A (en) * | 2015-12-30 | 2016-05-11 | 李栋军 | Environmental-protection type oil-resistant sealant |
| CN105505290A (en) * | 2015-12-30 | 2016-04-20 | 李栋军 | Sealant special for high-performance electronic components |
| CN108380152A (en) * | 2018-05-23 | 2018-08-10 | 杭州之江新材料有限公司 | A kind of device and method that organosilicon sealant is quickly cooled down |
| CN116042174B (en) * | 2023-02-25 | 2023-12-05 | 常熟市江南粘合剂有限公司 | Oil-resistant silicone sealant and preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101831271B (en) * | 2010-03-18 | 2012-07-11 | 常熟市恒信粘胶有限公司 | Hollow glass bi-component organosilicone sealant and preparation method and application thereof |
| CN104232013B (en) * | 2014-10-14 | 2016-02-10 | 泸州北方化学工业有限公司 | Silicone sealant and preparation method thereof |
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