CN103773257A - Adhesive film for encapsulating electronic element - Google Patents
Adhesive film for encapsulating electronic element Download PDFInfo
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- CN103773257A CN103773257A CN201410025994.2A CN201410025994A CN103773257A CN 103773257 A CN103773257 A CN 103773257A CN 201410025994 A CN201410025994 A CN 201410025994A CN 103773257 A CN103773257 A CN 103773257A
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- electronic element
- glued membrane
- adhesive film
- encapsulating electronic
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Abstract
The invention discloses an adhesive film for encapsulating an electronic element. The adhesive film consists of the following components in parts by mass: 35-55 parts of organic silicon resin, 15-25 parts of acrylic resin, 12-18 parts of inorganic filler, 4-9 parts of titanium oxide, 3-7 parts of polyethylene wax and 5-9 parts of functional aid, wherein the functional aid comprises a dispersing agent, a curing agent and a film forming aid. The adhesive film for encapsulating the electronic element provided in the technical scheme of the invention can form a layer of protective film around the electronic element, so that chemical or physical damages of the external environment to the electronic element are reduced greatly. Moreover, the adhesive film is stable in property, is prevented from falling off easily, and does not damage the electronic element.
Description
Technical field
The present invention relates to a kind of glued membrane, particularly a kind of glued membrane for encapsulating electronic components.
Background technology
Electronic component is the strength member that forms electronics or electromechanical equipment, and volume is relatively little and more scattered.That packs is incorrect, often causes electronic component to be subject to the impact of environmental factors, and occurs oxidation, distortion or other infringement causing the function of electronic component to be affected, and even brings harm to whole equipment, therefore the storage of electronic component is most important.In prior art; be generally silicon rubber or other housings of sealing for the material of encapsulating electronic components; although can reduce to a certain extent the harm that surrounding environment is brought; but effect is still limited; and structure setting is unreasonable; cause electronic component to produce mechanical friction in protection housing, cause unnecessary harm.
Summary of the invention
Goal of the invention: for above-mentioned deficiency, the object of the invention is to provide a kind of glued membrane of effective encapsulating electronic components.
Technical scheme of the present invention: a kind of encapsulating electronic components glued membrane, wherein: glued membrane is made up of the component of following mass fraction: silicone resin 35-55 part, acrylic resin 15-25 part, mineral filler 12-18 part, titanium oxide 4-9 part, polyethylene wax 3-7 part and functional agent 5-9 part, wherein functional agent comprises dispersion agent, solidifying agent and film coalescence aid.
As preferably, mineral filler is talcum powder, kaolin or bentonitic one or both combination.
As preferably, dispersion agent is aluminum silicate fiber.
As preferably, solidifying agent is fatty amines solidifying agent.
Beneficial effect: the encapsulating electronic components glued membrane that technical solution of the present invention provides; can around electronic component, form layer protecting film, greatly reduce external environment electronic component is produced to chemistry or physical injury, and latex film property be stable; difficult drop-off, and can not cause damage to electronic component.
Embodiment
In order further to understand the present invention, below in conjunction with embodiment, the preferred embodiment of the invention is described, but should be appreciated that these are described is for further illustrating the features and advantages of the present invention, rather than limiting to the claimed invention.
Embodiment 1
A kind of encapsulating electronic components glued membrane, wherein: glued membrane is made up of the component of following mass fraction: 5 parts of 35 parts of silicone resins, 15 parts of acrylic resins, 12 parts of wilkinites, 4 parts of titanium oxide, 3 parts of polyethylene waxs and functional agents, wherein functional agent comprises 1 part of 2 parts of aluminum silicate fibers, 2 parts, fatty amines solidifying agent and film coalescence aid.
Embodiment 2
A kind of encapsulating electronic components glued membrane, wherein: glued membrane is made up of the component of following mass fraction: 9 parts of 55 parts of silicone resins, 25 parts of acrylic resins, 18 parts of wilkinites, 9 parts of titanium oxide, 7 parts of polyethylene waxs and functional agents, wherein functional agent comprises 2 parts of 4 parts of aluminum silicate fibers, 3 parts, fatty amines solidifying agent and film coalescence aid.
Embodiment 3
A kind of encapsulating electronic components glued membrane, wherein: glued membrane is made up of the component of following mass fraction: 7 parts of 45 parts of silicone resins, 18 parts of acrylic resins, 16 parts of wilkinites, 6 parts of titanium oxide, 6 parts of polyethylene waxs and functional agents, wherein functional agent comprises 1 part of 3 parts of aluminum silicate fibers, 3 parts, fatty amines solidifying agent and film coalescence aid.
Below by specific experiment, further illustrate the excellent effect that the present invention reaches.
The coating that above-mentioned embodiment is made is made model, is experimental group; Getting silicon rubber is control group, carries out performance test, and result is as follows:
Waterproof test: embodiment 1-3 water resistance is all more than 95, and control group is 90 points;
High temperature test: embodiment 1-3 tolerable temperature is significantly higher than control group;
1000 hours burn-in tests: embodiment 1-3 is considerable change, control group has slight foaming.
Hence one can see that, and encapsulating electronic components glued membrane provided by the invention has the effect that good protection electronic component is avoided environmental influence.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To be apparent for those skilled in the art to the multiple modification of these embodiment, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. an encapsulating electronic components glued membrane, it is characterized in that: glued membrane is made up of the component of following mass fraction: silicone resin 35-55 part, acrylic resin 15-25 part, mineral filler 12-18 part, titanium oxide 4-9 part, polyethylene wax 3-7 part and functional agent 5-9 part, wherein functional agent comprises dispersion agent, solidifying agent and film coalescence aid.
2. encapsulating electronic components glued membrane according to claim 1, is characterized in that: mineral filler is talcum powder, kaolin or bentonitic one or both combination.
3. encapsulating electronic components glued membrane according to claim 1, is characterized in that: dispersion agent is aluminum silicate fiber.
4. encapsulating electronic components glued membrane according to claim 1, is characterized in that: solidifying agent is fatty amines solidifying agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410025994.2A CN103773257A (en) | 2014-01-20 | 2014-01-20 | Adhesive film for encapsulating electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410025994.2A CN103773257A (en) | 2014-01-20 | 2014-01-20 | Adhesive film for encapsulating electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103773257A true CN103773257A (en) | 2014-05-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410025994.2A Pending CN103773257A (en) | 2014-01-20 | 2014-01-20 | Adhesive film for encapsulating electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103773257A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107699191A (en) * | 2017-10-25 | 2018-02-16 | 浙江星丰科技有限公司 | A kind of waterproof heat-resisting adhesive and preparation method thereof |
| CN107699166A (en) * | 2017-10-25 | 2018-02-16 | 浙江星丰科技有限公司 | A kind of high temperature resistant adhesive and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812278A (en) * | 2010-05-20 | 2010-08-25 | 上海西怡新材料科技有限公司 | Ultraviolet curable organic silicon-acrylic resin electronic adhesive and application thereof |
| CN102731743A (en) * | 2012-06-26 | 2012-10-17 | 华烁科技股份有限公司 | Preparation of white thermosetting resin used for LED light having encapsulating film |
-
2014
- 2014-01-20 CN CN201410025994.2A patent/CN103773257A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812278A (en) * | 2010-05-20 | 2010-08-25 | 上海西怡新材料科技有限公司 | Ultraviolet curable organic silicon-acrylic resin electronic adhesive and application thereof |
| CN102731743A (en) * | 2012-06-26 | 2012-10-17 | 华烁科技股份有限公司 | Preparation of white thermosetting resin used for LED light having encapsulating film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107699191A (en) * | 2017-10-25 | 2018-02-16 | 浙江星丰科技有限公司 | A kind of waterproof heat-resisting adhesive and preparation method thereof |
| CN107699166A (en) * | 2017-10-25 | 2018-02-16 | 浙江星丰科技有限公司 | A kind of high temperature resistant adhesive and preparation method thereof |
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Application publication date: 20140507 |