CN107699166A - A kind of high temperature resistant adhesive and preparation method thereof - Google Patents

A kind of high temperature resistant adhesive and preparation method thereof Download PDF

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Publication number
CN107699166A
CN107699166A CN201711007641.XA CN201711007641A CN107699166A CN 107699166 A CN107699166 A CN 107699166A CN 201711007641 A CN201711007641 A CN 201711007641A CN 107699166 A CN107699166 A CN 107699166A
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parts
high temperature
temperature resistant
preparation
adhesive
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谢土根
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ZHEJIANG XINGFENG INDUSTRY TECH Co Ltd
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ZHEJIANG XINGFENG INDUSTRY TECH Co Ltd
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Priority to CN201711007641.XA priority Critical patent/CN107699166A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation

Abstract

The present invention relates to field of adhesive technology, discloses a kind of high temperature resistant adhesive and preparation method thereof.The raw material that the adhesive is matched by following parts by weight is made:40 ~ 50 parts of Hydroxylated acrylic resin, 30 ~ 35 parts of modified organic silicone resin, 10 ~ 15 parts of talcum powder, 5 ~ 8 parts of diethylenetriamines, 3 ~ 8 parts of butyl glycol ether, 2 ~ 5 parts of dibutyl phthalate, 3 ~ 8 parts of hydroquinones, 2 ~ 6 parts of VTES.Invention adhesive has good resistance to elevated temperatures.

Description

A kind of high temperature resistant adhesive and preparation method thereof
Technical field
The present invention relates to field of adhesive technology, more particularly, to a kind of high temperature resistant adhesive and preparation method thereof.
Background technology
It is gluing to refer to homogeneity or technology that heterogeneous body surface is linked together with adhesive, have that stress distribution is continuous, The features such as in light weight, or sealing, most technological temperatures are low.It is gluing especially suitable for unlike material, different-thickness, ultra-thin specification and The connection of complex component.Gluing RECENT DEVELOPMENTS is most fast, and application industry is extremely wide, and to high-and-new science and technology progress and the daily life of the people Improvement living has significant impact.Therefore, it is particularly significant to study, develop and produce all kinds of adhesive.The properties of adhesive determine The Storage period of the extensive degree, especially adhesive of its application, directly determines its use cost and effect.Adhesive point For inorganic adhesive and organic adhesion agent, although inorganic adhesive with higher resistance to elevated temperatures and higher intensity, Fragility is big, and the risk that seal failure is connected in shock and vibration environment is larger;General polymerization thing have it is preferably flexible, can be with Overcome inorganic adhesive fragility big, the shortcomings that intolerant to shock and vibration.But when adhesive applications are in hot environment, adhesive It is easy to decompose, adhesive is lost plybonding effect.
The content of the invention
The present invention is to overcome the technical problem of existing adhesive non-refractory, there is provided a kind of resistant to elevated temperatures adhesive.
Present invention also offers a kind of preparation method of high temperature resistant adhesive.
To achieve these goals, the present invention uses following technical scheme:A kind of high temperature resistant adhesive, by following weight The raw material of number proportioning is made:40~50 parts of Hydroxylated acrylic resin, 30~35 parts of modified organic silicone resin, talcum powder 10~15 Part, 5~8 parts of diethylenetriamines, 3~8 parts of butyl glycol ether, 2~5 parts of dibutyl phthalate, 3~8 parts of hydroquinones With 2~6 parts of VTES.
The use of Hydroxylated acrylic resin and modified organic silicone resin is sticky matter;Talcum powder is filler, can make adhesive Thermal coefficient of expansion is reduced, and shrinkage is reduced;Diethylenetriamines is curing agent, can shorten the hardening time of adhesive;Second two Alcohol butyl ether is diluent, the more sticky adhesive of dilution, increases the uniformity mixed between each component;Dibutyl phthalate For plasticizer;Hydroquinones high-temperature stabilizer, it is possible to increase the stability of adhesive under the high temperature conditions, suppress point of adhesive Solution;VTES is coupling agent, by increasing capacitance it is possible to increase dispersiveness and uniformity of the talcum powder in component.
Preferably, the preparation method of the modified organic silicone resin comprises the following steps:
(1) 10~20g trim,ethylchlorosilanes and 4~8g ethyl chlorosilanes are added to 50~60mL dimethyl formamide solutions In, stir at normal temperatures 2~3 hours, then adding 6~10g dichloro-diethyl silanes, stirring 30~60 minutes, obtain chlorine Silane mixture liquid;
(2) 40~50mL methanol and 10~16mL dichloromethane are added in 180~200mL distilled water, heated up, Ran Houjia Enter chlorosilane mixed liquor, stir 1~2 hour, obtain organic-silicone prepolymer solution;
(3) 8~12g flyash is added in 70~80mL methanol solutions, then adds the organic siliconresin that step (2) obtains Prepolymer solution, it is stirred, obtains modified organic silicone resin.
The skeleton structure of organic siliconresin in flyash is Si-O-Si, and Si-O has larger bond energy, in the bar of high temperature Easy fracture and decomposition are not allowed under part, therefore there is excellent heat-resisting quantity and stability;It is carried out further using flyash It is heat resistance modified, the silica in flyash contains hydroxyl, and the hydroxyl in organosilicon can be with the hydroxyl of silica surface Polycondensation reaction is freeed, improves the degree of cross linking of organosilicon, further enhancing the heat resistance of organosilicon;Silica and organosilicon The polymer formed after crosslinking has certain colloidal nature, possesses certain adsorption capacity, can substantially reduce consolidating for adhesive Change temperature and shorten the hardening time of adhesive.
Preferably, it is warming up to 50~55 DEG C in the step (2).
Preferably, mixing time is 4~6 hours in the step (3).
A kind of preparation method of high temperature resistant adhesive, it is characterized in that, it is described to comprise the following steps:
(A) first into reactor add 40~50 parts of Hydroxylated acrylic resins, 30~35 parts of modified organic silicone resins, 3~8 parts it is right Benzenediol and 2~6 parts of VTESs, above-mentioned material is stirred;
(B) temperature of reaction kettle is increased to 50~70 DEG C, 10~15 parts of talcum powder, 5~8 parts of diethylidenes is added into reactor Triamine, 3~8 parts of butyl glycol ethers, 2~5 parts of dibutyl phthalates, are then stirred;
(C) natural cooling after the completion of question response, for the high temperature adhesive of preparation.
Preferably, mixing speed is 100~150r/min in the step (A), mixing time is 30~50 minutes.
Preferably, mixing speed is 140~160r/min in the step (B), mixing time is 2~3 hours.
Therefore, the present invention has the advantages that:(1) hydroquinones high-temperature stabilizer is added, it is possible to increase adhesive Stability under the high temperature conditions, suppress the decomposition of adhesive;(2) organic siliconresin has larger bond energy, in the bar of high temperature Easy fracture and decomposition are not allowed under part, therefore there is excellent heat-resisting quantity and stability;(3) traveling one is entered to it using flyash What is walked is heat resistance modified, further enhancing the heat resistance of organosilicon;(4) silica with it is organosilicon crosslinked after formed polymerize Thing has certain colloidal nature, possesses certain adsorption capacity, can substantially reduce the solidification temperature of adhesive and shorten gluing The hardening time of agent.
Embodiment
Below by specific embodiment, technical scheme is described further.
In the present invention, if not refering in particular to, used raw material and equipment etc. are commercially available or commonly used in the art, Method in embodiment, it is the conventional method of this area unless otherwise instructed.
Embodiment 1
A kind of high temperature resistant adhesive, the raw material matched by following parts by weight are made:40 parts of Hydroxylated acrylic resin, modification have It is 30 parts of machine silicones, 10 parts of talcum powder, 5 parts of diethylenetriamines, 3 parts of butyl glycol ether, 2 parts of dibutyl phthalate, right 3 parts of benzenediol, 2 parts of VTES.
Wherein, the preparation method of modified organic silicone resin comprises the following steps:
(1) 10g trim,ethylchlorosilanes and 4g ethyl chlorosilanes are added in 50mL dimethyl formamide solutions, stirred at normal temperatures Mix 2 hours, then adding 6g dichloro-diethyl silanes, stirring 30 minutes, obtain chlorosilane mixed liquor;
(2) 40mL methanol and 10mL dichloromethane are added in 180mL distilled water, are warming up to 50 DEG C, then add chlorine silicon Alkane mixed liquor, stir 1 hour, obtain organic-silicone prepolymer solution;
(3) 8g flyash is added in 70mL methanol solutions, it is molten then adds the organic-silicone prepolymer that step (2) obtains Liquid, it is stirred 4 hours, obtains modified organic silicone resin.
A kind of preparation method of high temperature resistant adhesive, comprises the following steps:
(A) Hydroxylated acrylic resin, modified organic silicone resin, hydroquinones and the second of above-mentioned parts by weight are first added into reactor Alkenyl triethoxysilane, above-mentioned material is stirred, mixing speed 100r/min, mixing time is 30 minutes;
(B) temperature of reaction kettle is increased to 50 DEG C, added into reactor the talcum powder of above-mentioned parts by weight, diethylenetriamines, Butyl glycol ether, dibutyl phthalate, are then stirred, mixing speed 140r/min, and mixing time is 2 hours; (C) natural cooling after the completion of question response, for the high temperature adhesive of preparation.
Embodiment 2
A kind of high temperature resistant adhesive, the raw material matched by following parts by weight are made:42 parts of Hydroxylated acrylic resin, modification have It is 32 parts of machine silicones, 12 parts of talcum powder, 6 parts of diethylenetriamines, 4 parts of butyl glycol ether, 3 parts of dibutyl phthalate, right 4 parts of benzenediol, 3 parts of VTES.
Wherein, the preparation method of modified organic silicone resin comprises the following steps:
(1) 12g trim,ethylchlorosilanes and 5g ethyl chlorosilanes are added in 52mL dimethyl formamide solutions, stirred at normal temperatures Mix 2.2 hours, then adding 7g dichloro-diethyl silanes, stirring 40 minutes, obtain chlorosilane mixed liquor;
(2) 42mL methanol and 12mL dichloromethane are added in 185mL distilled water, are warming up to 52 DEG C, then add chlorine silicon Alkane mixed liquor, stir 1.2 hours, obtain organic-silicone prepolymer solution;
(3) 9g flyash is added in 72mL methanol solutions, it is molten then adds the organic-silicone prepolymer that step (2) obtains Liquid, it is stirred 4.5 hours, obtains modified organic silicone resin.
A kind of preparation method of high temperature resistant adhesive, comprises the following steps:
(A) Hydroxylated acrylic resin, modified organic silicone resin, hydroquinones and the second of above-mentioned parts by weight are first added into reactor Alkenyl triethoxysilane, above-mentioned material is stirred, mixing speed 110r/min, mixing time is 35 minutes;
(B) temperature of reaction kettle is increased to 55 DEG C, talcum powder diethylenetriamines, the second of above-mentioned parts by weight is added into reactor Glycol butyl ether and dibutyl phthalate, are then stirred, mixing speed 145r/min, and mixing time is 2.2 hours; (C) natural cooling after the completion of question response, for the high temperature adhesive of preparation.
Embodiment 3
A kind of high temperature resistant adhesive, the raw material matched by following parts by weight are made:45 parts of Hydroxylated acrylic resin, modification have It is 33 parts of machine silicones, 13 parts of talcum powder, 7 parts of diethylenetriamines, 5 parts of butyl glycol ether, 3 parts of dibutyl phthalate, right 6 parts of benzenediol, 4 parts of VTES.
Wherein, the preparation method of modified organic silicone resin comprises the following steps:
(1) 15g trim,ethylchlorosilanes and 6g ethyl chlorosilanes are added in 52mL dimethyl formamide solutions, stirred at normal temperatures Mix 2.5 hours, then adding 7.5g dichloro-diethyl silanes, stirring 45 minutes, obtain chlorosilane mixed liquor;
(2) 45mL methanol and 13mL dichloromethane are added in 190mL distilled water, are warming up to 53 DEG C, then add chlorine silicon Alkane mixed liquor, stir 1.5 hours, obtain organic-silicone prepolymer solution;
(3) 10g flyash is added in 75mL methanol solutions, then adds the organic-silicone prepolymer that step (2) obtains Solution, it is stirred 5 hours, obtains modified organic silicone resin.
A kind of preparation method of high temperature resistant adhesive, comprises the following steps:
(A) Hydroxylated acrylic resin, modified organic silicone resin, hydroquinones and the second of above-mentioned parts by weight are first added into reactor Alkenyl triethoxysilane, above-mentioned material is stirred, mixing speed 120r/min, mixing time is 40 minutes;
(B) temperature of reaction kettle is increased to 60 DEG C, talcum powder diethylenetriamines, the second of above-mentioned parts by weight is added into reactor Glycol butyl ether and dibutyl phthalate, are then stirred, mixing speed 150r/min, and mixing time is 2.5 hours; (C) natural cooling after the completion of question response, for the high temperature adhesive of preparation.
Embodiment 4
A kind of high temperature resistant adhesive, the raw material matched by following parts by weight are made:48 parts of Hydroxylated acrylic resin, modification have It is 34 parts of machine silicones, 14 parts of talcum powder, 7 parts of diethylenetriamines, 6 parts of butyl glycol ether, 4 parts of dibutyl phthalate, right 7 parts of benzenediol, 5 parts of VTES.
Wherein, the preparation method of modified organic silicone resin comprises the following steps:
(1) 18g trim,ethylchlorosilanes and 7g ethyl chlorosilanes are added in 56mL dimethyl formamide solutions, stirred at normal temperatures Mix 2.8 hours, then adding 8g dichloro-diethyl silanes, stirring 50 minutes, obtain chlorosilane mixed liquor;
(2) 48mL methanol and 14mL dichloromethane are added in 195mL distilled water, are warming up to 54 DEG C, then add chlorine silicon Alkane mixed liquor, stir 1.8 hours, obtain organic-silicone prepolymer solution;
(3) 11g flyash is added in 78mL methanol solutions, then adds the organic-silicone prepolymer that step (2) obtains Solution, it is stirred 5.5 hours, obtains modified organic silicone resin.
A kind of preparation method of high temperature resistant adhesive, comprises the following steps:
(A) Hydroxylated acrylic resin, modified organic silicone resin, hydroquinones and the second of above-mentioned parts by weight are first added into reactor Alkenyl triethoxysilane, above-mentioned material is stirred, mixing speed 140r/min, mixing time is 45 minutes;
(B) temperature of reaction kettle is increased to 65 DEG C, talcum powder diethylenetriamines, the second of above-mentioned parts by weight is added into reactor Glycol butyl ether and dibutyl phthalate, are then stirred, mixing speed 155r/min, and mixing time is 2.8 hours; (C) natural cooling after the completion of question response, for the high temperature adhesive of preparation.
Embodiment 5
A kind of high temperature resistant adhesive, the raw material matched by following parts by weight are made:50 parts of Hydroxylated acrylic resin, modification have It is 35 parts of machine silicones, 15 parts of talcum powder, 8 parts of diethylenetriamines, 8 parts of butyl glycol ether, 5 parts of dibutyl phthalate, right 8 parts of benzenediol, 6 parts of VTES.
Wherein, the preparation method of modified organic silicone resin comprises the following steps:
(1) 20g trim,ethylchlorosilanes and 8g ethyl chlorosilanes are added in 60mL dimethyl formamide solutions, stirred at normal temperatures Mix 3 hours, then adding 10g dichloro-diethyl silanes, stirring 60 minutes, obtain chlorosilane mixed liquor;
(2) 50mL methanol and 16mL dichloromethane are added in 200mL distilled water, are warming up to 55 DEG C, then add chlorine silicon Alkane mixed liquor, stir 2 hours, obtain organic-silicone prepolymer solution;
(3) 12g flyash is added in 80mL methanol solutions, then adds the organic-silicone prepolymer that step (2) obtains Solution, it is stirred 6 hours, obtains modified organic silicone resin.
A kind of preparation method of high temperature resistant adhesive, comprises the following steps:
(A) above-mentioned parts by weight Hydroxylated acrylic resin, modified organic silicone resin, hydroquinones and ethene are first added into reactor Ethyl triethoxy silicane alkane, above-mentioned material is stirred, mixing speed 150r/min, mixing time is 50 minutes;
(B) temperature of reaction kettle is increased to 70 DEG C, added into reactor the talcum powder of above-mentioned parts by weight, diethylenetriamines, Butyl glycol ether and dibutyl phthalate, are then stirred, mixing speed 160r/min, and mixing time is 3 hours; (C) natural cooling after the completion of question response, for the high temperature adhesive of preparation.
Comparative example 1:
A kind of high temperature resistant adhesive, the raw material matched by following parts by weight are made:45 parts of Hydroxylated acrylic resin, organosilicon 33 parts of resin, 13 parts of talcum powder, 7 parts of diethylenetriamines, 5 parts of butyl glycol ether, 3 parts of dibutyl phthalate, to benzene two 6 parts of phenol, 4 parts of VTES.
A kind of preparation method of high temperature resistant adhesive, comprises the following steps:
(A) Hydroxylated acrylic resin, organic siliconresin, hydroquinones and the vinyl of above-mentioned parts by weight are first added into reactor Triethoxysilane, above-mentioned material is stirred, mixing speed 120r/min, mixing time is 40 minutes;
(B) temperature of reaction kettle is increased to 60 DEG C, talcum powder diethylenetriamines, the second of above-mentioned parts by weight is added into reactor Glycol butyl ether and dibutyl phthalate, are then stirred, mixing speed 150r/min, and mixing time is 2.5 hours; (C) natural cooling after the completion of question response, for the high temperature adhesive of preparation.
Comparative example 2
Comparative example 1:
A kind of high temperature resistant adhesive, the raw material matched by following parts by weight are made:45 parts of Hydroxylated acrylic resin, talcum powder 13 parts, 7 parts of diethylenetriamines, 5 parts of butyl glycol ether, 3 parts of dibutyl phthalate, 6 parts of hydroquinones, the second of vinyl three 4 parts of TMOS.
A kind of preparation method of high temperature resistant adhesive, comprises the following steps:
(A) Hydroxylated acrylic resin, hydroquinones and vinyl triethoxyl silicon of above-mentioned parts by weight are first added into reactor Alkane, above-mentioned material is stirred, mixing speed 120r/min, mixing time is 40 minutes;
(B) temperature of reaction kettle is increased to 60 DEG C, talcum powder diethylenetriamines, the second of above-mentioned parts by weight is added into reactor Glycol butyl ether and dibutyl phthalate, are then stirred, mixing speed 150r/min, and mixing time is 2.5 hours; (C) natural cooling after the completion of question response, for the high temperature adhesive of preparation.
Embodiment 1 is to embodiment 5, comparative example 1 (organic siliconresin is not modified in adhesive components) and comparative example 2 (without addition organic siliconresin in adhesive components) peel strength of the adhesive at 300 DEG C such as following table
It can be seen from peel strength, it can increase the adhesive property of adhesive by adding organic siliconresin in adhesive, pass through To adhesive modification, the adhesive property of adhesive is further enhanced.
The above described is only a preferred embodiment of the present invention, any formal limitation not is made to the present invention, though So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any to be familiar with this professional technology people Member, without departing from the scope of the present invention, when the technology contents using the disclosure above make a little change or modification For the equivalent embodiment of equivalent variations, as long as being the technical spirit pair according to the present invention without departing from technical solution of the present invention content Any simple modification, equivalent change and modification that above example is made, in the range of still falling within technical solution of the present invention.

Claims (7)

1. a kind of high temperature resistant adhesive, it is characterized in that, the raw material matched by following parts by weight is made:Hydroxylated acrylic resin 40 ~ 50 parts, 30 ~ 35 parts of modified organic silicone resin, 10 ~ 15 parts of talcum powder, 5 ~ 8 parts of diethylenetriamines, butyl glycol ether 3 ~ 8 2 ~ 6 parts of part, 2 ~ 5 parts of dibutyl phthalate, 3 ~ 8 parts of hydroquinones and VTES.
2. a kind of high temperature resistant adhesive according to claim 1, it is characterized in that, the preparation of the modified organic silicone resin Method comprises the following steps:
(1)10 ~ 20g trim,ethylchlorosilanes and 4 ~ 8g ethyl chlorosilanes are added in 50 ~ 60 mL dimethyl formamide solutions, Stir at normal temperatures 2 ~ 3 hours, then adding 6 ~ 10g dichloro-diethyl silanes, stirring 30 ~ 60 minutes, obtain chlorosilane and mix Close liquid;
(2)40 ~ 50 mL methanol and 10 ~ 16mL dichloromethane are added in 180 ~ 200mL distilled water, heats up, then adds Chlorosilane mixed liquor, stir 1 ~ 2 hour, obtain organic-silicone prepolymer solution;
(3)8 ~ 12g flyash is added in 70 ~ 80mL methanol solutions, then adds step(2)Obtained organic siliconresin is pre- Oligomer solution, it is stirred, obtains modified organic silicone resin.
3. a kind of high temperature resistant adhesive according to claim 2, it is characterized in that, the step(2)In be warming up to 50 ~ 55 ℃。
4. a kind of high temperature resistant adhesive according to claim 2, it is characterized in that, the step(3)Middle mixing time is 4 ~ 6 hours.
5. a kind of preparation method of high temperature resistant adhesive as described in claim 1 ~ 4 any claim, it is characterized in that, institute State and comprise the following steps:
(A)40 ~ 50 parts of Hydroxylated acrylic resins, 30 ~ 35 parts of modified organic silicone resins are first added into reactor, 3 ~ 8 parts to benzene Diphenol and 2 ~ 6 parts of VTESs, above-mentioned material is stirred;
(B)Temperature of reaction kettle is increased to 50 ~ 70 DEG C, 10 ~ 15 parts of talcum powder, 5 ~ 8 parts of diethylidenes three are added into reactor Amine, 3 ~ 8 parts of butyl glycol ethers, 2 ~ 5 parts of dibutyl phthalates, are then stirred;
(C)Natural cooling after the completion of question response, for the high temperature adhesive of preparation.
6. a kind of preparation method of high temperature resistant adhesive according to claim 5, it is characterized in that, the step(A)In Mixing speed is 100 ~ 150r/min, and mixing time is 30 ~ 50 minutes.
7. a kind of preparation method of high temperature resistant adhesive according to claim 5, it is characterized in that, the step(B)In Mixing speed is 140 ~ 160 r/min, and mixing time is 2 ~ 3 hours.
CN201711007641.XA 2017-10-25 2017-10-25 A kind of high temperature resistant adhesive and preparation method thereof Pending CN107699166A (en)

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Application publication date: 20180216