CN107254278A - A kind of preparation method of the water-resistant adhesive efficiently solidified - Google Patents
A kind of preparation method of the water-resistant adhesive efficiently solidified Download PDFInfo
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- CN107254278A CN107254278A CN201610994737.9A CN201610994737A CN107254278A CN 107254278 A CN107254278 A CN 107254278A CN 201610994737 A CN201610994737 A CN 201610994737A CN 107254278 A CN107254278 A CN 107254278A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of preparation method of the water-resistant adhesive efficiently solidified, concretely comprise the following steps：1）Preparation prepares the raw material of bisphenol-A epoxy resin first, then prepares bisphenol-A epoxy resin stand-by；2）Then the modification operation of bisphenol-A epoxy resin is carried out, addition modifying agent and the bisphenol-A epoxy resin prepared carry out heating response, and obtain modified epoxy；3）Then mixed curing agent is prepared, the mixed curing agent includes 20 45 parts of cyanoethylation diethylentriamine curing agent, 6 12 parts of ethylene glycol diglycidylether, 15 30 parts of filler, 9 15 parts of ACM, 7 20 parts of methyl-phosphoric acid dimethyl ester；4）After modified epoxy and mixed curing agent are independently encapsulated, then packed products together two-by-two.The present invention method by rationally controlling each reactant between proportioning, rationally control reaction condition and prepare a kind of High-durability epoxy resin adhesive.
Description
Technical field
The present invention relates to high-molecular gel field, a kind of preparation method of the water-resistant adhesive efficiently solidified is specifically referred to.
Background technology
The adhesive product that building adhesive is commonly used as building trade is widely used in inside construction and house and filled
Repair, for house inside fitting, floor glue can be usually used in composite floor board.And floor glue conventional at present generally contains
There are the organic poisons such as aldehydes, its release can influence health.So, how to solve composite floor board glue release dusty gas
It is the technical problem of urgent need to resolve.
And epoxyn as a kind of environment-friendly type gel rubber material the problem of can solve the problem that existing building adhesive, institute
The epoxyn stated is the work that a class is formulated by epoxy resin base-material, curing agent, diluent, accelerator and filler
Journey adhesive.Because its adhesive property is good, feature is good, less expensive, technique for sticking easy, so existing in recent decades
Household electrical appliances, automobile, water conservancy traffic, electronic apparatus and aerospace industry field are widely used.With new and high technology and nanometer
Technology is continued to develop, and in recent years, the modification to epoxy resin deepens continuously, and interpenetrating networks, chemical copolymerization and nano-particle increase
The method extensive use such as tough, by epoxy preparation into various high-performance adhesive kinds it is also more and more.But it has one
Individual obvious shortcoming is toughness deficiency, easily poor impact resistance, cracking after solidification, and the shortcoming greatly limit answering for epoxy resin
With.The characteristic requirements more and more highers developed rapidly to epoxy resin of various materials, epoxy resin is solidified into epoxy resin
The emphasis of use research, people carry out solidification toughness reinforcing using a variety of methods to epoxy resin, so that its application field is more
Extensively.
The content of the invention
It is an object of the invention to provide it is a kind of with efficient curing performance, be capable of strong adherence and moistureproof water-fast function
The preparation method of adhesive.
The present invention is achieved through the following technical solutions：A kind of preparation method of the water-resistant adhesive efficiently solidified, specific step
Suddenly it is：
（1）Preparation prepares the raw material of bisphenol-A epoxy resin first, then prepares bisphenol-A epoxy resin
It is stand-by；
（2）Then the modification operation of bisphenol-A epoxy resin, addition modifying agent and the hydrogenated bisphenol A type prepared are carried out
Epoxy resin carries out heating response, and obtains modified epoxy；
（3）Then mixed curing agent is prepared, the mixed curing agent includes 20-45 parts of cyanoethylation diethylentriamine curing agent,
6-12 parts of ethylene glycol diglycidylether, 15-30 parts of filler, 9-15 parts of ACM, 7-20 parts of methyl-phosphoric acid dimethyl ester；
（4）After modified epoxy and mixed curing agent are independently encapsulated, then packed products together two-by-two.
Further, the step（1）It is middle to prepare concretely comprising the following steps for bisphenol-A epoxy resin：
（1.1）Prepare raw material, the raw material is sodium hydroxide, epoxychloropropane, hydrogenated bisphenol A and methyl iso-butyl ketone (MIBK)；
（1.2）Represented with parts by weight, take 6-8 parts of sodium hydroxide, 30-40 parts of epoxychloropropane, 15-18 parts of A Hydrogenated Bisphenol A
A, methyl iso-butyl ketone (MIBK) is simultaneously added in reactor by a certain percentage, and adds catalyst, then 50-60 DEG C of water bath with thermostatic control and is stirred
Mix；Then condensing reflux reacts 24h；
（1.3）Then add after deionized water is sufficiently mixed and staticly settle after question response terminates, after then upper aqueous layer is filtered out
Surplus solution is heated to 75 DEG C and sodium hydroxide solution is added, then constant temperature stirring reaction 1-3h；
（1.4）Distilled water washing point liquid is added after question response, until when the water layer pH value separated is neutral, filtrate is completely distilled off
Later, light yellow, transparent bisphenol-A epoxy resin is obtained.
Further, the step（1.3）In sodium hydroxide mass fraction be 30-38%, the step（1.4）In
Vapo(u)rizing temperature be 95-96 DEG C.
Further, the step（2）In modification operation concretely comprise the following steps：
（2.1）Modifying agent is got out, the modifying agent is vinyl acetate latex and dibutyl phthalate latex, by two kinds
Dry for standby after latex demulsification；
（2.2）Then vinyl acetate latex is added in bisphenol-A epoxy resin, then for 120-140 DEG C of temperature
Under the conditions of react 2-4h；
（2.3）Question response adds dibutyl phthalate latex after terminating, 1- is reacted under 120-140 DEG C of temperature conditionss
1.2h, that is, obtain the modified epoxy for thick liquid under normal temperature.
Further, the step（3）In prepare concretely comprising the following steps for mixed curing agent：
（3.1）Get out mix the raw material of fixative, the raw material represent that cyanoethylation diethylentriamine is consolidated with parts by weight
20-45 parts of agent, 6-12 parts of ethylene glycol diglycidylether, 15-30 parts of filler, 9-15 parts of ACM, methyl acid phosphate
7-20 parts of dimethyl ester；
（3.2）First take cyanoethylation diethylentriamine curing agent and addition ACM and filler are mixed thereto
Heating stirring 1-2h, slowly ethylene glycol diglycidylether is added in whipping process thereto；
（3.3）Then add methyl-phosphoric acid dimethyl ester and continue constant temperature stirring 30-50min, produce mixing fixative.
Bisphenol-A epoxy resin chemical name employed in the present invention is hydrogenated bisphenol A diglycidyl ether, is
Obtained hexahydro bisphenol-A is hydrogenated with by bisphenol-A to obtain in sodium hydroxide catalyzed lower polycondensation with epoxychloropropane.Be a kind of viscosity very
The fairly good epoxy resin of low, gel time length, weatherability.And ethylene glycol diglycidylether curing agent is a kind of colourless to light
Yellow transparent viscous liquid, relative density 0.985.Viscosity（25℃）90~150mPa·s.500~700mgKOH/g of total amine value.
Ethanol, acetone polar solvent are dissolved in, has a certain degree of intersolubility with water.Low toxicity.And the filler is particularly preferred as two
Silicon oxide particle, the silica dioxide granule particle diameter is 1-2mm.Described silica, the technical terms of chemistry, pure silica without
It is solid under color, normal temperature, chemical formula is SiO2, it is water insoluble, insoluble in acid.Crystalline silica and nothing are there are in nature
Two kinds of amorphous silicon dioxide.Silica have many uses it is general, be mainly used in glass processed, waterglass, pottery, enamel, refractory material,
Aerogel blanket, ferrosilicon, molding sand, elemental silicon, cement etc., in ancient times, silica are also used for making the glaze and carcass of porcelain.One
As stone be mainly made up of silica, calcium carbonate.
The present invention compared with prior art, with advantages below and beneficial effect：
The method of the present invention by rationally controlling each reactant between proportioning, rationally control reaction condition and prepare a kind of height
Solidify obtained from endurance quality epoxy resin adhesive, the epoxy resin composition that epoxy resin of the invention is obtained
Thing, with the mechanical properties such as moisture-proof, excellent heat resistance, and impact resistance also excellent performance, adhesive property is good, durability
Can be good, and preparation method is simple and easy to apply, is adapted to industrialized production, is compared compared with other epoxy resin adhesives, is bonded without strict
The metal of surface treatment and it is nonmetallic all have good adhesive property and endurance quality, can be applied to adhesive field.
Embodiment
Embodiments of the invention are described below in detail.
Embodiment 1：
A kind of water-resistant adhesive efficiently solidified of the present embodiment, is represented with parts by weight, including bisphenol-A epoxy resin base
150-270 parts of material, 20-45 parts of cyanoethylation diethylentriamine curing agent, 6-12 parts of ethylene glycol diglycidylether, filler 15-
30 parts, 9-15 parts of ACM, 7-20 parts of methyl-phosphoric acid dimethyl ester.
The preparation method of the present invention, is concretely comprised the following steps：
（1）Preparation prepares the raw material of bisphenol-A epoxy resin first, is represented with parts by weight, takes 6-8 parts of hydroxide
Sodium, 16-22 parts of epoxychloropropane, 9-13 parts of hydrogenated bisphenol A, methyl iso-butyl ketone (MIBK) simultaneously adds reactor by a certain percentage
In, and catalyst is added, then 50-60 DEG C of water bath with thermostatic control and stirred；Then condensing reflux reacts 24h；
（2）Then add after deionized water is sufficiently mixed and staticly settle after question response terminates, will after then upper aqueous layer is filtered out
Surplus solution is heated to 75 DEG C and adds sodium hydroxide solution, then constant temperature stirring reaction 1-3h；Distilled water is added after question response
Washing point liquid, until when the water layer pH value separated is neutrality, after filtrate is completely distilled off, obtaining light yellow, transparent hydrogenation
Bisphenol A type epoxy resin；
（4）Then the modification operation of bisphenol-A epoxy resin is carried out, modifying agent is got out, the modifying agent is acetic acid second
Alkene ester latex and dibutyl phthalate latex, by dry for standby after two kinds of latex demulsifications；Then by vinyl acetate latex
Add in bisphenol-A epoxy resin, then react 2-4h under for 115-130 DEG C of temperature conditionss；Question response terminate after again
Dibutyl phthalate latex is added, 1.3-1.5h is reacted under 115-130 DEG C of temperature conditionss, that is, obtains being thick shape under normal temperature
The modified epoxy of liquid；
（5）Then mixed curing agent is prepared by raw material of cyanoethylation diethylentriamine curing agent, 20-45 parts of cyanogen second is first taken
Base diethylentriamine curing agent, and add 9-15 parts ACM and 15-30 parts filler carry out Hybrid Heating stir
1-2h is mixed, the slow ethylene glycol diglycidylether for adding 6-12 parts thereto in whipping process；Then 7-14 parts are added
Methyl-phosphoric acid dimethyl ester continue constant temperature stirring 30-50min, produce mixing fixative；
（6）After modified epoxy and mixed curing agent are independently encapsulated, then packed products together two-by-two.
Embodiment 2：
A kind of water-resistant adhesive efficiently solidified of the present embodiment, is represented with parts by weight, the bisphenol-A epoxy resin base
160 parts of material, 25 parts of cyanoethylation diethylentriamine curing agent, 7 parts of ethylene glycol diglycidylether, 16 parts of filler, acrylate
10 parts of rubber, 10 parts of methyl-phosphoric acid dimethyl ester.
Embodiment 3：
A kind of water-resistant adhesive efficiently solidified of the present embodiment, is represented with parts by weight, the bisphenol-A epoxy resin base
220 parts of material, 32 parts of cyanoethylation diethylentriamine curing agent, 9 parts of ethylene glycol diglycidylether, 25 parts of filler, acrylate
12 parts of rubber, 15 parts of methyl-phosphoric acid dimethyl ester.
Embodiment 4：
A kind of water-resistant adhesive efficiently solidified of the present embodiment, is represented with parts by weight, the bisphenol-A epoxy resin base
260 parts of material, 44 parts of cyanoethylation diethylentriamine curing agent, 11 parts of ethylene glycol diglycidylether, 30 parts of filler, acrylate
14 parts of rubber, 19 parts of methyl-phosphoric acid dimethyl ester.
Then the water-resistant adhesive of three kinds of different formulations ratios of embodiment 2 ~ 4 is subjected to detection contrast, to verify this hair
Bright implementation result.
1st, adhesive strength is tested：Take one group（4）The ligneous piece of same specification, in each ligneous piece, corresponding contact surface is pressed
Every square metre of glue coating of 100g, the specification of each contact surface is 80mm × 40mm, afterwards by the contact surface pair of Liang Ge ligneous pieces
Compression should be overlapped, closed assembly time is no more than 20 minutes, and contact surface applies 0.85-1.20Mpa pressure, and at room temperature, installation time 8 is small
When, place 16 hours after pressure relief, make a strength test again；4 repetitions, average；
2nd, bending strength is tested：Take one group（4）The plastic part of same specification, the modeling referring next to state marked as GB1042-79
Material bend test method is tested, and the specification of every group of plastic part is 100 × 20 × 15mm；
3rd, compressive strength is tested：Take one group（4）The plastic part of same specification, the modeling referring next to state marked as GB1041-79
Material compression test method is tested, and the cross-sectional dimensions for the plastic part tested are 20 × 15mm, a height of 10mm；
4th, water resistance test：Take one group（4）The ligneous piece of same specification, it is every by 100g in the corresponding contact surface of each ligneous piece
Square metre cementing, the specification of each contact surface is 80mm × 40mm, and the contact surface correspondence of Liang Ge ligneous pieces is overlapped into pressure afterwards
Tightly, spontaneously dry 8 hours, soaked in 32-40 DEG C of water, measure is come unglued the time, and 4 repetitions are averaged；
5th, hardening time tests：Take bisphenol-A epoxy resin 5g to be placed in beaker, keep bar of the room temperature at 20-25 DEG C
Under part, take mixed curing agent 2.0-2.5g to add in beaker, and stir standing after 15-20min and test its hardening time, 4 weights
Average again.
Table 1
It will be better than according to the adhesive strength of the results showed that embodiment of the present invention 2 ~ 4, bending strength, compressive strength and water resistance
Using the comparative example of ordinary epoxy resin adhesive, and hardening time will also be less than ordinary epoxy resin adhesive, and originally
Between three embodiments of invention, it can be seen that all test indexs all show that the formula rate of the present invention within the specific limits can
Preferable effect is enough reached, obvious difference occurs if too small or too big, and pass through to all groups by the present invention
Collaboration between the adjustment of distribution ratio, each component, both keeps high intensity, can have preferable water resistance again, with significant
It is innovative.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
A variety of change, modification, replacement and modification can be carried out to these embodiments by departing under the principle and objective of the present invention, of the invention
Scope is limited by claim and its equivalent.
Claims (5)
1. a kind of preparation method of the water-resistant adhesive efficiently solidified, it is characterized in that being：Concretely comprise the following steps：
（1）Preparation prepares the raw material of bisphenol-A epoxy resin first, then prepares bisphenol-A epoxy resin
It is stand-by；
（2）Then the modification operation of bisphenol-A epoxy resin, addition modifying agent and the hydrogenated bisphenol A type prepared are carried out
Epoxy resin carries out heating response, and obtains modified epoxy；
（3）Then mixed curing agent is prepared, the mixed curing agent includes 20-45 parts of cyanoethylation diethylentriamine curing agent,
6-12 parts of ethylene glycol diglycidylether, 15-30 parts of filler, 9-15 parts of ACM, 7-20 parts of methyl-phosphoric acid dimethyl ester；
（4）After modified epoxy and mixed curing agent are independently encapsulated, then packed products together two-by-two.
2. a kind of preparation method of water-resistant adhesive efficiently solidified according to claim 1, it is characterised in that：The step
Suddenly（1）It is middle to prepare concretely comprising the following steps for bisphenol-A epoxy resin：
（1.1）Prepare raw material, the raw material is sodium hydroxide, epoxychloropropane, hydrogenated bisphenol A and methyl iso-butyl ketone (MIBK)；
（1.2）Represented with parts by weight, take 6-8 parts of sodium hydroxide, 30-40 parts of epoxychloropropane, 15-18 parts of A Hydrogenated Bisphenol A
A, methyl iso-butyl ketone (MIBK) is simultaneously added in reactor by a certain percentage, and adds catalyst, then 50-60 DEG C of water bath with thermostatic control and is stirred
Mix；Then condensing reflux reacts 24h；
（1.3）Then add after deionized water is sufficiently mixed and staticly settle after question response terminates, after then upper aqueous layer is filtered out
Surplus solution is heated to 75 DEG C and sodium hydroxide solution is added, then constant temperature stirring reaction 1-3h；
（1.4）Distilled water washing point liquid is added after question response, until when the water layer pH value separated is neutral, filtrate is completely distilled off
Later, light yellow, transparent bisphenol-A epoxy resin is obtained.
3. a kind of preparation method of water-resistant adhesive efficiently solidified according to claim 2, it is characterised in that：The step
Suddenly（1.3）In sodium hydroxide mass fraction be 30-38%, the step（1.4）In vapo(u)rizing temperature be 95-96 DEG C.
4. a kind of preparation method of water-resistant adhesive efficiently solidified according to any one of claim 1 ~ 3, its feature exists
In：The step（2）In modification operation concretely comprise the following steps：
（2.1）Modifying agent is got out, the modifying agent is vinyl acetate latex and dibutyl phthalate latex, by two kinds
Dry for standby after latex demulsification；
（2.2）Then vinyl acetate latex is added in bisphenol-A epoxy resin, then for 120-140 DEG C of temperature
Under the conditions of react 2-4h；
（2.3）Question response adds dibutyl phthalate latex after terminating, 1- is reacted under 120-140 DEG C of temperature conditionss
1.2h, that is, obtain the modified epoxy for thick liquid under normal temperature.
5. a kind of preparation method of water-resistant adhesive efficiently solidified according to any one of claim 1 ~ 3, its feature exists
In：The step（3）In prepare concretely comprising the following steps for mixed curing agent：
（3.1）Get out mix the raw material of fixative, the raw material represent that cyanoethylation diethylentriamine is consolidated with parts by weight
20-45 parts of agent, 6-12 parts of ethylene glycol diglycidylether, 15-30 parts of filler, 9-15 parts of ACM, methyl acid phosphate
7-20 parts of dimethyl ester；
（3.2）First take cyanoethylation diethylentriamine curing agent and addition ACM and filler are mixed thereto
Heating stirring 1-2h, slowly ethylene glycol diglycidylether is added in whipping process thereto；
（3.3）Then add methyl-phosphoric acid dimethyl ester and continue constant temperature stirring 30-50min, produce mixing fixative.
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| CN201610994737.9A CN107254278A (en) | 2016-11-11 | 2016-11-11 | A kind of preparation method of the water-resistant adhesive efficiently solidified |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112920614A (en) * | 2021-01-28 | 2021-06-08 | 金闻闻 | High-temperature-resistant waterproof epoxy asphalt and preparation method thereof |
| CN116178975A (en) * | 2023-03-10 | 2023-05-30 | 南京林业大学 | Preparation method of hydrogenated epoxy resin modified emulsified asphalt |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105062395A (en) * | 2015-08-21 | 2015-11-18 | 广州市白云化工实业有限公司 | Two-component epoxy glue and preparation method thereof |
-
2016
- 2016-11-11 CN CN201610994737.9A patent/CN107254278A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105062395A (en) * | 2015-08-21 | 2015-11-18 | 广州市白云化工实业有限公司 | Two-component epoxy glue and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112920614A (en) * | 2021-01-28 | 2021-06-08 | 金闻闻 | High-temperature-resistant waterproof epoxy asphalt and preparation method thereof |
| CN116178975A (en) * | 2023-03-10 | 2023-05-30 | 南京林业大学 | Preparation method of hydrogenated epoxy resin modified emulsified asphalt |
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Application publication date: 20171017 |